公开(公告)号：US20160037640A1

公开(公告)日：2016-02-04

申请号：US14883792

申请日：2015-10-15

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kiyofumi TAKAI ,  Hidenori OBIYA ,  Shinya HITOMI

IPC: H05K1/14 ,  H05K1/11 ,  H01L23/29 ,  H01L23/498 ,  H01L23/31 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K1/147 ,  H01L23/12 ,  H01L23/13 ,  H01L23/24 ,  H01L23/293 ,  H01L23/3107 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49833 ,  H01L23/5384 ,  H01L23/5385 ,  H01L23/552 ,  H01L23/66 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L24/81 ,  H01L2224/16227 ,  H01L2224/291 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/81205 ,  H01L2224/81801 ,  H01L2924/14 ,  H01L2924/1421 ,  H01L2924/15153 ,  H01L2924/15159 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/16152 ,  H01L2924/16251 ,  H01L2924/1631 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/0298 ,  H05K1/111 ,  H05K1/18 ,  H05K2201/042 ,  H05K2201/10007 ,  H05K2201/10053 ,  H05K2201/10098 ,  H05K2201/1053 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/00012

Abstract: In a method for mounting a filter circuit component to obtain desired frequency characteristics of the filter circuit component without receiving the influence of a parasitic inductance and a parasitic capacitance, and to increase the packing density of components, since the ground terminal of the filter circuit component connected to the mounting electrode is connected to the ground electrode through the via conductors at the shortest distance, the occurrence of an unnecessary parasitic inductance and an unnecessary parasitic capacitance is prevented. The filter circuit component is mounted on the high-frequency component to obtain the desired frequency characteristics of the filter circuit component without the influence of a parasitic inductance and a parasitic capacitance. Since the component is located in a space surrounded by the inner peripheral surface of the supporting frame body, the packing density of components is increased.

Abstract translation: 在用于安装滤波器电路部件以获得滤波器电路部件的期望频率特性而不接收到寄生电感和寄生电容的影响的方法中，并且为了增加部件的封装密度，由于滤波电路部件的接地端子 连接到安装电极的电极通过通孔导体以最短距离连接到接地电极，防止了不必要的寄生电感和不必要的寄生电容的发生。 滤波器电路组件安装在高频分量上，以获得滤波器电路组件的期望频率特性，而不受寄生电感和寄生电容的影响。 由于部件位于由支撑框体的内周面包围的空间内，所以部件的堆积密度增加。

公开(公告)号：US09253910B2

公开(公告)日：2016-02-02

申请号：US13900758

申请日：2013-05-23

Applicant: Texas Instruments Incorporated

Inventor： Mark Allen Gerber

IPC: H05K7/00 ,  H05K7/02 ,  H05K1/18

CPC classification number: H05K7/02 ,  H01L2224/16225 ,  H01L2924/1461 ,  H01L2924/19103 ,  H01L2924/19105 ,  H05K1/182 ,  H05K2201/09072 ,  H05K2201/1003 ,  H05K2201/10515 ,  H05K2201/1053 ,  Y10T29/49117 ,  Y10T29/49139 ,  H01L2924/00

Abstract: A circuit assembly includes a substrate having a substrate electrical circuit, opposite top and bottom substrate surfaces, and a substrate hole extending through the substrate. The circuit assembly also includes a discrete component assembly electrically connected to the substrate electrical circuit and a support member attached to the discrete component. At least a portion of the discrete component is physically mounted in the substrate hole.

Abstract translation: 电路组件包括具有衬底电路，相对的顶部和底部衬底表面以及延伸穿过衬底的衬底孔的衬底。 电路组件还包括电连接到基板电路的分立组件组件和附接到分立组件的支撑构件。 离散部件的至少一部分物理地安装在基板孔中。

公开(公告)号：US09252122B2

公开(公告)日：2016-02-02

申请号：US13966636

申请日：2013-08-14

Applicant: Invensas Corporation

Inventor： Ellis Chau ,  Reynaldo Co ,  Roseann Alatorre ,  Philip Damberg ,  Wei-Shun Wang ,  Se Young Yang

