公开(公告)号：US20090068864A1

公开(公告)日：2009-03-12

申请号：US12222321

申请日：2008-08-07

Applicant: Takayoshi Honda ,  Minoru Hozuka

Inventor： Takayoshi Honda ,  Minoru Hozuka

IPC: H01R12/00

CPC classification number: H05K3/3447 ,  H01R12/57 ,  H01R12/58 ,  H01R12/724 ,  H01R43/0256 ,  H05K1/116 ,  H05K2201/09381 ,  H05K2201/10189 ,  H05K2201/10787 ,  H05K2201/1084 ,  H05K2201/10848 ,  H05K2201/10856 ,  H05K2201/10871 ,  H05K2203/1178

Abstract: An electronic device includes a printed circuit board and an electronic element having a terminal. The terminal has a surface section and an insertion section. The printed circuit board includes a through hole extending from a first surface to a second surface of the printed circuit board, a surface land disposed on the first surface, and an insertion land integrally disposed on a sidewall of the through hole and on a periphery around the through hole. The surface section is coupled with the surface land through a solder. The insertion section is disposed in the through hole and is coupled with the insertion land through the solder. The surface section has a recess part and a portion of recess part is disposed so as to be axially aligned with a portion of the through hole.

Abstract translation: 电子设备包括印刷电路板和具有端子的电子元件。 端子具有表面部分和插入部分。 印刷电路板包括从印刷电路板的第一表面延伸到第二表面的通孔，设置在第一表面上的表面焊盘，以及一体地设置在通孔的侧壁上和周围的周边的插入槽 通孔。 表面部分通过焊料与表面焊盘耦合。 插入部设置在通孔中，并通过焊料与插入平台联接。 表面部分具有凹部，凹部的一部分设置成与通孔的一部分轴向对齐。

公开(公告)号：US20090032915A1

公开(公告)日：2009-02-05

申请号：US12154753

申请日：2008-05-27

Applicant: Gabe Cherian ,  Don Saunders

Inventor： Gabe Cherian ,  Don Saunders

IPC: H01L21/60 ,  H01L23/495

CPC classification number: H05K3/3426 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/49555 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/73 ,  H01L24/742 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/1012 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13184 ,  H01L2224/13582 ,  H01L2224/136 ,  H01L2224/13655 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/1601 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45599 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73203 ,  H01L2224/73251 ,  H01L2224/73257 ,  H01L2224/81903 ,  H01L2224/85 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15331 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K3/308 ,  H05K2201/09418 ,  H05K2201/10318 ,  H05K2201/10424 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10825 ,  H05K2201/10871 ,  H05K2201/10946 ,  H05K2201/10977 ,  H05K2203/0769 ,  Y02P70/613 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/72

Abstract: Two groups of interconnection devices and methods are described. Both provide columns between electronic packages and boards or between chips and substrates or the like. In the first group, called Thermal Flex Contact Carrier (TFCC), the column elements are carved out of a flat laminated structure and then formed to suit. In the second group, the carrier, which carries the connecting elements, is made out of a soluble or removable material, which acts at the same time, as a solder mask, to prevent the solder from wicking along the stem of the elements.

Abstract translation: 描述了两组互连设备和方法。 两者都在电子封装和电路板之间或芯片和衬底之间提供列等。 在第一组中，称为热挠性接触载体（TFCC），将柱元素从平面层压结构中雕刻出来，然后形成。 在第二组中，承载连接元件的载体由可溶或可移除的材料制成，其作为焊接掩模同时作用，以防止焊料沿着元件的芯部芯吸。

公开(公告)号：US20080284535A1

公开(公告)日：2008-11-20

申请号：US11975753

申请日：2007-10-22

Applicant: Takeshi Uchida ,  Manabu Ito ,  Tomotaka Kuroda

Inventor： Takeshi Uchida ,  Manabu Ito ,  Tomotaka Kuroda

IPC: H03B5/30 ,  B32B3/24

CPC classification number: H01R43/0256 ,  H01R12/52 ,  H05K1/141 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/09036 ,  H05K2201/09463 ,  H05K2201/10303 ,  H05K2201/1084 ,  H05K2201/10871 ,  H05K2203/1178 ,  Y10T428/24612

Abstract: The present invention relates to a two-level mounting board in which a second substrate is supported horizontally by a metal pin above a first substrate having a mounting electrode on an outer base surface, the free, lower end of the metal pin is inserted in a hole provided in the surface of the first substrate, and the metal pin is affixed by solder to an annular electrode land provided on the surface of the first substrate to form an outer periphery of the hole, wherein part of the ring of the annular electrode land is cut away to open the same. This provides a two-level mounting board in which metal pins can be connected reliably to the first substrate to support the second substrate horizontally, and a crystal oscillator using the same.

