公开(公告)号：US09474152B2

公开(公告)日：2016-10-18

申请号：US13875062

申请日：2013-05-01

Applicant: Tyco Electronics Corporation

Inventor： David Bruce Sarraf ,  Charles Randall Malstrom

IPC: H05K1/09 ,  H05K3/12 ,  H05K3/32 ,  H01R12/72 ,  H05K1/11 ,  H05K3/40 ,  H01Q1/24 ,  H01Q1/38

CPC classification number: H05K1/092 ,  H01Q1/243 ,  H01Q1/38 ,  H01R12/728 ,  H05K1/11 ,  H05K3/12 ,  H05K3/32 ,  H05K3/4015 ,  H05K2201/0311 ,  H05K2201/0999 ,  H05K2201/10295 ,  H05K2201/1034 ,  H05K2201/10386 ,  Y10T29/4913

Abstract: An electronic device includes a dielectric substrate having a first surface, a conductive circuit deposited on the first surface and having a printed conductive ink trace on the first surface, and a conductive interposer mechanically coupled to the substrate. The conductive interposer is electrically coupled to the conductive circuit. The conductive interposer has a separable contact interface configured to be mechanically and electrically connected to a removable contact. Optionally, the conductive interposer may include a main body and a flexible element extending between the main body and the conductive circuit. The flexible element electrically connects the conductive circuit with the main body.

Abstract translation: 电子器件包括具有第一表面的电介质衬底，沉积在第一表面上的导电电路，并且在第一表面上具有印刷的导电油墨迹线，以及机械耦合到衬底的导电插入器。 导电插入器电耦合到导电电路。 导电插入器具有可分离的接触界面，其被配置为机械地和电连接到可移除触点。 可选地，导电插入件可以包括主体和在主体和导电电路之间延伸的柔性元件。 柔性元件将导电电路与主体电连接。

公开(公告)号：US09350124B2

公开(公告)日：2016-05-24

申请号：US14408039

申请日：2013-03-13

Applicant: HSIO TECHNOLOGIES, LLC

Inventor： James Rathburn

IPC: H01R12/68 ,  H01R12/50 ,  H01R13/24 ,  H01R12/82 ,  H05K3/36 ,  H05K3/40 ,  H01R12/73 ,  H01L23/00 ,  H05K1/09 ,  H05K1/11 ,  H05K1/18 ,  H05K3/00 ,  H05K3/42 ,  H05K3/46

CPC classification number: H01R23/6813 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01R12/73 ,  H01R12/82 ,  H01R13/2457 ,  H01R13/2485 ,  H01R31/06 ,  H05K1/092 ,  H05K1/111 ,  H05K1/141 ,  H05K1/182 ,  H05K3/0094 ,  H05K3/10 ,  H05K3/1291 ,  H05K3/326 ,  H05K3/363 ,  H05K3/365 ,  H05K3/4007 ,  H05K3/4015 ,  H05K3/4092 ,  H05K3/425 ,  H05K3/4694 ,  H05K7/1076 ,  H05K2201/0397 ,  H05K2201/048 ,  H05K2201/09381 ,  H05K2201/09545 ,  H05K2201/09563 ,  H05K2201/09854 ,  H05K2201/10378 ,  H05K2201/10386 ,  H05K2201/2072 ,  H05K2201/209 ,  H05K2203/041 ,  H05K2203/1476 ,  Y10T29/49165 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A method of making an array of integral terminals on a circuit assembly. The method includes the steps of depositing at least a first liquid dielectric layer on the first surface of a first circuit member, imaged to include a plurality of first recesses corresponding to the array of integral terminals. The selected surfaces of the first recesses are processed to accept electro-less conductive plating deposition. Electro-lessly plating is applied to the selected surfaces of the first recesses to create a plurality of first conductive structures electrically coupled to, and extending generally perpendicular to, the first circuitry layer. Electro-plating is applied to the electro-less plating to substantially first recesses with a conductive material. The steps of depositing, processing, electro-less plating, and electro-plating are repeated to form the integral terminals of a desired shape. The dielectric layers are removed to expose the terminals.

