公开(公告)号：US08887569B2

公开(公告)日：2014-11-18

申请号：US13177485

申请日：2011-07-06

Applicant: Jong Woon Kim ,  Won Kyu Jeung

Inventor： Jong Woon Kim ,  Won Kyu Jeung

IPC: G01P15/02 ,  G01P15/09 ,  G01P15/18 ,  G01C19/56 ,  C23F1/02 ,  G01P15/08

CPC classification number: B81C1/00158 ,  B81B3/0062 ,  B81B3/007 ,  B81B2201/0235 ,  B81B2203/053 ,  B81C1/00484 ,  B81C1/00531 ,  B81C1/00539 ,  B81C1/00571 ,  B81C2201/01 ,  B81C2201/0132 ,  B81C2201/0133 ,  B81C2201/014 ,  C09K13/00 ,  C09K13/08 ,  G01C19/56 ,  G01P15/0802 ,  G01P15/0922 ,  G01P15/18 ,  G01P2015/084 ,  G01P2015/0871

Abstract: Disclosed herein an inertial sensor and a method of manufacturing the same. An inertial sensor 100 according to a preferred embodiment of the present invention is configured to include a plate-shaped membrane 110, a mass body 120 that includes an adhesive part 123 disposed under a central portion 113 of the membrane 110 and provided at the central portion thereof and a patterning part 125 provided at an outer side of the adhesive part 123 and patterned to vertically penetrate therethrough, and a first adhesive layer 130 that is formed between the membrane 110 and the adhesive part 123 and is provided at an inner side of the patterning part 125. An area of the first adhesive layer 130 is narrow by isotropic etching using the patterning part 125 as a mask, thereby making it possible to improve sensitivity of the inertial sensor 100.

Abstract translation: 本文公开了一种惯性传感器及其制造方法。 根据本发明的优选实施例的惯性传感器100被配置为包括板状膜110，质量体120，其包括设置在膜110的中心部分113下方并设置在中心部分处的粘合部123 以及设置在粘合部123的外侧并被图案化以垂直贯穿其中的图案形成部分125，以及形成在膜110和粘合部123之间的第一粘合层130，并且设置在第一粘合层130的内侧 图形部分125.通过使用图案形成部分125作为掩模的各向同性蚀刻，第一粘合剂层130的区域变窄，从而可以提高惯性传感器100的灵敏度。

公开(公告)号：US20140319631A1

公开(公告)日：2014-10-30

申请号：US14331495

申请日：2014-07-15

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chia-Hua Chu ,  Chun-Wen Cheng

IPC: B81B7/00 ,  B81C1/00

CPC classification number: B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/025 ,  B81B2201/0264 ,  B81B2203/0127 ,  B81B2203/0315 ,  B81C1/00182 ,  B81C1/00238 ,  B81C2201/013 ,  B81C2201/019 ,  B81C2203/0118 ,  B81C2203/0792 ,  H01L23/10 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L25/50 ,  H01L2224/29011 ,  H01L2224/29013 ,  H01L2224/291 ,  H01L2224/29124 ,  H01L2224/29144 ,  H01L2224/32145 ,  H01L2224/83193 ,  H01L2224/83805 ,  H01L2924/01322 ,  H01L2924/1461 ,  H01L2224/3012 ,  H01L2924/00012 ,  H01L2924/01029 ,  H01L2924/00

Abstract: A method embodiment includes providing a MEMS wafer comprising an oxide layer, a MEMS substrate, a polysilicon layer. A carrier wafer comprising a first cavity formed using isotropic etching is bonded to the MEMS, wherein the first cavity is aligned with an exposed first portion of the polysilicon layer. The MEMS substrate is patterned, and portions of the sacrificial oxide layer are removed to form a first and second MEMS structure. A cap wafer including a second cavity is bonded to the MEMS wafer, wherein the bonding creates a first sealed cavity including the second cavity aligned to the first MEMS structure, and wherein the second MEMS structure is disposed between a second portion of the polysilicon layer and the cap wafer. Portions of the carrier wafer are removed so that first cavity acts as a channel to ambient pressure for the first MEMS structure.

