公开(公告)号：US20110111606A1

公开(公告)日：2011-05-12

申请号：US13002473

申请日：2009-05-04

Applicant: Jun-Ho Lee

Inventor： Jun-Ho Lee

IPC: H01R12/62 ,  H05K3/00

CPC classification number: H01R12/79 ,  H01R12/613 ,  H01R12/62 ,  H01R12/85 ,  H01R12/88 ,  H05K3/365 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2201/10393 ,  Y10T29/49124

Abstract: The present invention relates to an FPC connector for electrically connecting an FPC to contact portion of a wirings printed on a PCB, and to an FPC connection method using the same, wherein an FPC (10) is inserted into a housing (110) so that the contact portion of the FPC (10) may come in direct contact with a contact portion (2a) of the PCB, and an pressing member pressing the FPC (10) on the PCB so as to directly contact the FPC (10) to the PCB (1).

Abstract translation: 本发明涉及一种用于将FPC电连接到印刷在PCB上的布线的接触部分的FPC连接器以及使用其的FPC连接方法，其中FPC（10）插入到壳体（110）中，使得 FPC（10）的接触部分可以与PCB的接触部分（2a）直接接触，并且将印刷电路板上的FPC（10）按压到与FPC（10）直接接触的按压部件 PCB（1）。

公开(公告)号：US20110050386A1

公开(公告)日：2011-03-03

申请号：US12899941

申请日：2010-10-07

Applicant: Roberto SCHLENKER ,  Michael NAGEL ,  Juergen MARTIN

Inventor： Roberto SCHLENKER ,  Michael NAGEL ,  Juergen MARTIN

IPC: H01H37/76

CPC classification number: H01H37/761 ,  H05K1/0201 ,  H05K1/0263 ,  H05K3/222 ,  H05K3/341 ,  H05K3/3415 ,  H05K2201/0311 ,  H05K2201/10181 ,  H05K2201/10265

Abstract: An electronic circuit includes a conductor path on a circuit board, and at least one SMD component, electronic component and/or electromechanical component mounted on the circuit board and connected to the conductor path. A circuit connection is established via a soldered joint and a spring-loaded or stressed springy contact bridge that provides fuse protection. In the event of excessive power dissipation or high temperature, the soldered joint melts or softens and the contact bridge springs open to interrupt the circuit.

Abstract translation: 电子电路包括电路板上的导体路径和安装在电路板上并连接到导体路径的至少一个SMD组件，电子组件和/或机电组件。 通过焊接接头和弹簧加载或应力弹性接触桥建立电路连接，提供保险丝保护。 在功耗过高或温度过高的情况下，焊接接头熔化或软化，接触桥弹簧打开以中断电路。

公开(公告)号：US07891980B2

公开(公告)日：2011-02-22

申请号：US12265311

申请日：2008-11-05

Applicant: Gary D. Frasco

Inventor： Gary D. Frasco

IPC: H01R12/00

CPC classification number: H01R12/52 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/0233 ,  H05K1/0246 ,  H05K1/141 ,  H05K1/181 ,  H05K1/184 ,  H05K3/4046 ,  H05K2201/10022 ,  H05K2201/10037 ,  H05K2201/10174 ,  H05K2201/10181 ,  H05K2201/10265 ,  H05K2201/10378 ,  H05K2201/10734 ,  Y02P70/611

Abstract: An interconnect device is provided with a body through which a plurality of wells has been defined. At least one component having two terminals is provided in one or more of the wells. The component is sealed in its respective well such that the two terminals are accessible on opposite sides of the body. The body corresponds to a Ball Grid Array (BGA) device and is positioned between a BGA device and a printed circuit board (PCB). The component in the well is then inline with a solder ball on the BGA device and a corresponding pad on the PCB. Providing the component in the well frees up surface area on the PCB and also allows for positioning the component closer to a source of a signal. A component in the well is a discrete component having two terminals that may be solderable or made from a conductive pliable material. The terminals may be spring-mounted on the component.

