公开(公告)号：US20060189195A1

公开(公告)日：2006-08-24

申请号：US11358121

申请日：2006-02-22

Applicant: Yoshikatsu Okada

Inventor： Yoshikatsu Okada

IPC: H01R13/62

CPC classification number: H01R13/20 ,  H01R12/721 ,  H01R13/6597 ,  H05K1/117 ,  H05K3/325 ,  H05K3/42 ,  H05K2201/09036 ,  H05K2201/09481 ,  H05K2201/09745

Abstract: A connector device includes a plug including a plurality of plug terminals and a socket including a plurality of socket terminals. Ground plug terminals each have a recess on the contact surface, and ground socket terminals each have a dimple on the contact surface thereof. The dimple of the ground socket terminal is elastically urged to the recess of the ground plug terminal for obtaining a firm electric contact between the ground plug terminal and the ground socket terminal.

Abstract translation: 连接器装置包括具有多个插头端子的插头和包括多个插座端子的插座。 接地插头端子各自在接触表面上具有凹部，并且接地插座端子在其接触表面上都具有凹坑。 接地插座端子的凹坑弹性地推动到接地插头端子的凹部，以获得接地插头端子和接地插座端子之间的牢固的电接触。

公开(公告)号：US20060125076A1

公开(公告)日：2006-06-15

申请号：US11096452

申请日：2005-03-31

Applicant: Masato Fukagaya ,  Osamu Koido

Inventor： Masato Fukagaya ,  Osamu Koido

IPC: H01L23/48

CPC classification number: H01L23/10 ,  H01L23/04 ,  H01L24/97 ,  H01L25/0657 ,  H01L2224/32225 ,  H01L2224/97 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/15192 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16195 ,  H01L2924/1627 ,  H01L2924/163 ,  H01L2924/19041 ,  H01L2924/19043 ,  H05K1/0298 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/242 ,  H05K3/3473 ,  H05K2201/0919 ,  H05K2201/09354 ,  H05K2201/09481 ,  H05K2203/175

Abstract: A circuit board 3 includes a ceramic substrate 6 with an internal layer circuit 7 therein. The internal layer circuit 7 is used to electroplate a plurality of component electrodes 8, a plurality of terminal electrodes 9, and a loop electrode 10 that surrounds the component electrodes 8 on surfaces of the substrate 6 by using the internal layer circuit 7. A hole is bored in a periphery of the substrate 6 to sever the internal layer circuit 7 and isolate the component electrodes 8 from the loop electrode 10. Part of the severed internal layer circuit 7 is then used to electroplate a surface of the loop electrode 10 with a brazing material 5 to provide the circuit board 3.

Abstract translation: 电路板3包括其内部层电路7的陶瓷基板6。 内层电路7用于通过使用内层电路7对多个元件电极8，多个端子电极9和围绕基板6的表面上的元件电极8的环形电极10进行电镀。 在基板6的周围钻孔，切断内层电路7，并将元件电极8与环形电极10隔离。 然后将切断的内层电路7的一部分用钎焊材料5电镀环形电极10的表面以提供电路板3。

公开(公告)号：US07046501B2

公开(公告)日：2006-05-16

申请号：US11100827

申请日：2005-04-06

Applicant: Yoshiomi Tsuji

Inventor： Yoshiomi Tsuji

IPC: H01G4/228 ,  H01G4/30 ,  H01G4/05

CPC classification number: H01G4/232 ,  H01G4/30 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/50 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/3011 ,  H05K1/162 ,  H05K2201/09309 ,  H05K2201/09481 ,  H05K2201/09509 ,  H05K2201/09527 ,  H05K2201/096 ,  H05K2201/09718

Abstract: A capacitor-embedded substrate for reliably compensating for fluctuation of a power source voltage is provided. A decoupling capacitor is formed between an input side electrode layer and an output side electrode layer via interlayer insulating layers, the decoupling capacitor includes a ground layer, a power source layer, and a dielectric layer interposed therebetween. A plurality of power supply terminals used for power supply to a semiconductor device is formed by patterning the output side electrode layer and is connected to the power source layer via a capacitor via.

