公开(公告)号：US07368666B2

公开(公告)日：2008-05-06

申请号：US11351780

申请日：2006-02-10

Applicant: Shuichi Takeda

Inventor： Shuichi Takeda

IPC: H05K1/16

CPC classification number: H05K1/141 ,  H05K3/341 ,  H05K3/3436 ,  H05K3/368 ,  H05K2201/094 ,  H05K2201/10242 ,  H05K2201/10371 ,  H05K2201/2036 ,  H05K2203/1572 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: A surface-mounting type electronic circuit unit includes pedestal bases. The pedestal bases are attached to first lands provided on the bottom surface of an insulating substrate and are made of plate-shaped metal material having a solder film on the outer surface thereof. Solder bumps are provided on second lands. Since the pedestal bases used as the mounting reference of the insulating substrate is formed in a plate shape and is placed on the same plane as the first lands and the mother board, the contact state between the first lands a the mother board is effectively stabilized. In addition, since the solderable amount is more than that of a conventional invention, the solder is not detached due to an impact.

Abstract translation: 表面安装型电子电路单元包括基座。 基座底座安装在绝缘基板的底面上的第一台面上，在其外表面由具有焊锡膜的板状金属材料制成。 焊接凸点设置在第二焊盘上。 由于用作绝缘基板的安装基准的基座基板形成为板状并且与第一焊盘和母板放置在同一平面上，所以母板的第一焊盘之间的接触状态被有效地稳定。 此外，由于可焊接量大于常规发明的量，焊料不会由于冲击而脱落。

公开(公告)号：US07316572B2

公开(公告)日：2008-01-08

申请号：US10906111

申请日：2005-02-03

Applicant: William E. Bernier ,  David E. Eichstadt ,  Mukta G. Farooq ,  John U. Knickerbocker

Inventor： William E. Bernier ,  David E. Eichstadt ,  Mukta G. Farooq ,  John U. Knickerbocker

IPC: H01R12/00

CPC classification number: H01L24/13 ,  G01R1/06716 ,  G01R1/07314 ,  G01R3/00 ,  H01L21/6835 ,  H01L24/11 ,  H01L24/81 ,  H01L2221/68377 ,  H01L2224/11003 ,  H01L2224/114 ,  H01L2224/11505 ,  H01L2224/116 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13169 ,  H01L2224/1318 ,  H01L2224/13184 ,  H01L2224/81205 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/8384 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/30105 ,  H01L2924/30107 ,  H05K3/06 ,  H05K3/3436 ,  H05K2201/10242 ,  Y02P70/613 ,  Y10T29/49124 ,  Y10T29/49204 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/0401

Abstract: A method of forming compliant electrical contacts includes patterning a conductive layer into an array of compliant members. The array of compliant members is then positioned to be in contact with electrical connection pads on an integrated circuit wafer and the compliant members are joined to the pads. Then, the supporting layer that supported the compliant members is removed to leave the compliant members connected to the pads.

Abstract translation: 形成顺应性电触头的方法包括将导电层图案化为顺应构件阵列。 然后将顺应构件阵列定位成与集成电路晶片上的电连接焊盘接触，并且柔性构件连接到焊盘。 然后，移除支撑柔顺构件的支撑层，以使与柔性构件连接的衬垫离开。

公开(公告)号：US20070279871A1

公开(公告)日：2007-12-06

申请号：US11755379

申请日：2007-05-30

Applicant: Yuichi ISHIDA ,  Masaaki ISHIGURO ,  Kazuaki Nakamura

Inventor： Yuichi ISHIDA ,  Masaaki ISHIGURO ,  Kazuaki Nakamura

IPC: H05K7/20

CPC classification number: H05K5/0247 ,  H05K1/0204 ,  H05K1/056 ,  H05K3/3447 ,  H05K7/20436 ,  H05K2201/066 ,  H05K2201/10242 ,  H05K2201/1028

Abstract: A circuit board includes a plate-shaped conductive core and an insulative section covering the core. An electrical component is disposed on the insulative section. A heat radiating member is disposed on the insulative section and connected to the core. A casing houses the circuit board, the electrical component and the heat generating member.