Abstract translation: 互连装置设置有已经定义了多个井的主体。 在一个或多个井中提供具有两个端子的至少一个部件。 该部件密封在其各自的井中，使得两个端子可在主体的相对侧上接近。 主体对应于球栅阵列（BGA）器件，并位于BGA器件和印刷电路板（PCB）之间。 然后，井中的组件与BGA设备上的焊球和PCB上的相应焊盘成直线。 提供井中的组件释放PCB上的表面积，并且还允许将组件定位成更靠近信号源。 井中的部件是具有两个端子的分立部件，该端子可以是可焊接的或由导电柔性材料制成。 端子可以弹簧安装在部件上。

公开(公告)号：US07891089B2

公开(公告)日：2011-02-22

申请号：US12254608

申请日：2008-10-20

Applicant: Takashi Kariya ,  Toshiki Furutani ,  Takeshi Kawanishi

Inventor： Takashi Kariya ,  Toshiki Furutani ,  Takeshi Kawanishi

IPC: H05K3/30

CPC classification number: H05K3/4015 ,  H01L21/4853 ,  H01L23/49811 ,  H01L24/45 ,  H01L24/72 ,  H01L24/78 ,  H01L24/81 ,  H01L24/83 ,  H01L24/90 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/1134 ,  H01L2224/131 ,  H01L2224/451 ,  H01L2224/45139 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/78301 ,  H01L2224/786 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/838 ,  H01L2224/851 ,  H01L2224/85205 ,  H01L2224/90 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/3011 ,  H05K3/326 ,  H05K3/341 ,  H05K2201/10265 ,  H05K2201/10287 ,  H05K2203/049 ,  Y10T29/49135 ,  Y10T29/49142 ,  Y10T29/49149 ,  Y10T29/49153 ,  H01L2224/13099 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2224/48 ,  H01L2924/00015 ,  H01L2224/05599

Abstract: A printed circuit board according to the present invention is a printed circuit board (4) including a component mounting pin (1) made of a metal wire to connect with a semiconductor chip (10). The semiconductor chip (10) is a surface mounting type semiconductor chip having an electrode pad on its mounting surface for use in a flip-chip mounting system. The component mounting pin (1) is formed by using wire-bonding technology. This printed circuit board (4) is able to decrease malconnections or disconnection caused by a difference between the coefficients of thermal expansion of the semiconductor chip (10) and the printed circuit board (4).

Abstract translation: 根据本发明的印刷电路板是印刷电路板（4），包括由金属线制成的元件安装销（1），以与半导体芯片（10）连接。 半导体芯片（10）是表面安装型半导体芯片，其在其安装表面上具有用于倒装芯片安装系统的电极焊盘。 元件安装销（1）通过引线接合技术形成。 该印刷电路板（4）能够减少由半导体芯片（10）和印刷电路板（4）的热膨胀系数之间的差异引起的误连接或断开。

公开(公告)号：US07878834B2

公开(公告)日：2011-02-01

申请号：US12424341

申请日：2009-04-15

Applicant: Neil S. Sherman ,  Brian H. Steuer

Inventor： Neil S. Sherman ,  Brian H. Steuer

IPC: H01R13/62

CPC classification number: H01R12/57 ,  H01R12/585 ,  H01R12/7023 ,  H01R12/7064 ,  H01R13/2421 ,  H05K3/325 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2201/10598 ,  H05K2201/10628

Abstract: A connector device for maintaining a desired spatial relationship for spatially and securely connecting to a platform, such as a circuit board, in an efficient manner. The connector device generally includes a body portion separated from the secondary device, a plurality of legs extending from the body portion for removably attaching the body portion to the secondary device, wherein the plurality of legs each include a foot member insertable within an opening of the secondary device for grasping the secondary device and at least one contact pin extending from the body portion to contact the secondary device on an opposite surface as the foot member. The contact pin maintains the separation between the body portion and the secondary device and includes a spring for providing a counter force against the secondary device with respect to the foot member.

