公开(公告)号：US07289328B2

公开(公告)日：2007-10-30

申请号：US11021500

申请日：2004-12-21

Applicant: Christian L. Belady ,  Gary W. Williams ,  Shaun L. Harris ,  Steven A. Belson ,  Eric C. Peterson ,  Stuart C. Haden

Inventor： Christian L. Belady ,  Gary W. Williams ,  Shaun L. Harris ,  Steven A. Belson ,  Eric C. Peterson ,  Stuart C. Haden

IPC: H05K7/20

CPC classification number: H05K7/20436 ,  H05K1/0204 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/0061 ,  H05K2201/045 ,  H05K2201/064 ,  H05K2201/09054 ,  H05K2201/10189 ,  H05K2201/1056 ,  H05K2201/10689 ,  H05K2203/1572

Abstract: Embodiments include apparatus, methods, and systems having a multi-chip module with a power system and pass-thru holes. An exemplary electronic module includes a first portion having a first printed circuit board (PCB) with a memory and plural processors. A second portion has a power system and a thermal dissipation device. The thermal dissipation device has plural extensions, and the power system has plural pass-thru holes. The first portion electrically couples to the second portion to form the electronic module when the plural extensions extend through the plural pass-thru holes of the power system and through plural pass-thru holes of a second PCB disposed between the first and second portions.

Abstract translation: 实施例包括具有电源系统和通孔的多芯片模块的装置，方法和系统。 示例性电子模块包括具有带存储器的第一印刷电路板（PCB）和多个处理器的第一部分。 第二部分具有动力系统和散热装置。 散热装置具有多个延伸部，电力系统具有多个通过孔。 当多个延伸部延伸穿过电力系统的多个通孔并且通过设置在第一和第二部分之间的第二PCB的多个通过孔时，第一部分电耦合到第二部分以形成电子模块。

公开(公告)号：US20070240900A1

公开(公告)日：2007-10-18

申请号：US11689858

申请日：2007-03-22

Applicant: Toshihiko Yokomaku

Inventor： Toshihiko Yokomaku

IPC: H05K1/11 ,  H01R12/04

CPC classification number: H05K3/3463 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/16251 ,  H05K1/0262 ,  H05K1/141 ,  H05K3/341 ,  H05K3/3415 ,  H05K3/3457 ,  H05K3/4602 ,  H05K2201/045 ,  H05K2201/10189 ,  H05K2201/10318 ,  H05K2201/10424 ,  H05K2201/10674 ,  H05K2203/1572 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49149 ,  H01L2224/05599

Abstract: A component mounting method of a multilayer printed wiring board includes a plurality of solder bumps to mount electronic components formed on both of or either of the front and back thereof, wherein when the solder bumps are formed of any of first, second, third and fourth solders, the first, second, third and fourth solders have different melting points and the melting points of the first, second, third and fourth solders are arranged as the melting point of the first solder, the melting point of the second solder, the melting point of the third solder and the melting point of the fourth solder in order of high melting point and the first, second, third and fourth solders are sequentially used to solder electronic components and the like in order of high melting point. Further, in that case, it is preferable that the solder bump having large volume should be soldered earlier than other solder bumps. This multilayer printed wiring board is easy to mount components, excellent in work efficiency or easy in reworkable process and a mounting method of such multilayer printed wiring board is also provided.

Abstract translation: 多层印刷电路板的部件安装方法包括：多个焊料凸块，用于安装形成在其前后的电子元件，其中当焊料凸块由第一，第二，第三和第四 焊料，第一，第二，第三和第四焊料具有不同的熔点，第一，第二，第三和第四焊料的熔点被排列为第一焊料的熔点，第二焊料的熔点，熔化 第三焊料的点和第四焊料的熔点按照高熔点顺序依次使用，并且第一，第二，第三和第四焊料依次用于以高熔点的顺序焊接电子部件等。 此外，在这种情况下，优选地，具有大体积的焊料凸块应比其它焊料凸块更早地焊接。 该多层印刷电路板容易安装组件，工作效率优异或易于再加工的工艺，并且还提供了这种多层印刷线路板的安装方法。

