公开(公告)号：US20050087366A1

公开(公告)日：2005-04-28

申请号：US10991064

申请日：2004-11-17

Applicant: Timothy Crockett ,  Harry Minikel

Inventor： Timothy Crockett ,  Harry Minikel

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/14 ,  H05K1/18 ,  H05K3/40 ,  H05K1/03

CPC classification number: H05K1/0231 ,  H05K1/0298 ,  H05K1/145 ,  H05K1/184 ,  H05K1/185 ,  H05K3/4046 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/10583 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/4913 ,  Y10T29/49131 ,  Y10T29/49133 ,  Y10T29/49147 ,  Y10T29/49165 ,  Y10T29/53187

Abstract: A printed circuit board and method for reducing the impedance within the reference path and/or saving space within the printed circuit board. In one embodiment of the present invention, a printed circuit board comprises a plurality of conductive layers. The printed circuit board further comprises two or more vias for interconnecting two or more conductive layers. The printed circuit board further comprises an electrical component embedded in a particular via between two conductive layers to reduce the impedance within the reference path and/or save space within the printed circuit board.

Abstract translation: 一种用于减小参考路径内的阻抗和/或节省印刷电路板内的空间的印刷电路板和方法。 在本发明的一个实施例中，印刷电路板包括多个导电层。 印刷电路板还包括用于互连两个或更多个导电层的两个或更多个通孔。 印刷电路板还包括嵌入在两个导电层之间的特定通孔中的电气部件，以减小参考路径内的阻抗和/或节省印刷电路板内的空间。

公开(公告)号：US06879493B2

公开(公告)日：2005-04-12

申请号：US10212698

申请日：2002-08-07

Applicant: Suzushi Kimura ,  Tsuyoshi Himori ,  Koji Hashimoto

Inventor： Suzushi Kimura ,  Tsuyoshi Himori ,  Koji Hashimoto

IPC: H01L23/538 ,  H01L25/16 ,  H05K1/02 ,  H05K1/18 ,  H05K3/40 ,  H05K3/46

CPC classification number: H05K1/184 ,  H01L23/5383 ,  H01L23/5386 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16265 ,  H01L2224/73204 ,  H01L2924/01078 ,  H01L2924/19103 ,  H01L2924/19105 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/185 ,  H05K3/4046 ,  H05K3/4602 ,  H05K2201/09118 ,  H05K2201/09827 ,  H05K2201/10204 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2203/1469 ,  H05K2203/161 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49155 ,  Y10T29/49158 ,  Y10T29/49172

Abstract: The invention relates to a module component having chip components buried in a circuit board, and a method of manufacturing the same, and more specifically it relates to a module component capable of obtaining desired circuit characteristics and functions stably if the size of the component is reduced, being produced very efficiently, and suited to machine mounting, and a method of manufacturing the same. According to the invention, since a desired circuit is composed by disposing a specific number of chip components according to a specified rule, it is not necessary to heat the buried chip components at high temperature when forming a module, chip components are obtained in specified values, and the circuit characteristics, functions, and dimensional precision are stably obtained exactly as designed, and moreover since the chip components are disposed according to a specified rule, it is easy to automate insertion of chip components and increase its operation speed, even if the size of the chip components is reduced, and the circuit composition may be flexibly and easily changed only by changing the inserting position and type of chip components.

Abstract translation: 本发明涉及一种具有埋入电路板中的芯片组件的模块组件及其制造方法，更具体地说，涉及一种能够获得希望的电路特性并能够稳定地工作的模块组件，如果该组件的尺寸减小 ，非常有效地生产并且适合于机器安装及其制造方法。 根据本发明，由于根据规定通过设置特定数量的芯片部件来构成所需的电路，因此在形成模块时不需要在高温下加热埋层芯片部件，以特定值获得芯片部件 ，并且电路特性，功能和尺寸精度都按照设计得到稳定的获得，而且由于芯片部件按照规定进行配置，因此即使是 芯片部件的尺寸减小，并且仅通过改变芯片部件的插入位置和类型可以灵活且容易地改变电路组成。

公开(公告)号：US06843675B2

公开(公告)日：2005-01-18

申请号：US10463040

申请日：2003-06-17

Applicant: Hiroshi Yamashita

Inventor： Hiroshi Yamashita

IPC: H01R43/02 ,  H05K3/36 ,  H01R13/62

CPC classification number: H01R43/0256 ,  H01R12/52 ,  H01R43/0263 ,  H05K3/366 ,  H05K2201/048 ,  H05K2201/09645 ,  H05K2201/09827

Abstract: In a standing board fixing structure, a main board has a long hole, and a standing board has a hole inserting portion with taper faces of convergent shape formed at a bottom portion thereof. Engagement grooves are formed at an upper end portion of each taper face. A plated wire is attached onto the main board to stride across a region in the long hole corresponding to a lower edge portion on each taper face of the standing board. When the standing board is inserted into the long hole, the plated wire is guided to be gradually spread outwards along the taper faces and fitted and engaged in the engagement grooves, and the corresponding patterns of the standing board and the main board are soldered, whereby the standing board is stood and fixed on the main board.

