公开(公告)号：US08031475B2

公开(公告)日：2011-10-04

申请号：US12136007

申请日：2008-06-09

Applicant: Seng Guan Chow ,  Il Kwon Shim ,  Byung Joon Han ,  Kambhampati Ramakrishna

Inventor： Seng Guan Chow ,  Il Kwon Shim ,  Byung Joon Han ,  Kambhampati Ramakrishna

IPC: H05K1/16 ,  H05K1/00 ,  H01L23/02

CPC classification number: H05K1/189 ,  H01L23/49816 ,  H01L23/5387 ,  H01L24/48 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06579 ,  H01L2225/06586 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19105 ,  H05K1/141 ,  H05K1/147 ,  H05K3/284 ,  H05K3/3436 ,  H05K2201/042 ,  H05K2201/056 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2203/1316 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099

Abstract: An integrated circuit package system includes: providing a flexible circuit substrate; mounting an integrated circuit or an integrated circuit package over the flexible circuit substrate and connected to the flexible circuit substrate with interconnects; and encapsulating the integrated circuit or integrated circuit package with a mounded encapsulation having a first level and a second level, the second level having the flexible circuit substrate folded thereover.

Abstract translation: 集成电路封装系统包括：提供柔性电路基板; 在柔性电路基板上安装集成电路或集成电路封装，并用互连连接到柔性电路基板; 以及用具有第一电平和第二电平的堆叠封装封装所述集成电路或集成电路封装，所述第二电平具有在其上折叠的所述柔性电路基板。

公开(公告)号：US20110233783A1

公开(公告)日：2011-09-29

申请号：US13061261

申请日：2008-08-26

Applicant: Hock Peng Lim ,  Meng Kiang Lim

Inventor： Hock Peng Lim ,  Meng Kiang Lim

IPC: H01L27/06 ,  H01L23/532

CPC classification number: H01L25/0657 ,  H01L23/5387 ,  H01L25/16 ,  H01L2224/32145 ,  H01L2225/06579 ,  H01L2924/15192 ,  H01L2924/19106 ,  H05K1/189 ,  H05K2201/042

Abstract: In an embodiment, a substrate arrangement is provided. The substrate arrangement may include a semiconductor substrate including a first contact portion and a second contact portion on a first surface of the semiconductor substrate, wherein the semiconductor substrate is arranged such that the first contact portion and the second contact portion face each other. The substrate arrangement may further include an electrical connector configured to connect the first contact portion and the second contact portion.

Abstract translation: 在一个实施例中，提供了衬底布置。 衬底布置可以包括在半导体衬底的第一表面上包括第一接触部分和第二接触部分的半导体衬底，其中半导体衬底被布置成使得第一接触部分和第二接触部分彼此面对。 衬底布置还可以包括被配置为连接第一接触部分和第二接触部分的电连接器。

公开(公告)号：US07965340B2

公开(公告)日：2011-06-21

申请号：US11518904

申请日：2006-09-12

Applicant: Kazumasa Kurokawa ,  Yoshimi Kondo ,  Hirokazu Shibata

Inventor： Kazumasa Kurokawa ,  Yoshimi Kondo ,  Hirokazu Shibata

IPC: H04N9/74

CPC classification number: H05K1/144 ,  G02F1/13452 ,  H05K1/18 ,  H05K2201/042 ,  H05K2201/064

Abstract: A LCD apparatus includes a liquid crystal panel, a circuit board having a mounting surface and circuit elements mounted on the mounting surface to constitute a drive circuit for driving the LCD apparatus, and a case for holding the liquid crystal panel and the circuit board. The circuit board is positioned approximately in a vertical direction during normal use of the LCD apparatus. The circuit elements include a first element having a first projecting length from the mounting surface and a second element having a second projecting length from the mounting surface. The first projecting length is greater than a projecting length of any other element of the circuit elements. The second projecting length is slightly smaller than the first projecting length. The first and the second elements are arranged on the mounting surface approximately in a line in the vertical direction.

Abstract translation: LCD装置包括液晶面板，具有安装面的电路板和安装在安装面上的电路元件，构成用于驱动LCD装置的驱动电路，以及用于保持液晶面板和电路板的壳体。 在LCD装置的正常使用期间，电路板大致位于垂直方向。 电路元件包括具有来自安装表面的第一突出长度的第一元件和具有来自安装表面的第二突出长度的第二元件。 第一突出长度大于电路元件的任何其它元件的突出长度。 第二突出长度略小于第一突出长度。 第一和第二元件在垂直方向上大致以一条直线布置在安装表面上。

公开(公告)号：US07952204B2

公开(公告)日：2011-05-31

申请号：US12102793

申请日：2008-04-14

Applicant: Yumin Liu ,  Hua Yang ,  Yong Liu ,  Tiburcio A. Maldo

Inventor： Yumin Liu ,  Hua Yang ,  Yong Liu ,  Tiburcio A. Maldo

IPC: H01L23/538 ,  H01L21/60 ,  H01L23/488 ,  H01L23/48 ,  H01L23/34

CPC classification number: H01L23/5385 ,  H01L25/162 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H05K1/0306 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/042 ,  H05K2201/10318 ,  H05K2203/1572 ,  H01L2924/00 ,  H01L2224/05599

Abstract: An exemplary semiconductor die package is disclosed having one or more semiconductor dice disposed on a first substrate, one or more packaged electrical components disposed on a second substrate that is electrical coupled to the first substrate, and an electrically insulating material disposed over portions of the substrates. The first substrate may hold power-handling devices and may be specially constructed to dissipation heat and to facilitate fast and inexpensive manufacturing. The second substrate may hold packaged components of control circuitry for the power-handling devices, and may be specially constructed to enable fast and inexpensive wiring design and fast and inexpensive component assembly. The first substrate may be used with different designs of the second substrate.

