公开(公告)号：US20150366072A1

公开(公告)日：2015-12-17

申请号：US14304982

申请日：2014-06-16

Applicant: Wistron NeWeb Corp.

Inventor： Babak Radi ,  Yu-Fu Kuo

IPC: H05K3/10 ,  H05K3/00

CPC classification number: H05K3/185 ,  H04M1/0277 ,  H05K1/0215 ,  H05K1/023 ,  H05K1/0284 ,  H05K1/0326 ,  H05K1/034 ,  H05K1/0346 ,  H05K1/165 ,  H05K3/0014 ,  H05K3/105 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/083 ,  H05K2201/09118 ,  H05K2201/10098 ,  Y10T29/49156

Abstract: A method of forming a metallic pattern on a polymer substrate is provided. A mixture layer is formed on a polymer substrate surface. The mixture layer includes an active carrier medium and nanoparticles dispersed in the active carrier medium. A laser process is performed to treat a portion of the mixture layer to form active seed residues on the surface of the polymer substrate. A cleaning process is performed to remove an untreated portion of the mixture layer to expose the surface of the polymer substrate, while the active seed residues are remained on the surface of the polymer substrate. Then, the active seed residues on the polymer substrate are subjected to an electroless plating process to form the metallic pattern over the active seed residues on the polymer substrate.

Abstract translation: 提供了一种在聚合物基板上形成金属图案的方法。 在聚合物基材表面上形成混合层。 混合物层包括活性载体介质和分散在活性载体介质中的纳米颗粒。 执行激光处理以处理混合物层的一部分以在聚合物基材的表面上形成活性种子残留物。 进行清洁处理以除去混合物层的未处理部分以暴露聚合物基材的表面，同时活性种子残留物保留在聚合物基材的表面上。 然后，对聚合物基底上的活性种子残留物进行化学镀处理，以在聚合物基底上的活性种子残基上形成金属图案。

公开(公告)号：US09192048B1

公开(公告)日：2015-11-17

申请号：US14310075

申请日：2014-06-20

Applicant: Avago Technologies General IP (Singapore) Pte. Ltd.

Inventor： Jin Jeong ,  Chris Chung ,  Deog Soon Choi ,  Young Ho Lee ,  Yong-Ik Choi

IPC: H01L23/48 ,  H05K1/18 ,  H01L23/00 ,  H05K1/09 ,  H05K1/11

CPC classification number: H05K1/111 ,  H01L23/49811 ,  H01L24/06 ,  H01L24/17 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/05147 ,  H01L2224/16227 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/45166 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H05K1/092 ,  H05K1/181 ,  H05K3/244 ,  H05K3/3426 ,  H05K2201/0145 ,  H05K2201/10106 ,  H05K2203/049 ,  Y02P70/611 ,  H01L2924/00014

Abstract: A bonding pad for use in attaching a semiconductor chip to a printed circuit board, includes: a copper layer; an organic layer disposed over the copper layer in a pattern such that part of the copper layer is exposed; and a gold layer disposed over the organic layer and in contact with the exposed part of the copper layer.

Abstract translation: 一种用于将半导体芯片附着到印刷电路板的接合焊盘，包括：铜层; 以使得部分铜层露出的图案设置在铜层上的有机层; 以及设置在有机层上并与铜层的暴露部分接触的金层。

公开(公告)号：US20150282296A1

公开(公告)日：2015-10-01

申请号：US14626881

申请日：2015-02-19

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： TETSUYOSHI OGURA ,  DAISUKE WAKUDA ,  TAKASHI MATSUMOTO

IPC: H05K1/02 ,  H05K3/10 ,  H05K1/03 ,  H05K1/09 ,  H05K1/11 ,  H05K1/18

CPC classification number: H05K1/0213 ,  A41D31/00 ,  H05K1/0274 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/0283 ,  H05K1/0296 ,  H05K1/0366 ,  H05K1/038 ,  H05K1/09 ,  H05K1/115 ,  H05K1/189 ,  H05K3/103 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0326 ,  H05K2201/09063 ,  H05K2201/09854 ,  H05K2201/10083 ,  H05K2201/10151 ,  Y10T29/49162

Abstract: There is provided an elastic flexible substrate including an insulating film base material which includes a wire. The insulating film base material includes an opening which is formed by opening a slit, and an opened state of the opening is held by an insulating member.

