公开(公告)号：US08314347B2

公开(公告)日：2012-11-20

申请号：US12637244

申请日：2009-12-14

Applicant: Kenta Uchiyama ,  Akihiko Tateiwa ,  Yuji Kunimoto

Inventor： Kenta Uchiyama ,  Akihiko Tateiwa ,  Yuji Kunimoto

IPC: H05K1/11 ,  H05K1/09 ,  H01B5/00 ,  H01L23/48

CPC classification number: H05K3/303 ,  H01R12/718 ,  H05K3/284 ,  H05K2201/10318 ,  H05K2201/10424 ,  H05K2201/10977 ,  H05K2203/1147 ,  Y02P70/613 ,  Y10T29/49162 ,  Y10T29/49171

Abstract: A wiring board with lead pins includes: connection pads formed on a wiring board, and lead pins bonded through a conductive material to the connection pads, wherein each of the lead pins has a head portion that is formed in one end of a shaft portion to be larger in diameter than the shaft portion, the head portions are bonded to the connection pads by the conductive material, a face of the wiring board on which the connection pads are formed is resin-sealed by a first resin to be thicker than the head portions, except portions to which the head portions are bonded, and sides of faces of the head portions to which the shaft portions are connected are sealed to be in close contact with the first resin by a second resin.

Abstract translation: 具有引线引脚的布线板包括：形成在布线板上的连接焊盘和通过导电材料连接到连接焊盘的引线引脚，其中每个引脚具有形成在轴部分的一端中的头部， 直径比轴部分大，头部通过导电材料接合到连接焊盘，其上形成有连接焊盘的布线板的表面被第一树脂树脂密封以比头部厚 除了头部接合的部分和与轴部分连接的头部的表面的侧面之外的部分被第二树脂密封以与第一树脂紧密接触。

公开(公告)号：US20120252301A1

公开(公告)日：2012-10-04

申请号：US13524037

申请日：2012-06-15

Applicant: Wen-Hsin Lin ,  Ching-Kun Lai ,  Chien-Hung Chen

Inventor： Wen-Hsin Lin ,  Ching-Kun Lai ,  Chien-Hung Chen

IPC: H01J9/00

CPC classification number: H01J9/241 ,  H05K3/0058 ,  H05K3/341 ,  H05K2201/10318 ,  H05K2201/10409 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/49128 ,  Y10T29/4913

Abstract: A method for manufacturing PCB, a display module and a method for fabricating a display module is disclosed. The method for fabricating a display module comprises the following steps. A printed circuit board with at least one locating pin formed thereon is provided. The printed circuit board is positioned on a backboard of a display module by means of the locating pin.

Abstract translation: 公开了一种制造PCB的方法，显示模块和制造显示模块的方法。 制造显示模块的方法包括以下步骤。 提供一种其上形成有至少一个定位销的印刷电路板。 印刷电路板通过定位销定位在显示模块的背板上。

公开(公告)号：US08258888B2

公开(公告)日：2012-09-04

申请号：US12588731

申请日：2009-10-26

Applicant: Hidetaka Ootsuka

Inventor： Hidetaka Ootsuka

IPC: H01P5/02

CPC classification number: H05K1/117 ,  H05K1/0216 ,  H05K1/024 ,  H05K1/025 ,  H05K2201/0792 ,  H05K2201/09663 ,  H05K2201/09909 ,  H05K2201/10318 ,  Y10T29/49204

Abstract: A substrate device includes: a substrate; a ground layer disposed on one of two opposing surfaces of the substrate; a transmission line disposed on the other of the two opposing surfaces of the substrate; a pad which is disposed on the other of the two opposing surfaces of the substrate and connected to the transmission line; and a connector connected to the pad via a contact point. The pad has a part on the transmission line side and a part positioned on the opposite side of the transmission line with respect to the contact point with the connector which are electrically insulated from each other.

Abstract translation: 衬底装置包括：衬底; 设置在所述基板的两个相对表面中的一个上的接地层; 布置在所述基板的所述两个相对表面中的另一个表面上的传输线; 衬垫，其设置在所述衬底的所述两个相对表面中的另一个上并连接到所述传输线; 以及通过接触点连接到焊盘的连接器。 衬垫在传输线侧具有一部分，并且相对于彼此电绝缘的与连接器的接触点位于传输线相对侧的部分。

公开(公告)号：US08192206B1

公开(公告)日：2012-06-05

申请号：US13159847

申请日：2011-06-14

Applicant: Ted Ju

Inventor： Ted Ju

IPC: H01R12/00

CPC classification number: H01R12/714 ,  H01R12/57 ,  H05K3/3426 ,  H05K2201/10189 ,  H05K2201/10318 ,  H05K2201/10424 ,  Y02P70/613

Abstract: An electrical connector for electrically connecting to a circuit board. In one embodiment, the electrical connector includes: an insulating body, having at least one grounding terminal slot and a plurality of signal terminal slots, at least one grounding terminal, made of a flexible conductive material and accommodated in the grounding terminal slot, and including a first base and a first soldering portion accommodated in the grounding terminal slot in a suspended manner, a plurality of signal terminals, and a plurality of solder balls, at least one of which is disposed on the first soldering portion.