Abstract translation: 一种连接器装置，用于以有效的方式保持用于空间和牢固地连接到平台（例如电路板）的期望的空间关系。 连接器装置通常包括与次级装置分离的主体部分，从主体部分延伸的多个腿部，用于可拆卸地将主体部分附接到次要装置，其中多个腿部各自包括可插入到第二装置的开口内的脚部件 用于抓握次级装置的次级装置和从主体部分延伸的至少一个接触销，以在与脚部件相反的表面上接触次级装置。 接触销保持主体部分和次要装置之间的分离，并且包括用于相对于脚部构件提供抵抗次级装置的反作用力的弹簧。

公开(公告)号：US07848113B2

公开(公告)日：2010-12-07

申请号：US12044504

申请日：2008-03-07

Applicant: Toshiki Oooka

Inventor： Toshiki Oooka

IPC: H05K7/00

CPC classification number: H05K3/3415 ,  H05K1/182 ,  H05K3/1216 ,  H05K3/3484 ,  H05K2201/09072 ,  H05K2201/10189 ,  H05K2201/10265 ,  H05K2203/1572 ,  H05K2203/159 ,  Y02P70/613

Abstract: According to one embodiment, a printed circuit board is provided with a printed wiring board and a circuit component mounted on the printed wiring board. The printed wiring board includes a first surface on which the circuit component is set, a second surface formed on the reverse side of the first surface, and a through hole formed penetrating the printed wiring board from the first surface to the second surface. The circuit component includes a projected portion to be inserted into the through hole. The projected portion is deformable between a first state in which a distal end of the projected portion projects to the outside of the printed wiring board beyond the second surface and a second state in which the distal end of the projected portion is situated in the through hole.

Abstract translation: 根据一个实施例，印刷电路板设置有印刷线路板和安装在印刷线路板上的电路部件。 印刷布线板包括设置有电路部件的第一表面，形成在第一表面的相反侧的第二表面和从第一表面到第二表面穿透印刷电路板的通孔。 电路部件包括插入通孔的突出部分。 突出部分可在其中突出部分的远端突出到印刷电路板的外部超过第二表面的第一状态和突出部分的远端位于通孔中的第二状态之间变形 。

公开(公告)号：US07703200B2

公开(公告)日：2010-04-27

申请号：US12032748

申请日：2008-02-18

Applicant: Ting-Jui Wang ,  Ming-De Wu

Inventor： Ting-Jui Wang ,  Ming-De Wu

IPC: H01R9/00

CPC classification number: H05K1/182 ,  H05K3/3447 ,  H05K2201/10265 ,  H05K2201/10409 ,  Y10T29/49117 ,  Y10T29/49147 ,  Y10T29/49149 ,  Y10T29/49947

Abstract: A packaging method for assembling a screw to a printed circuit board (PCB) includes the steps of: providing a screw having a head, a threaded shank, and a ferrule enclosing the threaded shank; mounting a stop ring on the threaded shank to maintain a predetermined height from top of the head to bottom of the ferrule; using a tool to fetch the screw and align the threaded shank with one through hole provided on the PCB; releasing the screw from the tool for a flange of the ferrule to extend into the through hole on the PCB; heating to melt a solder layer atop of the PCB, so that the ferrule is fixedly held to the PCB when the molten solder layer is cooled and hardened again; and removing the stop ring so that the threaded shank is retracted into the ferrule.

Abstract translation: 用于将螺钉组装到印刷电路板（PCB）的包装方法包括以下步骤：提供具有头部，螺纹柄和包围螺纹柄的套圈的螺钉; 在所述螺纹柄上安装止动环以保持从头部的顶部到所述套圈的底部的预定高度; 使用工具取出螺丝，并将螺纹柄与PCB上提供的一个通孔对准; 从工具上释放螺丝以使套圈的凸缘延伸到PCB上的通孔中; 加热以在PCB的顶部熔化焊料层，使得当熔融焊料层再次冷却和硬化时，套圈固定地保持在PCB上; 并且移除止动环，使得螺纹杆缩回到套圈中。

