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    Circuit writer
    141.
    发明授权
    Circuit writer 失效
    电路作家

    公开(公告)号：US5099090A

    公开(公告)日：1992-03-24

    申请号：US460980

    申请日：1990-01-11

    Applicant: G. Graham Allan ,  Gary A. DeBardi ,  Amar N. Neogi ,  Kenneth N. Bates ,  Robert B. Erley ,  Thomas L. Jacobs ,  Ramzi F. Hamade ,  Stephen J. Horne ,  Manu C. Patel ,  John E. Rose ,  Mark S. Schlosser ,  David P. Warden

    Inventor： G. Graham Allan ,  Gary A. DeBardi ,  Amar N. Neogi ,  Kenneth N. Bates ,  Robert B. Erley ,  Thomas L. Jacobs ,  Ramzi F. Hamade ,  Stephen J. Horne ,  Manu C. Patel ,  John E. Rose ,  Mark S. Schlosser ,  David P. Warden

    IPC: H01B1/22 ,  H05K1/09 ,  H05K3/00 ,  H05K3/12 ,  H05K3/40 ,  H05K3/46

    CPC classification number: H05K1/095 ,  H01B1/22 ,  H05K3/0091 ,  H05K3/1241 ,  H05K3/4069 ,  H05K2201/09581 ,  H05K2201/09827 ,  H05K2201/0989 ,  H05K2203/0126 ,  H05K2203/0763 ,  H05K3/4644 ,  Y10T29/49155

    Abstract: An apparatus and method are disclosed for preparing electrically conductive traces on a circuit board using an additive technology. The traces are directly written in a serial process with each trace being able to be individually insulated. The apparatus includes an extrusion element for extruding a first material and a stage. The stage is for holding the extrusion element and the circuit board in relative proximity and for producing relative motion between the extrusion element and the circuit board in order to extrude the first material onto the surface of the circuit board along preselected paths to produce the electrically conductive traces. According to the method of invention, a first polymerizable material is extruded onto a circuit substrate support along preselected paths to form traces, and the first polymerizable material is polymerized, the first polymerizable material being conductive after polymerization. A circuit board for holding electrical components is disclosed which includes a circuit substrate support and a plurality of electrically conductive traces. The traces are adhered to the circuit substrate support between locations for the electrical components, the traces being formed of a polymer thick film by extrusion from an orifice onto the support along paths defining the location of the traces. Several embodiments of extrusion systems are described as are systems for milling and drilling boards to provide new manufactures of circuit boards.

    Abstract translation: PCT No.PCT / US89 / 02026 Sec。 371 1990年1月11日第 102（e）1990年1月11日日期PCT提交1989年5月11日PCT公布。 出版物WO89 / 11209 日本公开了一种用于使用添加剂技术在电路板上制备导电迹线的装置和方法。 轨迹直接写在串行过程中，每个迹线都可以单独隔离。 该装置包括用于挤出第一材料和台架的挤出元件。 该阶段用于将挤出元件和电路板保持在相对接近处并且用于在挤出元件和电路板之间产生相对运动，以便沿预选路径将第一材料挤压到电路板的表面上以产生导电 痕迹 根据本发明的方法，将第一可聚合材料沿预选路径挤出到电路基板支撑件上以形成迹线，并且第一可聚合材料聚合，第一可聚合材料在聚合之后是导电的。 公开了一种用于保持电气部件的电路板，其包括电路基板支撑件和多个导电迹线。 轨迹在电气部件的位置之间粘附到电路基板支撑件，迹线由聚合物厚膜形成，通过从限定走线位置的路径从孔口挤压到支撑件上。 挤压系统的几个实施例被描述为用于铣削和钻孔板以提供新的电路板制造商的系统。

    Method for making metal core printed circuit board
    142.
    发明授权
    Method for making metal core printed circuit board 失效
    制作金属芯印刷电路板的方法