Abstract translation: 一种在电路组件上制成集成端子阵列的方法。 该方法包括以下步骤：在第一电路构件的第一表面上沉积至少第一液体电介质层，成像为包括与集成端子阵列相对应的多个第一凹部。 处理第一凹槽的选定表面以接受无电导电电镀沉积。 对所述第一凹槽的所选择的表面施加无电镀以产生电耦合到所述第一电路层并且大致垂直于所述第一电路层延伸的多个第一导电结构。 使用导电材料将电镀施加到基本上第一凹部的无电镀。 重复沉积，加工，无电镀和电镀的步骤以形成所需形状的整体端子。 去除电介质层以露出端子。

公开(公告)号：US20160103147A1

公开(公告)日：2016-04-14

申请号：US14878644

申请日：2015-10-08

Applicant: Continental Automotive Systems, Inc.

Inventor： Gaetan Vich

IPC: G01P1/02 ,  G01P3/42 ,  H01R4/28

CPC classification number: G01P1/026 ,  G01P3/42 ,  H01R4/28 ,  H05K3/28 ,  H05K3/326 ,  H05K2201/0397 ,  H05K2201/10151 ,  H05K2201/10386 ,  H05K2201/10446 ,  H05K2201/10757 ,  H05K2203/1316 ,  H05K2203/1327

Abstract: An automotive component assembly comprises an input circuit portion for a sensor and a component portion. The input circuit portion is aligned with the component portion in a desired assembly position. A pocket is at least partially defined by the component portion to receive the input circuit portion and a clamping force retains the input circuit portion between a first layer and a second layer of the component portion forming the pocket. An overmold material is applied to retain the input circuit portion and the component portion to one another.

Abstract translation: 汽车部件组件包括用于传感器的输入电路部分和部件部分。 输入电路部分与组件部分对准在期望的组装位置。 口袋至少部分地由部件限定以接收输入电路部分，并且夹紧力将输入电路部分保持在形成口袋的部件部分的第一层和第二层之间。 施加包覆成型材料以将输入电路部分和部件部分保持彼此。

公开(公告)号：US09237683B2

公开(公告)日：2016-01-12

申请号：US14024826

申请日：2013-09-12

Applicant: DELPHI TECHNOLOGIES, INC.

Inventor： Vineet Gupta ,  Joseph K. Huntzinger ,  Michael G. Coady ,  Curtis Allen Stapert ,  Kevin Earl Meyer ,  Timothy D. Garner ,  Jeffrey T. Bell ,  Robert L. Vadas ,  Allen E. Oberlin

IPC: H05K7/20 ,  H05K9/00 ,  H04B1/08 ,  H05K1/02 ,  H05K5/02 ,  H05K13/00 ,  H04R1/02 ,  B29C59/16 ,  G06F11/00 ,  B60R11/02 ,  H05K1/14

CPC classification number: H05K9/0007 ,  B29C59/16 ,  B60R11/02 ,  G06F11/00 ,  H04B1/082 ,  H04R1/02 ,  H05K1/0215 ,  H05K1/141 ,  H05K5/0217 ,  H05K5/0221 ,  H05K5/0226 ,  H05K7/20409 ,  H05K7/20418 ,  H05K7/20436 ,  H05K9/0047 ,  H05K9/0079 ,  H05K9/0081 ,  H05K13/00 ,  H05K2201/09081 ,  H05K2201/10386 ,  H05K2201/10446 ,  Y10T16/547 ,  Y10T16/5476 ,  Y10T29/49002 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49169 ,  Y10T29/49172 ,  Y10T29/4957 ,  Y10T29/49826 ,  Y10T29/49861 ,  Y10T29/5313 ,  Y10T74/20396 ,  Y10T403/70 ,  Y10T403/77 ,  Y10T428/24289

Abstract: A lightweight radio/Audio player for vehicular application includes a case and frontal interface formed of polymer based material molded to provide details to accept audio devices and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips.

Abstract translation: 用于车辆应用的轻便无线电/音频播放器包括由聚合物基材料模制的壳体和正面接口，以提供接收音频设备和无线电接收器的细节以及电气控制和显示所需的电路板。 外壳和正面接口为复合结构，包括已经通过模制操作预先形成轮廓的镶嵌模制导电丝网。 丝网通过暴露的金属丝网垫和相邻的接地夹提供电路板的屏蔽和接地。

公开(公告)号：US09119288B2

公开(公告)日：2015-08-25

申请号：US14620782

申请日：2015-02-12

Applicant: DELPHI TECHNOLOGIES, INC.

