公开(公告)号：US07915729B2

公开(公告)日：2011-03-29

申请号：US12385902

申请日：2009-04-23

Applicant: Yoshimitsu Ukai ,  Kazunori Ozawa ,  Fukuo Ishikawa

Inventor： Yoshimitsu Ukai ,  Kazunori Ozawa ,  Fukuo Ishikawa

IPC: H01L23/34 ,  H01L23/10 ,  H01L23/28

CPC classification number: H05K1/0201 ,  H01L2924/0002 ,  H05K1/0206 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10545 ,  H05K2203/304 ,  H01L2924/00

Abstract: A load driving semiconductor apparatus includes: a driving transistor, which operates based on an input voltage from an external circuit; a power semiconductor device controlling power supply to a load in such a manner that the power semiconductor device supplies electric power to the load when the transistor operates, and the power semiconductor device stops supplying electric power to the load when the transistor stops operating; and a mounting board, on which the driving transistor and the power semiconductor device are mounted. The mounting board includes a heat radiation pattern for emitting heat generated in the power semiconductor device. The heat radiation pattern includes a heat receiving pattern, on which the driving transistor is mounted.

Abstract translation: 一种负载驱动半导体装置，包括：驱动晶体管，其基于来自外部电路的输入电压进行动作; 功率半导体装置，其以这样的方式控制对负载的电力供给，即当所述晶体管工作时所述功率半导体装置向所述负载提供电力，并且所述功率半导体装置在所述晶体管停止工作时停止向所述负载供给电力; 以及安装基板，其上安装有驱动晶体管和功率半导体器件。 安装板包括用于发射在功率半导体器件中产生的热的散热图案。 散热图案包括其上安装驱动晶体管的热接收图案。

公开(公告)号：US20110024163A1

公开(公告)日：2011-02-03

申请号：US12512029

申请日：2009-07-30

Applicant: Masaharu Goto ,  Minoru Uchida ,  Koji Tokuno

Inventor： Masaharu Goto ,  Minoru Uchida ,  Koji Tokuno

IPC: H05K1/05 ,  H05K3/00 ,  H05K1/11

CPC classification number: H05K1/0256 ,  H05K1/181 ,  H05K2201/0723 ,  H05K2201/09036 ,  H05K2201/09072 ,  H05K2201/09972 ,  H05K2201/10166 ,  Y10T29/49155

Abstract: A print circuit board includes: a first surface; a guard plane disposed on an inner layer; a high insulated region formed on the first surface of the board so as to be opposed to the guard plane, the high insulated region being substantially surrounded by one or more first guard patterns; and a quasi-high insulated region formed on the first surface of the board so as to be disposed adjacent to the high insulated region. The quasi-high insulated region is substantially surrounded by at least a part of the one or more first guard patterns and by one or more second guard patterns, in which the one or more first guard patterns and the one or more second guard patterns are each formed by forming one or more trenches in the first surface of the board so as to expose the guard plane on a bottom surface of the trenches.

Abstract translation: 印刷电路板包括：第一表面; 设置在内层上的保护平面; 形成在所述基板的所述第一表面上以与所述保护平面相对的高绝缘区域，所述高绝缘区域基本上被一个或多个第一保护图案包围; 以及形成在所述基板的所述第一表面上以准备邻近所述高绝缘区域设置的准高绝缘区域。 准高绝缘区域基本上由一个或多个第一保护图案的至少一部分和一个或多个第二保护图案包围，其中一个或多个第一保护图案和一个或多个第二保护图案各自 通过在所述板的所述第一表面中形成一个或多个沟槽而形成，以便在所述沟槽的底表面上露出所述保护平面。