Abstract translation: 在立式板固定结构中，主板具有长孔，并且竖立板具有在其底部形成有锥形形状的锥形面的孔插入部。 接合槽形成在每个锥面的上端部。 电镀线附着在主板上，跨越长孔中对应于站立板的每个锥面上的下边缘部分的区域。 当将长板插入长孔时，电镀线被引导成逐渐沿着锥面向外扩展，并嵌合并接合在接合槽中，并且将常规板和主板的相应图案焊接在一起，由此 常设板站立并固定在主板上。

公开(公告)号：US20050006548A1

公开(公告)日：2005-01-13

申请号：US10618541

申请日：2003-07-10

Applicant: Seng Goh ,  Yi Hwang ,  Heng Cheng

Inventor： Seng Goh ,  Yi Hwang ,  Heng Cheng

IPC: G02F1/13 ,  H05K3/30 ,  A47H1/10

CPC classification number: G02F1/133308 ,  G02F2201/46 ,  G02F2201/465 ,  H05K3/301 ,  H05K3/306 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/10128 ,  H05K2201/10598 ,  H05K2203/1446

Abstract: Improved electronic display module for surface mount construction. Plastic components are heat-stake mounted to a printed circuit board substrate. Providing recesses for the reflowed plastic heat stakes reduces or eliminates rework required to provide flat surface needed for surface mounting.

Abstract translation: 改进的电子显示模块，用于表面贴装结构。 塑料部件被热铆钉安装到印刷电路板基板上。 为回流塑料热风提供凹槽减少或消除了为提供表面安装所需的平坦表面所需的返工。

公开(公告)号：US06793501B1

公开(公告)日：2004-09-21

申请号：US09831415

申请日：2001-09-14

Applicant: Reginald Leeman ,  Bernard Houteman ,  Georges Embo ,  Edgard Acke

Inventor： Reginald Leeman ,  Bernard Houteman ,  Georges Embo ,  Edgard Acke

IPC: H01R1200

CPC classification number: H01R24/50 ,  H01R9/0515 ,  H01R12/707 ,  H01R24/38 ,  H01R2103/00 ,  H05K3/3447 ,  H05K3/3484 ,  H05K2201/09045 ,  H05K2201/09827 ,  H05K2201/10189 ,  H05K2201/10568 ,  H05K2201/10598

Abstract: An electric circuit board component, in particular a RF coaxial connector, in which the housing (1) of the component is fixed on the circuit board (7) by way of solder joints between the SMD solder connections provided on the bottom side (6) of said housing and solder connections assigned thereto on the side of the circuit board, and in which the housing (1), for additionally securing the same to the circuit board (7), has on the bottom side (6) thereof a plurality of solderable bolt pins (11) which engage in continuous plated bolt holes (12) assigned thereto on the circuit board (7) and are soldered in said bolt holes.

Abstract translation: 一种电路板部件，特别是RF同轴连接器，其中部件的壳体（1）通过在底侧（6）上提供的SMD焊接连接之间的焊接接头固定在电路板（7）上， 在电路板一侧分配的所述壳体和焊接连接部分，其中用于将其固定到电路板（7）的壳体（1）在其底侧（6）上具有多个 可焊接螺栓销（11），它们接合在电路板（7）上分配给它的连续电镀螺栓孔（12）中，并焊接在所述螺栓孔中。

公开(公告)号：US20040066633A1

公开(公告)日：2004-04-08

申请号：US10662368

申请日：2003-09-16

Inventor： Yoshitarou Yazaki ,  Tomohiro Yokochi ,  Koji Kondo ,  Toshikazu Harada ,  Yoshihiko Shiraishi

IPC: H05K001/00 ,  H05K001/18 ,  H05K007/02 ,  H05K007/06 ,  H05K007/08

CPC classification number: H05K3/4632 ,  H05K1/095 ,  H05K3/4069 ,  H05K3/4617 ,  H05K2201/0129 ,  H05K2201/0272 ,  H05K2201/0305 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2203/0425 ,  H05K2203/1131 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49165 ,  Y10T428/24917

Abstract: Conductive paste containing tin particles and silver particles is packed in a substantially cylindrical via hole formed in a thermoplastic resin film that interposes between conductor patterns and is hot-pressed from both sides. When the metal particles contained in the conductive paste are sintered to form a unified conductive compound, the volume of the conductive paste shrinks. Synchronously, the resin film around the via-hole protrudes into the via-hole. Therefore, the shape of the side wall on the cross-section of the conductive compound provides an arch shape, and a side wall adjacent to a junction part of the conductive compound, which contacts the conductor pattern, is formed with an inclination. Therefore, it is possible to prevent the stress concentration due to deformation of the board.

