公开(公告)号：US20150036304A1

公开(公告)日：2015-02-05

申请号：US14326071

申请日：2014-07-08

Applicant: TAIYO YUDEN CO., LTD.

Inventor： Motoi YAMAUCHI ,  Osamu KAWACHI

IPC: H05K1/11 ,  H05K1/02

CPC classification number: H01L21/561 ,  H01L23/04 ,  H01L24/95 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/12042 ,  H01L2924/15174 ,  H01L2924/15787 ,  H01L2924/181 ,  H03H9/02913 ,  H03H9/1007 ,  H03H9/1085 ,  H03H2009/0019 ,  H05K1/0209 ,  H05K1/0216 ,  H05K1/0243 ,  H05K1/141 ,  H05K3/284 ,  H05K3/303 ,  H05K3/3436 ,  H05K2201/0305 ,  H05K2201/049 ,  H05K2201/068 ,  H05K2201/10068 ,  H05K2201/10371 ,  H05K2201/10537 ,  H05K2201/1056 ,  H05K2201/10674 ,  H05K2203/1316 ,  H01L2924/00

Abstract: An electronic device includes: a wiring substrate; a plurality of device chips that are flip-chip mounted on an upper surface of the wiring substrate through bumps, have gaps which expose the bumps between the device chips and the upper surface of the wiring substrate, and include at least one device chip that has a substrate having a thermal expansion coefficient more than a thermal expansion coefficient of the wiring substrate; a junction substrate that is joined to the plurality of device chips, and has a thermal expansion coefficient equal to or less than the thermal expansion coefficient of the substrate included in the at least one device chip; and a sealer that covers the junction substrate, and seals the plurality of device chips.

Abstract translation: 电子设备包括：布线基板; 通过凸块倒装安装在布线基板的上表面上的多个器件芯片具有露出器件芯片与布线基板的上表面之间的凸块的间隙，并且包括至少一个器件芯片， 具有大于所述布线基板的热膨胀系数的热膨胀系数的基板; 连接到所述多个器件芯片的接合衬底，并且具有等于或小于所述至少一个器件芯片中包括的衬底的热膨胀系数的热膨胀系数; 以及覆盖接合基板的密封件，并且密封多个器件芯片。

公开(公告)号：US20140196940A1

公开(公告)日：2014-07-17

申请号：US13777298

申请日：2013-02-26

Applicant: QUALCOMM INCORPORATED

Inventor： Christopher J. Healy ,  Gopal C. Jha ,  Manuel Aldrete

IPC: H05K1/02 ,  H05K3/40

CPC classification number: H05K1/0271 ,  H01L21/56 ,  H01L23/3157 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/10145 ,  H01L2224/1191 ,  H01L2224/13021 ,  H01L2224/13022 ,  H01L2224/131 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2924/12042 ,  H01L2924/3841 ,  H05K3/4038 ,  H05K2201/0305 ,  Y10T29/49165 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Improved Molded Laser Package (MLP) Packages which include a relief path for pressure and reduces the risk of shorting adjacent solder balls are provided. The MLP packages may include a gutter integrally connected to one or more through mold vias allowing a path to relieve pressure created when moisture gets entrapped in through mold vias, during the manufacturing process, while also reducing the risk of solder shorts between adjacent solder balls located in the through mold vias. Additionally, MLP packages which include gutters integrally connected to one or more through mold vias may enable tighter bump pitch and thinner packages. As a result, process margins and risks associated with surface mount technology (SMT) may be improved and provide more flexibility on inventory staging.

Abstract translation: 改进的模制激光封装（MLP）提供了包括压力释放路径和降低相邻焊球短路风险的封装。 MLP包装可以包括一个整体地连接到一个或多个通过模具通孔的沟槽，允许在制造过程期间通过模具通道将水分截留时产生的压力减小的路径，同时还降低相邻焊球之间的焊料短路的风险 在通孔中通孔。 此外，包括整体连接到一个或多个通过模具通孔的沟槽的MLP封装可以实现更紧密的突起间距和更薄的封装。 因此，可能会提高与表面贴装技术（SMT）相关的工艺余量和风险，并为库存阶段提供更大的灵活性。