Abstract translation: 提供了一种弹性柔性基底，其包括包括线的绝缘膜基材。 绝缘膜基材包括通过打开狭缝形成的开口，并且开口的打开状态被绝缘构件保持。

公开(公告)号：US20150237741A1

公开(公告)日：2015-08-20

申请号：US14333734

申请日：2014-07-17

Applicant: Samsung Electro-Mechanics Co., Ltd. ,  Korea Advanced Institute of Science and Technology

Inventor： Yong Jin PARK ,  Sung Gap Im ,  Young Gwan Ko ,  Jae Bum You ,  Shin Young Kim

IPC: H05K3/38 ,  H05K3/10 ,  H05K1/09

CPC classification number: B32B15/08 ,  B32B7/12 ,  B32B15/20 ,  B32B2307/206 ,  B32B2457/08 ,  C09J133/14 ,  H05K3/384 ,  H05K3/386 ,  H05K3/387 ,  H05K2201/0145 ,  H05K2201/0154

Abstract: There are provided a printed circuit board and a manufacturing method thereof. The printed circuit board (PCB) includes an adhesive film disposed between an insulating layer and a circuit pattern, wherein the adhesive film includes poly(glycidyl methacrylate). The printed circuit board may include the adhesive film between the circuit pattern and the insulating layer, and thus, adhesive strength may be increased, while having a low roughness value, a fine circuit pattern may be formed, and reliability thereof may be enhanced.

Abstract translation: 提供了印刷电路板及其制造方法。 印刷电路板（PCB）包括设置在绝缘层和电路图案之间的粘合膜，其中粘合膜包括聚（甲基丙烯酸缩水甘油酯）。 印刷电路板可以包括电路图案和绝缘层之间的粘合膜，因此，可以增加粘合强度，同时具有低粗糙度值，可以形成精细电路图案，并且可以提高其可靠性。

公开(公告)号：US20150181692A1

公开(公告)日：2015-06-25

申请号：US14136428

申请日：2013-12-20

Applicant: Christopher Jezewski ,  Ravi Pillarisetty ,  Brian Doyle

Inventor： Christopher Jezewski ,  Ravi Pillarisetty ,  Brian Doyle

IPC: H05K1/02 ,  H05K1/03

CPC classification number: H05K1/038 ,  D03D1/0088 ,  D03D11/02 ,  D03D15/00 ,  H05K1/028 ,  H05K1/0393 ,  H05K1/189 ,  H05K3/0058 ,  H05K3/10 ,  H05K3/28 ,  H05K3/284 ,  H05K3/32 ,  H05K2201/0145 ,  H05K2201/015 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/029

Abstract: A system comprises an article comprising one or more fabric layers, a plurality of electronic devices, each being incorporated into or onto one of the one or more fabric layers, and one or more communication links between two or more of the plurality of electronic devices. Each of the plurality of electronic devices can comprise a flexible substrate coupled to the fabric layer, one or more metallization layers deposited on the flexible substrate, and one or more electronic components electrically coupled to the one or more metallization layers.

Abstract translation: 系统包括包括一个或多个织物层的制品，多个电子装置，每个电子装置并入到一个或多个织物层中的一个或多个织物层之一中，以及多个电子装置中的两个或更多个之间的一个或多个通信连接。 多个电子设备中的每一个可以包括耦合到织物层的柔性衬底，沉积在柔性衬底上的一个或多个金属化层以及电耦合到一个或多个金属化层的一个或多个电子部件。

公开(公告)号：US20150171297A1

公开(公告)日：2015-06-18

申请号：US14478599

申请日：2014-09-05

Applicant: LG ELECTRONICS INC.