公开(公告)号：US20110002358A1

公开(公告)日：2011-01-06

申请号：US12574588

申请日：2009-10-06

Applicant: Tetsuo Sato ,  Ryotaro Kudo

Inventor： Tetsuo Sato ,  Ryotaro Kudo

IPC: G01K7/00

CPC classification number: G01K7/00 ,  G01K1/026 ,  G01K3/00 ,  G01K7/01 ,  G01K2003/145 ,  G06F1/206 ,  G06F1/26 ,  H01L23/34 ,  H01L2924/0002 ,  H05K1/0201 ,  H05K1/0262 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2203/163 ,  Y02D10/16 ,  H01L2924/00

Abstract: An apparatus, in one embodiment, can include a configuration including a plurality of heat generation devices. The apparatus also includes a plurality of thermal sensors respectively, operably connected to each of the plurality of heat generation devices, wherein each thermal sensor of the plurality of thermal sensors includes a respective output terminal configured to provide a voltage representative of the temperature of the respective heat generation device. The apparatus further includes an output circuit configured to output the highest temperature information among the heat generation devices. The output terminals of the plurality of thermal sensors are tied together. A corresponding method is also discussed.

Abstract translation: 在一个实施例中，装置可以包括包括多个发热装置的构造。 该装置还包括分别可操作地连接到多个发热装置中的每一个的多个热传感器，其中多个热传感器中的每个热传感器包括相应的输出端子，其被配置为提供代表相应 发热装置。 该装置还包括：输出电路，被配置为在发热装置之间输出最高温度信息。 多个热传感器的输出端子被连接在一起。 还讨论了相应的方法。

公开(公告)号：US07821346B2

公开(公告)日：2010-10-26

申请号：US12229114

申请日：2008-08-20

Applicant: Jeffrey A. McCracken

Inventor： Jeffrey A. McCracken

IPC: H03B1/00 ,  H03B5/32 ,  H03L1/02

CPC classification number: H03L1/04 ,  H03L1/028 ,  H05K1/0206 ,  H05K1/0212 ,  H05K1/141 ,  H05K3/305 ,  H05K2201/09036 ,  H05K2201/10068 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10462 ,  H05K2201/10545 ,  H05K2201/10946

Abstract: An ovenized oscillator package including at least a heater and a crystal package mounted on opposite sides of a circuit board. Vias extend through the body of the circuit board to transfer heat from the heater to the crystal package. Layers of thermally conductive material extend through the body of the circuit board and are in thermally coupled relationship with the vias for spreading heat throughout the circuit board and other elements mounted thereon.

Abstract translation: 一种加热振荡器封装，其至少包括加热器和安装在电路板的相对侧上的晶体封装。 通孔延伸穿过电路板的主体，以将热量从加热器传递到晶体封装。 导热材料层延伸穿过电路板的主体并与通孔热耦合，用于在整个电路板和安装在其上的其它元件上散热。

公开(公告)号：US07821207B2

公开(公告)日：2010-10-26

申请号：US11817140

申请日：2006-03-02

Applicant: Etsuji Morimoto ,  Kazuhiko Itou ,  Masayoshi Gyoten ,  Akira Takahashi

Inventor： Etsuji Morimoto ,  Kazuhiko Itou ,  Masayoshi Gyoten ,  Akira Takahashi

IPC: H01J23/16

CPC classification number: H05K1/0201 ,  H01J61/327 ,  H01J61/56 ,  H05B41/298 ,  H05B41/2988 ,  H05K1/18 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/10166 ,  H05K2201/10522

Abstract: Provided is a lighting unit and a discharge lamp each of which is capable of causing a capacitor to break down by heat generated in a heat generating component, so that circuit operation is safely terminated without any additional cost. A compact self-ballasted fluorescent lamp is provided with a lighting unit (50) housed in a case. The lighting unit (50) causes an arc tube to emit light and is composed of a plurality of electronic components, including a rectifier/smoothing circuit portion, an inverter circuit portion having transistors (Q1 and Q2), a resonant circuit portion, and a preheating circuit portion having a positive temperature coefficient element. Among the plurality of electronic components, the transistors (Q1 and Q2) and the positive temperature coefficient element generate excessive heat when, for example, the lamp is operated at the end of electrode's life. Capacitors (C4 and C6) disposed in the vicinity of the positive temperature coefficient element would break down by heat in a short mode.