Abstract translation: 含有锡颗粒和银颗粒的导电糊料被包装在形成在热塑性树脂膜中的大致圆柱形的通孔中，该热塑性树脂膜介于导体图案之间并且从两侧被热压。 当包含在导电浆料中的金属颗粒被烧结以形成统一的导电化合物时，导电浆料的体积收缩。 同时，通孔周围的树脂膜突出到通孔中。 因此，导电性化合物的横截面上的侧壁的形状形成拱形，并且与导体图案接触的导电性化合物的接合部分相邻的侧壁形成倾斜。 因此，可以防止由于板的变形引起的应力集中。

公开(公告)号：US06713687B2

公开(公告)日：2004-03-30

申请号：US10022222

申请日：2001-12-20

Applicant: Yoshitarou Yazaki ,  Tomohiro Yokochi ,  Koji Kondo ,  Toshikazu Harada ,  Yoshihiko Shiraishi

Inventor： Yoshitarou Yazaki ,  Tomohiro Yokochi ,  Koji Kondo ,  Toshikazu Harada ,  Yoshihiko Shiraishi

IPC: H05K111

CPC classification number: H05K3/4632 ,  H05K1/095 ,  H05K3/4069 ,  H05K3/4617 ,  H05K2201/0129 ,  H05K2201/0272 ,  H05K2201/0305 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2203/0425 ,  H05K2203/1131 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49165 ,  Y10T428/24917

Abstract: Conductive paste containing tin particles and silver particles is packed in a substantially cylindrical via hole formed in a thermoplastic resin film that interposes between conductor patterns and is hot-pressed from both sides. When the metal particles contained in the conductive paste are sintered to form a unified conductive compound, the volume of the conductive paste shrinks. Synchronously, the resin film around the via-hole protrudes into the via-hole. Therefore, the shape of the side wall on the cross-section of the conductive compound provides an arch shape, and a side wall adjacent to a junction part of the conductive compound, which contacts the conductor pattern, is formed with an inclination. Therefore, it is possible to prevent the stress concentration due to deformation of the board.

Abstract translation: 含有锡颗粒和银颗粒的导电糊料被包装在形成在热塑性树脂膜中的大致圆柱形的通孔中，该热塑性树脂膜介于导体图案之间并且从两侧被热压。 当包含在导电浆料中的金属颗粒被烧结以形成统一的导电化合物时，导电浆料的体积收缩。 同时，通孔周围的树脂膜突出到通孔中。 因此，导电性化合物的横截面上的侧壁的形状形成拱形，并且与导体图案接触的导电性化合物的接合部分相邻的侧壁形成倾斜。 因此，可以防止由于板的变形引起的应力集中。

公开(公告)号：US20040020688A1

公开(公告)日：2004-02-05

申请号：US10210091

申请日：2002-08-02

Applicant: United Test Center Inc.

Inventor： Chung-Che Tsai ,  Wei-Heng Shan

IPC: H05K001/09 ,  H05K001/11

CPC classification number: H05K3/3452 ,  H01L23/49816 ,  H01L2924/0002 ,  H05K3/244 ,  H05K2201/09745 ,  H05K2201/09827 ,  H05K2201/099 ,  H05K2203/0594 ,  H01L2924/00

Abstract: The present invention is to provide a printed circuit board, which comprises a substrate, a conductive pattern disposed on a surface of said substrate and a solder mask coated on the surface of said substrate and covered over the conductive pattern. The conductive pattern has a bonding pad. The solder mask has an opening corresponding in location to the bonding pad such that a portion of the bonding pad is exposed outside. A space is left between said solder mask and said bonding pad and is communicated with the opening. Whereby, a solder ball can be received in the opening and the space and electrically connected to the bonding pad, such that the solder ball is held on the printed circuit board securely.