Abstract translation: 一种用于电连接到电路板的电连接器。 在一个实施例中，电连接器包括：绝缘体，具有至少一个接地端子槽和多个信号端子槽，至少一个由柔性导电材料制成并容纳在接地端子槽中的接地端子，并且包括 第一基座和第一焊接部分，以悬挂的方式容纳在接地端子槽中，多个信号端子以及多个焊球，其中至少一个焊球设置在第一焊接部分上。

公开(公告)号：US08125795B2

公开(公告)日：2012-02-28

申请号：US12037289

申请日：2008-02-26

Applicant: Chih-Hung Chiang ,  Kai-Hung Huang

Inventor： Chih-Hung Chiang ,  Kai-Hung Huang

IPC: H05K1/11 ,  H05K1/14

CPC classification number: H01R12/57 ,  H01R12/7082 ,  H01R12/718 ,  H05K1/141 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/10242 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/1084 ,  H05K2201/2036 ,  H05K2203/1178 ,  Y02P70/613

Abstract: The present invention relates to a surface-mount connector for electrically interconnecting a first circuit board and a second circuit board. The surface-mount connector includes a first end part and a second end part. The first end part is bonded onto the first circuit board. The second end part has a sidewall and a receptacle defined within the sidewall for receiving a solder bump therein. The solder bump is partially protruded from the sidewall and bonded onto the second circuit board such that the first circuit board and the second circuit board are electrically connected to each other.

Abstract translation: 本发明涉及一种用于电连接第一电路板和第二电路板的表面安装连接器。 表面安装连接器包括第一端部和第二端部。 第一端部被接合到第一电路板上。 第二端部具有侧壁和限定在侧壁内的容器，用于在其中容纳焊料凸块。 焊料凸起部分地从侧壁突出并且接合到第二电路板上，使得第一电路板和第二电路板彼此电连接。

公开(公告)号：US08120166B2

公开(公告)日：2012-02-21

申请号：US12512277

申请日：2009-07-30

Applicant: Naoyuki Koizumi ,  Akihiko Tateiwa

Inventor： Naoyuki Koizumi ,  Akihiko Tateiwa

IPC: H01L23/538

CPC classification number: H05K3/284 ,  H01L21/4853 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/0102 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/1461 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K3/4682 ,  H05K2201/091 ,  H05K2201/10318 ,  H05K2201/10977 ,  H01L2224/0401

Abstract: A semiconductor package of the present invention, includes a wiring substrate, a lead pin fixed to a connection pad on one surface side of the wiring substrate by solder, and a reinforcing resin layer formed on a surface of the wiring substrate on which the lead pin is provided and having a projection-shaped resin portion which projects locally around the lead pin and covers a side surface of a base portion side of the lead pin. The projection-shaped resin portion has a top surface extending from an outer peripheral portion of the lead pin to an outside, and a side surface constituting a non-identical surface to the top surface.

Abstract translation: 本发明的半导体封装包括布线基板，通过焊料固定在布线基板的一个表面侧的连接焊盘的引线引脚，以及形成在布线基板的表面上的强化树脂层，引线引脚 并且具有突出形状的树脂部分，其突出在引线销周围局部，并且覆盖引脚的基部侧的侧表面。 突起状树脂部分具有从引脚的外周部分延伸到外部的顶表面和与顶表面构成不相同表面的侧表面。

公开(公告)号：US20120026705A1

公开(公告)日：2012-02-02

申请号：US13193422

申请日：2011-07-28

Applicant: Karl Geisler ,  Jason Klassen ,  Michael Woizeschke

Inventor： Karl Geisler ,  Jason Klassen ,  Michael Woizeschke

IPC: H05K1/18 ,  H01B5/00

CPC classification number: H01L23/49811 ,  H01L2924/0002 ,  H05K3/32 ,  H05K3/3421 ,  H05K2201/10318 ,  H05K2201/10378 ,  H05K2201/10757 ,  H05K2201/10962 ,  Y02P70/613 ,  H01L2924/00

Abstract: An interposer lead provides a connection between an integrated circuit and a circuit board. The interposer lead includes a first leg for interfacing with the circuit board. The interposer lead also includes a second leg disposed generally parallel to the first leg for interfacing with an IC electrical lead extending from the integrated circuit. A connecting portion operatively connects the first leg and the second leg. The interposer lead further includes a lip extending non-parallel from the second leg for limiting movement of the IC electrical lead on the second leg.