IPC: H01L23/00 ,  H01L23/31 ,  H01L23/498 ,  H01L21/56 ,  H01L25/10 ,  H01L25/00 ,  H01L23/495 ,  H01L21/48 ,  H01L23/367 ,  H01L23/433 ,  H01L25/065 ,  H05K3/34

CPC classification number: H01L24/85 ,  H01L21/4853 ,  H01L21/56 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/49517 ,  H01L23/49811 ,  H01L23/49816 ,  H01L24/06 ,  H01L24/16 ,  H01L24/43 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/78 ,  H01L25/0655 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/05599 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/4554 ,  H01L2224/45565 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/4824 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/48997 ,  H01L2224/49171 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/78301 ,  H01L2224/851 ,  H01L2224/8518 ,  H01L2224/85399 ,  H01L2224/85951 ,  H01L2224/85986 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06558 ,  H01L2225/06562 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2225/1094 ,  H01L2924/00011 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/12042 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/1715 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/3511 ,  H05K3/3436 ,  H05K2201/10515 ,  H05K2201/1053 ,  Y10T29/49149 ,  Y10T29/49151 ,  H01L2224/45664 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/20751 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20754 ,  H01L2924/20755 ,  H01L2924/20756 ,  H01L2924/20757 ,  H01L2924/20758 ,  H01L2924/20759 ,  H01L2924/2076

Abstract: A structure includes a substrate having a first region and a second region, the substrate also having a first surface and a second surface. Electrically conductive elements are exposed at the first surface within the second region. Wire bonds have bases bonded to respective ones of the conductive elements and ends remote from the substrate and remote from the bases. At least one of the wire bonds has a shape such that the wire bond defines an axis between the free end and the base thereof and such that the wire bond defines a plane. A bent portion of the at least one wire bond extends away from the axis within the plane. A dielectric encapsulation layer covers portions of the wire bonds such that unencapsulated portions, including the ends, of the wire bonds are defined by portions of the wire bonds that are uncovered by the encapsulation layer.

Abstract translation: 一种结构包括具有第一区域和第二区域的衬底，该衬底还具有第一表面和第二表面。 导电元件在第二区域内的第一表面露出。 引线键具有粘合到导电元件中的相应导电元件的基底并且远离基底并远离基底的基底。 线接合中的至少一个具有这样的形状，使得线接合限定自由端和其基部之间的轴线，并且使得线接合限定平面。 所述至少一个导线接合部的弯曲部分远离所述平面内的轴线延伸。 电介质封装层覆盖引线接合的部分，使得引线键合的包括末端的未封装部分由未被封装层覆盖的引线键的部分限定。

公开(公告)号：US09119322B2

公开(公告)日：2015-08-25

申请号：US14510219

申请日：2014-10-09

Applicant: IBIDEN CO., LTD.

Inventor： Yukinobu Mikado ,  Shunsuke Sakai ,  Takashi Kariya ,  Toshiki Furutani

IPC: H05K1/18 ,  H05K3/30 ,  H01G2/06 ,  H05K1/11 ,  H05K3/32 ,  H05K1/02 ,  H05K3/46

CPC classification number: H05K1/185 ,  H01G2/06 ,  H05K1/0207 ,  H05K1/115 ,  H05K3/30 ,  H05K3/32 ,  H05K3/4602 ,  H05K2201/09827 ,  H05K2201/10015 ,  H05K2201/10522 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2203/1469 ,  Y02P70/611 ,  Y10T29/49146

Abstract: A wiring board includes a substrate having an opening portion, electronic components positioned in the opening portion of the substrate and including first and second electronic components, and an insulation layer formed over the substrate and the first and second components. The first component has first and second electrodes having side portions on side surfaces of the first component, the second component has first and second electrodes having side portions on side surfaces of the second component, the first electrode of the first component and the first electrode of the second component are set to have substantially the same electric potential, and the first component and the second component are positioned in the opening portion of the substrate such that the side portion of the first electrode of the first component is beside the side portion of the first electrode of the second component.