Inventor： Byungjoon RHEE ,  Kyuhyun BANG

IPC: H01L33/62 ,  H01L33/50 ,  F21K99/00

CPC classification number: F21K9/50 ,  F21K9/60 ,  F21Y2115/10 ,  H01L33/38 ,  H01L33/387 ,  H01L2224/95 ,  H05K1/113 ,  H05K1/189 ,  H05K3/323 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/10106

Abstract: Discussed is a display device including a wiring substrate disposed with a first electrode; a conductive adhesive layer disposed between the wiring substrate and a second electrode; and a plurality of semiconductor light emitting devices coupled to the conductive adhesive layer, and electrically connected to the first electrode and the second electrode, wherein at least one of the plurality of semiconductor light emitting devices comprises a first conductive electrode and a second conductive electrode disposed to be separated from each other, the at least one of the semiconductor light emitting devices having a lateral surface, and wherein the second conductive electrode extends beyond the lateral surface of the at least one of semiconductor light emitting devices.

Abstract translation: 讨论了包括布置有第一电极的布线基板的显示装置; 布置在所述布线基板和第二电极之间的导电粘合剂层; 以及耦合到所述导电粘合剂层并且电连接到所述第一电极和所述第二电极的多个半导体发光器件，其中所述多个半导体发光器件中的至少一个包括第一导电电极和设置的第二导电电极 所述至少一个所述半导体发光器件具有侧表面，并且其中所述第二导电电极延伸超过所述至少一个半导体发光器件的侧表面。

公开(公告)号：US20150166810A1

公开(公告)日：2015-06-18

申请号：US14515539

申请日：2014-10-16

Applicant: Nano and Advanced Materials Institute Limited

Inventor： Li FU ,  Kai LI ,  Chau Shek LI

IPC: C09D11/52 ,  H01B1/02 ,  H01B13/00 ,  B22F9/24

CPC classification number: C09D11/52 ,  B22F9/24 ,  C09D11/322 ,  H01B1/02 ,  H01B13/00 ,  H05K1/0306 ,  H05K1/0386 ,  H05K1/097 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2203/1131

Abstract: A conductive ink formuation comprising metal nanoparticles and the preparation of the metal nanoparticles therein are disclosed. The ink formulation comprises at least one type of metal nanoparticles and solvent, which is to adjust the viscosity and surface tension of the ink formulation as well as the aggregation of the metal nanoparticles. The ink formulation is stable and demonstrates optimal performance, such as, improved jetting performance and good wetting property. The ink formulatin can be printed on a substrate and be further processed by sintering. The resultant film is of high conductivity. Since the annealing temperature in the present invention is relatively low, the fabrication process is compatible with plastic substrate used for flexible electronics.

Abstract translation: 公开了包含金属纳米颗粒的导电油墨形成和其中的金属纳米颗粒的制备。 油墨配方包括至少一种类型的金属纳米颗粒和溶剂，其用于调节油墨配方的粘度和表面张力以及金属纳米颗粒的聚集。 油墨配方是稳定的并且表现出最佳性能，例如改善喷射性能和良好的润湿性能。 油墨形式可以印刷在基材上，并通过烧结进一步加工。 所得膜具有高导电性。 由于本发明的退火温度相对较低，所以制造工艺与用于柔性电子器件的塑料基板兼容。

公开(公告)号：US08999778B2

公开(公告)日：2015-04-07

申请号：US13298451

申请日：2011-11-17

Applicant: Shawn O'Rourke ,  Curtis Moyer ,  Scott Ageno ,  Dirk Bottesch ,  Barry O'Brien ,  Michael Marrs

Inventor： Shawn O'Rourke ,  Curtis Moyer ,  Scott Ageno ,  Dirk Bottesch ,  Barry O'Brien ,  Michael Marrs

IPC: H01L21/84 ,  H01L21/683 ,  H01L29/66 ,  H01L29/786

CPC classification number: H01L21/6835 ,  H01L29/66765 ,  H01L29/78603 ,  H01L2221/6835 ,  H01L2924/3025 ,  H05K1/0393 ,  H05K3/007 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/068

Abstract: Some embodiments include a method of providing a semiconductor device. The method can include: (a) providing a flexible substrate; (b) depositing at least one layer of material over the flexible substrate, wherein the deposition of the at least one layer of material over the flexible substrate occurs at a temperature of at least 180° C.; and (c) providing a diffusion barrier between a metal layer and an a-Si layer. Other embodiments are disclosed in this application.