Abstract translation: 提供了一种照明单元和放电灯，每个照明单元和放电灯能够使电容器由于在发热部件中产生的热量而分解，使得电路操作安全地终止而没有任何额外的成本。 小型自镇流荧光灯设置有容纳在壳体中的照明单元（50）。 照明单元（50）使电弧管发光，并且由包括整流/平滑电路部分的多个电子部件组成，具有晶体管（Q1和Q2），谐振电路部分和 具有正温度系数元件的预热回路部。 在多个电子部件中，当例如在电极寿命结束时操作时，晶体管（Q1和Q2）和正温度系数元件产生过多的热量。 设置在正温度系数元素附近的电容器（C4和C6）将在短时间模式下被热分解。

公开(公告)号：US20100238633A1

公开(公告)日：2010-09-23

申请号：US12682689

申请日：2008-10-27

Applicant: Gebhard Michenfelder ,  Stephan Pauli

Inventor： Gebhard Michenfelder ,  Stephan Pauli

IPC: H05K7/20

CPC classification number: H01L23/34 ,  B60S1/08 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0209 ,  H05K2201/066 ,  H05K2201/09781 ,  H05K2201/10166 ,  H01L2924/00

Abstract: A power circuit (10) for activating a drive unit for a wiper system of a motor vehicle has a circuit breaker (14) for activating the drive unit. According to the invention a heat accumulator (16) for absorbing heat accumulating in the circuit breaker (14) when the drive unit is in the blocked state is thermally connected to the circuit breaker (14). In the event of sudden heat generation in the circuit breaker (14) a majority of the resulting heat can be discharged quickly to the heat accumulator (16) such that the circuit breaker (14) can be smaller in size and the power circuit (10) enables use of a higher-ohm circuit breaker (14).

Abstract translation: 用于启动机动车辆的刮水器系统的驱动单元的电源电路（10）具有用于启动驱动单元的断路器（14）。 根据本发明，当驱动单元处于阻挡状态时，用于吸收蓄积在断路器（14）中的热量的蓄热器（16）热连接到断路器（14）。 在断路器（14）中突然产生热量的情况下，所得到的热量的大部分能够快速地排放到蓄热器（16），使得断路器（14）的尺寸可以更小并且电力电路（10 ）使得能够使用更高欧姆的断路​​器（14）。

公开(公告)号：US20100219519A1

公开(公告)日：2010-09-02

申请号：US12779815

申请日：2010-05-13

Applicant: King Owyang ,  Mohammed Kasem ,  Yuming Bai ,  Frank Kuo ,  Sen Mao ,  Sam Kuo

Inventor： King Owyang ,  Mohammed Kasem ,  Yuming Bai ,  Frank Kuo ,  Sen Mao ,  Sam Kuo

IPC: H01L23/52 ,  H01L23/28 ,  H01L23/538 ,  H01L23/34

CPC classification number: G05F3/08 ,  H01L23/36 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L25/16 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0106 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/30107 ,  H02M3/00 ,  H02M3/04 ,  H05K1/0206 ,  H05K1/0218 ,  H05K1/141 ,  H05K1/181 ,  H05K3/202 ,  H05K3/284 ,  H05K3/3436 ,  H05K7/20409 ,  H05K7/205 ,  H05K2201/10166 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/05599

Abstract: A complete power management system implemented in a single surface mount package. The system may be drawn to a DC to DC converter system and includes, in a leadless surface mount package, a driver/controller, a MOSFET transistor, passive components (e.g., inductor, capacitor, resistor), and optionally a diode. The MOSFET transistor may be replaced with an insulated gate bipolar transistor, IGBT in various embodiments. The system may also be a power management system, a smart power module or a motion control system. The passive components may be connected between the leadframe connections. The active components may be coupled to the leadframe using metal clip bonding techniques. In one embodiment, an exposed metal bottom may act as an effective heat sink.

