公开(公告)号：US20100141615A1

公开(公告)日：2010-06-10

申请号：US12597195

申请日：2009-02-06

Applicant: Kazuyoshi Nakamura ,  Yoshihiro Matsui

Inventor： Kazuyoshi Nakamura ,  Yoshihiro Matsui

IPC: G06F3/038

CPC classification number: H05K3/368 ,  G09G3/2965 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/10295 ,  H05K2201/10409

Abstract: In a plasma display device, the scan electrode drive circuit is mounted at least on a first circuit board generating a sustain pulse and a second circuit board outputting a scan pulse to the scan electrodes. The first circuit board includes a plurality of first metal fittings, each having a screw hole, as an output terminal. The second circuit board includes a plurality of second metal fittings, each having a through-hole, as an input terminal. The first circuit board and the second circuit board are connected to each other by inserting and screwing screws into the screw holes of the first metal fittings via the through-holes of the second metal fittings.

Abstract translation: 在等离子体显示装置中，扫描电极驱动电路至少安装在产生维持脉冲的第一电路板和向扫描电极输出扫描脉冲的第二电路板。 第一电路板包括多个第一金属配件，每个第一金属配件具有螺孔，作为输出端子。 第二电路板包括多个第二金属配件，每个具有通孔作为输入端。 第一电路板和第二电路板通过第二金属配件的通孔将螺钉插入并拧入第一金属配件的螺孔中而相互连接。

公开(公告)号：US07729131B2

公开(公告)日：2010-06-01

申请号：US11650122

申请日：2007-01-05

Applicant: Erik L. Wang ,  Louie Sangunietti

Inventor： Erik L. Wang ,  Louie Sangunietti

IPC: H05K9/00

CPC classification number: H05K1/144 ,  H05K1/18 ,  H05K7/1417 ,  H05K9/005 ,  H05K2201/042 ,  H05K2201/10371 ,  H05K2201/2018

Abstract: Electronic devices can be provided with at least one first circuit component coupled to a first circuit board, at least one second circuit component coupled to a second circuit board, and a mating assembly coupled to the boards for holding them in a vertical stack. The first circuit components can face the second circuit components in the stack. One or more of the first circuit components can be horizontally offset from one or more of the second circuit components in the stack to reduce the thickness of the mated circuit boards. Portions of the circuit boards and the mating assembly can shield the circuit components of the stack from electromagnetic interference.

Abstract translation: 电子设备可以设置有耦合到第一电路板的至少一个第一电路部件，耦合到第二电路板的至少一个第二电路部件，以及耦合到板的配合组件，用于将它们保持在垂直堆叠中。 第一个电路组件可以面对堆叠中的第二个电路组件。 第一电路部件中的一个或多个可以与堆叠中的一个或多个第二电路部件水平地偏移，以减小配对电路板的厚度。 电路板和配对组件的部分可以屏蔽堆叠的电路部件免受电磁干扰。

公开(公告)号：US20100062621A1

公开(公告)日：2010-03-11

申请号：US12209019

申请日：2008-09-11

Applicant: MICHAEL BRUENNERT ,  Peter Gregorius ,  Georg Braun ,  Andreas Gartner ,  Hermann Ruckerbauer ,  George William Alexander ,  Johannes Stecker

Inventor： MICHAEL BRUENNERT ,  Peter Gregorius ,  Georg Braun ,  Andreas Gartner ,  Hermann Ruckerbauer ,  George William Alexander ,  Johannes Stecker

IPC: H05K1/00

CPC classification number: H05K1/141 ,  H05K1/144 ,  H05K3/326 ,  H05K3/328 ,  H05K3/366 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/042 ,  H05K2201/045 ,  H05K2201/10159 ,  H05K2203/049

Abstract: Horizontal dual in-line memory modules are disclosed. In one embodiment, the memory module includes a circuit board, a plurality of memory chips attached to a top surface of the circuit board, and a plurality of connector contacts disposed under a back surface of the circuit board and extending away from the memory chips, the connector contacts being electrically coupled to the memory chips, the back surface opposite the top surface of the circuit board.