Inventor： Chris R. Snider ,  Vineet Gupta ,  Michael G. Coady ,  Curtis Allen Stapert ,  Donald G. Moeschberger ,  Allen E. Oberlin

IPC: H05K5/00 ,  H05K9/00 ,  H05K5/02

CPC classification number: H05K9/0007 ,  B29C59/16 ,  B60R11/02 ,  G06F11/00 ,  H04B1/082 ,  H04R1/02 ,  H05K1/0215 ,  H05K1/141 ,  H05K5/0217 ,  H05K5/0221 ,  H05K5/0226 ,  H05K7/20409 ,  H05K7/20418 ,  H05K7/20436 ,  H05K9/0047 ,  H05K9/0079 ,  H05K9/0081 ,  H05K13/00 ,  H05K2201/09081 ,  H05K2201/10386 ,  H05K2201/10446 ,  Y10T16/547 ,  Y10T16/5476 ,  Y10T29/49002 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49169 ,  Y10T29/49172 ,  Y10T29/4957 ,  Y10T29/49826 ,  Y10T29/49861 ,  Y10T29/5313 ,  Y10T74/20396 ,  Y10T403/70 ,  Y10T403/77 ,  Y10T428/24289

Abstract: A lightweight radio/CD player for vehicular application includes a case and frontal interface formed of polymer based material molded to provide details to accept audio devices and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips.

公开(公告)号：US20150136467A1

公开(公告)日：2015-05-21

申请号：US14408039

申请日：2013-03-13

Applicant: HSIO TECHNOLOGIES, LLC

Inventor： James Rathburn

IPC: H01R12/77 ,  H01R12/82 ,  H01R12/79

CPC classification number: H01R23/6813 ,  H01L24/16 ,  H01L24/48 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01R12/73 ,  H01R12/82 ,  H01R13/2457 ,  H01R13/2485 ,  H01R31/06 ,  H05K1/092 ,  H05K1/111 ,  H05K1/141 ,  H05K1/182 ,  H05K3/0094 ,  H05K3/10 ,  H05K3/1291 ,  H05K3/326 ,  H05K3/363 ,  H05K3/365 ,  H05K3/4007 ,  H05K3/4015 ,  H05K3/4092 ,  H05K3/425 ,  H05K3/4694 ,  H05K7/1076 ,  H05K2201/0397 ,  H05K2201/048 ,  H05K2201/09381 ,  H05K2201/09545 ,  H05K2201/09563 ,  H05K2201/09854 ,  H05K2201/10378 ,  H05K2201/10386 ,  H05K2201/2072 ,  H05K2201/209 ,  H05K2203/041 ,  H05K2203/1476 ,  Y10T29/49165 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A method of making an array of integral terminals on a circuit assembly. The method includes the steps of depositing at least a first liquid dielectric layer on the first surface of a first circuit member, imaged to include a plurality of first recesses corresponding to the array of integral terminals. The selected surfaces of the first recesses are processed to accept electro-less conductive plating deposition. Electro-lessly plating is applied to the selected surfaces of the first recesses to create a plurality of first conductive structures electrically coupled to, and extending generally perpendicular to, the first circuitry layer. Electro-plating is applied to the electro-less plating to substantially first recesses with a conductive material. The steps of depositing, processing, electro-less plating, and electro-plating are repeated to form the integral terminals of a desired shape. The dielectric layers are removed to expose the terminals.

Abstract translation: 一种在电路组件上制成集成端子阵列的方法。 该方法包括以下步骤：在第一电路构件的第一表面上沉积至少第一液体电介质层，成像为包括与集成端子阵列相对应的多个第一凹部。 处理第一凹槽的选定表面以接受无电导电电镀沉积。 对所述第一凹槽的所选择的表面施加无电镀以产生电耦合到所述第一电路层并且大致垂直于所述第一电路层延伸的多个第一导电结构。 使用导电材料将电镀施加到基本上第一凹部的无电镀。 重复沉积，加工，无电镀和电镀的步骤以形成所需形状的整体端子。 去除电介质层以露出端子。

公开(公告)号：US08988884B2

公开(公告)日：2015-03-24

申请号：US14048082

申请日：2013-10-08

Applicant: Delphi Technologies, Inc.