公开(公告)号：US07259465B2

公开(公告)日：2007-08-21

申请号：US10104826

申请日：2002-03-22

Applicant: Tasao Soga ,  Hanae Shimokawa ,  Tetsuya Nakatsuka ,  Kazuma Miura ,  Mikio Negishi ,  Hirokazu Nakajima ,  Tsuneo Endoh

Inventor： Tasao Soga ,  Hanae Shimokawa ,  Tetsuya Nakatsuka ,  Kazuma Miura ,  Mikio Negishi ,  Hirokazu Nakajima ,  Tsuneo Endoh

IPC: H01L29/40

CPC classification number: H01L24/13 ,  B32B15/01 ,  C22C5/02 ,  C22C9/02 ,  C22C11/06 ,  C22C13/00 ,  H01L21/50 ,  H01L21/56 ,  H01L21/563 ,  H01L23/10 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/4924 ,  H01L23/49513 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81024 ,  H01L2224/81054 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/8121 ,  H01L2224/81409 ,  H01L2224/81815 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15738 ,  H01L2924/1576 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/166 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/141 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/045 ,  H05K2201/09572 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01031 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2224/83205

Abstract: Each of junctions formed between a semiconductor device and a substrate comprises metal balls of Cu, etc., and compounds of Sn and the metal balls, and the metal balls are bonded together by the compounds.

Abstract translation: 形成在半导体器件和衬底之间的接合部包括Cu等的金属球，Sn和金属球的化合物以及金属球通过化合物结合在一起。

公开(公告)号：US07136289B2

公开(公告)日：2006-11-14

申请号：US10931124

申请日：2004-08-30

Applicant: Samir Vasavda ,  William F. Edwards, Jr. ,  Michael Kornprobst ,  David Nelsen

Inventor： Samir Vasavda ,  William F. Edwards, Jr. ,  Michael Kornprobst ,  David Nelsen

IPC: H05K1/14

CPC classification number: G06F1/185 ,  G02B6/4246 ,  G02B6/4284 ,  G02B6/4292 ,  G06F1/184 ,  G06F1/186 ,  H01R12/716 ,  H01R12/724 ,  H01R2201/04 ,  H05K1/141 ,  H05K7/142 ,  H05K7/1428 ,  H05K2201/045 ,  H05K2201/10189 ,  H05K2201/10515 ,  H05K2203/1572

Abstract: A system for providing dual 10 GB uplinks in the front side of a single rack unit switch that stacks two MSA X2 I/O devices in a limited space. In one embodiment the two X2 I/O devices are mounted on opposite sides of a single circuit board positioned above the motherboard.

公开(公告)号：US20060166400A1

公开(公告)日：2006-07-27

申请号：US11384964

申请日：2006-03-20

Applicant: Donald Tran

Inventor： Donald Tran

IPC: H01L21/50

CPC classification number: H01L23/50 ,  H01L2924/0002 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K1/183 ,  H05K3/325 ,  H05K7/1092 ,  H05K2201/045 ,  H05K2201/049 ,  H05K2201/10409 ,  H05K2201/10515 ,  H05K2201/10734 ,  H01L2924/00

Abstract: In some example embodiments, an integrated circuit, electronic assembly and method provide a current path for supplying power to a processor. As an example, the integrated circuit includes a base having power contacts that extend from an upper surface of base. The integrated circuit further includes a substrate that is mounted to the upper surface of the base to electrically couple the substrate to the base. A die is mounted on a substrate such that the die is electrically coupled to the substrate. The power contacts on the upper surface of the base engage a daughterboard so that the die is able to receive power from a voltage source mounted on the daughterboard through the power contacts on the upper surface of the base.