Abstract translation: 公开了一种示例性的半导体管芯封装，其具有设置在第一衬底上的一个或多个半导体管芯，设置在电耦合到第一衬底的第二衬底上的一个或多个封装的电气部件，以及设置在衬底部分上的电绝缘材料 。 第一基板可以保持动力处理装置，并且可以被特别构造以散热并促进快速和便宜的制造。 第二基板可以保持用于功率处理装置的控制电路的封装部件，并且可以被特别构造以实现快速和便宜的布线设计以及快速和便宜的部件组装。 第一衬底可以与第二衬底的不同设计一起使用。

公开(公告)号：US20110023291A1

公开(公告)日：2011-02-03

申请号：US12848089

申请日：2010-07-30

Applicant: James Peter Caska

Inventor： James Peter Caska

IPC: B23P19/00

CPC classification number: H05K1/0287 ,  H05K1/0289 ,  H05K1/142 ,  H05K1/144 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/10189 ,  H05K2201/10303 ,  Y10T29/53174

Abstract: An integrated method of prototyping and manufacturing electronic circuit boards where a new circuit design can move between virtual, prototype, partially merged and fully merged forms in a relatively automated fashion. A scaleable high density matrix of solderless electrical connections between the pin-outs of a plurality of electronic modules forms a virtual breadboard prototype circuit that can be merged into printed circuit board electrical layers to thus directly synthesize manufacturable forms of prototyped electronic circuits.

Abstract translation: 一种电子电路板的原型和制造的集成方法，其中新的电路设计可以以相对自动化的方式在虚拟，原型，部分合并和完全合并之间移动。 多个电子模块的引脚之间的无焊接电连接的可扩展高密度矩阵形成虚拟面包板原型电路，其可以被合并到印刷电路板电层中，从而直接合成可制造形式的原型电子电路。

公开(公告)号：US07847470B2

公开(公告)日：2010-12-07

申请号：US11904526

申请日：2007-09-26

Applicant: Tomotaka Kuroda

Inventor： Tomotaka Kuroda

IPC: H01L41/047 ,  H01L41/053

CPC classification number: H05K1/144 ,  H05K3/301 ,  H05K3/3421 ,  H05K3/3442 ,  H05K3/3447 ,  H05K2201/042 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/10083 ,  H05K2201/10318 ,  H05K2201/10325 ,  H05K2201/10871

Abstract: To provide high reliable surface mounting oscillator that solder does not leak out by heat from the oscillator. The base print board with a terminal on the first surface and a concave on the second surface which is the opposite side of the first surface, the metal strut fixed to the concave, the sub print board has piezoelectric vibrator supported by the metal strut, the base print board, the cover which covers the metal strut and the sub print board.

Abstract translation: 提供高可靠的表面安装振荡器，焊料不会从振荡器的热量泄漏出来。 基板印刷电路板具有位于第一表面上的端子，第二表面上是与第一表面相对的凹面，金属支柱固定在凹面上，副印刷电路板具有由金属支柱支撑的压电振动器， 基板印刷板，覆盖金属支柱和副印刷板的盖板。

公开(公告)号：US20100264806A1

公开(公告)日：2010-10-21

申请号：US12542903

申请日：2009-08-18

Applicant: Beijing Yu

Inventor： Beijing Yu

IPC: H01J5/00

CPC classification number: F21V3/02 ,  F21K9/00 ,  F21K9/232 ,  F21K9/238 ,  F21V23/005 ,  F21V23/006 ,  F21Y2107/60 ,  F21Y2115/10 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/09027 ,  H05K2201/10106

Abstract: Disclosed is an LED light bulb having safe and efficient heat dissipation, while also providing maximum light distribution by providing multiple printed circuit boards arranged in a pyramidal structure, having multiple LEDs. The multiple printed circuit boards are connected by conductor wires contained within a transparent housing, so that the multiple printed circuit boards sit on a base of the LED light bulb. A bottom printed circuit board may also be employed if additional circuitry is desired.