公开(公告)号：US20140183050A1

公开(公告)日：2014-07-03

申请号：US14142443

申请日：2013-12-27

Applicant: Rohm and Haas Electronic Materials LLC

Inventor： Hiroki OKADA ,  Li SHENGHUA ,  Makoto KONDO

IPC: C25D3/32

CPC classification number: C25D3/32 ,  C23C18/1605 ,  C23C18/1653 ,  C25D3/60 ,  C25D5/022 ,  C25D7/123 ,  H01L21/2885 ,  H01L21/76879 ,  H05K3/187 ,  H05K3/4007 ,  H05K3/423 ,  H05K2201/0305 ,  H05K2201/0367 ,  H05K2201/09563

Abstract: Tin or tin alloy plating liquid with a sufficient plated deposit can be formed in the opening without causing burns on the plated film surface or abnormal deposits, and which has a good via filling effect. When a specific α,β-unsaturated carbonyl compound is added into the tin or tin alloy plating liquid, the plating liquid with good via filling performance can be obtained, and the deposit which is substantially free of voids and burns or abnormal deposits on the deposit surface are reduced.

Abstract translation: 可以在开口中形成具有足够镀层沉积物的锡或锡合金电镀液，而不会在镀膜表面上产生烧伤或异常沉积，并具有良好的通孔填充效果。 当将特定的α，β-不饱和羰基化合物加入到锡或锡合金电镀液中时，可以获得具有良好的通孔填充性能的电镀液，并且可以获得基本上没有空隙和沉积物的沉积物 沉积物表面减少。

公开(公告)号：US20140139310A1

公开(公告)日：2014-05-22

申请号：US14129148

申请日：2012-06-21

Applicant: Hiroaki Asano ,  Yasuhiro Koike ,  Kiminori Ozaki ,  Hitoshi Shimadu ,  Tetsuya Furuta ,  Masao Miyake ,  Takahiro Hayakawa ,  Tomoaki Asai ,  Ryou Yamauchi

Inventor： Hiroaki Asano ,  Yasuhiro Koike ,  Kiminori Ozaki ,  Hitoshi Shimadu ,  Tetsuya Furuta ,  Masao Miyake ,  Takahiro Hayakawa ,  Tomoaki Asai ,  Ryou Yamauchi

IPC: H05K1/11 ,  H01F27/28 ,  H05K1/02

CPC classification number: H05K1/115 ,  H01F27/2804 ,  H05K1/0265 ,  H05K1/0268 ,  H05K1/0298 ,  H05K1/118 ,  H05K1/165 ,  H05K3/20 ,  H05K2201/0305 ,  H05K2201/0391 ,  H05K2201/09036 ,  H05K2201/0969 ,  H05K2201/09736 ,  H05K2201/09745

Abstract: This wiring board is provided with an insulating core substrate, a first conductor pattern, a second conductor pattern, and a conductive material. The first conductor pattern and the second conductor pattern are adhered to the insulating core substrate. The second conductor pattern has a first surface and a second surface. The second conductor pattern has a concavity and a through-hole. The opening of the concavity that opens to the first surface and the opening of the through hole that opens to the first surface are interconnected to each other. The first conductor pattern is positioned at the opening of the concavity. The first conductor pattern and the second conductor pattern are electrically connected by means of the conductive material, which fills from the opening of the through hole that opens to the second surface.

Abstract translation: 该布线板设置有绝缘芯基板，第一导体图案，第二导体图案和导电材料。 第一导体图案和第二导体图案粘附到绝缘芯基板。 第二导体图案具有第一表面和第二表面。 第二导体图案具有凹部和通孔。 通向第一表面的凹部的开口和通向第一表面的通孔的开口相互连接。 第一导体图案位于凹部的开口处。 第一导体图案和第二导体图案通过导电材料电连接，导电材料从通孔的开口填充到第二表面。

公开(公告)号：US20140071639A1

公开(公告)日：2014-03-13

申请号：US13990378

申请日：2012-12-25

Applicant: Kazuhiko Honjo ,  Akito Iwasaki

Inventor： Kazuhiko Honjo ,  Akito Iwasaki

IPC: H05K1/02 ,  H05K3/40

CPC classification number: H05K1/0271 ,  H05K1/036 ,  H05K1/0366 ,  H05K1/0393 ,  H05K3/382 ,  H05K3/4046 ,  H05K3/4069 ,  H05K3/4652 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0154 ,  H05K2201/0269 ,  H05K2201/0272 ,  H05K2201/0305 ,  H05K2201/09563 ,  H05K2203/0307 ,  Y10T29/49165

Abstract: A flexible wiring board includes an electric insulating base material including an incompressible member having bendability and a thermosetting member having bendability; a first wiring and a second wiring formed with the electric insulating base material interposed therebetween; and a via-hole conductor penetrating the electric insulating base material, and electrically connecting the first wiring and the second wiring to each other. The via-hole conductor includes a resin portion and a metal portion. The metal portion includes a first metal region mainly composed of Cu; a second metal region mainly composed of a Sn—Cu alloy; and a third metal region mainly composed of Bi. The second metal region is larger than the first metal region, and larger than the third metal region.