Abstract translation: 电路板包括板状导电芯和覆盖芯的绝缘部。 电气部件设置在绝缘部上。 散热构件设置在绝缘部上并与芯连接。 壳体容纳电路板，电气部件和发热部件。

公开(公告)号：US07291922B2

公开(公告)日：2007-11-06

申请号：US11207715

申请日：2005-08-22

Applicant: Hokichi Yoshioka ,  Kazuhiko Ito

Inventor： Hokichi Yoshioka ,  Kazuhiko Ito

IPC: H01L23/48

CPC classification number: H05K3/4046 ,  H01L23/10 ,  H01L23/49827 ,  H01L2924/0002 ,  H01L2924/01079 ,  H05K1/0306 ,  H05K3/388 ,  H05K2201/09572 ,  H05K2201/10242 ,  H01L2924/00

Abstract: A substrate having many via contact means disposed therein. Each of the via contact means is composed of a via hole, as a through-hole, formed in the substrate, a metal film disposed on the inner peripheral surface of the via hole, and a solder filled into the cavity defined by the metal film.

Abstract translation: 具有设置在其中的许多通孔接触装置的基板。 每个通孔接触装置由形成在基板中的作为通孔的通孔，设置在通孔的内周面上的金属膜和填充到由金属膜限定的空腔中的焊料构成 。

公开(公告)号：US20070228549A1

公开(公告)日：2007-10-04

申请号：US11473271

申请日：2006-06-23

Applicant: Yung-Yu Hsu ,  Shyi- Liau ,  Ra-Min Tain ,  Jr-Yuan Jeng

Inventor： Yung-Yu Hsu ,  Shyi- Liau ,  Ra-Min Tain ,  Jr-Yuan Jeng

IPC: H01L23/04

CPC classification number: H01L21/4853 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/12 ,  H01L24/742 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05571 ,  H01L2224/111 ,  H01L2224/13076 ,  H01L2224/13078 ,  H01L2224/13099 ,  H01L2224/13147 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01019 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/368 ,  H05K2201/10242 ,  H05K2201/10265 ,  H01L2224/05599 ,  H01L2224/05099

Abstract: An interconnect structure with stress buffering ability is disclosed, which comprises: a first surface, connected to a device selected form the group consisting of a substrate and an electronic device; a second surface, connected to a device selected form the group consisting of the substrate and the electronic device; a supporting part, sandwiched between and interconnecting the first and the second surfaces while enabling the areas of the two ends of the supporting part to be small than those of the first and the second surfaces in respective; and a buffer, arranged surrounding the supporting part for absorbing and buffering stresses.

Abstract translation: 公开了具有应力缓冲能力的互连结构，其包括：第一表面，连接到由基板和电子器件组成的组中选择的器件; 第二表面，连接到从由所述基板和所述电子装置组成的组中选择的装置; 支撑部分，夹持在第一和第二表面之间并互相连接，同时使得支撑部分的两个端部的区域相对于第一和第二表面的面积小; 以及缓冲器，其布置成围绕所述支撑部分以吸收和缓冲应力。

公开(公告)号：US20070125571A1

公开(公告)日：2007-06-07

申请号：US11292694

申请日：2005-12-02

Applicant: Anthony Casasnovas ,  Scott Dukes

Inventor： Anthony Casasnovas ,  Scott Dukes

IPC: H05K1/16

CPC classification number: H05K3/3436 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/15312 ,  H05K2201/10242 ,  H05K2201/10265 ,  H05K2201/1031 ,  H05K2201/10893 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49222 ,  Y10T29/53174 ,  H01L2924/00

Abstract: A method for forming interconnections within a column grid array is provided. The method involves casting one or more columns with at least a compliant core material that increases flexibility between an electronic component and a printed wiring board by at least a factor of two over metallic-based solder columns, and forming the one or more columns to length for interconnecting between the electronic component and the printed wiring board. The method also involves forming a conductive material for the one or more columns to provide electrical interconnection between the electronic component and the printed wiring board.