Abstract translation: 公开了水平双列直插式存储器模块。 在一个实施例中，存储器模块包括电路板，附接到电路板的顶表面的多个存储器芯片以及设置在电路板的背面下方并远离存储器芯片延伸的多个连接器触点， 连接器触点电耦合到存储器芯片，背面与电路板的顶表面相对。

公开(公告)号：US07652628B2

公开(公告)日：2010-01-26

申请号：US12048011

申请日：2008-03-13

Applicant: Jan-Willem Zweers

Inventor： Jan-Willem Zweers

IPC: H01Q1/24 ,  H01Q1/12

CPC classification number: H01Q1/273 ,  H01Q1/243 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q7/00 ,  H01Q9/27 ,  H01Q9/42 ,  H04R1/1091 ,  H04R2225/51 ,  H04R2420/07 ,  H05K1/16 ,  H05K1/189 ,  H05K2201/042

Abstract: An electronic device includes a dielectric plate oriented parallel to a first direction. A conductive trace may be on a surface of the dielectric plate and forms a meander pattern on the surface of the dielectric plate. The conductive trace forms a loop antenna element including an RF feed point at a first end of the trace and a ground point at a second end of the conductive trace. A meandered printed circuit board (PCB) extends from the dielectric plate on a side of the dielectric plate opposite the conductive trace. The meandered PCB includes a plurality of primary portions extending in a second direction perpendicular to the first direction, and the plurality of primary portions include electronic components mounted thereon.

Abstract translation: 电子设备包括平行于第一方向定向的电介质板。 导电迹线可以在电介质板的表面上并且在电介质板的表面上形成曲折图案。 导电迹线形成环形天线元件，其包括在迹线的第一端处的RF馈电点和导电迹线的第二端处的接地点。 蜿蜒的印刷电路板（PCB）从电介质板延伸到电介质板的与导电迹线相对的一侧。 蜿蜒的PCB包括沿垂直于第一方向的第二方向延伸的多个主要部分，并且多个主要部分包括安装在其上的电子部件。

公开(公告)号：US20090303686A1

公开(公告)日：2009-12-10

申请号：US12135556

申请日：2008-06-09

Applicant: David R. Hall ,  Jim Shumway

Inventor： David R. Hall ,  Jim Shumway

IPC: H05K5/00

CPC classification number: H05K7/1417 ,  E21B47/011 ,  H05K1/189 ,  H05K3/284 ,  H05K3/4691 ,  H05K2201/0133 ,  H05K2201/042 ,  H05K2201/2009

Abstract: A downhole tool string component has a through-bore intermediate first and second tool joints adapted for connection to adjacent tool string components. An instrumentation package is disposed within an outer diameter of the component. The instrumentation package comprises a circuit board assembly. The circuit board assembly comprises alternating rigid and elastomeric layers. The rigid layers are in electrical communication with each other.

Abstract translation: 井下工具串组件具有通孔中间的第一和第二工具接头，适于连接到相邻的工具组件。 仪器包装被设置在部件的外径内。 仪表组件包括电路板组件。 电路板组件包括交替的刚性和弹性体层。 刚性层彼此电连通。

公开(公告)号：US20090279243A1

公开(公告)日：2009-11-12

申请号：US12465560

申请日：2009-05-13

Applicant: Mike H. Amidi ,  Robert S. Pauley ,  Satyanarayan Shivkumar Iyer

Inventor： Mike H. Amidi ,  Robert S. Pauley ,  Satyanarayan Shivkumar Iyer

IPC: H05K7/00

CPC classification number: H05K1/141 ,  G11C5/04 ,  H01L25/0652 ,  H01L2924/0002 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/042 ,  H05K2201/045 ,  H05K2201/10159 ,  H05K2201/10378 ,  H05K2203/1572 ,  H01L2924/00

Abstract: A memory module with attached transposer and interposers to provide additional surface area for the placement of memory devices is disclosed. The memory module includes a memory board with a first surface, a second surface and an edge with a set of electrical contacts. A transposer is attached to each surface of the memory board, and an interposer is attached to each transposer on the opposite surface of the transposer from the memory board. The interposer has space to allow placement of memory devices on both a first surface between the interposer and the memory board, and on a second surface of the interposer away from the memory board.