Abstract translation: 在单个表面贴装封装中实现的完整的电源管理系统。 该系统可被绘制到DC-DC转换器系统，并且在无引线表面贴装封装中包括驱动器/控制器，MOSFET晶体管，无源元件（例如，电感器，电容器，电阻器）和可选的二极管。 在各种实施例中，MOSFET晶体管可以由绝缘栅双极晶体管，IGBT替代。 该系统还可以是电源管理系统，智能电源模块或运动控制系统。 无源组件可以连接在引线框连接之间。 可以使用金属夹接合技术将有源部件耦合到引线框架。 在一个实施例中，暴露的金属底部可以用作有效散热器。

公开(公告)号：US20100218684A1

公开(公告)日：2010-09-02

申请号：US12681362

申请日：2008-10-01

Applicant: Stefan Etter ,  Urs Gaudenz ,  Gilles Gavillet ,  Thomas Hodel ,  Alexandre Kollep ,  Peter Möri ,  Renzo Moser ,  Peter Preisig ,  Robin Schwab

Inventor： Stefan Etter ,  Urs Gaudenz ,  Gilles Gavillet ,  Thomas Hodel ,  Alexandre Kollep ,  Peter Möri ,  Renzo Moser ,  Peter Preisig ,  Robin Schwab

IPC: A47J31/44 ,  F24H1/10 ,  G01F1/00 ,  H05K1/00

CPC classification number: A47J31/441 ,  A47J31/407 ,  A47J31/542 ,  A47J31/545 ,  F24H1/101 ,  F24H9/2028 ,  H01H37/52 ,  H05K1/18 ,  H05K3/306 ,  H05K2201/10151 ,  H05K2201/10166 ,  H05K2201/10181 ,  H05K2201/10189 ,  H05K2201/10424 ,  H05K2201/105 ,  H05K2201/2036

Abstract: An in-line heating device for a liquid food or beverage preparation machine in which liquid is circulated through the heating device and then guided into a brewing chamber. This heating device includes a thermoblock with a metal mass that incorporates an inlet, an outlet and a heating chamber extending therebetween to form a passage for guiding the liquid circulating through the mass, with the mass arranged to accumulate heat and to supply heat to the liquid; and one or more electric components that are rigidly secured onto or into the thermoblock and that are connected to a printed circuit board or a flex-print arranged to control the thermoblock. The electric components are rigidly connected to the printed circuit board or flex-print, in particular via rigid connector pins or blades or rigid plug and socket members.

Abstract translation: 一种用于液体食品或饮料制备机的在线加热装置，其中液体通过加热装置循环，然后被引导到煮泡室中。 该加热装置包括具有金属块的热块，其包括入口，出口和在其间延伸的加热室，以形成用于引导循环通过物料的液体的通道，质量被布置成积聚热量并向液体供应热量 ; 以及一个或多个刚性地固定在热块上并且连接到布置成控制热块的印刷电路板或柔性印刷件的电气部件。 电气部件刚性地连接到印刷电路板或柔性印刷，特别是通过刚性连接器销或刀片或刚性插头和插座部件。

公开(公告)号：US20100201661A1

公开(公告)日：2010-08-12

申请号：US12765084

申请日：2010-04-22

Applicant: Hajime Kimura ,  Shunpei Yamazaki

Inventor： Hajime Kimura ,  Shunpei Yamazaki

IPC: G06F3/038

CPC classification number: G02F1/13452 ,  G02F1/13306 ,  G02F1/133345 ,  G02F1/133512 ,  G02F1/133514 ,  G02F1/1339 ,  G02F1/13394 ,  G02F1/1341 ,  G02F1/1368 ,  G09G3/20 ,  G09G3/2092 ,  G09G3/3614 ,  G09G2300/0408 ,  G09G2300/0426 ,  G09G2300/0439 ,  G09G2300/08 ,  G09G2310/0264 ,  G09G2320/043 ,  G09G2330/021 ,  G09G2330/08 ,  H01L27/1222 ,  H01L2924/0002 ,  H05K1/0263 ,  H05K1/0265 ,  H05K1/117 ,  H05K1/148 ,  H05K3/361 ,  H05K2201/094 ,  H05K2201/09727 ,  H05K2201/10136 ,  H05K2201/10166 ,  H01L2924/00

