公开(公告)号：US08557633B2

公开(公告)日：2013-10-15

申请号：US13079939

申请日：2011-04-05

Applicant: Kunio Shigemura ,  Kenji Hanada ,  Masaki Nakanishi ,  Takafumi Nishita ,  Masayoshi Shinoda ,  Seiichi Tomoi

Inventor： Kunio Shigemura ,  Kenji Hanada ,  Masaki Nakanishi ,  Takafumi Nishita ,  Masayoshi Shinoda ,  Seiichi Tomoi

IPC: H01L21/00

CPC classification number: H01L25/162 ,  H01L23/3121 ,  H01L23/4824 ,  H01L23/5227 ,  H01L24/27 ,  H01L24/45 ,  H01L24/48 ,  H01L24/73 ,  H01L24/743 ,  H01L24/75 ,  H01L24/83 ,  H01L25/50 ,  H01L27/0617 ,  H01L27/0629 ,  H01L2224/0401 ,  H01L2224/05155 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45015 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/92247 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01061 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H05K1/141 ,  H05K3/284 ,  H05K3/3463 ,  H05K3/3494 ,  H05K2201/045 ,  H05K2203/081 ,  H05K2203/1476 ,  Y10T29/49144 ,  Y10T29/49146 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/43 ,  H01L2924/01006

Abstract: A technique that makes it possible to enhance the reliability of a module using PCB as its module substrate is provided. Solder connection of a single-chip component 43, an integrated chip component 44, and a semiconductor chip IC2 by Pb-free solder is carried out by heat treatment at a temperature below 280° C. using a heat block. Solder connection of a semiconductor chip IC1 by high-melting point solder is carried out by heat treatment at a temperature of 280° C. or higher using a hot jet. Thus, the semiconductor chip IC1 can be solder connected to PCB 38 using high-melting point solder without the following troubles: damage to the PCB 38 due to heat, for example, burning of solder resist; and peeling of prepreg from a core material. Therefore, the semiconductor chip IC1 can be mounted over the PCB 38 with high connection strength.

Abstract translation: 提供了一种可以提高使用PCB作为其模块基板的模块的可靠性的技术。 通过使用热块在低于280℃的温度下进行热处理，进行无铅焊料的单芯片部件43，集成芯片部件44和半导体芯片IC2的焊接连接。 通过高熔点焊料的半导体芯片IC1的焊接连接通过使用热射流在280℃以上的温度进行热处理来进行。 因此，可以使用高熔点焊料将半导体芯片IC1焊接到PCB 38上，而不会有以下问题：由于热而导致的PCB 38的损坏，例如焊料抗蚀剂的燃烧; 和预浸料从芯材剥离。 因此，半导体芯片IC1可以以高连接强度安装在PCB 38上。

公开(公告)号：US08379391B2

公开(公告)日：2013-02-19

申请号：US12465560

申请日：2009-05-13

Applicant: Mike H. Amidi ,  Robert S. Pauley ,  Satyanarayan Shivkumar Iyer

Inventor： Mike H. Amidi ,  Robert S. Pauley ,  Satyanarayan Shivkumar Iyer

IPC: H05K5/00 ,  H05K7/00

CPC classification number: H05K1/141 ,  G11C5/04 ,  H01L25/0652 ,  H01L2924/0002 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/042 ,  H05K2201/045 ,  H05K2201/10159 ,  H05K2201/10378 ,  H05K2203/1572 ,  H01L2924/00

Abstract: A memory module with attached transposer and interposers to provide additional surface area for the placement of memory devices is disclosed. The memory module includes a memory board with a first surface, a second surface and an edge with a set of electrical contacts. A transposer is attached to each surface of the memory board, and an interposer is attached to each transposer on the opposite surface of the transposer from the memory board. The interposer has space to allow placement of memory devices on both a first surface between the interposer and the memory board, and on a second surface of the interposer away from the memory board.