Abstract translation: 本发明提供一种印刷电路板，其包括基板，设置在所述基板的表面上的导电图案和涂覆在所述基板的表面上且覆盖在导电图案上的焊接掩模。 导电图案具有接合焊盘。 焊接掩模具有与焊盘的位置对应的开口，使得焊盘的一部分暴露在外部。 所述焊接掩模和所述接合焊盘之间留有空间，并与开口连通。 由此，可以在开口和空间中容纳焊球并电连接到焊盘，使得焊球牢固地保持在印刷电路板上。

公开(公告)号：US20030215619A1

公开(公告)日：2003-11-20

申请号：US10436143

申请日：2003-05-13

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Kazuhiko Ooi ,  Masaru Yamazaki ,  Yukiji Watanabe ,  Takaaki Yazawa

IPC: B32B015/04

CPC classification number: H05K3/44 ,  H05K3/429 ,  H05K3/4608 ,  H05K3/4641 ,  H05K2201/09518 ,  H05K2201/09554 ,  H05K2201/09563 ,  H05K2201/09718 ,  H05K2201/09809 ,  H05K2201/09827 ,  H05K2201/09845 ,  Y10S428/901 ,  Y10T428/24917

Abstract: A metal core substrate comprises a core layer (10) consisting of first and second metal plates (11, 12) layered with a third insulating layer (13) interposed therebetween; first and second insulating layers (20, 21) formed on the first and metal plates, respectively; first and second wiring patterns (45, 46) formed on the first and second insulating layers, respectively. A conductive layer (40) formed in a through-hole (22) penetrates the first insulating layer, the first metal plate, the third insulating layer, the second metal plate and the second insulating layer for electrically connecting the first wiring pattern with the second wiring pattern. The first metal plate (11) is electrically connected with the first wiring pattern (45) and the second wiring pattern (46), respectively, by means of a via (44) and by means a via (43). The second metal plate (12) is electrically connected with the second wiring pattern (46) and the first wiring pattern (45), respectively, by means of a via (42) and by means a via (41), respectively.

Abstract translation: 金属芯基板包括由第一和第二金属板（11,12）组成的芯层（10），第一和第二金属板与第三绝缘层（13）分开; 分别形成在第一和金属板上的第一和第二绝缘层（20,21）; 分别形成在第一和第二绝缘层上的第一和第二布线图案（45,46）。 形成在通孔（22）中的导电层（40）穿过第一绝缘层，第一金属板，第三绝缘层，第二金属板和第二绝缘层，用于将第一布线图案与第二绝缘层 接线图案。 第一金属板（11）通过通孔（44）和通孔（43）分别与第一布线图案（45）和第二布线图案（46）电连接。 第二金属板（12）分别通过通孔（42）和通孔（41）与第二布线图案（46）和第一布线图案（45）电连接。

公开(公告)号：US06642625B2

公开(公告)日：2003-11-04

申请号：US10299131

申请日：2002-11-19

Applicant: Thomas H. Dozier, II ,  Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu ,  David V. Pederson ,  Michael A. Stadt

Inventor： Thomas H. Dozier, II ,  Benjamin N. Eldridge ,  Gary W. Grube ,  Igor Y. Khandros ,  Gaetan L. Mathieu ,  David V. Pederson ,  Michael A. Stadt

IPC: H01L2304

CPC classification number: G01R1/0408 ,  B23K3/087 ,  G01R1/0416 ,  G01R1/0466 ,  G01R31/2886 ,  H01L23/04 ,  H01L23/13 ,  H01L23/32 ,  H01L23/5385 ,  H01L24/72 ,  H01L2224/1134 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/16237 ,  H01L2224/73251 ,  H01L2224/8114 ,  H01L2224/81901 ,  H01L2924/00013 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/119 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/0311 ,  H05K2201/09472 ,  H05K2201/09827 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49139 ,  Y10T29/4914 ,  Y10T29/49147 ,  Y10T29/49153 ,  Y10T29/49208 ,  Y10T29/53174 ,  Y10T29/53178 ,  Y10T29/53183 ,  H01L2924/00014 ,  H01L2224/72

Abstract: Temporary connections to spring contact elements extending from an electronic component such as a semiconductor device are made by urging the electronic component, consequently the ends of the spring contact elements, vertically against terminals of an interconnection substrate, or by horizontally urging terminals of an interconnection substrate against end portions of the spring contact elements. A variety of terminal configurations are disclosed.

Abstract translation: 从诸如半导体器件的电子部件延伸的弹簧接触元件的临时连接是通过推动电子部件，因此弹簧接触元件的端部垂直地抵靠互连基板的端子，或者通过水平推动互连基板的端子 抵抗弹簧接触元件的端部。 公开了各种终端配置。