Abstract translation: 柔性布线板包括电绝缘基材，其包括具有弯曲性的不可压缩构件和具有弯曲性的热固性构件; 形成有绝缘基材的第一布线和第二布线; 以及穿过电绝缘基材的通孔导体，并且将第一布线和第二布线彼此电连接。 通孔导体包括树脂部分和金属部分。 金属部分包括主要由Cu组成的第一金属区域; 主要由Sn-Cu合金构成的第二金属区域; 和主要由Bi组成的第三金属区域。 第二金属区域大于第一金属区域，大于第三金属区域。

公开(公告)号：US20130335183A1

公开(公告)日：2013-12-19

申请号：US13972286

申请日：2013-08-21

Applicant: Harris Corporation

Inventor： MICHAEL RAYMOND WEATHERSPOON ,  LOUIS JOSEPH RENDEK, JR. ,  LAWRENCE WAYNE SHACKLETTE ,  ROBERT PATRICK MALONEY ,  DAVID M. SMITH

IPC: H01F27/28

CPC classification number: H01F27/2804 ,  H01F5/00 ,  H01F17/0006 ,  H01F41/041 ,  H01F2017/0046 ,  H01F2017/0073 ,  H05K1/165 ,  H05K3/146 ,  H05K3/16 ,  H05K3/20 ,  H05K2201/0141 ,  H05K2201/0305 ,  H05K2201/1003 ,  H05K2203/016 ,  Y10T29/4902 ,  Y10T29/49071 ,  Y10T29/49073 ,  Y10T29/49075

Abstract: A method is for making an electrical inductor. The method includes forming a first subunit having a sacrificial substrate, and an electrically conductive layer defining the electrical inductor and including a first metal on the sacrificial substrate. The method includes forming a second subunit having a dielectric layer and an electrically conductive layer thereon defining electrical inductor terminals and having the first metal, and coating a second metal onto the first metal of one of the first and second subunits. The method includes aligning the first and second subunits together, heating and pressing the aligned first and second subunits to form an intermetallic compound of the first and second metals bonding adjacent metal portions together, and removing the sacrificial substrate.

公开(公告)号：US08535959B2

公开(公告)日：2013-09-17

申请号：US13512328

申请日：2010-11-04

Applicant: Young Seob Lee

Inventor： Young Seob Lee

IPC: H01L21/00

CPC classification number: H01L33/647 ,  F21K9/00 ,  F21V29/20 ,  F21V29/70 ,  F21V29/89 ,  F21W2131/103 ,  F21Y2115/10 ,  H01L33/642 ,  H01L2224/48091 ,  H05K1/0206 ,  H05K3/0047 ,  H05K3/0061 ,  H05K2201/0305 ,  H05K2201/09854 ,  H05K2201/10106 ,  H05K2203/1572 ,  H01L2924/00014

Abstract: The present invention relates to a method for manufacturing large lighting which uses a power LED, such as for large LED lighting for street lamps, which incorporates a heat dissipation device that has the ability to dissipate heat with natural convection to maintain ambient temperature. The disclosed method is novel applied technology for producing a large LED lighting, such as for street lamps, which has a power LED device with a unique, rear heat dissipation capability. In addition to maximum thermal efficiency by heat dissipation, the present LED lighting system also increases luminous efficiency by providing high light emission with only a small quantity of LED power.

