公开(公告)号：US11927741B2

公开(公告)日：2024-03-12

申请号：US18145302

申请日：2022-12-22

Applicant: Preciseley Microtechnology Corp.

Inventor： Tiansheng Zhou

IPC: G02B26/08 ,  B81C1/00

CPC classification number: G02B26/085 ,  B81C1/00603 ,  G02B26/0841 ,  B81B2201/033 ,  B81B2201/042 ,  B81B2203/0136

Abstract: A micromirror which comprises a mirror pivotally attached to a mount by a first pivoting structure that permits pivotal movement of the mirror relative to the mount about a first axis; a first comb drive which has a first position fixed relative to the mirror and second portion fixed relative to the mount. The first comb drive being for actuating the mirror about the first axis. A weight connected to the mirror, and the weight and mirror being on opposite sides of a fulcrum of the first pivoting structure. The first axis is non-parallel to a longitudinal axis extending through the weight and the mirror.

公开(公告)号：US11892619B2

公开(公告)日：2024-02-06

申请号：US16673180

申请日：2019-11-04

Applicant: Lumentum Operations LLC

Inventor： Wenlin Jin ,  Stephen Bagnald ,  Gonzalo Wills

IPC: G02B26/08 ,  B81B3/00 ,  H02N1/00

CPC classification number: G02B26/0841 ,  B81B3/0021 ,  H02N1/008 ,  B81B2201/033 ,  B81B2201/034 ,  B81B2201/042

Abstract: A micro-sized optical device may comprise a mirror suspended on a set of hinges that are mounted to the substrate and that are configured to tilt the mirror about an axis, wherein a hinge of the set of hinges is a two-layer structure with a pivot point that aligns with a mass center of the mirror; and a three-layer comb actuator structure associated with the hinge of the set of hinges, wherein the three-layer comb actuator structure includes a rotor comb actuator, a first stator comb actuator, and a second stator comb actuator.

公开(公告)号：US20230257255A1

公开(公告)日：2023-08-17

申请号：US18014365

申请日：2021-07-06

Applicant: VLC Holding B.V.

Inventor： Hendrikus Wilhelmus Leonardus Antonius Maria VAN LIEROP

IPC: B81B3/00 ,  G02B26/08

CPC classification number: B81B3/0045 ,  G02B26/0833 ,  B81B2201/033 ,  B81B2201/034 ,  B81B2201/042 ,  B81B2203/0109 ,  B81B2203/0163 ,  B81B2203/056 ,  B81B2207/11

Abstract: The improved scanning MEMS mirror device disclosed herein comprises a mirror body that is rotatable around a rotation axis with respect to a stationary body, wherein a rotation of the mirror body is flexibly restrained with at least one coupling element that biases the mirror body towards a neutral state. The coupling element comprises at least a bridge section and a first leaf spring section and a second leaf spring section. The first leaf spring section extends in an extension direction from a first end thereof at the bridge section towards a second end thereof that is connected to the mirror body. The second leaf spring section extends in an extension direction from a first end thereof at the bridge section towards a second end thereof where it is connected to the stationary body. The extension direction of the first leaf spring section and the extension direction of the second leaf spring section are at least substantially the same as the second planar direction. The leaf spring sections have a thickness defined in a direction orthogonal to the reference plane that is smaller than their width, defined in said first planar direction. The construction of the improved scanning MEMS mirror device results in an increased eigenfrequency of undesirable eigenmodes.

公开(公告)号：US11703681B2

公开(公告)日：2023-07-18

申请号：US17302938

申请日：2021-05-17

Applicant: Infineon Technologies AG

Inventor： Stephan Gerhard Albert ,  Marten Oldsen

IPC: B81C1/00 ,  G02B26/08 ,  B81B3/00 ,  H01L21/02

CPC classification number: G02B26/0841 ,  B81B3/007 ,  B81B3/0021 ,  B81C1/0019 ,  B81C1/00063 ,  B81C1/00373 ,  B81C1/00682 ,  H01L21/02595 ,  H01L21/02598 ,  B81B2201/033 ,  B81B2201/042 ,  B81B2203/0136 ,  B81B2203/033