Abstract translation: 布线板包括具有开口部分的基板，位于基板的开口部分中的电子部件，并且包括第一和第二电子部件，以及形成在基板和第一和第二部件上的绝缘层。 第一部件具有在第一部件的侧面具有侧部的第一电极和第二电极，第二部件具有第一部件和第二电极，第一部件的第一电极和第二电极具有在第二部件的侧面上的侧面部分，第一部件的第一电极和第一部件的第一电极 第二部件被设定为具有大致相同的电位，并且第一部件和第二部件位于基板的开口部分中，使得第一部件的第一电极的侧部位于第二部件的侧部 第二部件的第一电极。

公开(公告)号：US20150228400A1

公开(公告)日：2015-08-13

申请号：US14696382

申请日：2015-04-25

Applicant: Jian-Hong Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

Inventor： Jian-Hong Zeng ,  Wei Yang ,  Shou-Yu Hong ,  Jian-Ping Ying

IPC: H01F27/29 ,  H01F27/28

CPC classification number: H01F27/29 ,  H01F17/0013 ,  H01F17/0033 ,  H01F27/2804 ,  H01F2017/048 ,  H01L2224/16225 ,  H01L2924/0002 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19105 ,  H02M3/00 ,  H05K1/141 ,  H05K1/145 ,  H05K3/3442 ,  H05K7/026 ,  H05K2201/1003 ,  H05K2201/10166 ,  H05K2201/1053 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

Abstract: An electrical component is disclosed, the electrical component comprising: a magnetic body having a top surface, a bottom surface, wherein at least one first conductive through hole is formed from the top surface to bottom surface of the magnetic body; and a coil disposed in the magnetic body, wherein a first end of the coil is electrically connected to one of the at least one first conductive through hole.

Abstract translation: 公开了一种电气部件，所述电气部件包括：具有顶表面，底表面的磁体，其中至少一个第一导电通孔从所述磁体的顶表面到底表面形成; 以及设置在所述磁体中的线圈，其中所述线圈的第一端电连接到所述至少一个第一导电通孔中的一个。

公开(公告)号：US09095067B2

公开(公告)日：2015-07-28

申请号：US14069054

申请日：2013-10-31

Applicant: Wintec Industries, Inc.

Inventor： Kong-Chen Chen

IPC: H05K1/11 ,  H05K3/30 ,  H01L23/64 ,  H05K1/02 ,  H05K1/18 ,  H05K3/34

CPC classification number: H05K1/111 ,  H01L23/64 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2924/19103 ,  H01L2924/19104 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/0234 ,  H05K1/181 ,  H05K3/301 ,  H05K3/341 ,  H05K2201/086 ,  H05K2201/10515 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/10643 ,  H05K2201/10674 ,  H05K2201/10719 ,  Y02P70/611 ,  Y10T29/4902 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: An electronic device is presented for electrical connection between a first pad contact of an integrated circuit component and a target contact positioned substantially in a first plane of a target platform. The electronic device includes a first surface substantially parallel to the first plane and a second surface below the first surface substantially parallel to the first plane. The first surface includes a first contact region configured to connect to the first pad contact when the electronic device is connected between the first pad contact and the target contact. The second surface includes a second contact region configured to connect to the target contact when the electronic device is connected between the first pad contact and the target contact. The electronic device further includes a multitude of electrically passive elements connected between the first and second contact regions.

Abstract translation: 呈现电子设备用于集成电路部件的第一焊盘触点和基本上位于目标平台的第一平面中的目标触点之间的电连接。 电子设备包括基本上平行于第一平面的第一表面和基本上平行于第一平面的第一表面下方的第二表面。 第一表面包括第一接触区域，被配置为当电子设备连接在第一焊盘触点和目标触点之间时连接到第一焊盘触点。 第二表面包括被配置为当电子设备连接在第一焊盘触点和目标触点之间时连接到目标触点的第二触点区域。 电子设备还包括连接在第一和第二接触区域之间的多个电动无源元件。

公开(公告)号：US09066435B2

公开(公告)日：2015-06-23

申请号：US13853227

申请日：2013-03-29

Applicant: IBIDEN CO., LTD.