    公开(公告)号：US4924590A

    公开(公告)日：1990-05-15

    申请号：US291119

    申请日：1988-12-28

    Applicant: Helmut Hadwiger ,  Hans Schmidt

    Inventor： Helmut Hadwiger ,  Hans Schmidt

    IPC: B32B15/08 ,  H05K1/00 ,  H05K1/05 ,  H05K3/38 ,  H05K3/44

    CPC classification number: H05K3/445 ,  B32B15/08 ,  H05K1/056 ,  H05K1/0393 ,  H05K2201/0195 ,  H05K2201/09118 ,  H05K2201/09581 ,  H05K2203/1327 ,  H05K2203/1438 ,  H05K3/386 ,  Y10T29/49158 ,  Y10T428/31681 ,  Y10T428/31692 ,  Y10T428/31721

    Abstract: A method for the manufacturing of a metal core pc board which provides for manufacturing of two or three dimensional metal core pc boards of any form with or without throughplating. The manufacturing of such pc boards can occur by injection molding, injection/compressing molding or by a pressing method. High-heat resistant thermoplastics, as well as duroplastics are preferably employed as pc board materials. A metal with good thermal conductibility is used for the core. The material is selected such that the thermal expansion coefficients of the metal core and the pc board material are optimally equal. The manufacturing contains the following steps: lamination of the metal plate with a plastic foil on one or both sides; introduction of the desired hole pattern with a corresponding over dimension into the laminated metal plate; placing of such prepared metal core in an injection molding tool; and thermoforming the plastic on the laminated core over the plastic foil and simultaneously filling out the holes to a final dimension with the plastic.

    Abstract translation: 一种用于制造具有或不具有通孔的任何形式的二维或三维金属芯片印刷电路板的金属芯片印刷电路板的制造方法。 这种印刷电路板的制造可以通过注射成型，注射/压缩成型或压制方法进行。 优选使用高耐热性热塑性塑料以及硬质塑料作为印刷电路板材料。 核心使用具有良好导热性的金属。 选择材料使得金属芯和印刷电路板材料的热膨胀系数最佳相等。 该制造包括以下步骤：金属板与塑料箔在一侧或两侧上的层叠; 将所需的具有相应尺寸的孔图案引入到层压金属板中; 将这种制备的金属芯放置在注射成型工具中; 并在塑料箔上将叠层芯上的塑料热成型，同时用塑料填充孔至最终尺寸。

    Method for producing circuit boards
    143.
    发明授权
    Method for producing circuit boards 失效
    电路板生产方法

    公开(公告)号：US4751105A

    公开(公告)日：1988-06-14

    申请号：US558710

    申请日：1983-12-07

    Applicant: Gunter Kisters ,  Fritz Stahl

    Inventor： Gunter Kisters ,  Fritz Stahl

    IPC: H05K3/38 ,  H05K3/46 ,  B05D5/12

    CPC classification number: H05K3/387 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/09563 ,  H05K2201/09581 ,  H05K2203/0796

    Abstract: A method for producing circuit boards in which a plurality of planar circuit board bases having a circuit pattern thereon are interconnected at predetermined points. The method includes the steps of applying a mask over the circuit pattern on a base leaving, at the points to be interconnected, a window in the mask; applying an adhesive coating over the mask with the adhesive coating extending over the mask windows and onto the circuit pattern metal to form a second smaller window; treating and depositing metal on said adhesive coating to form a second circuit pattern on the plane of said adhesive and interconnecting the second circuit pattern with the first circuit pattern at said second windows; and, repeating said steps until a circuit board of the desired number of planar circuit patterns is produced.

    Abstract translation: 一种电路板的制造方法，其中在其上具有电路图案的多个平面电路板基座在预定点处相互连接。 该方法包括以下步骤：将电路图案上的掩模施加在基座上，在待互连的点处留下掩模中的窗口; 在所述掩模上施加粘合剂涂层，所述粘合剂涂层在所述掩模窗口上延伸到所述电路图案金属上以形成第二较小的窗口; 在所述粘合剂涂层上处理和沉积金属以在所述粘合剂的平面上形成第二电路图案，并将所述第二电路图案与所述第二窗口处的所述第一电路图案互连; 并重复所述步骤，直到产生所需数量的平面电路图案的电路板。

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