公开(公告)号：US07075797B1

公开(公告)日：2006-07-11

申请号：US11152137

申请日：2005-06-14

Applicant: Brian Hargrove Leonard ,  Michael Thano Matthews ,  Susan Sommers Moffatt ,  John David Swansey

Inventor： Brian Hargrove Leonard ,  Michael Thano Matthews ,  Susan Sommers Moffatt ,  John David Swansey

IPC: H05K1/18 ,  H05K7/10 ,  H01R12/18

CPC classification number: G06F1/185 ,  G06F1/184 ,  G06F1/186 ,  H01R12/52 ,  H01R12/7082 ,  H05K1/14 ,  H05K2201/045 ,  H05K2201/09954 ,  H05K2201/10189

Abstract: A substantially rigid card having a first side and an opposing second side, a first connector end adapted to mate with a first expansion connector on a circuit board and a second connector end adapted to mate with a second expansion connector on the board. A first peripheral card connector is connected to the first side and electrically connected to the first connector end, wherein the first connector is of a first form factor and adapted to mate with a first peripheral card. A second peripheral card connector is connected to the second side and electrically connected to the second connector end, wherein the second connector is of a second form factor different from the first form factor and matable with a second peripheral card. The first peripheral card connector is spaced from the first connector end a distance approximately the same as the distance the second peripheral card connector is spaced from the second connector end such that the peripheral card carried by the riser card shares approximately the same region whether the riser card is in a first or a second orientation.

Abstract translation: 具有第一侧和相对的第二侧的基本刚性的卡，适于与电路板上的第一扩展连接器配合的第一连接器端和适于与板上的第二扩展连接器配合的第二连接器端。 第一外围卡连接器连接到第一侧并电连接到第一连接器端，其中第一连接器具有第一形状因数并且适于与第一外围卡匹配。 第二外围卡连接器连接到第二侧并且电连接到第二连接器端，其中第二连接器具有不同于第一形状因数的第二形状因数并且可与第二外围卡匹配。 第一外围卡连接器与第一连接器端部间隔开距离与第二外围卡连接器与第二连接器端部间隔的距离大致相同的距离，使得由提升卡携带的外围卡共享大致相同的区域， 卡片处于第一或第二方向。

公开(公告)号：US07072185B1

公开(公告)日：2006-07-04

申请号：US11021527

申请日：2004-12-21

Applicant: Christian L. Belady ,  Gary W. Williams ,  Shaun L Harris ,  Steven A. Belson ,  Eric C. Peterson ,  Stuart C. Haden

Inventor： Christian L. Belady ,  Gary W. Williams ,  Shaun L Harris ,  Steven A. Belson ,  Eric C. Peterson ,  Stuart C. Haden

IPC: H05K7/20

CPC classification number: H05K1/141 ,  G06F1/189 ,  G06F1/20 ,  H01L23/3677 ,  H01L2924/0002 ,  H05K1/0204 ,  H05K1/0263 ,  H05K1/144 ,  H05K3/0061 ,  H05K2201/045 ,  H05K2201/064 ,  H05K2201/09054 ,  H05K2201/10189 ,  H05K2201/1056 ,  H05K2201/10689 ,  H05K2203/1572 ,  H01L2924/00

Abstract: Embodiments include apparatus, methods, and systems of an electronic module for a system board having at least one pass-thru hole. An exemplary electronic module, connectable to a system board with a pass-thru hole, includes a first portion coupled to one side of the system board. The first portion has a printed circuit board (PCB) with plural processors. A second portion of the electronic module couples to a second, opposite side of the system board. The second portion has a power system board electrically coupled to the first portion. The second portion also includes a thermal dissipation device that extends through the pass-thru hole of the system board.

Abstract translation: 实施例包括用于具有至少一个通过孔的系统板的电子模块的装置，方法和系统。 可连接到具有通孔的系统板的示例性电子模块包括耦合到系统板的一侧的第一部分。 第一部分具有多个处理器的印刷电路板（PCB）。 电子模块的第二部分耦合到系统板的第二相对侧。 第二部分具有电耦合到第一部分的电力系统板。 第二部分还包括延伸穿过系统板的通孔的散热装置。

公开(公告)号：US20060133041A1

公开(公告)日：2006-06-22

申请号：US11021504

申请日：2004-12-21

Applicant: Christian Belady ,  Gary Williams ,  Shaun Harris ,  Steven Belson ,  Eric Peterson

Inventor： Christian Belady ,  Gary Williams ,  Shaun Harris ,  Steven Belson ,  Eric Peterson

IPC: H05K7/20

CPC classification number: G06F1/20 ,  G06F2200/201 ,  H05K1/0203 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/0061 ,  H05K2201/045 ,  H05K2201/064 ,  H05K2201/09054 ,  H05K2201/10189 ,  H05K2201/1056 ,  H05K2201/10689 ,  H05K2203/1572

Abstract: Embodiments include apparatus, methods, and systems of a processor module for a system board. In one embodiment, an electronic module, having first and second portions, is removably connectable to the system board. The first portion connects to the system board and includes a thermal dissipation device and a printed circuit board (PCB) with a processor connected to a first side of the PCB. The thermal dissipation device dissipates heat, via a heat exchange, from the processor. The second portion is disposed in a space created between the first portion and the system board. The second portion has a power system board for providing power to the processor. The power system board extends adjacent and parallel to a second side of the PCB.