Abstract translation: 方法实施例包括提供包括氧化物层，MEMS衬底，多晶硅层的MEMS晶片。 包括使用各向同性蚀刻形成的第一空腔的载体晶片被结合到MEMS，其中第一空腔与多晶硅层的暴露的第一部分对准。 图案化MEMS衬底，并且去除牺牲氧化物层的部分以形成第一和第二MEMS结构。 包括第二腔的盖晶片被结合到MEMS晶片，其中所述接合产生包括与所述第一MEMS结构对准的所述第二腔的第一密封腔，并且其中所述第二MEMS结构设置在所述多晶硅层的第二部分和 盖晶圆。 去除载体晶片的部分，使得第一腔作为第一MEMS结构的环境压力的通道。

公开(公告)号：US20140312438A1

公开(公告)日：2014-10-23

申请号：US14256239

申请日：2014-04-18

Applicant: Seiko Epson Corporation

Inventor： Yutaka TAKADA

IPC: B81B7/00

CPC classification number: B81B7/0064 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2207/07 ,  B81C1/00253 ,  G01C19/5628 ,  G01P1/023 ,  G01P15/08

Abstract: A physical quantity sensor includes a sensor element, an integrated circuit that is electrically connected to the sensor element, and a ceramic package (base body) on which the integrated circuit is mounted. A first conductor pattern (interconnection pattern) for electrical connection with the outside is provided on one surface of the ceramic package. A second conductor pattern is provided to be electrically connected to the interconnection pattern. The second conductor pattern includes an interconnection pattern that passes through the inside of the ceramic package, and a metallized region that is exposed on the other surface of the ceramic package. The interconnection pattern is longer than a distance between the one surface and the other surface of the ceramic package.

Abstract translation: 物理量传感器包括传感器元件，电连接到传感器元件的集成电路以及安装集成电路的陶瓷封装（基体）。 用于与外部电连接的第一导体图案（互连图案）设置在陶瓷封装的一个表面上。 提供第二导体图案以电连接到互连图案。 第二导体图案包括穿过陶瓷封装的内部的互连图案，以及暴露在陶瓷封装的另一个表面上的金属化区域。 互连图案比陶瓷封装的一个表面和另一个表面之间的距离更长。

公开(公告)号：US20140310914A1

公开(公告)日：2014-10-23

申请号：US14207796

申请日：2014-03-13

Applicant: RAVIV ERLICH ,  YUVAL GERSON

Inventor： RAVIV ERLICH ,  YUVAL GERSON

IPC: E05D1/02 ,  B81C1/00

CPC classification number: F16C11/12 ,  B81B3/0043 ,  B81B2201/0235 ,  B81B2201/034 ,  B81B2201/042 ,  B81B2203/0118 ,  B81B2203/0163 ,  B81C1/0015 ,  B81C1/00198 ,  B81C1/00523 ,  B81C2201/013 ,  E05D1/02 ,  E05D7/00 ,  E05D11/0081 ,  F16F1/48 ,  F16F2224/025 ,  F16F2226/00 ,  F16F2226/042 ,  G01C19/02 ,  G01P15/09 ,  G01P15/093 ,  G01P15/125 ,  G02B26/0833 ,  G02B26/105 ,  Y10T16/522 ,  Y10T16/525 ,  Y10T29/24 ,  Y10T29/25

Abstract: A mechanical device includes a long, narrow element made of a rigid, elastic material. A rigid frame is configured to anchor at least one end of the element, which is attached to the frame, and to define a gap running longitudinally along the element between the beam and the frame, so that the element is free to move within the gap. A solid filler material, different from the rigid, elastic material, fills at least a part of the gap between the element and the frame so as to permit a first mode of movement of the element within the gap while inhibiting a different, second mode of movement.

Abstract translation: 机械装置包括由刚性弹性材料制成的长而窄的元件。 刚性框架构造成锚固附接到框架的元件的至少一个端部并且限定沿着梁和框架之间的元件纵向延伸的间隙，使得元件在间隙内自由移动 。 与刚性弹性材料不同的固体填充材料填充元件和框架之间的间隙的至少一部分，以便允许元件在间隙内的第一移动模式，同时抑制不同的第二模式 运动。

公开(公告)号：US20140308757A1

公开(公告)日：2014-10-16

申请号：US13863269

申请日：2013-04-15

Applicant: Tao Ju

Inventor： Tao Ju

IPC: B81C1/00

CPC classification number: B81B3/0032 ,  B81B2201/0235 ,  B81B2201/0242 ,  G01C19/56 ,  G01C19/5755 ,  G01C19/5769 ,  G01P15/105 ,  H01L29/82 ,  H01L2924/1461

Abstract: A MEMS gyro is provided, having a movable portion, a non-movable portion, and a magnetic sensing structure that comprises a magnetic source disposed at the movable portion, a magnetic sensing element positioned at the non-movable portion. The movable portion is capable of moving in response to external angular velocity or an external accelerator such that the magnetic field sensed by the magnetic sensing element is in relation to the movement of the movable portion, therefore, the angular velocity or the accelerator. A method of making the MEMS gyro device is disclosed herein.

