公开(公告)号：US07981703B2

公开(公告)日：2011-07-19

申请号：US12191544

申请日：2008-08-14

Applicant: Joseph Charles Fjelstad

Inventor： Joseph Charles Fjelstad

IPC: H01L21/00

CPC classification number: H05K1/144 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K1/185 ,  H05K1/186 ,  H05K3/284 ,  H05K3/4046 ,  H05K2201/041 ,  H05K2201/10318 ,  H05K2203/065 ,  H05K2203/1316 ,  H05K2203/1327 ,  Y10T29/49117 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: The present invention provides an electronic assembly 400 and a method for its manufacture 800, 900, 1000 1200, 1400, 1500, 1600, 1700. The assembly 400 uses no solder. Components 406, or component packages 402, 802, 804, 806 with I/O leads 412 are placed 800 onto a planar substrate 808. The assembly is encapsulated 900 with electrically insulating material 908 with vias 420, 1002 formed or drilled 1000 through the substrate 808 to the components' leads 412. Then the assembly is plated 1200 and the encapsulation and drilling process 1500 repeated to build up desired layers 422, 1502, 1702. Assemblies may be mated 1800. Within the mated assemblies, items may be inserted including pins 2202a, 2202b, and 2202c, mezzanine interconnection devices 2204, heat spreaders 2402, and combination heat spreaders and heat sinks 2602. Edge card connectors 2802 may be attached to the mated assemblies.

Abstract translation: 本发明提供电子组件400及其制造方法800,900,10001200,1400,1500,1600,1700。组件400不使用焊料。 具有I / O引线412的组件406或组件封装402,802,804,806被放置在800平面衬底808上。该组件被电绝缘材料908封装，电绝缘材料908具有穿过衬底形成或钻孔1000的通孔420,1002。 808到组件引线412.然后组件被电镀1200，并且重复进行封装和钻孔工艺1500以构建所需的层422,1502,1702。组件可以配合1800.在配合的组件内，物品可以被插入，包括销 2202a，2202b和2202c，夹层互连设备2204，散热器2402以及散热器和散热器2602组合。边缘卡连接器2802可以附接到配合的组件。

公开(公告)号：US20100315110A1

公开(公告)日：2010-12-16

申请号：US12569474

申请日：2009-09-29

Applicant: Andreas Armin Fenner ,  Geoffrey Batchelder ,  Paul F. Gerrish ,  Lary R. Larson ,  Anna J. Malin ,  Trevor D. Marrott ,  Tyler Mueller ,  David A. Ruben

Inventor： Andreas Armin Fenner ,  Geoffrey Batchelder ,  Paul F. Gerrish ,  Lary R. Larson ,  Anna J. Malin ,  Trevor D. Marrott ,  Tyler Mueller ,  David A. Ruben

IPC: G01R31/02 ,  G01R1/04

CPC classification number: H05K1/144 ,  H01L23/3107 ,  H01L23/3185 ,  H01L23/564 ,  H01L24/05 ,  H01L24/06 ,  H01L24/80 ,  H01L24/81 ,  H01L24/94 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05541 ,  H01L2224/0556 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/818 ,  H01L2224/81894 ,  H01L2224/83894 ,  H01L2225/06513 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/3025 ,  H05K1/0298 ,  H05K1/11 ,  H05K2201/041 ,  Y10T29/49117 ,  Y10T29/49147 ,  H01L2224/05552 ,  H01L2924/00

Abstract: Electrical circuit apparatus and methods including hermeticity testing structures for testing the hermeticity of the electrical circuit apparatus.

Abstract translation: 包括用于测试电路装置的气密性的气密性测试结构的电路装置和方法。

公开(公告)号：US20100314733A1

公开(公告)日：2010-12-16

申请号：US12569504

申请日：2009-09-29

Applicant: Tyler Mueller ,  Geoffrey Batchelder ,  Ralph B. Danzl ,  Paul F. Gerrish ,  Anna J. Malin ,  Trevor D. Marrott ,  Michael F. Mattes

Inventor： Tyler Mueller ,  Geoffrey Batchelder ,  Ralph B. Danzl ,  Paul F. Gerrish ,  Anna J. Malin ,  Trevor D. Marrott ,  Michael F. Mattes

IPC: H01L23/58 ,  H01L21/50 ,  H05K5/06

CPC classification number: H05K1/144 ,  H01L23/3107 ,  H01L23/3185 ,  H01L23/564 ,  H01L24/05 ,  H01L24/06 ,  H01L24/80 ,  H01L24/81 ,  H01L24/94 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/05541 ,  H01L2224/0556 ,  H01L2224/05599 ,  H01L2224/16 ,  H01L2224/818 ,  H01L2224/81894 ,  H01L2224/83894 ,  H01L2225/06513 ,  H01L2924/00014 ,  H01L2924/0002 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01022 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15788 ,  H01L2924/19041 ,  H01L2924/3025 ,  H05K1/0298 ,  H05K1/11 ,  H05K2201/041 ,  Y10T29/49117 ,  Y10T29/49147 ,  H01L2224/05552 ,  H01L2924/00

Abstract: Apparatus and methods to protect circuitry from moisture ingress, e.g., using a metallic structure as part of a moisture ingress barrier.