Abstract translation: 提供了用于可靠地补偿电源电压波动的电容器嵌入式基板。 在输入侧电极层和输出侧电极层之间经由层间绝缘层形成去耦电容器，去耦电容器包括接地层，电源层和介于其间的电介质层。 用于向半导体器件供电的多个电源端子通过对输出侧电极层进行构图而形成，并通过电容器通孔连接到电源层。

公开(公告)号：US07042077B2

公开(公告)日：2006-05-09

申请号：US10825400

申请日：2004-04-15

Applicant: Michael J. Walk ,  Hamid Azimi ,  John S. Guzek ,  Charan K. Gurumurthy

Inventor： Michael J. Walk ,  Hamid Azimi ,  John S. Guzek ,  Charan K. Gurumurthy

IPC: H01L23/02

CPC classification number: H05K1/0271 ,  H01L23/49827 ,  H01L23/49833 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/15312 ,  H01L2924/15313 ,  H05K1/162 ,  H05K3/4688 ,  H05K2201/0133 ,  H05K2201/09481 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/10734

Abstract: A system may include a coreless substrate, a layer of material attached to the substrate, the layer of material having a lower elastic modulus than the substrate, an interposer coupled to the layer of material, and a capacitive layer coupled to the interposer.

Abstract translation: 系统可以包括无芯衬底，附着到衬底的材料层，具有比衬底更低的弹性模量的材料层，耦合到材料层的插入器以及耦合到插入器的电容层。

公开(公告)号：US20060065438A1

公开(公告)日：2006-03-30

申请号：US11231746

申请日：2005-09-22

Applicant: Kouki Yamamoto

Inventor： Kouki Yamamoto

IPC: H05K1/18

CPC classification number: H05K3/3442 ,  H05K1/111 ,  H05K3/243 ,  H05K3/244 ,  H05K3/284 ,  H05K3/4015 ,  H05K2201/0209 ,  H05K2201/0341 ,  H05K2201/0347 ,  H05K2201/09481 ,  H05K2201/0959 ,  H05K2201/09736 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: A circuit component mounting device includes a resin substrate, vias, a circuit component composed of a main body and electrode portions, a solder, and an insulative sealing resin that covers the circuit component and the solder. The device further includes a base metal pattern which covers parts of the principal face of the resin substrate where the vias are exposed and is composed of a Cu layer and a Ni layer and a copper plated pattern which is provided on the base metal pattern and is composed of a Cu layer, a Ni layer, and an Au layer. The circuit component is provided on the copper plated pattern. The solder allows the copper plated pattern and the circuit component to adhere to each other.

Abstract translation: 电路部件安装装置包括树脂基板，通孔，由主体和电极部分组成的电路部件，焊料和覆盖电路部件和焊料的绝缘密封树脂。 该装置还包括基体金属图案，其覆盖树脂基板的主要面的部分，其中通孔露出，并且由Cu层和Ni层构成，并且镀铜图案设置在基底金属图案上，并且是 由Cu层，Ni层和Au层构成。 电路元件设置在镀铜图案上。 焊料允许镀铜图案和电路部件彼此粘附。

公开(公告)号：US20060027909A1

公开(公告)日：2006-02-09

申请号：US11194391

申请日：2005-08-01

Applicant: Tomonaga Kobayashi

Inventor： Tomonaga Kobayashi

IPC: H01L23/48

CPC classification number: G02F1/13452 ,  H01L2924/0002 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/0715 ,  H05K2201/0919 ,  H05K2201/09481 ,  H05K2201/09845 ,  H01L2924/00

Abstract: A connecting substrate includes a first conductive member; an insulating layer; and a second conductive member, the first conductive member and the second conductive member facing each other via the insulating layer, in which wherein an end portion of either one of the first conductive member and the second conductive member extends past an end portion of the other conductive member and past an end portion of the insulating layer.