Abstract translation: 提供了一种MEMS陀螺仪，其具有可移动部分，不可移动部分和包括设置在可动部分处的磁源的磁感测结构，位于不可移动部分的磁感应元件。 可移动部分能够响应于外部角速度或外部加速器移动，使得由磁感测元件感测的磁场相对于可移动部分的运动，因此角速度或加速器。 本文公开了制造MEMS陀螺仪装置的方法。

公开(公告)号：US20140306312A1

公开(公告)日：2014-10-16

申请号：US14357046

申请日：2012-11-09

Applicant: U Electronics Co., Ltd.

Inventor： Yong Hee Han ,  Hyung Won Kim ,  Mi Sook Ahn

IPC: B81B7/00 ,  B81C1/00 ,  H01L31/02

CPC classification number: B81B7/0038 ,  B81B7/007 ,  B81B2201/0207 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2207/096 ,  B81C1/00269 ,  B81C1/00285 ,  B81C2203/0118 ,  G01P15/0802 ,  H01L31/02016 ,  H01L2224/291 ,  H01L2924/014

Abstract: A micro electro mechanical systems (MEMS sensor packaging includes a first wafer having a readout integrated circuit (ROIC) formed thereon., a second wafer disposed corresponding to the first wafer and having a concave portion on one side thereof and a MEMS sensor prepared on the concave portion, joint solders formed along a surrounding of the MEMS sensor and sealing the MEMS sensor jointing the first and second wafers, and pad solders formed to electrically connect the ROIC circuit of the first wafer and the MEMS sensor of the second wafer. According to the present disclosure, in joining and packaging a wafer having the ROIC formed thereon and a wafer having the MEMS sensor formed thereon, the size of a package can be reduced and an electric signal can be stably provided by forming internally pad solders for electrically connecting the ROIC and the MEMS sensor.

Abstract translation: 微电子机械系统（MEMS传感器封装包括其上形成有读出集成电路（ROIC）的第一晶片），与第一晶片相对设置并且在其一侧具有凹部的第二晶片和在其上制备的MEMS传感器 凹部，沿着MEMS传感器的周围形成的接合焊料，并密封连接第一和第二晶片的MEMS传感器，以及形成为将第一晶片的ROIC电路电连接到第二晶片的MEMS传感器的焊盘焊接，根据 本公开内容中，在其上形成有ROIC的晶片和其上形成有MEMS传感器的晶片的接合和封装中，可以减小封装的尺寸，并且可以通过形成用于电连接的内部焊盘焊料来稳定地提供电信号 ROIC和MEMS传感器。

公开(公告)号：US08853839B2

公开(公告)日：2014-10-07

申请号：US13645094

申请日：2012-10-04

Applicant: Analog Devices, Inc.

Inventor： Jia Gao ,  Jicheng Yang ,  Shafi Saiyed ,  Siu Lung Ng ,  Xiaojie Xue

IPC: H01L23/495

CPC classification number: H01L29/84 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/00269 ,  B81C2203/0109 ,  B81C2203/032 ,  B81C2203/035 ,  H01L23/047 ,  H01L23/49861 ,  H01L29/66007 ,  H01L2924/0002 ,  H01L2924/19107 ,  H01L2924/00

Abstract: A housing for integrated devices that includes an air-release mechanism is disclosed. This is achieved, in various embodiments, by forming a vent hole in a package substrate, and arranging a package lid over the package substrate. The vent hole allows air to be released from within the cavity package, thereby ensuring that the package lid remains stably affixed to the package substrate despite increased temperatures during processing. The vent hole may be sealed upon mounting the package onto a mounting substrate.

Abstract translation: 公开了一种用于包括空气释放机构的集成装置的壳体。 这在各种实施例中通过在封装衬底中形成通气孔并且在封装衬底上布置封装盖来实现。 通气孔允许空气从空腔包装内释放，从而确保包装盖保持稳定地固定到包装基板上，尽管加工过程中温度升高。 当将包装件安装到安装基板上时，通气孔可以被密封。

公开(公告)号：US20140264648A1

公开(公告)日：2014-09-18

申请号：US13894821

申请日：2013-05-15

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Chia-Hua Chu ,  Chun-Wen Cheng

IPC: B81C1/00 ,  B81B3/00

CPC classification number: B81C1/00293 ,  B81B3/0021 ,  B81B7/0041 ,  B81B7/007 ,  B81B7/02 ,  B81B7/04 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/025 ,  B81B2201/0264 ,  B81C1/00134 ,  B81C1/00309 ,  B81C2201/013 ,  B81C2203/0118 ,  G01C19/56 ,  G01C19/5769 ,  G01L9/0044 ,  G01L19/0076 ,  G01L19/0092 ,  G01P15/00 ,  G01P15/0802 ,  G01P15/125