Abstract: A method for producing a MEMS device comprises fabricating a first semiconductor layer and selectively depositing a second semiconductor layer over the first semiconductor layer, wherein the second semiconductor layer comprises a first part composed of monocrystalline semiconductor material and a second part composed of polycrystalline semiconductor material. The method furthermore comprises structuring at least one of the semiconductor layers, wherein the monocrystalline semiconductor material of the first part and underlying material of the first semiconductor layer form a spring element of the MEMS device and the polycrystalline semiconductor material of the second part and underlying material of the first semiconductor layer form at least one part of a comb drive of the MEMS device.

公开(公告)号：US11703680B2

公开(公告)日：2023-07-18

申请号：US16625702

申请日：2018-07-06

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Tatsuya Sugimoto ,  Tomofumi Suzuki ,  Kyosuke Kotani

IPC: G02B26/08 ,  B81B3/00 ,  G01J3/02 ,  G01J3/45

CPC classification number: G02B26/0841 ,  B81B3/0045 ,  G01J3/021 ,  G01J3/0202 ,  G01J3/45 ,  B81B2201/033 ,  B81B2201/042 ,  B81B2203/0136 ,  B81B2203/0154 ,  B81B2203/04

Abstract: An optical device includes: a base that includes a main surface; a movable unit that includes an optical function unit; and an elastic support unit that is connected between the base and the movable unit, and supports the movable unit so that the movable unit is movable along a first direction perpendicular to the main surface. The elastic support unit includes a lever, a first torsion support portion that extends along a second direction perpendicular to the first direction and is connected between the lever and the movable unit, and a second torsion support portion that extends along the second direction and is connected between the lever and the base. A torsional spring constant of the first torsion support portion is greater than a torsional spring constant of the second torsion support portion.

公开(公告)号：US20190241426A1

公开(公告)日：2019-08-08

申请号：US15891975

申请日：2018-02-08

Applicant: PixArt Imaging Inc.

Inventor： Chih-Ming SUN ,  Ming-Han TSAI ,  Yu-Tao LEE

IPC: B81B3/00 ,  H01L27/146 ,  H01L23/00 ,  B81C1/00

CPC classification number: B81B3/0021 ,  B81B2201/033 ,  B81B2203/0109 ,  B81B2203/0172 ,  B81B2203/04 ,  B81B2203/051 ,  B81B2203/055 ,  B81B2207/07 ,  B81C1/00142 ,  H01L24/16 ,  H01L27/14636 ,  H01L2224/16245 ,  H01L2924/1461

Abstract: A sensor package including a fixed frame, a moveable platform, elastic restoring members and a sensor chip is provided. The moveable platform is moved with respect to the fixed frame, and used to carry the sensor chip. The elastic restoring members are connected between the fixed frame and the moveable platform, and used to restore the moved moveable platform to an original position. The sensor chip is arranged on the elastic restoring members to send detected data via the elastic restoring members.

公开(公告)号：US20190023563A1

公开(公告)日：2019-01-24

申请号：US15757672

申请日：2016-09-09

Applicant: DENSO CORPORATION

Inventor： Akira OGAWA ,  Yoshitaka NODA ,  Tetsuo YOSHIOKA ,  Yuhei SHIMIZU

IPC: B81C1/00

CPC classification number: B81C1/00579 ,  B81B2201/033 ,  B81C2201/0112 ,  B81C2201/0132 ,  B81C2201/0139 ,  B81C2201/0142 ,  G01P15/0802 ,  G01P15/125 ,  G01P2015/0814 ,  G01P2015/0882

Abstract: A semiconductor device production method includes performing trench etching to form a trench in a thickness direction of a semiconductor layer so that both of a first pattern portion and a second pattern portion whose side walls face each other across the trench are formed. In the trench etching, the semiconductor layer is etched and removed while a protective film is formed on a surface of the semiconductor layer, and the trench etching is performed so that the first pattern portion and the second pattern portion are configured to have a same potential or a same temperature during the trench etching.

公开(公告)号：US10077184B2

公开(公告)日：2018-09-18

申请号：US15503192

申请日：2015-05-11

Applicant: Wuxi Wio Technology Co., Ltd.