Abstract translation: 保护电路免受水分侵入的装置和方法，例如使用金属结构作为湿气入口屏障的一部分。

公开(公告)号：US07769355B2

公开(公告)日：2010-08-03

申请号：US11152308

申请日：2005-06-14

Applicant: Ikuroh Ichitsubo ,  Kanya Kubota ,  Wen Chung Liu

Inventor： Ikuroh Ichitsubo ,  Kanya Kubota ,  Wen Chung Liu

IPC: H01Q11/12 ,  H04B1/04

CPC classification number: H01L23/66 ,  H01L24/48 ,  H01L24/49 ,  H01L25/162 ,  H01L25/165 ,  H01L25/18 ,  H01L2223/665 ,  H01L2224/48091 ,  H01L2224/48095 ,  H01L2224/4813 ,  H01L2224/48137 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/49175 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/09701 ,  H01L2924/10329 ,  H01L2924/10336 ,  H01L2924/1305 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19103 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/30111 ,  H01L2924/3025 ,  H03F1/0272 ,  H03F1/34 ,  H03F3/195 ,  H03F3/24 ,  H03F2200/294 ,  H03F2200/372 ,  H03G3/3042 ,  H04B2001/0433 ,  H05K1/0237 ,  H05K1/144 ,  H05K1/16 ,  H05K3/341 ,  H05K3/3442 ,  H05K2201/041 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A substantially rectangular shaped power amplifier module includes a power amplifier for amplifying radio frequency signals, a bias control terminal and a power sensing terminal disposed on the same side of the power amplifier module, an input terminal and a ground terminal disposed on the same side of the power amplifier module, and an output terminal and one or more power supply terminals disposed on the same side of the power amplifier module.

Abstract translation: 一个大致矩形的功率放大器模块包括一个用于放大射频信号的功率放大器，一个偏置控制端子和一个设置在功率放大器模块同侧的功率检测端子，一个输入端子和一个接地端子， 功率放大器模块，以及设置在功率放大器模块的同一侧的输出端子和一个或多个电源端子。

公开(公告)号：US20090290743A1

公开(公告)日：2009-11-26

申请号：US12400691

申请日：2009-03-09

Applicant: David W. Carroll

Inventor： David W. Carroll

IPC: H04R1/00

CPC classification number: H05K1/189 ,  H04R1/105 ,  H05K3/0058 ,  H05K2201/041 ,  H05K2201/053 ,  H05K2201/10037 ,  H05K2201/10083 ,  H05K2201/10128

Abstract: A skin-mounted digital audio device composed of one or more removable adhesive sheets, a battery layer, and flex circuitry. The device can be folded and unfolded, and permits convenient, hands-free wearing and operation by a user via the adhesive sheet(s).

Abstract translation: 由一个或多个可移除的粘合片，电池层和柔性电路组成的皮肤安装的数字音频装置。 该装置可以折叠和展开，并且允许使用者通过粘合片方便，免手工佩戴和操作。

公开(公告)号：US20090121346A1

公开(公告)日：2009-05-14

申请号：US11936938

申请日：2007-11-08

Applicant: Kurt Peter Wachtler

Inventor： Kurt Peter Wachtler

IPC: H01L23/488 ,  H01L21/60

CPC classification number: H01L25/0657 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5387 ,  H01L25/162 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2225/06572 ,  H01L2924/00014 ,  H01L2924/01019 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3025 ,  H05K1/028 ,  H05K1/141 ,  H05K1/147 ,  H05K1/189 ,  H05K2201/041 ,  H05K2201/10378 ,  H01L2224/05599

Abstract: A semiconductor device with a first (101) and a second (111) semiconductor chip assembled on an insulating flexible interposer (120). The interposer, preferably about 25 to 50 μm thick, has conductive traces (121), a central planar rectangular area and on each side of the rectangle a wing bent at an angle from the central plane. The central area has metal studs (122, 123) on the top and the bottom surface, which match the terminals of the chips, further conductive vias of a pitch center-to-center about 50 μm or less. The side wings have contact pads (130) with metallic connectors (131) on the bottom surface; the connectors may be solder balls, metal studs, or anisotropic conductive films. The second chip is adhesively attached to a substrate, whereby the interposer faces away from the substrate. The interposer side wings have a convex bending (150) downwardly along the second chip and a concave bending (151) over the substrate; the side wing connectors are attached to the matching substrate sites.