Abstract: If misalignment in a line width direction of an electrode (pad) of a connection terminal is caused in attachment of a substrate and an FPC, a connection area of the FPC terminal and the connection terminal becomes smaller and contact resistance is increased. In particular, an increase in contact resistance of the connection terminal to which a power supply potential serving as a power source is inputted is a cause of defective display. In view of the above, an object of the present invention is to decrease the resistance of a power supply line, to suppress a voltage drop in the power supply line, and to prevent defective display. A connection terminal portion includes a plurality of connection terminals. The plurality of connection terminals is provided with a plurality of connection pads which is part of the connection terminal. The plurality of connection pads includes a first connection pad and a second connection pad having a line width different from that of the first connection pad. Pitches between the plurality of connection pads are equal to each other.

Abstract translation: 如果在基板和FPC的安装中引起连接端子的电极（焊盘）的线宽方向的偏移，则FPC端子和连接端子的连接面积变小，接触电阻增加。 特别地，输入用作电源的电源电位的连接端子的接触电阻的增加是缺陷显示的原因。 鉴于上述，本发明的目的是降低电源线的电阻，以抑制电源线中的电压降，并且防止不良显示。 连接端子部分包括多个连接端子。 多个连接端子设置有作为连接端子的一部分的多个连接焊盘。 多个连接焊盘包括第一连接焊盘和具有不同于第一连接焊盘的线宽的第二连接焊盘。 多个连接垫之间的间距彼此相等。

公开(公告)号：US20100147572A1

公开(公告)日：2010-06-17

申请号：US12336669

申请日：2008-12-17

Applicant: Peter Janes ,  Riazuddin R. Shaikh

Inventor： Peter Janes ,  Riazuddin R. Shaikh

IPC: H05K1/16 ,  H05K13/00

CPC classification number: H01L21/02 ,  H01L23/051 ,  H01L23/16 ,  H01L24/72 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/1301 ,  H01L2924/13034 ,  H01L2924/1305 ,  H01L2924/13055 ,  H05K1/0271 ,  H05K1/182 ,  H05K2201/10166 ,  H05K2201/2045 ,  Y10T29/41 ,  Y10T29/49002 ,  Y10T29/49169 ,  H01L2924/00

Abstract: Disclosed herein is a device for reducing noise generated by an electrical component, the device including a stiffening component secured to an electrical component, wherein the stiffening component provides rigidity to the electrical component, thereby reducing the mechanical resonance of the electrical component during operation. The electrical component has at least one end face and a flange portion that includes a flange face that extends about a perimeter of the end face. The flange face is substantially parallel to the end face, wherein the stiffening component is secured to the flange face of the electrical component such that it does not extend into a plane of the end face. Further, the stiffening component can include a stiffening portion and a securing portion, wherein the stiffening portion is secured to the flange face of the electrical component by the securing portion. Further, the electrical component can be a power semiconductor device.

Abstract translation: 本文公开了一种用于减少由电气部件产生的噪声的装置，该装置包括固定到电气部件的加强部件，其中加强部件为电气部件提供刚性，由此在运行期间减小电气部件的机械谐振。 电气部件具有至少一个端面和凸缘部分，该凸缘部分包括围绕端面的周边延伸的凸缘面。 凸缘面基本上平行于端面，其中加强部件固定到电气部件的凸缘面，使得其不延伸到端面的平面内。 此外，加强部件可以包括加强部分和固定部分，其中加强部分通过固定部分固定到电气部件的凸缘面。 此外，电气部件可以是功率半导体器件。