Abstract translation: 连接基板包括第一导电部件; 绝缘层; 以及第二导电构件，所述第一导电构件和所述第二导电构件经由所述绝缘层彼此面对，其中所述第一导电构件和所述第二导电构件中的任一个的端部延伸超过所述另一导电构件的端部 导电构件并经过绝缘层的端部。

公开(公告)号：US20060000636A1

公开(公告)日：2006-01-05

申请号：US10882167

申请日：2004-07-02

Applicant: John Lauffer ,  James Larnerd ,  Voya Markovich

Inventor： John Lauffer ,  James Larnerd ,  Voya Markovich

IPC: H05K1/03 ,  H05K3/46

CPC classification number: H01L23/49811 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/15311 ,  H05K1/0216 ,  H05K1/0256 ,  H05K1/056 ,  H05K3/0047 ,  H05K3/429 ,  H05K3/44 ,  H05K3/4641 ,  H05K2201/093 ,  H05K2201/09345 ,  H05K2201/09481 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2203/0323 ,  H05K2203/1476 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49162 ,  Y10T29/49165 ,  Y10T29/49176 ,  H01L2224/0401

Abstract: A circuitized substrate which includes a plurality of contiguous open segments which define facing edge portions within an electrically conductive layer to isolate separate portions of the conductive layer such that the layer can be used for different functions, e.g., as both power and ground elements, within a product (e.g., electrical assembly) which includes the substrate as part thereof. A method of making the substrate, an electrical assembly utilizing the substrate, a multilayered circuitized assembly also utilizing the substrate and an information handling system, e.g., a mainframe computer, are also provided.

Abstract translation: 电路化基板，其包括多个邻接的开放段，其在导电层内限定面对的边缘部分，以隔离导电层的分离部分，使得该层可用于不同的功能，例如功率和接地元件内部的功能和接地元件 包括基板作为其一部分的产品（例如，电气组件）。 还提供了制造衬底的方法，利用衬底的电组件，还利用衬底的多层电路化组件和诸如主机的信息处理系统。

公开(公告)号：US20050237075A1

公开(公告)日：2005-10-27

申请号：US11170852

申请日：2005-06-30

Applicant: Alan Wood ,  Tim Corbett

Inventor： Alan Wood ,  Tim Corbett

IPC: G01R1/04 ,  G01R1/067 ,  G01R1/073 ,  G01R3/00 ,  G01R31/26 ,  G01R31/28 ,  H01L21/60 ,  H01L21/66 ,  H01L23/13 ,  H05K3/00 ,  H05K3/40 ,  H05K3/42

CPC classification number: H01L24/80 ,  G01R1/0466 ,  G01R1/0483 ,  G01R1/0491 ,  G01R1/0735 ,  G01R3/00 ,  G01R31/2831 ,  G01R31/2855 ,  G01R31/2863 ,  G01R31/2867 ,  G01R31/2886 ,  G01R31/2889 ,  G01R31/2893 ,  H01L22/20 ,  H01L22/22 ,  H01L23/13 ,  H01L2224/16145 ,  H01L2225/06562 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15151 ,  H05K3/0058 ,  H05K3/0067 ,  H05K3/4007 ,  H05K3/423 ,  H05K2201/0133 ,  H05K2201/0347 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09481 ,  H05K2201/09563 ,  H05K2203/0307 ,  H05K2203/0723

Abstract: A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consisting of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between the wafer and electrical testing equipment. A rigid substrate has conductors thereon which establish electrical contact with the wafer. The test fixture need not be opened until the burn-in and electrical testing are completed. After burn-in stress and electrical testing, it is possible to establish interconnection between the single die or separate and package dice into discrete parts, arrays or clusters, either as singulated parts or as arrays.