Inventor： Chris R. Snider ,  Vineet Gupta ,  Michael G. Coady ,  Curtis Allen Stapert ,  Donald G. Moeschberger ,  Allen E. Oberlin

IPC: H05K5/00 ,  H05K7/20 ,  H04B1/08 ,  H05K1/02 ,  H05K9/00 ,  H05K5/02 ,  H05K13/00 ,  H04R1/02 ,  B29C59/16 ,  G06F11/00 ,  B60R11/02 ,  H05K1/14

CPC classification number: H05K9/0007 ,  B29C59/16 ,  B60R11/02 ,  G06F11/00 ,  H04B1/082 ,  H04R1/02 ,  H05K1/0215 ,  H05K1/141 ,  H05K5/0217 ,  H05K5/0221 ,  H05K5/0226 ,  H05K7/20409 ,  H05K7/20418 ,  H05K7/20436 ,  H05K9/0047 ,  H05K9/0079 ,  H05K9/0081 ,  H05K13/00 ,  H05K2201/09081 ,  H05K2201/10386 ,  H05K2201/10446 ,  Y10T16/547 ,  Y10T16/5476 ,  Y10T29/49002 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49169 ,  Y10T29/49172 ,  Y10T29/4957 ,  Y10T29/49826 ,  Y10T29/49861 ,  Y10T29/5313 ,  Y10T74/20396 ,  Y10T403/70 ,  Y10T403/77 ,  Y10T428/24289

Abstract: A lightweight radio/CD player for vehicular application includes a case and frontal interface formed of polymer based material molded to provide details to accept audio devices and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips.

公开(公告)号：US08947860B2

公开(公告)日：2015-02-03

申请号：US13905246

申请日：2013-05-30

Applicant: Delphi Technologies, Inc.

Inventor： Chris R. Snider ,  Vineet Gupta ,  Joseph K. Huntzinger ,  Michael G. Coady

IPC: H05K5/00 ,  H05K7/20 ,  H04B1/08 ,  H05K1/02 ,  H05K9/00 ,  H05K5/02 ,  H05K13/00 ,  H04R1/02 ,  B29C59/16 ,  G06F11/00 ,  B60R11/02 ,  H05K1/14

CPC classification number: H05K9/0007 ,  B29C59/16 ,  B60R11/02 ,  G06F11/00 ,  H04B1/082 ,  H04R1/02 ,  H05K1/0215 ,  H05K1/141 ,  H05K5/0217 ,  H05K5/0221 ,  H05K5/0226 ,  H05K7/20409 ,  H05K7/20418 ,  H05K7/20436 ,  H05K9/0047 ,  H05K9/0079 ,  H05K9/0081 ,  H05K13/00 ,  H05K2201/09081 ,  H05K2201/10386 ,  H05K2201/10446 ,  Y10T16/547 ,  Y10T16/5476 ,  Y10T29/49002 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49169 ,  Y10T29/49172 ,  Y10T29/4957 ,  Y10T29/49826 ,  Y10T29/49861 ,  Y10T29/5313 ,  Y10T74/20396 ,  Y10T403/70 ,  Y10T403/77 ,  Y10T428/24289

Abstract: A lightweight radio/CD player for vehicular application is virtually “fastenerless” and includes a case and frontal interface formed of polymer based material that is molded to provide details to accept audio devices such as playback mechanisms (if desired) and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides EMC, RFI, BCI and ESD shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration. The major components and subassemblies are self-fixturing during the final assembly process, eliminating the need for dedicated tools, fixtures and assembly equipment. The major components and subassemblies self-interconnect by integral guide and connection features effecting “slide lock” and “snap lock” self-interconnection. The radio architecture includes improved push buttons employing 4-bar living hinge linkage and front loaded decorative trim buttons.