Abstract translation: 本发明涉及一种二级安装板，其中第二基板由位于外基座表面上的具有安装电极的第一基板上的金属销水平支撑，金属销的自由下端插入 并且所述金属销通过焊料固定到设置在所述第一基板的表面上的环形电极焊盘，以形成所述孔的外周，其中所述环形电极的环的一部分 被切开打开一样。 这提供了两级安装板，其中金属引脚可以可靠地连接到第一基板以水平地支撑第二基板，以及使用其的晶体振荡器。

公开(公告)号：US20070284706A1

公开(公告)日：2007-12-13

申请号：US11689558

申请日：2007-03-22

Applicant: Gabe Cherian

Inventor： Gabe Cherian

IPC: H01L23/495

CPC classification number: H05K3/3426 ,  H01L21/4853 ,  H01L21/6835 ,  H01L23/49555 ,  H01L23/49811 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/72 ,  H01L24/73 ,  H01L24/742 ,  H01L24/85 ,  H01L2224/0401 ,  H01L2224/0603 ,  H01L2224/1012 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/11822 ,  H01L2224/1308 ,  H01L2224/13083 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13184 ,  H01L2224/13582 ,  H01L2224/136 ,  H01L2224/13655 ,  H01L2224/1403 ,  H01L2224/16 ,  H01L2224/1601 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/4556 ,  H01L2224/45599 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73203 ,  H01L2224/73251 ,  H01L2224/73257 ,  H01L2224/81903 ,  H01L2224/85 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01043 ,  H01L2924/01047 ,  H01L2924/01057 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15331 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H01L2924/3511 ,  H05K3/308 ,  H05K2201/09418 ,  H05K2201/10318 ,  H05K2201/10424 ,  H05K2201/10689 ,  H05K2201/10704 ,  H05K2201/10719 ,  H05K2201/10734 ,  H05K2201/10825 ,  H05K2201/10871 ,  H05K2201/10946 ,  H05K2201/10977 ,  H05K2203/0769 ,  Y02P70/613 ,  H01L2224/13099 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/05599 ,  H01L2924/00012 ,  H01L2224/72

Abstract: The present invention relates generally to permanent interconnections between electronic devices, such as integrated circuit packages, chips, wafers and printed circuit boards or substrates, or similar electronic devices. More particularly it relates to high-density electronic devices. The invention describes means and methods that can be used to counteract the undesirable effects of thermal cycling, shock and vibrations and severe environment conditions in general. For leaded devices, the leads are oriented to face the thermal center of the devices and the system they interact with. For leadless devices, the mounting elements are treated or prepared to control the migration of solder along the length of the elements, to ensure that those elements retain their desired flexibility.

Abstract translation: 本发明一般涉及电子设备之间的永久互连，例如集成电路封装，芯片，晶片和印刷电路板或基板或类似的电子设备。 更具体地说，涉及高密度电子设备。 本发明描述了可用于抵消热循环，冲击和振动以及恶劣环境条件的不良影响的手段和方法。 对于含铅器件，引线面向设备的热中心及其与之相互作用的系统。 对于无引线器件，安装元件被处理或准备好以控制沿着元件长度的焊料的迁移，以确保这些元件保持其期望的柔性。

公开(公告)号：US07199309B2

公开(公告)日：2007-04-03

申请号：US11167662

申请日：2005-06-27

Applicant: Bruce John Chamberlin ,  Mark Kenneth Hoffmeyer ,  Wai Mon Ma ,  Arch Nuttall ,  James R. Stack

Inventor： Bruce John Chamberlin ,  Mark Kenneth Hoffmeyer ,  Wai Mon Ma ,  Arch Nuttall ,  James R. Stack