Abstract translation: 公开了一种具有安全且高效散热的LED灯泡，同时通过提供具有多个LED的金字塔形结构中布置的多个印刷电路板来提供最大的光分布。 多个印刷电路板通过包含在透明外壳内的导线连接，使得多个印刷电路板位于LED灯泡的基座上。 如果需要附加电路，也可以采用底部印刷电路板。

公开(公告)号：US07786721B2

公开(公告)日：2010-08-31

申请号：US12006543

申请日：2008-01-03

Applicant: Min-Gu Kim ,  Young-Soo An ,  Ho-Jeong Choi ,  Jung-Hyeon Kim

Inventor： Min-Gu Kim ,  Young-Soo An ,  Ho-Jeong Choi ,  Jung-Hyeon Kim

IPC: G01R31/28 ,  G01R31/26

CPC classification number: G01R31/2851 ,  G01R1/04 ,  H05K1/144 ,  H05K1/148 ,  H05K2201/042 ,  H05K2201/09972 ,  H05K2201/10371

Abstract: There is provided a multilayer type test board assembly for high-precision inspection. The multilayer test board assembly comprises: a plurality of test boards separated from each other according to their functions, having input/output signal terminals, and including at least one test board each having a first section where first mounting devices sensitive to an influence of electrical signals are mounted and a second section where second mounting devices insensitive to an influence of electrical signals are mounted; spacers that arrange the test boards in parallel by spacing apart the test boards by predetermined intervals; connection cables connected to the input/output signal terminals of the test boards; and a signal shielding fence formed on each of the at least one test board so as to protect the first mounting devices from electrical signals generated by the second mounting devices.

Abstract translation: 提供了一种用于高精度检测的多层型测试板组件。 多层测试板组件包括：根据功能彼此分离的多个测试板，具有输入/输出信号端子，并且包括至少一个测试板，每个测试板具有第一部分，其中第一安装装置对电气的影响敏感 信号被安装，并且第二部分安装对电信号的影响不敏感的第二安装装置; 间隔件通过以预定的间隔隔开测试板来平行布置测试板; 连接电缆连接到测试板的输入/输出信号端子; 以及形成在所述至少一个测试板中的每一个上的信号屏蔽栅栏，以便保护所述第一安装装置免受由所述第二安装装置产生的电信号。

公开(公告)号：US20100170706A1

公开(公告)日：2010-07-08

申请号：US12452104

申请日：2008-06-06

Applicant: Peter Kimmich ,  Quoc-Dat Nguyen

Inventor： Peter Kimmich ,  Quoc-Dat Nguyen

IPC: H05K1/03 ,  H05K3/36 ,  H05K1/16 ,  H05K1/11

CPC classification number: H05K1/144 ,  H01L23/49531 ,  H01L23/49537 ,  H01L23/49551 ,  H01L25/16 ,  H01L2924/0002 ,  H01L2924/09701 ,  H05K1/0306 ,  H05K3/284 ,  H05K2201/0379 ,  H05K2201/042 ,  H05K2201/1034 ,  H05K2201/10924 ,  H05K2203/1316 ,  Y10T29/49126 ,  Y10T29/49213 ,  H01L2924/00

Abstract: An electronic module includes a first substrate having at least one electronic component, and a housing embedded in the substrate and designed as an injection molded housing or a transfer molded housing, and which includes electrical leads protruding from the housing, connected to the first substrate and designed as a pressed screen. At least one further second substrate provided with second electrical is embedded in the housing, the second leads being designed as a second pressed screen, and the two pressed screens being directly connected to each other in at least one location.

Abstract translation: 电子模块包括具有至少一个电子部件的第一基板和嵌入在该基板中并被设计为注射成型外壳或传递模制外壳的壳体，并且包括从壳体突出的电引线，连接到第一基板和 设计为压屏。 设置有第二电气的至少一个另外的第二基板嵌入壳体中，第二引线被设计为第二压制屏幕，并且两个压制屏幕在至少一个位置中彼此直接连接。

公开(公告)号：US20100159719A1

公开(公告)日：2010-06-24

申请号：US12632270

申请日：2009-12-07

Applicant: Ryo KUWABARA ,  Koso Matsuno ,  Atsushi Yamaguchi ,  Hidenori Miyakawa

Inventor： Ryo KUWABARA ,  Koso Matsuno ,  Atsushi Yamaguchi ,  Hidenori Miyakawa

IPC: H01R12/00

CPC classification number: H05K1/144 ,  H05K2201/042 ,  H05K2201/10189 ,  H05K2201/10515 ,  H05K2201/2036

Abstract: A package structure includes a first printed wiring board having mounted on a top surface a plurality of electronic components including at least one first electronic component, a second printed wiring board stacked on the top surface side of the first printed wiring board, and a plurality of connecting members for mechanically connecting the first and second printed wiring boards while maintaining a constant gap therebetween, the connecting members including a first cured resin for bonding a top surface of the at least one first electronic component to a bottom surface of the second printed wiring board.

Abstract translation: 封装结构包括：第一印刷线路板，其安装在顶表面上，多个电子部件包括至少一个第一电子部件，堆叠在第一印刷线路板的顶面侧的第二印刷线路板，以及多个 连接构件，用于机械地连接第一和第二印刷线路板，同时保持它们之间的恒定的间隙，所述连接构件包括用于将至少一个第一电子部件的顶表面接合到第二印刷线路板的底表面的第一固化树脂 。