Abstract translation: 提供了一种用于在列网格阵列内形成互连的方法。 该方法包括用至少一种柔性芯材料铸造一个或多个柱，其在金属基焊料柱上增加电子部件和印刷线路板之间的至少两倍的柔性，并且将一个或多个柱形成长度 用于在电子部件和印刷电路板之间互连。 该方法还涉及形成用于一个或多个列的导电材料以提供电子部件和印刷线路板之间的电互连。

公开(公告)号：US20050285253A1

公开(公告)日：2005-12-29

申请号：US10876434

申请日：2004-06-24

Applicant: Kumamoto Takashi

Inventor： Kumamoto Takashi

IPC: H01L21/4763 ,  H01L21/48 ,  H01L23/053 ,  H05K1/02 ,  H05K3/02 ,  H05K3/34 ,  H05K3/38 ,  H05K3/40

CPC classification number: H01L21/486 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/16152 ,  H05K1/0204 ,  H05K3/022 ,  H05K3/341 ,  H05K3/386 ,  H05K3/4046 ,  H05K2201/0355 ,  H05K2201/10242 ,  H05K2201/10416 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A preformed copper plug may be inserted into a via hole in a package substrate. The opposed surfaces of the copper preform may be covered with a solder material. Copper foils may then be applied over the core and over the preformed plug. A vacuum hot press method may be utilized to activate or cure adhesive between the foil and the core to adhesively secure the foil to the core. At the same time, the heat from the vacuum hot press method may solder the copper foil to the solder coated copper plug. Thus, in some embodiments, the difficulty of filling via holes in situ with plated copper may be reduced, increasing throughput and reducing cost in some cases.

Abstract translation: 预先形成的铜塞可以插入到封装基板的通孔中。 铜预制件的相对表面可以用焊料材料覆盖。 然后可以将铜箔施加在芯上并在预制塞上。 可以使用真空热压法来激活或固化箔和芯之间的粘合剂，以将箔粘合地固定到芯上。 同时，来自真空热压法的热量可以将铜箔焊接到焊料涂覆的铜塞上。 因此，在一些实施例中，可以减少用电镀铜原位填充孔的困难，在一些情况下可以降低生产量并降低成本。

公开(公告)号：US20050266703A1

公开(公告)日：2005-12-01

申请号：US11140195

申请日：2005-05-27

Applicant: Atsuhito Noda ,  Yasuhiro Ichijo ,  Shigeyuki Hoshikawa

Inventor： Atsuhito Noda ,  Yasuhiro Ichijo ,  Shigeyuki Hoshikawa

IPC: H01R4/02 ,  H01R12/00 ,  H01R13/24 ,  H05K3/30 ,  H05K3/34

CPC classification number: H01R12/714 ,  H01R4/028 ,  H01R12/52 ,  H01R12/57 ,  H01R13/24 ,  H01R13/2414 ,  H05K3/305 ,  H05K3/3436 ,  H05K2201/0133 ,  H05K2201/0311 ,  H05K2201/10242 ,  H05K2201/10257 ,  H05K2201/10378 ,  H05K2201/10424 ,  H05K2201/10977 ,  H05K2201/2081 ,  Y02P70/613

Abstract: Multiple small conductive and flexible hollow rings, each of which is made from a pliable material, provide a flexible connection medium for use between a substrate and a microelectronic device package. Each ring is soldered to both the substrate and the device and held in place during manufacture by way of a flexible non-conductive film in which H-shaped cutouts are formed and into which a conductive ring is inserted. The interior sections of the H-shaped cutouts extend into the conductive rings and hold the rings in place during manufacture. A portion of the sidewall of each ring is not soldered thus insuring that at least part of the ring stays flexible. The rings accommodate elevation differences on a substrate and electronic device package. They also provide a vibration resistant and flexible joint.