IPC: H01R12/04 ,  H05K1/11

CPC classification number: H05K3/4046 ,  H05K1/112 ,  H05K3/225 ,  H05K3/429 ,  H05K2201/1025 ,  H05K2201/10287 ,  H05K2201/10871 ,  H05K2203/0242 ,  H05K2203/175 ,  Y10T29/49165 ,  Y10T29/49167

Abstract: A method to replace an electrical interface on a printed circuit board having a plurality of contact pads on a top surface, the contact pads being connected to conducting material extending through said circuit board. For the contact pad being replaced, drilling a hole through said printed circuit board at that location, and removing any remaining conductor material attached to the contact pad on the top board surface. Providing a replacement conductor/contact pad structure having a generally T-configuration with a stem and a head that completely surrounds the stem, wherein said head has a diameter greater than the diameter of the drilled hole. Inserting the replacement conductor/contact pad into the hole with said stem extending beyond the second surface of the board with the bottom surface of the head being in contact with the first surface of said board. A replacement conductor/contact pad on repaired board is also described.

Abstract translation: 一种替代在顶表面上具有多个接触焊盘的印刷电路板上的电接口的方法，所述接触焊盘连接到延伸穿过所述电路板的导电材料。 对于更换的接触垫，在该位置穿过所述印刷电路板钻一个孔，并且去除附着在顶板表面上的接触垫上的剩余的导体材料。 提供具有大致T形结构的替换导体/接触垫结构，其具有完全围绕所述杆的杆和头部，其中所述头部的直径大于所述钻孔的直径。 将替换的导体/接触垫插入孔中，其中所述杆延伸超过板的第二表面，并且头的底表面与所述板的第一表面接触。 修理板上的替换导体/接触垫也被描述。

公开(公告)号：US20070057361A1

公开(公告)日：2007-03-15

申请号：US11552803

申请日：2006-10-25

Applicant: Bernhard Lange ,  William Boyd

Inventor： Bernhard Lange ,  William Boyd

IPC: H01L23/48 ,  H01L21/00

CPC classification number: H05K3/308 ,  H01L23/49555 ,  H01L24/49 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/14 ,  H05K2201/10689 ,  H05K2201/10787 ,  H05K2201/10871 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An integrated circuit (IC) package that comprises a lead frame. The lead frame has a downset portion and leads. The downset portion has an exterior surface that is configured to face away from a mounting board, and an interior surface that is configured to face towards the mounting board. The leads are bent away from the exterior surface, and each of the leads have a first end coupled to an IC and a second end configured to pass through one of a plurality of mounting holes extending through the mounting board. The IC is coupled to the interior surface.

Abstract translation: 一种包括引线框架的集成电路（IC）封装。 引线框架具有欠压部分和引线。 凹陷部分具有被配置为远离安装板的外表面和被配置为面向安装板的内表面。 引线从外表面弯曲，并且每个引线具有联接到IC的第一端和被配置为穿过延伸穿过安装板的多个安装孔中的一个的第二端。 IC耦合到内表面。

公开(公告)号：US20040137803A1

公开(公告)日：2004-07-15

申请号：US10721833

申请日：2003-11-25

Applicant: SynQor, Inc.

Inventor： Lennart Pitzele

IPC: H01R009/24

CPC classification number: H05K7/142 ,  H01R12/58 ,  H05K1/141 ,  H05K3/308 ,  H05K3/3447 ,  H05K3/3484 ,  H05K3/368 ,  H05K2201/1081 ,  H05K2201/10871 ,  H05K2203/0545 ,  Y10T29/49165

Abstract: A dc/dc converter is mounted to a printed circuit board with rigid terminal pins which extend into a converter substrate to provide electrical connection to circuitry on the substrate. A terminal pin includes a flange which abuts the printed circuit board and spaces the converter substrate from the printed circuit board. Connection to the printed circuit board is made by solder provided between the flange and the circuit board.

公开(公告)号：US20040012931A1

公开(公告)日：2004-01-22

申请号：US10378549

申请日：2003-03-03

Applicant: SynQor, Inc.

Inventor： Lennart Pitzele

IPC: H05K001/00

CPC classification number: H05K7/142 ,  H05K1/141 ,  H05K3/308 ,  H05K3/3447 ,  H05K3/3484 ,  H05K3/368 ,  H05K2201/1081 ,  H05K2201/10871 ,  H05K2203/0545 ,  Y10T29/49165

Abstract: A dc/dc converter is mounted to a printed circuit board with rigid terminal pins which extend into a converter substrate to provide electrical connection to circuitry on the substrate. A terminal pin includes a flange which abuts the printed circuit board and spaces the converter substrate from the printed circuit board. Connection to the printed circuit board is made by solder provided between the flange and the circuit board.