Abstract translation: 公开了一种具有连接的转印器和插入件以提供用于存储器件的放置的附加表面积的存储器模块。 存储器模块包括具有第一表面，第二表面和具有一组电触点的边缘的存储器板。 将转移器连接到存储器板的每个表面，并且插入器附接到转移器的与存储器板相反的表面上的每个转台。 插入器具有允许将存储器件放置在插入器和存储器板之间的第一表面上以及在插入器的远离存储器板的第二表面上的空间。

公开(公告)号：US20090215287A1

公开(公告)日：2009-08-27

申请号：US11918121

申请日：2006-07-06

Applicant: Masato Mori ,  Yoshihiko Yagi ,  Masahiro Ono ,  Yoshihiro Tomura ,  Kunio Hibino ,  Yasushi Nakagiri ,  Akihiro Miyashita ,  Kunio Sakurai

Inventor： Masato Mori ,  Yoshihiko Yagi ,  Masahiro Ono ,  Yoshihiro Tomura ,  Kunio Hibino ,  Yasushi Nakagiri ,  Akihiro Miyashita ,  Kunio Sakurai

IPC: H01R12/14

CPC classification number: H05K3/368 ,  H05K1/0271 ,  H05K1/144 ,  H05K1/145 ,  H05K2201/042 ,  H05K2201/09036 ,  H05K2201/09163 ,  H05K2201/2018

Abstract: A substrate connecting member connects two circuit boards connected together while maintaining high reliability of the junctions between itself and the circuit boards even if the circuit boards are warped by temperature change of an impact load. The substrate connecting member includes a frame member made of an insulating resin; slit grooves formed in at least one of the inner and outer surfaces of frame side portions composing the frame member, the slit grooves being formed throughout the entire length of the frame side portions in the direction perpendicular to the thickness direction of the frame side portions; and connection conductor portions having connection terminals provided on the top and bottom surfaces, respectively, of the frame side portions in the thickness direction and connecting conductors each connecting connection terminals.

Abstract translation: 衬底连接构件连接两个连接在一起的电路板，同时保持其自身和电路板之间的接合部的高可靠性，即使电路板由于冲击负载的温度变化而翘曲。 基板连接构件包括由绝缘树脂制成的框架构件; 狭缝槽形成在构成框架构件的框架侧部的至少一个内表面和外表面中，狭缝槽沿与框架侧部的厚度方向垂直的方向在框架侧部分的整个长度上形成; 以及连接导体部分，其具有分别设置在厚度方向上的框架侧部分的顶表面和底表面上的连接端子和连接连接端子的连接导体。

公开(公告)号：US20090213533A1

公开(公告)日：2009-08-27

申请号：US12386868

申请日：2009-04-24

Applicant: Andrei Bulucea

Inventor： Andrei Bulucea

IPC: G06F1/16 ,  H05K7/00

CPC classification number: G06F1/26 ,  G06F1/188 ,  H01R12/52 ,  H01R12/75 ,  H01R13/64 ,  H05K1/144 ,  H05K2201/042 ,  H05K2201/10189 ,  H05K2201/10356 ,  H05K2201/10446 ,  H05K2201/2036

Abstract: A computer system is described. This computer system includes a main power connector and one or more circuit boards rigidly connected to the main power connector, including mechanical and electrical connection. The main power connector has a body that includes a plurality of contacts. The main power connector is configured to mate with a corresponding connector, other than an expansion slot, on a motherboard in the computer system. The motherboard is coupled to one or more processors. A first plane including a first circuit board in the one or more circuit boards is substantially parallel to a symmetry plane of the body. The symmetry plane includes a direction of insertion of the main power connector when mated with the corresponding connector. The one or more circuit boards include one or more switched mode power supplies to convert an input signal to one or more output signals.

Abstract translation: 描述了计算机系统。 该计算机系统包括主电源连接器和刚性连接到主电源连接器的一个或多个电路板，包括机械和电连接。 主电源连接器具有包括多个触点的主体。 主电源连接器被配置为与计算机系统中的主板上的对应的连接器（不同于扩展槽）配合。 主板耦合到一个或多个处理器。 在一个或多个电路板中包括第一电路板的第一平面基本上平行于主体的对称平面。 对称平面包括当与相应的连接器配合时主电源连接器的插入方向。 一个或多个电路板包括一个或多个开关模式电源，用于将输入信号转换成一个或多个输出信号。