Abstract translation: 插入器引线提供集成电路和电路板之间的连接。 插入器引线包括用于与电路板接口的第一支脚。 插入器引线还包括大致平行于第一支腿设置的第二支脚，用于与从集成电路延伸的IC电引线对接。 连接部分可操作地连接第一腿部和第二腿部。 插入器引线还包括从第二支腿不平行地延伸的唇缘，用于限制IC电引线在第二支腿上的移动。

公开(公告)号：US08035035B2

公开(公告)日：2011-10-11

申请号：US12412693

申请日：2009-03-27

Applicant: Toshiya Asano

Inventor： Toshiya Asano

IPC: H05K1/03

CPC classification number: H05K3/303 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L2221/68345 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15174 ,  H01L2924/15311 ,  H01L2924/15312 ,  H05K3/0064 ,  H05K3/025 ,  H05K3/3436 ,  H05K3/4644 ,  H05K2201/10318 ,  H05K2201/10424 ,  Y02P70/613 ,  Y10T29/49117 ,  H01L2224/05599

Abstract: A multi-layer wiring board without a core substrate includes: a multi-layer laminated structure; first terminals provided on a front surface of the multi-layer laminated structure; second terminals provided on a rear surface of the multi-layer laminated structure; a solder resist which covers the rear surface and which has solder resist openings formed at positions corresponding to the second terminals; a reinforcing plate which is made of a non-metal material and which has reinforcing plate openings formed at positions corresponding to the second terminals; and an adhesive layer interposed between the solder resist and the reinforcing plate to fix the reinforcing plate to the solder resist and which includes adhesive layer openings formed at positions corresponding to the second terminals. A diameter of the solder resist openings and a diameter of the reinforcing plate openings are smaller than that of the adhesive layer openings.

Abstract translation: 没有芯基板的多层布线板包括：多层层叠结构; 设置在所述多层层叠结构的前表面上的第一端子; 设置在所述多层层叠结构的后表面上的第二端子; 覆盖后表面的阻焊剂，并且在与第二端子对应的位置上形成阻焊剂开口; 加强板，其由非金属材料制成，并且在对应于第二端子的位置处形成有加强板开口; 以及插入在阻焊剂和加强板之间的粘合剂层，以将加强板固定到阻焊剂上，并且包括形成在对应于第二端子的位置处的粘合剂层开口。 阻焊剂开口的直径和加强板开口的直径小于粘合剂层开口的直径。

公开(公告)号：US20110127080A1

公开(公告)日：2011-06-02

申请号：US13019550

申请日：2011-02-02

Applicant: Joseph C. Fjelstad

Inventor： Joseph C. Fjelstad

IPC: H05K1/11 ,  H05K3/02

CPC classification number: H05K1/144 ,  H01L24/73 ,  H01L24/82 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01063 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15184 ,  H01L2924/3025 ,  H05K1/0207 ,  H05K1/185 ,  H05K3/284 ,  H05K3/4664 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/10189 ,  H05K2201/10318 ,  H05K2201/10386 ,  H05K2201/1056 ,  H05K2203/1316 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The present invention provides an electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1700. The assembly 400 uses no solder. Components 406, or component packages 402, 802, 804, 806 with I/O leads 412 are placed 800 onto a planar substrate 808. The assembly is encapsulated 900 with electrically insulating material 908 with vias 420, 1002 formed or drilled 1000 through the substrate 808 to the components' leads 412. Then the assembly is plated 1200 and the encapsulation and drilling process 1500 repeated to build up desired layers 422, 1502, 1702.

Abstract translation: 本发明提供电子组件400及其制造方法800,900,10001200,1400,1500,1700。组件400不使用焊料。 具有I / O引线412的组件406或组件封装402,802,804,806被放置在800平面衬底808上。该组件被电绝缘材料908封装，电绝缘材料908具有穿过衬底形成或钻孔1000的通孔420,1002。 808到组件引线412.然后组装电镀1200，并重复封装和钻孔工艺1500以建立所需的层422,1502,1702。

公开(公告)号：US07944028B2

公开(公告)日：2011-05-17

申请号：US12154753

申请日：2008-05-27

Applicant: Don Saunders ,  Gabe Cherian

Inventor： Don Saunders ,  Gabe Cherian

IPC: H01L21/60

CPC classification number: H05K3/3426 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/49555 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/73 ,  H01L24/742 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/1012 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13184 ,  H01L2224/13582 ,  H01L2224/136 ,  H01L2224/13655 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/1601 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45599 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73203 ,  H01L2224/73251 ,  H01L2224/73257 ,  H01L2224/81903 ,  H01L2224/85 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15331 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K3/308 ,  H05K2201/09418 ,  H05K2201/10318 ,  H05K2201/10424 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10825 ,  H05K2201/10871 ,  H05K2201/10946 ,  H05K2201/10977 ,  H05K2203/0769 ,  Y02P70/613 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/72

Abstract: Two groups of interconnection devices and methods are described. Both provide columns between electronic packages and boards or between chips and substrates or the like. In the first group, called Thermal Flex Contact Carrier (TFCC), the column elements are carved out of a flat laminated structure and then formed to suit. In the second group, the carrier, which carries the connecting elements, is made out of a soluble or removable material, which acts at the same time, as a solder mask, to prevent the solder from wicking along the stem of the elements.

Abstract translation: 描述了两组互连设备和方法。 两者都在电子封装和电路板之间或芯片和衬底之间提供列等。 在第一组中，称为热挠性接触载体（TFCC），将柱元素从平面层压结构中雕刻出来，然后形成。 在第二组中，承载连接元件的载体由可溶或可移除的材料制成，其作为焊接掩模同时作用，以防止焊料沿着元件的芯部芯吸。