公开(公告)号：US5706160A

公开(公告)日：1998-01-06

申请号：US577548

申请日：1995-12-22

Applicant: Walter Latuszkin ,  Mohammad Masghati ,  Dorothy E. Kruglick

Inventor： Walter Latuszkin ,  Mohammad Masghati ,  Dorothy E. Kruglick

IPC: H02H9/04 ,  H04M3/18 ,  H05K1/02 ,  H05K1/18 ,  H02H9/06

CPC classification number: H02H9/044 ,  H04M3/18 ,  H05K1/0257 ,  H05K1/0254 ,  H05K1/0259 ,  H05K1/18 ,  H05K2201/09672 ,  H05K2201/10174 ,  H05K2201/10371 ,  Y10T307/786

Abstract: A surge protector module for protecting telecommunications equipment from power and transient surges includes a two-piece interfitting housing, a printed circuit board, a plurality of circuit surge protector devices mounted on the printed circuit board, an input connector connected to a first side of the printed circuit board, and an output connector connected to a second side of the printed circuit board. The printed circuit board includes a unique pattern of conductive traces for use in association with the electrical components of the protector devices so as to meet the TIA's Category 5 specification for connectors. As a result, the bandwidth of the protector module has been extended.

Abstract translation: 用于保护电信设备免受电力和瞬态浪涌的浪涌保护器模块包括两件式对接壳体，印刷电路板，安装在印刷电路板上的多个电路电涌保护器装置，连接到第一侧的输入连接器 印刷电路板和连接到印刷电路板的第二侧的输出连接器。 印刷电路板包括与保护器装置的电气部件相关联使用的导电迹线的独特图案，以便符合TIA针对连接器的5类规格。 结果，保护模块的带宽已经扩展。

公开(公告)号：US5661441A

公开(公告)日：1997-08-26

申请号：US509533

申请日：1995-07-31

Applicant: Takayoshi Morino ,  Yukiro Kashima

Inventor： Takayoshi Morino ,  Yukiro Kashima

IPC: H05K9/00 ,  H01P7/10 ,  H01P11/00 ,  H03B5/18 ,  H05K1/02 ,  H05K1/18 ,  H05K3/34

CPC classification number: H01P7/10 ,  H05K1/0243 ,  H05K1/182 ,  H05K2201/10068 ,  H05K2201/10371 ,  H05K3/0061 ,  H05K3/341

Abstract: A microwave oscillator includes a substrate having a circuit pattern on the top surface, a thin copper foil covering the bottom surface, and a hole. An electronic component is mounted to the top surface of the substrate. A metal plate is attached to the bottom surface of the substrate thereby closing the bottom of the hole. A dielectric resonator is attached to the metal plate through the hole. Since the dielectric resonator is attached to the metal plate by soldering, the bond between the dielectric resonator and the metal plate is stronger and more stable than that achieved by using a conventional adhesive. This enhances the reliability against temperature changes; mechanical impact or humidity.

Abstract translation: 微波振荡器包括在顶表面上具有电路图案的基板，覆盖底表面的薄铜箔和一个孔。 电子部件安装到基板的顶表面。 金属板附着到基板的底面，从而封闭孔的底部。 介质谐振器通过孔附着到金属板上。 由于介质谐振器通过焊接附接到金属板，所以介质谐振器和金属板之间的结合比通过使用常规粘合剂所实现的更坚固和更稳定。 这增强了对温度变化的可靠性; 机械冲击或湿度。

公开(公告)号：US5014160A

公开(公告)日：1991-05-07

申请号：US375642

申请日：1989-07-05

Applicant: John F. McCoy, Jr.

Inventor： John F. McCoy, Jr.

IPC: H05K3/30 ,  H05K3/34 ,  H05K9/00

CPC classification number: H05K9/0033 ,  H05K3/308 ,  H05K2201/09854 ,  H05K2201/10371 ,  H05K2201/1059 ,  H05K2203/1572 ,  H05K3/3447

Abstract: An apparatus is provided for EMI/RFI shielding of selected components mounted on a circuit board, the circuit board including a reference plane defined by conductive portions on the board. The circuit board also includes an arrangement of apertures in conductive relation with the reference plane. A first shield has depending members electrically engaging the apertures, while a second shield coacts electrically with either the apertures or depending members to provide encapsulation of the selected components.