Abstract translation: 用于车辆应用的轻量级无线电/ CD播放器实际上是“无紧固件”，并且包括由聚合物基材料形成的壳体和正面接口，其被模制以提供细节以接收音频设备，如回放机构（如果需要）和无线电接收器，以及 作为电气控制和显示所需的电路板。 外壳和正面接口为复合结构，包括已经通过模制操作预先形成轮廓的镶嵌模制导电丝网。 金属丝网通过暴露的金属丝网垫和相邻的接地夹提供EMC，RFI，BCI和ESD屏蔽和电路板的接地。 PCB结构分为第一板，其承载具有适合于大批量生产的表面安装配置中的公共电路部件，以及第二板，其以波焊焊棒安装配置的方式承载特定于应用的电路部件。 主要组件和组件在最终组装过程中是自固定的，无需专用工具，夹具和组装设备。 主要部件和组件通过整体引导和连接功能自我互连，实现“滑动锁定”和“卡锁”自动互连。 无线电架构包括改进的按钮，采用4杆活动铰链和前装饰装饰钮扣。

公开(公告)号：US20140328036A1

公开(公告)日：2014-11-06

申请号：US13875062

申请日：2013-05-01

Applicant: TYCO ELECTRONICS CORPORATION

Inventor： David Bruce Sarraf ,  Charles Randall Malstrom

IPC: H05K1/09 ,  H05K3/12 ,  H05K3/32

CPC classification number: H05K1/092 ,  H01Q1/243 ,  H01Q1/38 ,  H01R12/728 ,  H05K1/11 ,  H05K3/12 ,  H05K3/32 ,  H05K3/4015 ,  H05K2201/0311 ,  H05K2201/0999 ,  H05K2201/10295 ,  H05K2201/1034 ,  H05K2201/10386 ,  Y10T29/4913

Abstract: An electronic device includes a dielectric substrate having a first surface, a conductive circuit deposited on the first surface and having a printed conductive ink trace on the first surface, and a conductive interposer mechanically coupled to the substrate. The conductive interposer is electrically coupled to the conductive circuit. The conductive interposer has a separable contact interface configured to be mechanically and electrically connected to a removable contact. Optionally, the conductive interposer may include a main body and a flexible element extending between the main body and the conductive circuit. The flexible element electrically connects the conductive circuit with the main body.

Abstract translation: 电子器件包括具有第一表面的电介质衬底，沉积在第一表面上的导电电路，并且在第一表面上具有印刷的导电油墨迹线，以及机械耦合到衬底的导电插入器。 导电插入器电耦合到导电电路。 导电插入器具有可分离的接触界面，其被配置为机械地和电连接到可移除触点。 可选地，导电插入件可以包括主体和在主体和导电电路之间延伸的柔性元件。 柔性元件将导电电路与主体电连接。

公开(公告)号：US20140295697A1

公开(公告)日：2014-10-02

申请号：US14227574

申请日：2014-03-27

Applicant: Molex Incorporated

Inventor： Toshihiro NIITSU ,  Motohisa Haga

IPC: H01R12/52

CPC classification number: H01R12/523 ,  H01R12/79 ,  H05K1/117 ,  H05K3/326 ,  H05K3/365 ,  H05K3/368 ,  H05K3/403 ,  H05K2201/0367 ,  H05K2201/09163 ,  H05K2201/0919 ,  H05K2201/09863 ,  H05K2201/10303 ,  H05K2201/10386

Abstract: A connector for a multilayered board to connect a flat cable to a middle layer of a multilayered board while minimizing the impact due to variations in the dimensional precision and strength of multilayered boards and/or preventing deformation of the multilayered board and improving contact stability. The connector includes a board-side connecting portion and a cable-side connecting portion. The board-side connecting portion includes a column-shaped terminal, and the cable-side connecting portion includes flat terminals. The column-shaped terminal protrudes from the middle layer of the multilayered board in the thickness direction. The flat terminals include resilient contact portions, contacting a side surface portion of the column-shaped terminal from the width direction of the insertion slot in response to insertion of the cable-side connecting portion into the insertion slot.

Abstract translation: 一种用于多层板的连接器，用于将扁平电缆连接到多层板的中间层，同时最小化由于多层板的尺寸精度和强度的变化引起的冲击和/或防止多层板的变形并提高接触稳定性。 连接器包括板侧连接部和电缆侧连接部。 板侧连接部包括柱状端子，电缆侧连接部包括扁平端子。 柱状端子在厚度方向从多层板的中间层突出。 扁平端子包括弹性接触部分，其响应于电缆侧连接部分插入到插槽中而从插入槽的宽度方向接触到柱状端子的侧表面部分。