公开(公告)号：US07700884B2

公开(公告)日：2010-04-20

申请号：US11292694

申请日：2005-12-02

Applicant: Anthony Casasnovas ,  Scott P. Dukes

Inventor： Anthony Casasnovas ,  Scott P. Dukes

IPC: H05K1/16 ,  H01R43/00

CPC classification number: H05K3/3436 ,  H01L23/49811 ,  H01L2924/0002 ,  H01L2924/15312 ,  H05K2201/10242 ,  H05K2201/10265 ,  H05K2201/1031 ,  H05K2201/10893 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/49222 ,  Y10T29/53174 ,  H01L2924/00

Abstract: A method for forming interconnections within a column grid array is provided. The method involves casting one or more columns with at least a compliant core material that increases flexibility between an electronic component and a printed wiring board by at least a factor of two over metallic-based solder columns, and forming the one or more columns to length for interconnecting between the electronic component and the printed wiring board. The method also involves forming a conductive material for the one or more columns to provide electrical interconnection between the electronic component and the printed wiring board.

Abstract translation: 提供了一种用于在列网格阵列内形成互连的方法。 该方法包括用至少一种柔性芯材料铸造一个或多个柱，其在金属基焊料柱上增加电子部件和印刷线路板之间的至少两倍的柔性，并且将一个或多个柱形成长度 用于在电子部件和印刷电路板之间互连。 该方法还涉及形成用于一个或多个列的导电材料以提供电子部件和印刷线路板之间的电互连。

公开(公告)号：US20100001825A1

公开(公告)日：2010-01-07

申请号：US12484575

申请日：2009-06-15

Applicant: Masaki Yamamoto

Inventor： Masaki Yamamoto

IPC: H01F27/28

CPC classification number: H03J5/244 ,  H01F5/00 ,  H05K1/18 ,  H05K2201/1003 ,  H05K2201/10265 ,  H05K2201/10522

Abstract: A double-tuned circuit includes a primary side tuned circuit having a first air-cored coil and a secondary side tuned circuit having a second air-cored coil. The first air-cored coil and the second air-cored coil are opposed to each other so that one opening end of the first air-cored coil and one opening end of the second air-cored coil are capable of being coupled to each other on a coil mounting surface. The coil mounting surface is provided with a first conductive pattern formed adjacent to the first air-cored coil in a direction perpendicular to an arrangement direction of the first and second air-cored coils, and both ends of first conductive pattern are connected to a ground.

Abstract translation: 双调谐电路包括具有第一空心线圈的初级侧调谐电路和具有第二空心线圈的次级侧调谐电路。 第一空心线圈和第二空心线圈彼此相对，使得第一空心线圈的一个开口端和第二空心线圈的一个开口端能够彼此连接 线圈安装面。 线圈安装面设置有与第一空心线圈相邻的第一导电图案，该第一导电图案沿垂直于第一和第二空心线圈的排列方向的方向形成，第一导电图案的两端连接到地面 。

公开(公告)号：US20090223702A1

公开(公告)日：2009-09-10

申请号：US12098661

申请日：2008-04-07

Applicant: Yu-Huan Qiu ,  Wen-Kang Fan

Inventor： Yu-Huan Qiu ,  Wen-Kang Fan

IPC: H05K1/02

CPC classification number: H05K3/222 ,  H05K1/0237 ,  H05K3/0005 ,  H05K2201/09236 ,  H05K2201/10265

Abstract: A trace carrier is provided. The trace carrier includes a first insulating tube, a second insulating tube, a trace pair, and a sealed hollow insulating cylinder. The trace pair is passing through the first insulating tube and the second insulating tube, and is coiled up in an inner space of the first insulating tube and the second insulating tube. The sealed hollow insulating cylinder encapsulates the first insulating tube, the second insulating tube, and the trace pair, but the four terminals of the trace pair are exposed to the outside of the sealed hollow insulating cylinder.

Abstract translation: 提供轨迹载体。 迹线载体包括第一绝缘管，第二绝缘管，迹线对和密封中空绝缘筒。 轨迹对通过第一绝缘管和第二绝缘管，并且被卷绕在第一绝缘管和第二绝缘管的内部空间中。 密封的中空绝缘圆柱体封装第一绝缘管，第二绝缘管和迹线对，但是迹线对的四个端子暴露于密封的中空绝缘筒的外部。