Abstract translation: 提供了一种用于安装在电路板上的所选组件的EMI / RFI屏蔽的装置，该电路板包括由板上的导电部分限定的参考平面。 电路板还包括与参考平面呈导电关系的孔的布置。 第一屏蔽件具有电气接合孔的悬挂构件，而第二屏蔽件与孔或悬置构件电连接以提供所选部件的封装。

公开(公告)号：US4882550A

公开(公告)日：1989-11-21

申请号：US307439

申请日：1989-02-07

Applicant: Toshiki Baba

Inventor： Toshiki Baba

IPC: H03B1/00 ,  H03B5/18 ,  H04B1/38 ,  H04B1/40 ,  H05K1/02 ,  H05K3/30

CPC classification number: H04B1/40 ,  H03B5/18 ,  H05K1/0243 ,  H05K2201/10068 ,  H05K2201/10166 ,  H05K2201/10371 ,  H05K2201/10545 ,  H05K3/301

Abstract: A connecting structure for connecting two oscillator circuits to an amplifier. The oscillator circuits are provided on one surface of a printed circuit board and include two dielectric resonators. The amplifier circuit is provided on the other surface of the printed circuit board for selectively amplifying oscillatory outputs from the oscillator circuits. The dielectric resonators are fixed to a metal plate mounted on the printed circuit board, and the amplifier circuit is located at a position opposite to the metal plate.

Abstract translation: 用于将两个振荡电路连接到放大器的连接结构。 振荡器电路设置在印刷电路板的一个表面上并且包括两个介质谐振器。 放大电路设置在印刷电路板的另一表面上，用于选择性地放大来自振荡电路的振荡输出。 介质谐振器固定在安装在印刷电路板上的金属板上，放大电路位于与金属板相对的位置。

公开(公告)号：US4838475A

公开(公告)日：1989-06-13

申请号：US091150

申请日：1987-08-28

Applicant: Aaron B. Mullins ,  Michael H. Bartlett

Inventor： Aaron B. Mullins ,  Michael H. Bartlett

IPC: B23K1/005 ,  B23K3/04 ,  H05K3/34 ,  H05K9/00

CPC classification number: H05K9/0026 ,  H05K3/341 ,  H05K2201/0969 ,  H05K2201/10371 ,  H05K3/3494 ,  Y02P70/613 ,  Y10S174/35 ,  Y10T29/49144 ,  Y10T29/49146

Abstract: An EMI/RFI shield (10) comprises a box like structure formed of a metal integral member having a plurality of apertures (16) formed therethrough. The apertures (16) are of a size appropriate to substantially pass infrared energy (22) and to substantially block EMI/RFI energy (26). When placed on a substrate (18), infrared energy (22) can be utilized to reflow solder a device (19) encapsulated by the shield (10) to the substrate (18).

Abstract translation: EMI / RFI屏蔽（10）包括由具有穿过其形成的多个孔（16）的金属整体构件形成的盒状结构。 孔（16）的尺寸适于基本上通过红外能量（22）并且基本上阻挡EMI / RFI能量（26）。 当放置在基板（18）上时，可以利用红外能量（22）来将由屏蔽件（10）封装的装置（19）焊接到基板（18）。

公开(公告)号：US4644096A

公开(公告)日：1987-02-17

申请号：US713312

申请日：1985-03-18

Applicant: Romulo Gutierrez ,  Albert W. Bauer ,  Thomas L. McDonald

Inventor： Romulo Gutierrez ,  Albert W. Bauer ,  Thomas L. McDonald

IPC: H05K1/02 ,  H05K3/34 ,  H05K5/00 ,  H05K5/06

CPC classification number: H05K5/0095 ,  H05K1/0243 ,  H05K2201/068 ,  H05K2201/10166 ,  H05K2201/10371 ,  H05K2201/10818 ,  H05K2201/10969 ,  H05K2201/2036 ,  H05K2203/1147 ,  H05K3/3421

Abstract: A modified TO-8 package has a kovar header supporting an FET amplifier hermetically sealed by a cover welded along the seam between the cover edge and header edge. The header is formed with three circular openings in space quadrature about the package axis. A circular copper spacer contacts the header and is formed with channels extending radially outward from the header openings to define with the openings three lead channels. A lead having a right angle bend is seated in each channel having an upstanding pin portion above the header. The volume between the lead and the header is filled with hermetically sealing low expansion borosilicate glass. The remainder of each channel is filled or coated with nonconductive epoxy. The depending portions of the leads are flush with the bottom of the copper spacer. In another form the base and cover are rectangular in the form of a four-lead DIP package also having the channels, right-angle-bent leads flush with the bottom surrounded by hermetically sealing insulating low expansion borosilicate glass.