Abstract translation: 多个小型导电和柔性中空环，其每一个由柔韧材料制成，提供用于衬底和微电子器件封装之间的柔性连接介质。 每个环被焊接到基板和装置两者，并且在制造期间通过柔性非导电膜保持在适当的位置，其中形成有H形的切口并且插入导电环。 H形切口的内部部分延伸到导电环中，并在制造过程中将环保持在适当位置。 每个环的侧壁的一部分不被焊接，从而确保至少部分环保持柔性。 环可适应基板和电子设备封装上的高程差。 它们还提供抗振动和柔性接头。

公开(公告)号：US20040135251A1

公开(公告)日：2004-07-15

申请号：US10732666

申请日：2003-12-08

Inventor： John P. Tellkamp ,  Akira Matsunami

IPC: H01L023/48

CPC classification number: H05K3/3436 ,  B23K3/0623 ,  B23K35/001 ,  B23K35/0222 ,  B23K35/0238 ,  B23K2101/40 ,  H01L23/562 ,  H01L24/11 ,  H01L24/13 ,  H01L24/81 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/29109 ,  H01L2224/29111 ,  H01L2224/81801 ,  H01L2924/0001 ,  H01L2924/00013 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01022 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/14 ,  H05K3/3463 ,  H05K2201/10242 ,  H05K2201/10992 ,  H05K2203/033 ,  H05K2203/0415 ,  Y02P70/613 ,  Y10T29/49149 ,  H01L2924/01083 ,  H01L2924/00014 ,  H01L2924/0105 ,  H01L2224/29099

Abstract: An integrated circuit chip 903, which has a plurality of pads 903b and non-reflowable contact members 1201 to be connected by reflow attachment to external parts. Each of these contact members 1201 has a height-to-diameter ratio and uniform diameter favorable for absorbing strain under thermo-mechanical stress. The members have a solderable surface 1202 on each end and a layer of reflowable material on each end. Each member is solder-attached (1204) at one end to a chip contact pad 903b, while the other end (1203) of each member is operable for reflow attachment to external parts.

Abstract translation: 集成电路芯片903，其具有多个焊盘903b和不可回流接触部件1201，以通过回流附着到外部部件来连接。 这些接触构件1201中的每一个具有有利于在热机械应力下吸收应变的高度 - 直径比和均匀的直径。 这些构件在每个端部上具有可焊接表面1202，并且在每一端具有一层可回流材料。 每个构件在一端被焊接附着（1204）到芯片接触垫903b，而每个构件的另一端（1203）可操作以用于回流附着到外部部件。

公开(公告)号：US20040113708A1

公开(公告)日：2004-06-17

申请号：US10475072

申请日：2003-10-17

Inventor： Hitoshi Takanashi ,  Tsuneo Uchiyama ,  Youji Nagano ,  Kyo Horie ,  Noriyuki Watanabe ,  Kazuhiro Shii

IPC: H03B005/32

CPC classification number: H03H9/1021 ,  H03H9/0547 ,  H03H9/0552 ,  H05K1/181 ,  H05K3/3442 ,  H05K5/0091 ,  H05K2201/10083 ,  H05K2201/10234 ,  H05K2201/10242 ,  H05K2201/10515 ,  H05K2201/2018 ,  Y02P70/611

Abstract: A piezoelectric oscillator comprising a piezoelectric vibrator with a piezoelectric vibrating element housed in a package and bottom terminals formed on the outer side of the bottom of the package, a circuit board with at least one electronic circuit component mounted and conductor patterns formed on the top side, and columnlike supports which mechanically and electrically connects the bottom terminals of the piezoelectric vibrator and the conductor patterns on the circuit board. The piezoelectric oscillator has a smaller board occupation area, and can be manufactured by quantity production using a batch process at a high productivity and a reduced cost.

Abstract translation: 一种压电振荡器，包括压电振动器，其具有容纳在封装中的压电振动元件和形成在所述封装的底部的外侧上的底端子;电路板，具有安装的至少一个电子电路部件和形成在所述顶侧上的导体图案 和柱状支撑体，其将压电振动器的底端和电路板上的导体图案机械地和电连接。 压电振荡器具有较小的板占用面积，并且可以通过以高生产率和降低成本的批量处理的数量生产来制造。