Abstract translation: 本发明涉及一种制造大型照明的方法，其使用功率LED，例如用于路灯的大型LED照明，其包括具有通过自然对流散热以维持环境温度的能力的散热装置。 所公开的方法是用于生产诸如路灯的大型LED照明的新颖应用技术，其具有具有独特的后部散热能力的功率LED装置。 除了通过散热的最大热效率之外，目前的LED照明系统还通过仅提供少量LED功率的高发光量来提高发光效率。

公开(公告)号：US08448333B2

公开(公告)日：2013-05-28

申请号：US12640139

申请日：2009-12-17

Applicant: Masaya Uyama

Inventor： Masaya Uyama

IPC: H01L21/28 ,  H05K3/10

CPC classification number: H05K3/4038 ,  H05K2201/0305 ,  H05K2201/0394 ,  H05K2201/09509 ,  H05K2203/0425 ,  H05K2203/043 ,  H05K2203/1476 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49401

Abstract: A method for manufacturing a wiring board includes a first process of preparing a substrate having a hole passing through a first surface and a second surface opposite the first surface; a second process of closing the opening of the hole in the first surface with a wiring member; a third process of supplying a powder conductive material onto the second surface to fill the hole with the conductive material; a fourth process of removing the conductive material that is not charged into the hole from the top of the second surface; and a fifth process of melting the conductive material that fills the hole by heating the conductive material and thereafter solidifying the conductive material.

Abstract translation: 制造布线板的方法包括：制备具有穿过第一表面的孔和与第一表面相对的第二表面的基底的第一工艺; 用配线部件封闭第1面的孔的开口的第2工序; 将粉末导电材料供应到第二表面以用导电材料填充孔的第三工艺; 从第二表面的顶部除去未被填充到孔中的导电材料的第四工序; 以及通过加热导电材料然后固化导电材料来熔化填充孔的导电材料的第五工艺。

公开(公告)号：US08420952B2

公开(公告)日：2013-04-16

申请号：US13187404

申请日：2011-07-20

Applicant: Tomohiko Nawata

Inventor： Tomohiko Nawata

IPC: H05K1/16

CPC classification number: G01R31/2818 ,  H05K1/0268 ,  H05K1/0293 ,  H05K3/3452 ,  H05K3/3484 ,  H05K2201/0305 ,  H05K2203/043 ,  H05K2203/173

Abstract: A circuit board includes a board, a first conductive land over the board, a second conductive land over the board, a resist extending over the board, and a conductive material within the opening. The second conductive land is distanced from the first conductive land. The resist has an opening that extends over at least a portion of the first conductive land, at least a portion of the second conductive land, and at least a portion of an intervening region of the board. The intervening region extends between the first and second conductive lands. The conductive material extends over the at least a portion of the intervening region, the at least a portion of the first conductive land, and the at least a portion of the second conductive land.

Abstract translation: 电路板包括板，板上的第一导电焊盘，板上的第二导电焊盘，在板上延伸的抗蚀剂以及开口内的导电材料。 第二个导电区距离第一个导电区域。 抗蚀剂具有在第一导电焊盘的至少一部分，第二导电焊盘的至少一部分以及板的中间区域的至少一部分之上延伸的开口。 中间区域在第一和第二导电焊盘之间延伸。 导电材料在中间区域的至少一部分，第一导电焊盘的至少一部分和第二导电焊盘的至少一部分上延伸。

公开(公告)号：US20130048363A1

公开(公告)日：2013-02-28

申请号：US13304374

申请日：2011-11-24

Applicant: CHENG-FEI WENG ,  ZHENG-HENG SUN

Inventor： CHENG-FEI WENG ,  ZHENG-HENG SUN

IPC: H05K1/11 ,  H05K3/00

CPC classification number: H05K1/0293 ,  H05K2201/0305 ,  H05K2201/0939 ,  H05K2201/09909 ,  H05K2203/1105 ,  H05K2203/173 ,  Y10T29/49124

Abstract: A circuit board includes a board, a first signal trace and a second signal trace on the board, a first solder pad formed on the board and connected to a terminal of the first signal trace near to one end of the second signal trace, and a second pad formed on the board and connected to a terminal of the second signal trace near to the first solder pad. The second pad is apart from the first pad. The first pad or the second pad is coated with solder. After heated, the solder melts and spread to the second pad or the first pad, thereby connecting the first signal trace to the second signal trace.

Abstract translation: 电路板包括板上的第一信号迹线和板上的第二信号迹线，形成在板上并连接到靠近第二信号迹线的一端的第一信号迹线的端子的第一焊盘，以及 第二焊盘形成在板上并连接到靠近第一焊盘的第二信号迹线的端子。 第二垫与第一垫不同。 第一焊盘或第二焊盘涂覆有焊料。 加热后，焊料熔化并扩散到第二焊盘或第一焊盘，从而将第一信号迹线连接到第二信号迹线。