Abstract translation: 一些实施例包括提供半导体器件的方法。 该方法可以包括：（a）提供柔性基底; （b）在所述柔性基底上沉积至少一层材料，其中所述至少一层材料在柔性基底上的沉积在至少180℃的温度下发生; 和（c）在金属层和a-Si层之间提供扩散阻挡层。 在本申请中公开了其它实施例。

公开(公告)号：US20150068788A1

公开(公告)日：2015-03-12

申请号：US14485069

申请日：2014-09-12

Applicant: IBIDEN Co., Ltd.

Inventor： Tetsuo AMANO ,  Toshio Nishiwaki

IPC: H05K1/03 ,  H05K1/09 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0306 ,  H05K1/0219 ,  H05K1/024 ,  H05K1/0271 ,  H05K1/0373 ,  H05K1/09 ,  H05K1/115 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4655 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2201/096

Abstract: A printed wiring board includes a core insulation layer including a resin and having a via conductor through the core insulation layer, a first conductive layer formed on the core layer and including a copper foil and a plated film, an interlayer insulation layer formed on the first layer and including a resin, the interlayer layer having a via conductor through the interlayer layer, and a second conductive layer formed on the interlayer layer and including a copper foil and a plated film. The first layer includes a conductive circuit, the core and interlayer layers have dielectric constants of 4.0 or lower for signal transmission at frequency of 1 GHz and thermal expansion coefficient of 85 ppm/° C. or lower at or below Tg, and the foil of the first layer has thickness greater than thickness of the foil of the second layer.

Abstract translation: 印刷布线板包括：芯绝缘层，其包括树脂，并且具有通过芯绝缘层的通路导体，形成在芯层上并包括铜箔和镀膜的第一导电层，形成在第一层上的层间绝缘层 层，并且包括树脂，所述层间层具有穿过所述层间层的通孔导体，以及形成在所述中间层上并包括铜箔和镀膜的第二导电层。 第一层包括导电电路，核心层和层间介电常数为4.0或更低，信号传输频率为1GHz，热膨胀系数为85ppm /℃或更低，等于或低于Tg， 第一层的厚度大于第二层的箔的厚度。

公开(公告)号：US20150064493A1

公开(公告)日：2015-03-05

申请号：US14369909

申请日：2012-01-13

Applicant: Koichiro Tanaka ,  Kazuki Kammuri

Inventor： Koichiro Tanaka ,  Kazuki Kammuri

IPC: H05K1/03 ,  B32B15/20 ,  B32B7/02 ,  H05K1/05 ,  H05K1/09

CPC classification number: H05K1/0393 ,  B32B7/02 ,  B32B15/08 ,  B32B15/20 ,  B32B2307/712 ,  B32B2457/08 ,  H05K1/053 ,  H05K1/056 ,  H05K1/09 ,  H05K3/022 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/0358 ,  H05K2201/05 ,  H05K2201/06 ,  Y10T29/302 ,  Y10T428/12438 ,  Y10T428/273

Abstract: A copper foil composite comprising a copper foil and a resin layer laminated thereon, satisfying an equation 1: (f3×t3)/(f2×t2)=>1 wherein t2 (mm) is a thickness of the copper foil, f2 (MPa) is a stress of the copper foil under tensile strain of 4%, t3 (mm) is a thickness of the resin layer, f3 (MPa) is a stress of the resin layer under tensile strain of 4%, and an equation 2:1

Abstract translation: 包括铜箔和层压在其上的树脂层的铜箔复合体，满足等式1：（f3×t3）/（f2×t2）=> 1其中t2（mm）是铜箔的厚度，f2（MPa ）是拉伸应变为4％时的铜箔的应力，t3（mm）是树脂层的厚度，f3（MPa）是树脂层在拉伸应变下的应力为4％，等式2： 1 <= 33f1 /（F×T）其中，f1（N / mm）是铜箔和树脂层之间的180°剥离强度，F（MPa）是拉伸应变下的铜箔复合材料的强度为30％， T（mm）是铜箔复合体的厚度，其中以5〜100μg/ dm 2的涂布量形成Cr氧化物层。 形成在不层叠树脂层的铜箔的表面上。