Abstract translation: 实施例包括用于系统板的处理器模块的装置，方法和系统。 在一个实施例中，具有第一和第二部分的电子模块可拆卸地连接到系统板。 第一部分连接到系统板，并且包括散热装置和印刷电路板（PCB），处理器连接到PCB的第一侧。 散热装置通过热交换从处理器散热。 第二部分设置在第一部分和系统板之间产生的空间中。 第二部分具有用于向处理器提供电力的电力系统板。 电源系统板相邻并平行于PCB的第二侧延伸。

公开(公告)号：US20060133040A1

公开(公告)日：2006-06-22

申请号：US11021500

申请日：2004-12-21

Applicant: Christian Belady ,  Gary Williams ,  Shaun Harris ,  Steven Belson ,  Eric Peterson ,  Stuart Haden

Inventor： Christian Belady ,  Gary Williams ,  Shaun Harris ,  Steven Belson ,  Eric Peterson ,  Stuart Haden

IPC: H05K7/20

CPC classification number: H05K7/20436 ,  H05K1/0204 ,  H05K1/0263 ,  H05K1/141 ,  H05K1/144 ,  H05K3/0061 ,  H05K2201/045 ,  H05K2201/064 ,  H05K2201/09054 ,  H05K2201/10189 ,  H05K2201/1056 ,  H05K2201/10689 ,  H05K2203/1572

Abstract: Embodiments include apparatus, methods, and systems having a multi-chip module with a power system and pass-thru holes. An exemplary electronic module includes a first portion having a first printed circuit board (PCB) with a memory and plural processors. A second portion has a power system and a thermal dissipation device. The thermal dissipation device has plural extensions, and the power system has plural pass-thru holes. The first portion electrically couples to the second portion to form the electronic module when the plural extensions extend through the plural pass-thru holes of the power system and through plural pass-thru holes of a second PCB disposed between the first and second portions.

Abstract translation: 实施例包括具有电源系统和通孔的多芯片模块的装置，方法和系统。 示例性电子模块包括具有带存储器的第一印刷电路板（PCB）和多个处理器的第一部分。 第二部分具有动力系统和散热装置。 散热装置具有多个延伸部，电力系统具有多个通过孔。 当多个延伸部延伸穿过电力系统的多个通孔并且通过布置在第一和第二部分之间的第二PCB的多个通过孔时，第一部分电耦合到第二部分以形成电子模块。

公开(公告)号：US06862185B2

公开(公告)日：2005-03-01

申请号：US10705557

申请日：2003-11-10

Applicant: Terrel L. Morris

Inventor： Terrel L. Morris

IPC: H05K1/02 ,  H05K1/14 ,  H05K3/36 ,  H05K7/20

CPC classification number: H05K7/20154 ,  H01L2224/16225 ,  H01L2924/00014 ,  H05K1/0203 ,  H05K1/14 ,  H05K1/141 ,  H05K3/366 ,  H05K3/368 ,  H05K2201/045 ,  H05K2201/064 ,  H05K2201/10189 ,  H05K2201/10515 ,  H01L2224/0401

Abstract: One embodiment of the invention is a system comprising a first component that generates heat, and a second component that is thermally connected to the first component, wherein the heat from the first component is transferred to a coolant through the second component, and the second component has a function in the computer system associated with an operation of the system other than transferring heat.

Abstract translation: 本发明的一个实施例是包括产生热量的第一部件和与第一部件热连接的第二部件的系统，其中来自第一部件的热量通过第二部件传递到冷却剂，而第二部件 在与传送热量不同的系统操作相关联的计算机系统中具有功能。