Inventor： Makoto Terui ,  Daiki Komatsu ,  Masatoshi Kunieda ,  Takashi Kariya

IPC: H05K7/10 ,  H05K1/11 ,  H05K3/10 ,  H01L23/498 ,  H01L21/56 ,  H01L23/538 ,  H05K3/46 ,  H01L23/00

CPC classification number: H05K3/305 ,  H01L21/563 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49894 ,  H01L23/5382 ,  H01L23/5383 ,  H01L23/5384 ,  H01L24/03 ,  H01L24/16 ,  H01L24/81 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/131 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/81192 ,  H01L2924/12042 ,  H01L2924/1436 ,  H01L2924/15192 ,  H01L2924/15311 ,  H05K1/115 ,  H05K3/10 ,  H05K3/103 ,  H05K3/20 ,  H05K3/32 ,  H05K3/4602 ,  H05K3/4658 ,  H05K3/4694 ,  H05K2201/10159 ,  H05K2201/10378 ,  H05K2201/1053 ,  Y10T29/49128 ,  Y10T29/49165 ,  H01L2924/00 ,  H01L2924/014

Abstract: A wiring board includes a first insulation layer, a second insulation layer formed on the first insulation layer, a wiring structure interposed between the first insulation layer and the second insulation layer and including an insulation layer and conductive patterns formed on the insulation layer, second conductive patterns formed on the second insulation layer, and a via conductor formed through the second insulation layer and connected to one of the second conductive patterns on the second insulation layer.

Abstract translation: 布线板包括第一绝缘层，形成在第一绝缘层上的第二绝缘层，插入在第一绝缘层和第二绝缘层之间的布线结构，并且包括绝缘层和形成在绝缘层上的导电图案，第二导电 形成在第二绝缘层上的图案，以及通过第二绝缘层形成并连接到第二绝缘层上的第二导电图案之一的通路导体。

公开(公告)号：US20150072207A1

公开(公告)日：2015-03-12

申请号：US14230475

申请日：2014-03-31

Applicant: Johnson Controls Technology Company

Inventor： Edward J. Soleski ,  Mikhail S. Balk ,  Richard M. DeKeuster

IPC: H01M2/20

CPC classification number: H01M2/22 ,  B60L1/003 ,  B60L1/02 ,  B60L1/14 ,  B60L3/0046 ,  B60L3/12 ,  B60L11/123 ,  B60L11/14 ,  B60L11/1803 ,  B60L11/1851 ,  B60L11/1861 ,  B60L11/1864 ,  B60L11/1874 ,  B60L11/1877 ,  B60L11/1879 ,  B60L15/20 ,  B60L2210/10 ,  B60L2210/40 ,  B60L2240/34 ,  B60L2240/545 ,  B60L2240/547 ,  B60L2240/549 ,  B60L2250/10 ,  B60L2260/26 ,  B60L2270/20 ,  B60R16/03 ,  B60R16/033 ,  G01R31/025 ,  G01R31/362 ,  G01R31/3627 ,  H01H47/325 ,  H01M2/1077 ,  H01M2/1205 ,  H01M2/1211 ,  H01M2/1252 ,  H01M2/20 ,  H01M2/206 ,  H01M2/24 ,  H01M2/305 ,  H01M2/32 ,  H01M2/34 ,  H01M2/342 ,  H01M4/661 ,  H01M4/665 ,  H01M10/04 ,  H01M10/0413 ,  H01M10/058 ,  H01M10/425 ,  H01M10/4257 ,  H01M10/482 ,  H01M10/486 ,  H01M10/6551 ,  H01M2010/4271 ,  H01M2010/4278 ,  H01M2200/103 ,  H01M2220/20 ,  H01M2250/20 ,  H01R12/716 ,  H02H7/18 ,  H02J7/0021 ,  H02J7/0063 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/18 ,  H05K3/32 ,  H05K2201/10492 ,  H05K2201/1053 ,  H05K2201/10545 ,  Y02T10/6217 ,  Y02T10/645 ,  Y02T10/7005 ,  Y02T10/7016 ,  Y02T10/7044 ,  Y02T10/705 ,  Y02T10/7061 ,  Y02T10/7077 ,  Y02T10/7216 ,  Y02T10/7241 ,  Y02T10/7275 ,  Y10T29/49108 ,  Y10T29/4911 ,  Y10T29/49114

Abstract: A terminal for a battery module and a method of manufacture of the terminal are provided. The battery module may include a plurality of battery cells and a bus bar. The bus bar may be electrically coupled to the plurality of battery cells. The battery module also may include a battery terminal that carries a voltage from the bus bar. The battery terminal may include a generally cylindrical terminal portion and a connector. The connector may be coupled to the bus bar cell interconnect. The battery terminal also may include a bent portion. The bent portion is disposed between the terminal portion and the connector.