Abstract translation: 经修改的TO-8封装具有一个科瓦头，它支持一个FET放大器，该盖放大器通过沿盖边缘和集管边缘之间的接缝焊接的盖子进行气密密封。 集管形成有围绕封装轴线的空间正交的三个圆形开口。 环形铜隔离物与集管接触并形成有从集管开口径向向外延伸的沟道，以限定开口三个引线通道。 具有直角弯曲的引线位于每个通道中，其具有在头部上方的直立销部分。 引线和插头之间的体积填充有气密密封的低膨胀硼硅酸盐玻璃。 每个通道的其余部分被填充或涂覆有非导电环氧树脂。 引线的悬垂部分与铜间隔物的底部齐平。 在另一种形式中，底座和盖子是具有通道的四引脚DIP封装形式的矩形，直角弯曲引线与由气密密封的绝缘低膨胀硼硅酸盐玻璃包围的底部齐平。

公开(公告)号：US4603927A

公开(公告)日：1986-08-05

申请号：US630027

申请日：1984-07-12

Applicant: John R. Gardner

Inventor： John R. Gardner

IPC: H01B7/00 ,  H01R12/50 ,  H05K1/02 ,  H05K3/34 ,  H01R9/09 ,  H01R31/08

CPC classification number: H05K1/0263 ,  H01R23/6873 ,  H05K2201/10272 ,  H05K2201/10371 ,  H05K2201/10515 ,  H05K2201/10689 ,  H05K3/3421

Abstract: A surface mounted buss bar system is presented wherein the buss bar is mounted on the surface of a circuit board by mounting pads at fixed locations on the board. The buss bar may be mounted directly to the pads or on studs connected to the pads. No through holes or other mounting holes are required in the board for the buss bar.

Abstract translation: 提供了一种表面安装的总线系统，其中通过在板上的固定位置安装焊盘，将总线安装在电路板的表面上。 汇流条可以直接安装到垫或连接到垫的螺柱上。 母线板不需要通孔或其他安装孔。

公开(公告)号：US2886880A

公开(公告)日：1959-05-19

申请号：US29010652

申请日：1952-05-26

Applicant: HERMOPLAST LTD

Inventor： PAUL EISLER

IPC: H01F17/00 ,  H05K1/00 ,  H05K1/16 ,  H05K3/36

CPC classification number: H05K1/165 ,  H01F17/0006 ,  H05K1/0393 ,  H05K3/365 ,  H05K2201/048 ,  H05K2201/055 ,  H05K2201/09145 ,  H05K2201/10371 ,  Y10S310/06 ,  Y10T29/4902 ,  Y10T29/49069

公开(公告)号：US12016112B2

公开(公告)日：2024-06-18

申请号：US17204236

申请日：2021-03-17

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito Otsubo ,  Naoya Murakita

IPC: H05K1/02 ,  H01L23/552 ,  H05K3/28 ,  H05K9/00

CPC classification number: H05K1/0218 ,  H01L23/552 ,  H05K3/284 ,  H05K9/0084 ,  H05K2201/10371

Abstract: A module is provided with a substrate including a principal surface, a plurality of electronic components arranged on the principal surface, a sealing resin covering the principal surface and the plurality of electronic components, a ground electrode arranged on the principal surface or inside the substrate, a conductive layer covering the sealing resin and electrically connected to the ground electrode, and a magnetic member. The magnetic member includes a magnetic plate member arranged so as to cover at least a part of the sealing resin and a magnetic wall member arranged in a wall shape between any of the plurality of electronic components. The module is further provided with a metal pin or a metal wire provided along the magnetic wall member and connected to the ground electrode.

公开(公告)号：US12009311B2

公开(公告)日：2024-06-11

申请号：US17106907

申请日：2020-11-30

Applicant: Snap Inc.

Inventor： Stephen Andrew Steger ,  Emily Lauren Clopp

IPC: H05K1/02 ,  H01L23/552 ,  H05K9/00

CPC classification number: H01L23/552 ,  H05K1/0216 ,  H05K9/0081 ,  H05K9/0024 ,  H05K9/0052 ,  H05K9/0071 ,  H05K2201/0707 ,  H05K2201/10371

Abstract: Various circuit board systems and methods of use and manufacture thereof are disclosed. A circuit board system can have a first circuit board including a substrate and a first component susceptible to electromagnetic interference carried by the substrate. The system can also include a second circuit board including a second substrate, and a shield engaged to the substrate of the first component, the shield at least partially covering the first component and being configured to protect the first component from electromagnetic interference, wherein the shield couples the substrate of the first circuit board to the substrate of the second circuit board.