Abstract translation: 公开了一种具有连接的转印器和插入件以提供用于存储器件的放置的附加表面积的存储器模块。 存储器模块包括具有第一表面，第二表面和具有一组电触点的边缘的存储器板。 将转移器连接到存储器板的每个表面，并且插入器附接到转移器的与存储器板相反的表面上的每个转台。 插入器具有允许将存储器件放置在插入器和存储器板之间的第一表面上以及在插入器的远离存储器板的第二表面上的空间。

公开(公告)号：US08040683B2

公开(公告)日：2011-10-18

申请号：US12425107

申请日：2009-04-16

Applicant: Chris Karabatsos

Inventor： Chris Karabatsos

IPC: H01R12/16

CPC classification number: H01R12/62 ,  H01R12/721 ,  H01R13/6473 ,  H01R13/6658 ,  H05K1/141 ,  H05K1/147 ,  H05K1/189 ,  H05K3/366 ,  H05K2201/045 ,  H05K2201/049 ,  H05K2201/056 ,  H05K2201/10159 ,  H05K2201/10325 ,  H05K2201/10386

Abstract: An Active edge connector for memory modules has a base including two PCB sides and a spacer separating the sides, with driver chips mounted on each side of each side, printed wiring electrically connecting a first set of electrical signals from each of the driver chips to a mother board on which the connector is mounted, and printed wiring for electrically connecting a second set of electrical signals from each of the driver chips to a memory module inserted in the edge connector. When a group of connectors are mounted on a mother board, electrical signals arriving at the first connector are routed to its driver chips, producing re-driven signals to the next connector, and so on. A decoder circuit provides addressing signals determining the last such connector to which the signals are intended, and which prevents the signals from going to any connectors containing memories not addressed.

Abstract translation: 用于存储器模块的主动边缘连接器具有包括两个PCB侧的基座和分隔两侧的间隔件，其中安装在每侧的每一侧上的驱动器芯片，印刷布线将来自每个驱动器芯片的第一组电信号电连接到 安装有连接器的主板，以及用于将来自每个驱动器芯片的第二组电信号电连接到插入到边缘连接器中的存储模块的印刷布线。 当一组连接器安装在母板上时，到达第一连接器的电信号被路由到其驱动器芯片，产生到下一个连接器的重新驱动信号等等。 解码器电路提供确定信号所期望的最后一个这样的连接器的寻址信号，并且防止信号进入包含未被寻址的存储器的任何连接器。

公开(公告)号：US08022551B2

公开(公告)日：2011-09-20

申请号：US11399856

申请日：2006-04-07

Applicant: Tasao Soga ,  Hanae Shimokawa ,  Tetsuya Nakatsuka ,  Kazuma Miura ,  Mikio Negishi ,  Hirokazu Nakajima ,  Tsuneo Endoh

Inventor： Tasao Soga ,  Hanae Shimokawa ,  Tetsuya Nakatsuka ,  Kazuma Miura ,  Mikio Negishi ,  Hirokazu Nakajima ,  Tsuneo Endoh

IPC: H01L29/40

CPC classification number: H01L24/13 ,  B32B15/01 ,  C22C5/02 ,  C22C9/02 ,  C22C11/06 ,  C22C13/00 ,  H01L21/50 ,  H01L21/56 ,  H01L21/563 ,  H01L23/10 ,  H01L23/3128 ,  H01L23/3677 ,  H01L23/4334 ,  H01L23/4924 ,  H01L23/49513 ,  H01L24/11 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/06102 ,  H01L2224/11334 ,  H01L2224/1134 ,  H01L2224/1147 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/29101 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/29294 ,  H01L2224/29298 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81024 ,  H01L2224/81054 ,  H01L2224/81203 ,  H01L2224/81205 ,  H01L2224/8121 ,  H01L2224/81409 ,  H01L2224/81815 ,  H01L2224/8319 ,  H01L2224/83801 ,  H01L2224/97 ,  H01L2924/00011 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/0134 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12042 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/15738 ,  H01L2924/1576 ,  H01L2924/15787 ,  H01L2924/16152 ,  H01L2924/16315 ,  H01L2924/166 ,  H01L2924/181 ,  H01L2924/18301 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K1/141 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0215 ,  H05K2201/045 ,  H05K2201/09572 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/01031 ,  H01L2924/01026 ,  H01L2924/3512 ,  H01L2924/00015 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2224/29299 ,  H01L2224/2929 ,  H01L2224/83205

Abstract: Each of junctions formed between a semiconductor device and a substrate comprises metal balls of Cu, or other materials and compounds of Sn and the metal balls, and the metal balls are bonded together by the compounds.