Abstract translation: 提供一种电池模块的端子和端子的制造方法。 电池模块可以包括多个电池单元和汇流条。 母线可以电耦合到多个电池单元。 电池模块还可以包括承载来自母线的电压的电池端子。 电池端子可以包括大致圆柱形的端子部分和连接器。 连接器可以耦合到汇流条单元互连。 电池端子也可以包括弯曲部分。 弯曲部分设置在端子部分和连接器之间。

公开(公告)号：US20150072177A1

公开(公告)日：2015-03-12

申请号：US14231239

申请日：2014-03-31

Applicant: Johnson Controls Technology Company

Inventor： Edward J. Soleski ,  Mikhail S. Balk ,  Richard M. DeKeuster ,  Stephen D. Cash

IPC: H01M2/20

CPC classification number: H01M2/22 ,  B60L1/003 ,  B60L1/02 ,  B60L1/14 ,  B60L3/0046 ,  B60L3/12 ,  B60L11/123 ,  B60L11/14 ,  B60L11/1803 ,  B60L11/1851 ,  B60L11/1861 ,  B60L11/1864 ,  B60L11/1874 ,  B60L11/1877 ,  B60L11/1879 ,  B60L15/20 ,  B60L2210/10 ,  B60L2210/40 ,  B60L2240/34 ,  B60L2240/545 ,  B60L2240/547 ,  B60L2240/549 ,  B60L2250/10 ,  B60L2260/26 ,  B60L2270/20 ,  B60R16/03 ,  B60R16/033 ,  G01R31/025 ,  G01R31/362 ,  G01R31/3627 ,  H01H47/325 ,  H01M2/1077 ,  H01M2/1205 ,  H01M2/1211 ,  H01M2/1252 ,  H01M2/20 ,  H01M2/206 ,  H01M2/24 ,  H01M2/305 ,  H01M2/32 ,  H01M2/34 ,  H01M2/342 ,  H01M4/661 ,  H01M4/665 ,  H01M10/04 ,  H01M10/0413 ,  H01M10/058 ,  H01M10/425 ,  H01M10/4257 ,  H01M10/482 ,  H01M10/486 ,  H01M10/6551 ,  H01M2010/4271 ,  H01M2010/4278 ,  H01M2200/103 ,  H01M2220/20 ,  H01M2250/20 ,  H01R12/716 ,  H02H7/18 ,  H02J7/0021 ,  H02J7/0063 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/18 ,  H05K3/32 ,  H05K2201/10492 ,  H05K2201/1053 ,  H05K2201/10545 ,  Y02T10/6217 ,  Y02T10/645 ,  Y02T10/7005 ,  Y02T10/7016 ,  Y02T10/7044 ,  Y02T10/705 ,  Y02T10/7061 ,  Y02T10/7077 ,  Y02T10/7216 ,  Y02T10/7241 ,  Y02T10/7275 ,  Y10T29/49108 ,  Y10T29/4911 ,  Y10T29/49114

Abstract: A lid assembly for use in a battery module includes a lid with apertures extending through the lid in a vertical direction, where each of the apertures is configured to receive a terminal of a battery cell of the battery module. The lid assembly also includes one or more extensions extending away from the lid in the vertical direction. Each of the one or more extensions is configured to couple the lid to a printed circuit board assembly of the battery module. The lid assembly also includes walls extending away from the lid in the vertical direction. Each of the walls is configured to extend between a first terminal of a first battery cell and a second terminal of a second battery cell.