公开(公告)号：US20090190319A1

公开(公告)日：2009-07-30

申请号：US12357809

申请日：2009-01-22

Applicant: Tomoyuki HATAKEYAMA

Inventor： Tomoyuki HATAKEYAMA

IPC: H05K1/14

CPC classification number: H05K3/368 ,  B81B7/0048 ,  B81B7/007 ,  B81B2201/042 ,  B81B2207/012 ,  B81B2207/098 ,  B81C1/0023 ,  B81C2201/019 ,  G02B26/0841 ,  H01L23/055 ,  H01L23/16 ,  H01L25/0657 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2225/06517 ,  H01L2924/1461 ,  H05K1/144 ,  H05K2201/0311 ,  H05K2201/042 ,  H05K2201/1031 ,  Y02P70/611 ,  H01L2924/00

Abstract: A three-dimensional module having a first substrate holding a function element, and a second substrate holding other components. The first and second substrates are laid one above the other in a three-dimensional fashion, and are electrically and mechanically connected. The module has inter-substrate joining members interposed between the first and second substrates and joining the first and second substrates. Each inter-substrate joining member has a stress-absorption member and an electrically conductive stress-absorption member. The stress-absorption member has elasticity and mechanically joining the first and second substrates. The electrically conductive stress-absorption member connects the first and second substrates and can deform in a desirable direction.

Abstract translation: 具有保持功能元件的第一基板和保持其他部件的第二基板的三维模块。 第一和第二基板以三维方式彼此叠置地放置，并且被电气和机械连接。 该模块具有介于第一和第二基板之间并且连接第一和第二基板的基板间连接构件。 每个衬底间接合构件具有应力吸收构件和导电应力吸收构件。 应力吸收构件具有弹性并机械地接合第一和第二基板。 导电应力吸收构件连接第一和第二基板，并且可以沿期望的方向变形。

公开(公告)号：US20090129041A1

公开(公告)日：2009-05-21

申请号：US12232990

申请日：2008-09-26

Applicant: Jung-Chan Cho ,  Yang-Je Lee ,  Hyun-Seok Choi ,  Yong-Hyun Kim ,  Jung-Hyeon Kim ,  Hyo-Jae Bang ,  Do-Hyung Kim ,  Kyoung-Sun Kim ,  Young-Ho Lee ,  Jae-Sang Baik ,  Yong-Jin Kim

Inventor： Jung-Chan Cho ,  Yang-Je Lee ,  Hyun-Seok Choi ,  Yong-Hyun Kim ,  Jung-Hyeon Kim ,  Hyo-Jae Bang ,  Do-Hyung Kim ,  Kyoung-Sun Kim ,  Young-Ho Lee ,  Jae-Sang Baik ,  Yong-Jin Kim

IPC: H05K1/14 ,  H05K1/00 ,  H05K7/10

CPC classification number: H05K1/147 ,  H05K1/117 ,  H05K1/189 ,  H05K3/323 ,  H05K3/361 ,  H05K3/4691 ,  H05K2201/042 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/0949 ,  H05K2201/10159 ,  H05K2203/1572

Abstract: A stacked semiconductor module, a method of fabricating the same, and an electronic system using the module are provided. A first semiconductor module having a plurality of semiconductor devices mounted on a rigid printed circuit board (PCB) and a second semiconductor module having a plurality of other semiconductor devices mounted on a flexible PCB are provided. On the rigid PCB a number L of first tabs may be disposed on a first surface, and a number K of second tabs may be disposed on a second surface of the rigid PCB. The flexible PCB may have a number M of third tabs on a third surface, and a number N of fourth tabs on a fourth surface of the flexible PCB. The second tabs may be combined with the third tabs using a conductive adhesive. The third tabs may be electrically connected to corresponding ones of the second tabs.

Abstract translation: 提供堆叠半导体模块，其制造方法和使用该模块的电子系统。 提供了具有安装在刚性印刷电路板（PCB）上的多个半导体器件和具有安装在柔性PCB上的多个其它半导体器件的第二半导体模块的第一半导体模块。 在刚性PCB上，可以在第一表面上设置数L个第一突出部，并且可以在刚性PCB的第二表面上设置数个K个第二突片。 柔性PCB可以在第三表面上具有数量M的第三突出部，并且在柔性PCB的第四表面上可以具有数目N的第四突出部。 第二突片可以使用导电粘合剂与第三突片组合。 第三突片可以电连接到相应的第二突片。