Abstract translation: DC / DC转换器安装到具有刚性端子引脚的印刷电路板上，该引脚延伸到转换器基板中以提供与基板上的电路的电连接。 端子销包括与印刷电路板抵接并将转换器基板与印刷电路板隔开的凸缘。 与印刷电路板的连接是由法兰和电路板之间的焊料制成的。

公开(公告)号：US20030109170A1

公开(公告)日：2003-06-12

申请号：US10316026

申请日：2002-12-11

Applicant: YAZAKI CORPORATION

Inventor： Hiroyuki Ashiya ,  Masataka Suzuki ,  Yoshiyuki Tanaka ,  Shingo Matsuura

IPC: H01R013/58

CPC classification number: H01H1/5805 ,  H01H50/14 ,  H01H50/443 ,  H05K3/306 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/10424 ,  H05K2201/10568 ,  H05K2201/10871 ,  H05K2201/2036

Abstract: Terminals (11, 13) for electrical connection respectively have front end portions (11b, 13b) to be joined to a wiring board (20) with solder and base end portions (11a, 13a) drawn outside from a cover (7) made of heat-expanding material. In order for the base end portions to absorb stress countering the external force received from the cover subjected to thermal expansion due to the heat generated by an electromagnetic coil (5) by the deflection deformation of the intermediate portions (11c, 13c) of the terminals positioned closer to the cover than the wiring board 20 with the relay device mounted on the wiring board, the terminals are formed with a predetermined length of Lnull in the extending direction of the terminals so that the length required for necessary flexibility is secured for the intermediate portions.

Abstract translation: 用于电连接的端子（11,13）分别具有要接合到布线板（20）的前端部分（11b，13b），焊料和基端部（11a，13a）从由盖（7）制成的盖（7） 热膨胀材料。 为了使基端部能够吸收由于电磁线圈（5）由于端子的中间部（11c，13c）的偏转变形而产生的热而受到热膨胀的盖受到的外力的应力 定位在比布线板20更靠近盖子的位置，其中中继装置安装在布线板上，端子在端子的延伸方向上以预定长度的L'形成，从而确保了所需的柔性所需的长度 中间部分。

公开(公告)号：US20030034441A1

公开(公告)日：2003-02-20

申请号：US09984283

申请日：2001-10-29

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Dong-Hoon Kang ,  Joon-Ki Paik

IPC: G06M007/00

CPC classification number: G06F3/0317 ,  H05K1/0274 ,  H05K1/141 ,  H05K3/3447 ,  H05K2201/09072 ,  H05K2201/10303 ,  H05K2201/10477 ,  H05K2201/10871

Abstract: A sub chip on board for an optical mouse is disclosed. The chip on board has a sub PCB having both a plurality of input/output pads and a plurality of pin holes. A sensor die has an optical sensor wire-bonded to said input/output pads for sensing received light, and is attached to a bottom surface of the sub PCB. A transparent resin covers the sensor die at the bottom surface of the sub PCB. A cap is attached to the bottom surface of the sub PCB such that the cap covers the transparent resin, and has a hole for guiding the received light to said optical sensor. A main PCB has both a hole for guiding the received light to the optical sensor and a plurality of pin holes corresponding to the pin holes of the sub PCB. A plurality of pins are commonly inserted into the pin holes of both the main PCB and the sub PCB.

Abstract translation: 公开了一种用于光电鼠标的子芯片。 板上的芯片具有具有多个输入/输出焊盘和多个销孔的子PCB。 传感器管芯具有导线接合到所述输入/输出焊盘的光学传感器，用于感测接收到的光，并且附接到子PCB的底表面。 透明树脂覆盖子PCB底面的传感器芯片。 盖子附接到副PCB的底表面，使得帽覆盖透明树脂，并且具有用于将接收的光引导到所述光学传感器的孔。 主PCB具有用于将接收的光引导到光学传感器的孔和与子PCB的针孔对应的多个针孔。 多个引脚通常插入主PCB和副PCB的引脚孔中。