公开(公告)号：US20050230841A1

公开(公告)日：2005-10-20

申请号：US10825400

申请日：2004-04-15

Applicant: Michael Walk ,  Hamid Azimi ,  John Guzek ,  Charan Gurumurthy

Inventor： Michael Walk ,  Hamid Azimi ,  John Guzek ,  Charan Gurumurthy

IPC: H01L21/48 ,  H01L23/498 ,  H01L23/52 ,  H05K1/02 ,  H05K1/16

CPC classification number: H05K1/0271 ,  H01L23/49827 ,  H01L23/49833 ,  H01L2224/16 ,  H01L2924/01019 ,  H01L2924/15312 ,  H01L2924/15313 ,  H05K1/162 ,  H05K3/4688 ,  H05K2201/0133 ,  H05K2201/09481 ,  H05K2201/10378 ,  H05K2201/10674 ,  H05K2201/10734

Abstract: A system may include a coreless substrate, a layer of material attached to the substrate, the layer of material having a lower elastic modulus than the substrate, an interposer coupled to the layer of material, and a capacitive layer coupled to the interposer.

Abstract translation: 系统可以包括无芯衬底，附着到衬底的材料层，具有比衬底更低的弹性模量的材料层，耦合到材料层的插入器以及耦合到插入器的电容层。

公开(公告)号：US20050215086A1

公开(公告)日：2005-09-29

申请号：US10515062

申请日：2003-10-24

Applicant: Katsumi Sato ,  Kazuo Inoue

Inventor： Katsumi Sato ,  Kazuo Inoue

IPC: G01R31/02 ,  G01R1/06 ,  G01R1/067 ,  G01R1/073 ,  G01R31/28 ,  H01B5/16 ,  H01L21/66 ,  H01L23/498 ,  H01R11/01 ,  H01R33/76 ,  H05K1/11 ,  H05K3/40 ,  H05K3/42 ,  H01R12/00

CPC classification number: G01R1/07314 ,  G01R1/06711 ,  G01R1/06733 ,  H01L23/49811 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01R11/01 ,  H01R12/523 ,  H05K1/116 ,  H05K3/4007 ,  H05K3/423 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09436 ,  H05K2201/09481 ,  H05K2203/0733 ,  H01L2924/00

Abstract: Disclosed herein are a sheet-like connector that electrode structures each having a front-surface electrode part small in diameter can be formed, a stable electrically connected state can be surely achieved even to a circuit device, on which electrodes have been formed at a small pitch, and the electrode structures are prevented from falling off from an insulating sheet to achieve high durability, and a production process and applications thereof. The sheet-like connector of the invention has an insulating sheet and a plurality of electrode structures arranged in the insulating sheet and extending through in a thickness-wise direction of the insulating sheet. Each of the electrode structures is composed of a front-surface electrode part exposed to a front surfaces of the insulating sheet and projected from the front surface of the insulating sheet, a back-surface electrode part exposed to a back surface of the insulating sheet, a short circuit part continuously extending from the base end of the front-surface electrode part through the insulating sheet in the thickness-wise direction thereof and linked to the back-surface electrode part, and a holding part continuously extending from a base end portion of the front-surface electrode part outward along the front surface of the insulating sheet.

Abstract translation: 这里公开了一种片形连接器，其可以形成具有直径小的前表面电极部分的电极结构，甚至可以可靠地获得稳定的电连接状态，其中电路已经形成在小电极 节距，并且防止电极结构从绝缘片脱落以实现高耐久性，以及其制造方法和应用。 本发明的片状连接器具有布置在绝缘片中的绝缘片和多个电极结构，并沿绝缘片的厚度方向延伸。 每个电极结构由暴露于绝缘片的前表面并从绝缘片的前表面突出的前表面电极部分，暴露于绝缘片的背面的背面电极部分组成， 从前表面电极部分的基端沿其厚度方向通过绝缘片连续地延伸并连接到背面电极部分的短路部分，以及从背面电极部分的基端部分连续延伸的保持部分， 前表面电极部分沿着绝缘片的前表面向外。