Inventor： Qiao Chen ,  Huikai Xie

IPC: B61B3/00 ,  B81B3/00 ,  B81C1/00

CPC classification number: B81B3/0037 ,  B81B2201/0235 ,  B81B2201/0242 ,  B81B2201/033 ,  B81B2201/042 ,  B81B2203/0118 ,  B81B2203/0136 ,  B81C1/00007 ,  B81C1/0015 ,  B81C2201/013 ,  G01P15/0802 ,  G01P15/125 ,  G01P2015/0822 ,  G02B26/0841 ,  H01G5/16 ,  H02N1/008

Abstract: A MEMS self-aligned high-and-low comb tooth and manufacturing method thereof, the comb tooth having a lifting structure, the lifting structure generating a displacement in the vertical direction to drive the movement of a movable comb tooth or a fixed comb tooth attached thereto. The manufacturing method thereof adopts a silicon wafer, the lifting structure and the comb tooth are sequentially formed on a mechanical structure layer, the fixed comb tooth and the movable comb tooth are formed with the same etching process, and the stress in the lifting structure displaces the fixed comb tooth and the movable comb tooth in the vertical direction, thus forming the self-aligned high-and-low comb tooth.

公开(公告)号：US20180180872A1

公开(公告)日：2018-06-28

申请号：US14218970

申请日：2014-03-19

Applicant: Jonathan Hopkins ,  Robert Matthew Panas

Inventor： Jonathan Hopkins ,  Robert Matthew Panas

IPC: G02B26/08 ,  H02N1/00 ,  F16H21/54

CPC classification number: G02B26/0841 ,  B81B3/0062 ,  B81B2201/033 ,  B81B2203/053 ,  B81B2203/058

Abstract: A flexure-based micro-array having a plurality of micro-assemblies, each comprising: an object; and at least three electrostatic actuation modules for tipping, tilting, and/or piston-actuating the object, each actuation module comprising: a base with first and second electrodes electrically isolated from each other; an electrically conductive lever arm; a first flexure bearing suspending the lever arm adjacent the first and second electrodes so that electrical activation of at least one of the first and second electrodes produces an electrostatic moment of force on the lever arm to resiliently bias the first flexure bearing and pivot the lever arm about a fulcrum; and a second flexure bearing connecting the lever arm to the object at a connection location that is different from other connection locations of the other actuation modules so that pivoting the lever arm about the fulcrum induces the second flexure bearing to pivot the object about an object pivot axis defined between two of the other connection locations while the second flexure bearing decouples the lever arm from object displacements induced by two of the other actuation modules connected to the two other connection locations defining the object pivot axis, wherein the plurality of micro-assemblies are arranged with the objects juxtaposed in a substantially 2D array.

公开(公告)号：US20180072560A1

公开(公告)日：2018-03-15

申请号：US15702034

申请日：2017-09-12

Applicant: Robert Bosch GmbH

Inventor： Helmut Grutzeck ,  Jochen Reinmuth

IPC: B81B3/00 ,  H04R19/00 ,  H04R19/04 ,  H02N1/00 ,  G01L9/00

CPC classification number: B81B3/0037 ,  B81B3/0021 ,  B81B2201/0257 ,  B81B2201/0264 ,  B81B2201/033 ,  B81B2203/0127 ,  B81B2203/0172 ,  B81B2203/04 ,  G01L9/0072 ,  H02N1/008 ,  H04R19/005 ,  H04R19/04 ,  H04R2201/003

Abstract: A micromechanical component having a substrate, a membrane that covers an opening structured into the substrate from a first side of the substrate and that can be warped by a pressure difference between the first side of the substrate and a second side, oriented away from the first side, of the substrate, and having at least one actuator electrode that is connected at least to the membrane in such a way that the at least one actuator electrode can be displaced relative to the substrate by a warping of the membrane, the at least one actuator electrode being capable of being displaced relative to the substrate by the warping of the membrane, in each case along a displacement axis oriented parallel to the second side of the substrate. A production method for a micromechanical component is also described.