Abstract: A method embodiment includes providing a micro-electromechanical (MEMS) wafer including a polysilicon layer having a first and a second portion. A carrier wafer is bonded to a first surface of the MEMS wafer. Bonding the carrier wafer creates a first cavity. A first surface of the first portion of the polysilicon layer is exposed to a pressure level of the first cavity. A cap wafer is bonded to a second surface of the MEMS wafer opposite the first surface of the MEMS wafer. The bonding the cap wafer creates a second cavity comprising the second portion of the polysilicon layer and a third cavity. A second surface of the first portion of the polysilicon layer is exposed to a pressure level of the third cavity. The first cavity or the third cavity is exposed to an ambient environment.

Abstract translation: 方法实施例包括提供包括具有第一和第二部分的多晶硅层的微机电（MEMS）晶片。 载体晶片结合到MEMS晶片的第一表面。 粘合载体晶片产生第一腔。 多晶硅层的第一部分的第一表面暴露于第一腔的压力水平。 帽晶片结合到MEMS晶片的与MEMS晶片的第一表面相对的第二表面。 接合盖晶片产生包括多晶硅层的第二部分和第三腔的第二腔。 多晶硅层的第一部分的第二表面暴露于第三腔的压力水平。 第一腔或第三腔暴露于周围环境。

公开(公告)号：US20140264643A1

公开(公告)日：2014-09-18

申请号：US13798600

申请日：2013-03-13

Applicant: Rajashree Baskaran

Inventor： Rajashree Baskaran

IPC: B81C1/00 ,  B81B7/02

CPC classification number: B81C1/00238 ,  B81B7/02 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/0271 ,  B81B2207/012 ,  B81C1/00015 ,  B81C2203/0118 ,  B81C2203/0136 ,  B81C2203/035 ,  B81C2203/036 ,  B81C2203/0792 ,  H01L23/315 ,  H01L2224/16 ,  H01L2924/00 ,  H01L2924/0002

Abstract: Methods of forming integrated MEMS structures are described. Those methods and structures may include forming at least one MEMS structure on a first substrate, forming a first bonding layer on a top surface of the first substrate, and then coupling the first bonding layer disposed on the first substrate to a second substrate, wherein the second substrate comprises a device layer. The bonding may comprise a layer transfer process, wherein an integrated MEMS device is formed.

Abstract translation: 描述了形成集成MEMS结构的方法。 这些方法和结构可以包括在第一衬底上形成至少一个MEMS结构，在第一衬底的顶表面上形成第一结合层，然后将设置在第一衬底上的第一结合层耦合到第二衬底，其中 第二衬底包括器件层。 接合可以包括层转移工艺，其中形成集成的MEMS器件。

公开(公告)号：US20140260612A1

公开(公告)日：2014-09-18

申请号：US14353635

申请日：2011-11-28

Applicant: Takanori Aono ,  Kengo Suzuki ,  Masahide Hayashi ,  Heewon Jeong

Inventor： Takanori Aono ,  Kengo Suzuki ,  Masahide Hayashi ,  Heewon Jeong

IPC: G01C19/5705

CPC classification number: G01C19/5705 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81C1/00285 ,  G01C19/5783 ,  G01P15/0802 ,  G01P2015/088

Abstract: The disclosure provides a composite sensor with high reliability and a method for manufacturing the same. A moving body of an acceleration sensor and an oscillator of an angular velocity sensor are provided on the same sensor wafer, while being partitioned by a wall, and a cap wafer is formed to have a gap that corresponds to each of the sensors. A through hole and a bump are formed in a sensor sealing portion, the acceleration sensor is sealed in an air atmosphere in a first sealing process, and in a second sealing process, the angular velocity sensor is sealed by bringing the sensors and the cap into contact with each other and joining the sensors and the cap in a vacuum atmosphere. Thereafter, a composite sensor wafer is cut, a circuit board and a wiring board are mounted thereon, and a composite sensor is formed.

Abstract translation: 本公开提供了具有高可靠性的复合传感器及其制造方法。 加速度传感器的移动体和角速度传感器的振荡器设置在相同的传感器晶片上，同时由壁分隔，并且盖晶片形成为具有与每个传感器对应的间隙。 在传感器密封部中形成有贯通孔和凸块，在第一密封工序中将加速度传感器密封在空气气氛中，在第二密封工序中，通过将传感器和盖体 彼此接触并在真空环境中连接传感器和盖子。 此后，将复合传感器晶片切割，电路板和布线板安装在其上，并且形成复合传感器。