Abstract translation: 一种具有组装在绝缘柔性插入件（120）上的第一（101）和第二（111）半导体芯片的半导体器件。 优选约25至50μm厚的插入器具有导电迹线（121），中心平面矩形区域，并且在矩形的每一侧上以与中心平面成一定角度弯曲的翼。 中心区域在顶部和底部表面上具有与芯片的端子相匹配的金属螺柱（122,123），间距中心至中心约50mum或更小的导电通孔。 侧翼具有在底表面上具有金属连接器（131）的接触垫（130） 连接器可以是焊球，金属螺柱或各向异性导电膜。 第二芯片粘附到基板上，由此插入器面向基板。 插入器侧翼沿着第二芯片向下弯曲（150）并且在基板上方具有凹弯曲（151）; 侧翼连接器连接到匹配的基底部位。

公开(公告)号：US20080253085A1

公开(公告)日：2008-10-16

申请号：US12066003

申请日：2006-09-06

Applicant: Aviv Soffer

Inventor： Aviv Soffer

IPC: G06F1/16

CPC classification number: G06F1/18 ,  F28D15/0266 ,  F28D15/0275 ,  G06F1/20 ,  G06F2200/1635 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2924/19105 ,  H05K1/0284 ,  H05K1/185 ,  H05K7/205 ,  H05K2201/041 ,  H01L2924/00

Abstract: New and unique apparatuses, systems and methods are provided for constructing and implementing a 3-Dimensional multi-layered modular computer architecture that significantly improves computer mass, volume and power densities through the use of 3-Dimensional layered structure.

Abstract translation: 提供了新颖独特的设备，系统和方法，用于构建和实现通过使用三维分层结构显着提高计算机质量，体积和功率密度的三维多层模块化计算机体系结构。

公开(公告)号：US07151010B2

公开(公告)日：2006-12-19

申请号：US11051341

申请日：2005-02-04

Applicant: Cam T. Nguyen ,  Sherry Xiaoqi Zhu

Inventor： Cam T. Nguyen ,  Sherry Xiaoqi Zhu

IPC: H01L21/44

CPC classification number: H05K1/141 ,  H01L22/34 ,  H01L23/5385 ,  H01L24/16 ,  H01L24/48 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/0554 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/32145 ,  H01L2224/48227 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06572 ,  H01L2225/06596 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/3511 ,  H05K1/0284 ,  H05K1/182 ,  H05K3/3436 ,  H05K2201/041 ,  H05K2201/09072 ,  H05K2201/10378 ,  H05K2201/10515 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2203/1572 ,  H01L2924/00 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/0555 ,  H01L2224/0556

Abstract: Methods for assembling a stack package for a high density IC module on a PCB include the steps of assembling a first layer of the stack package on the PCB, assembling a second layer of the stack package on the first layer and assembling a third layer of the stack package on the second layer, such that each layer is provided in electrical communication with the PCB. Additional layers may be added to the stack package.

Abstract translation: 用于组装用于PCB上的高密度IC模块的堆叠封装的方法包括以下步骤：在PCB上组装堆叠封装的第一层，在第一层上组装堆叠封装的第二层并组装第三层 堆叠包装在第二层上，使得每个层被提供为与PCB电连通。 可以向堆叠包中添加附加层。

公开(公告)号：US5715144A

公开(公告)日：1998-02-03

申请号：US653092

申请日：1996-05-24

Applicant: Joseph George Ameen ,  Joseph Funari

Inventor： Joseph George Ameen ,  Joseph Funari

IPC: H01L25/065 ,  H05K1/11 ,  H05K3/34 ,  H05K3/36 ,  H01R23/68

CPC classification number: H01L25/0657 ,  H01R12/52 ,  H05K3/363 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2225/06513 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/06579 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/01079 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/3511 ,  H05K1/113 ,  H05K2201/041 ,  H05K2201/09572 ,  H05K2201/096 ,  H05K2201/10515 ,  H05K2201/10666 ,  H05K2201/10681 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/041 ,  H05K2203/0455 ,  H05K2203/1115 ,  H05K3/3494

Abstract: The present invention provides multi-layer multi-chip circuit board comprising at least two ATAB carriers having chips thereon, stacked upon each other in a pyramid configuration and attached to a substrate, thus reducing the required area on the substrate for mounting components to form a circuit board.

Abstract translation: 本发明提供了多层多芯片电路板，其包括至少两个具有芯片的ATAB载体，它们以金字塔形结构彼此堆叠并且附接到基板，从而减少了用于安装部件以形成基板的所需面积 电路板。

公开(公告)号：US12117648B2

公开(公告)日：2024-10-15

申请号：US17680267

申请日：2022-02-24

Applicant: Huazhong University of Science and Technology

Inventor： Weihua Guo ,  Xiangyang Dai ,  Qiaoyin Lu

IPC: G02B6/13 ,  G02B6/122 ,  H05K1/14 ,  H05K3/36

CPC classification number: G02B6/13 ,  G02B6/1228 ,  H05K1/144 ,  H05K3/368 ,  H05K2201/041 ,  Y10T29/4913

Abstract: A hybrid integration method includes: assembling a motherboard chip, assembling a daughterboard chip, and assembling an integrated chip. The motherboard chip includes a motherboard chip body, a first metal region, a first vertical support assembly, and a first waveguide region arranged on the motherboard chip body, and the first waveguide region includes a first conventional waveguide region and a first coupling waveguide region used for vertical coupling which are fixedly connected to each other; the daughterboard chip includes a daughterboard chip body, a second metal region, a second vertical support assembly and a second waveguide region arranged on the daughterboard chip body, and the second waveguide region includes a second conventional waveguide region and a second coupling waveguide region used for vertical coupling which are fixedly connected to each other.