Abstract translation: 在半导体器件和衬底之间形成的每一个接合点包括Cu的金属球或Sn的其它材料和化合物以及金属球，金属球通过化合物结合在一起。

公开(公告)号：US20110205714A1

公开(公告)日：2011-08-25

申请号：US13103788

申请日：2011-05-09

Applicant: Masahiko Takakusaki ,  Minoru Enomoto

Inventor： Masahiko Takakusaki ,  Minoru Enomoto

IPC: H05K1/18

CPC classification number: H05K1/141 ,  G06F1/1616 ,  G06F1/1658 ,  G06F1/185 ,  G06F1/203 ,  H05K1/144 ,  H05K2201/045 ,  H05K2201/09954 ,  H05K2201/10189

Abstract: A daughterboard to be attached to a motherboard on which a host controller is mounted includes a first connector electrically connected to the host controller, a bridge controller electrically connected to the first connector, a chip electrically connected to the bridge controller, and a second connector electrically connected to the bridge controller and configured to electrically connect to other daughterboards.

Abstract translation: 要连接到安装有主机控制器的母板的子板包括电连接到主机控制器的第一连接器，电连接到第一连接器的桥接控制器，电连接到桥接控制器的芯片和电连接到桥接控制器的第二连接器 连接到桥控制器并且被配置为电连接到其他子板。

公开(公告)号：US07995966B2

公开(公告)日：2011-08-09

申请号：US11554817

申请日：2006-10-31

Applicant: Shunichi Sukegawa ,  Takeo Sekino ,  Kenichi Shigenami ,  Shinichi Toi ,  Tatsuo Shimizu

Inventor： Shunichi Sukegawa ,  Takeo Sekino ,  Kenichi Shigenami ,  Shinichi Toi ,  Tatsuo Shimizu

IPC: H04B7/00

CPC classification number: H05K1/141 ,  H01L25/0652 ,  H01L25/18 ,  H01L2224/16225 ,  H01L2924/01019 ,  H01L2924/01037 ,  H01L2924/19107 ,  H05K1/0243 ,  H05K1/144 ,  H05K3/284 ,  H05K2201/045 ,  H05K2201/10098 ,  H05K2201/10515 ,  H05K2201/10674

Abstract: A communication semiconductor chip performs wireless communication with another communication semiconductor chip. The semiconductor chip includes a communication module and a control unit. The communication module performs the wireless communication with another communication semiconductor chip and has a receiving circuit for receiving data. The control unit supplies a reference voltage to the receiving circuit and performs a calibration operation on the reference voltage.

Abstract translation: 通信半导体芯片与另一通信半导体芯片进行无线通信。 半导体芯片包括通信模块和控制单元。 通信模块与另一通信半导体芯片进行无线通信，并具有用于接收数据的接收电路。 控制单元向接收电路提供参考电压，并对参考电压进行校准操作。

公开(公告)号：US20100214755A1

公开(公告)日：2010-08-26

申请号：US12293777

申请日：2007-03-21

Applicant: Uwe Gröschner ,  Falk Steiner ,  Stefan Asch

Inventor： Uwe Gröschner ,  Falk Steiner ,  Stefan Asch

IPC: H05K1/14 ,  H05K1/00

CPC classification number: H05K7/1439 ,  H05K1/14 ,  H05K1/144 ,  H05K2201/044 ,  H05K2201/045 ,  H05K2201/10409

Abstract: A backplane arrangement is provided for an electronic mounting rack with a base backplane with several contact strips, wherein a free space, into which at least one additional backplane can be inserted, is provided on the base backplane.

Abstract translation: 为具有带有多个接触条的基底板的电子安装架提供背板装置，其中可在其上插入有至少一个附加背板的自由空间设置在基底板上。

公开(公告)号：US20100062621A1

公开(公告)日：2010-03-11

申请号：US12209019

申请日：2008-09-11

Applicant: MICHAEL BRUENNERT ,  Peter Gregorius ,  Georg Braun ,  Andreas Gartner ,  Hermann Ruckerbauer ,  George William Alexander ,  Johannes Stecker

Inventor： MICHAEL BRUENNERT ,  Peter Gregorius ,  Georg Braun ,  Andreas Gartner ,  Hermann Ruckerbauer ,  George William Alexander ,  Johannes Stecker