Abstract translation: 用于电池模块的盖组件包括具有沿垂直方向延伸穿过盖的孔的盖，其中每个孔构造成接收电池模块的电池单元的端子。 盖组件还包括在垂直方向上远离盖延伸的一个或多个延伸部。 一个或多个延伸部中的每一个被配置为将盖连接到电池模块的印刷电路板组件。 盖组件还包括在垂直方向上远离盖延伸的壁。 每个壁被配置为在第一电池单元的第一端子和第二电池单元的第二端子之间延伸。

公开(公告)号：US20150072176A1

公开(公告)日：2015-03-12

申请号：US14231013

申请日：2014-03-31

Applicant: Johnson Controls Technology Company

Inventor： John P. Dinkelman ,  Lisa L. Winders ,  Richard M. DeKeuster ,  Edward J. Soleski ,  Mikhail S. Balk

IPC: H01M2/24 ,  H01M2/10 ,  H01M10/04 ,  H01M10/42

CPC classification number: H01M2/22 ,  B60L1/003 ,  B60L1/02 ,  B60L1/14 ,  B60L3/0046 ,  B60L3/12 ,  B60L11/123 ,  B60L11/14 ,  B60L11/1803 ,  B60L11/1851 ,  B60L11/1861 ,  B60L11/1864 ,  B60L11/1874 ,  B60L11/1877 ,  B60L11/1879 ,  B60L15/20 ,  B60L2210/10 ,  B60L2210/40 ,  B60L2240/34 ,  B60L2240/545 ,  B60L2240/547 ,  B60L2240/549 ,  B60L2250/10 ,  B60L2260/26 ,  B60L2270/20 ,  B60R16/03 ,  B60R16/033 ,  G01R31/025 ,  G01R31/362 ,  G01R31/3627 ,  H01H47/325 ,  H01M2/1077 ,  H01M2/1205 ,  H01M2/1211 ,  H01M2/1252 ,  H01M2/20 ,  H01M2/206 ,  H01M2/24 ,  H01M2/305 ,  H01M2/32 ,  H01M2/34 ,  H01M2/342 ,  H01M4/661 ,  H01M4/665 ,  H01M10/04 ,  H01M10/0413 ,  H01M10/058 ,  H01M10/425 ,  H01M10/4257 ,  H01M10/482 ,  H01M10/486 ,  H01M10/6551 ,  H01M2010/4271 ,  H01M2010/4278 ,  H01M2200/103 ,  H01M2220/20 ,  H01M2250/20 ,  H01R12/716 ,  H02H7/18 ,  H02J7/0021 ,  H02J7/0063 ,  H05K1/0262 ,  H05K1/0263 ,  H05K1/18 ,  H05K3/32 ,  H05K2201/10492 ,  H05K2201/1053 ,  H05K2201/10545 ,  Y02T10/6217 ,  Y02T10/645 ,  Y02T10/7005 ,  Y02T10/7016 ,  Y02T10/7044 ,  Y02T10/705 ,  Y02T10/7061 ,  Y02T10/7077 ,  Y02T10/7216 ,  Y02T10/7241 ,  Y02T10/7275 ,  Y10T29/49108 ,  Y10T29/4911 ,  Y10T29/49114

Abstract: A battery module includes a housing and battery cells disposed in the housing, each of the battery cells including two terminals. The battery module also includes bus bar cell interconnects including a first material, where each bus bar cell interconnect is configured to electrically couple two adjacent battery cells via an electrical coupling with a first terminal of one of the adjacent battery cells and a second terminal of the other adjacent battery cell, where at least one of the first and second terminals includes the first material. The battery module includes welds, each weld being disposed at a corresponding welding point to directly couple one of the bus bar cell interconnects with the corresponding at least one terminal including the first material. Each welding point is accessible for welding from a position above the battery cells when the interconnects are disposed over the battery cells.

Abstract translation: 电池模块包括壳体和设置在壳体中的电池单元，每个电池单元包括两个端子。 电池模块还包括汇流条单元互连，其包括第一材料，其中每个汇流条单元互连被配置为通过与相邻电池单元之一的第一端子的电耦合将两个相邻的电池单元电耦合， 其它相邻的电池单元，其中第一和第二端子中的至少一个包括第一材料。 电池模块包括焊缝，每个焊接点设置在相应的焊接点处，以将总线条单元互连中的一个与包括第一材料的对应的至少一个端子直接耦合。 当互连布置在电池单元上方时，每个焊接点可从电池单元上方的位置进行焊接。