IPC: H05K1/00

CPC classification number: H05K1/141 ,  H05K1/144 ,  H05K3/326 ,  H05K3/328 ,  H05K3/366 ,  H05K3/4092 ,  H05K2201/0397 ,  H05K2201/042 ,  H05K2201/045 ,  H05K2201/10159 ,  H05K2203/049

Abstract: Horizontal dual in-line memory modules are disclosed. In one embodiment, the memory module includes a circuit board, a plurality of memory chips attached to a top surface of the circuit board, and a plurality of connector contacts disposed under a back surface of the circuit board and extending away from the memory chips, the connector contacts being electrically coupled to the memory chips, the back surface opposite the top surface of the circuit board.

Abstract translation: 公开了水平双列直插式存储器模块。 在一个实施例中，存储器模块包括电路板，附接到电路板的顶表面的多个存储器芯片以及设置在电路板的背面下方并远离存储器芯片延伸的多个连接器触点， 连接器触点电耦合到存储器芯片，背面与电路板的顶表面相对。

公开(公告)号：US20090279243A1

公开(公告)日：2009-11-12

申请号：US12465560

申请日：2009-05-13

Applicant: Mike H. Amidi ,  Robert S. Pauley ,  Satyanarayan Shivkumar Iyer

Inventor： Mike H. Amidi ,  Robert S. Pauley ,  Satyanarayan Shivkumar Iyer

IPC: H05K7/00

CPC classification number: H05K1/141 ,  G11C5/04 ,  H01L25/0652 ,  H01L2924/0002 ,  H05K1/144 ,  H05K1/181 ,  H05K2201/042 ,  H05K2201/045 ,  H05K2201/10159 ,  H05K2201/10378 ,  H05K2203/1572 ,  H01L2924/00

Abstract: A memory module with attached transposer and interposers to provide additional surface area for the placement of memory devices is disclosed. The memory module includes a memory board with a first surface, a second surface and an edge with a set of electrical contacts. A transposer is attached to each surface of the memory board, and an interposer is attached to each transposer on the opposite surface of the transposer from the memory board. The interposer has space to allow placement of memory devices on both a first surface between the interposer and the memory board, and on a second surface of the interposer away from the memory board.

Abstract translation: 公开了一种具有连接的转印器和插入件以提供用于存储器件的放置的附加表面积的存储器模块。 存储器模块包括具有第一表面，第二表面和具有一组电触点的边缘的存储器板。 将转移器连接到存储器板的每个表面，并且插入器附接到转移器的与存储器板相反的表面上的每个转台。 插入器具有允许将存储器件放置在插入器和存储器板之间的第一表面上以及在插入器的远离存储器板的第二表面上的空间。

公开(公告)号：US07553163B2

公开(公告)日：2009-06-30

申请号：US11827268

申请日：2007-07-11

Applicant: Matthew Richard McAlonis ,  Lynn Robert Sipe ,  James Lee Fedder

Inventor： Matthew Richard McAlonis ,  Lynn Robert Sipe ,  James Lee Fedder

IPC: H01R12/00

CPC classification number: H01R12/721 ,  H01R12/83 ,  H05K1/141 ,  H05K1/142 ,  H05K2201/045 ,  H05K2201/10189

Abstract: A straddle mount connector for connecting a daughter card to a circuit board includes a dielectric housing extending along a longitudinal axis. The housing has a daughter card side and an opposite straddle mount side. A longitudinally extending mating slot at the daughter card side is configured to receive a mating edge of the daughter card. A longitudinally extending mounting slot at the straddle mount side is configured to receive a mounting edge of the circuit board. The daughter card is inserted in the mating slot at an acute insertion angle with respect to a plane of the circuit board and rotated to a fully mated position wherein the daughter card is substantially coplanar with the circuit board.

Abstract translation: 用于将子卡连接到电路板的跨接安装连接器包括沿着纵向轴线延伸的电介质外壳。 外壳具有子卡侧和相对的跨骑安装侧。 在子卡侧的纵向延伸的配合槽配置成接收子卡的配合边缘。 在跨骑安装侧的纵向延伸的安装槽被配置为容纳电路板的安装边缘。 子卡相对于电路板的平面以锐角插入插入配合槽中，并且旋转到完全匹配的位置，其中子卡与电路板基本共面。