公开(公告)号：US20160150634A1

公开(公告)日：2016-05-26

申请号：US14904551

申请日：2014-07-24

Applicant: LG CHEM, LTD.

Inventor： Ducksu OH ,  Sung Soo PARK ,  Minsoo KANG

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/14

CPC classification number: H05K1/028 ,  H01L27/3276 ,  H05K1/111 ,  H05K1/117 ,  H05K1/118 ,  H05K1/14 ,  H05K1/141 ,  H05K1/142 ,  H05K1/145 ,  H05K1/147 ,  H05K1/189 ,  H05K3/323 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/0397 ,  H05K2201/046 ,  H05K2201/05 ,  H05K2201/058 ,  H05K2201/09418 ,  H05K2201/10128 ,  H05K2201/10681 ,  H05K2203/049

Abstract: A flexible printed circuit board installed on a substrate in a display device is provided.

Abstract translation: 提供了一种安装在显示装置的基板上的柔性印刷电路板。

公开(公告)号：US20160088734A1

公开(公告)日：2016-03-24

申请号：US14490866

申请日：2014-09-19

Applicant: HARRIS CORPORATION

Inventor： Louis Joseph Rendek, JR.

IPC: H05K1/16 ,  H05K3/40 ,  H05K3/00 ,  H05K1/11 ,  C23C14/34

CPC classification number: H05K3/3452 ,  H01L2224/16225 ,  H05K1/028 ,  H05K1/03 ,  H05K1/0393 ,  H05K1/111 ,  H05K1/115 ,  H05K1/167 ,  H05K3/16 ,  H05K3/3436 ,  H05K3/4038 ,  H05K2201/0141 ,  H05K2201/05 ,  Y02P70/613

Abstract: A method of making an electronic device may include forming at least one circuit layer that includes solder pads on a substrate and forming at least one liquid crystal polymer (LCP) solder mask having mask openings therein. The method may also include forming at least one thin film resistor on the LCP solder mask and coupling the at least one LOP solder mask to the substrate so that the at least one thin film resistor is coupled to the at least one circuit layer and so that the solder pads are aligned with the mask openings.

Abstract translation: 制造电子器件的方法可以包括在衬底上形成至少一个包括焊盘的电路层，并在其中形成至少一个具有掩模开口的液晶聚合物（LCP）焊料掩模。 该方法还可以包括在LCP焊接掩模上形成至少一个薄膜电阻器并且将至少一个LOP焊接掩模耦合到衬底，使得至少一个薄膜电阻器耦合到至少一个电路层，并且使得 焊盘与掩模开口对准。

公开(公告)号：US09252489B2

公开(公告)日：2016-02-02

申请号：US14798488

申请日：2015-07-14

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Noboru Kato ,  Jun Sasaki

IPC: H01Q7/08 ,  H01Q7/06 ,  H01Q1/38 ,  H01L23/538 ,  H01L23/66 ,  H01Q1/20 ,  H01Q7/00 ,  H05K1/02 ,  H05K1/16 ,  H05K1/18 ,  H05K3/46

CPC classification number: H01Q7/06 ,  H01L23/5387 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01Q1/20 ,  H01Q1/38 ,  H01Q7/00 ,  H05K1/0233 ,  H05K1/0243 ,  H05K1/025 ,  H05K1/0281 ,  H05K1/165 ,  H05K1/189 ,  H05K3/4632 ,  H05K2201/05 ,  H05K2201/09336 ,  H05K2201/10098 ,  H05K2201/10189 ,  H01L2924/00

Abstract: A circuit board and a circuit module more accurately provide impedance matching between an antenna coil and an electronic component electrically connected to the antenna coil, and include a board body including board portions and a plurality of laminated insulating material layers made of a flexible material. An antenna coil includes coil conductors provided in the board portion. Wiring conductors are provided in the board portion and electrically connected to the antenna coil. The board portion has a structure that is less likely to deform than the board portion. An integrated circuit electrically connected to the wiring conductors is mounted on the board portion.

公开(公告)号：US20160007456A1

公开(公告)日：2016-01-07

申请号：US14768800

申请日：2014-02-19

Applicant: TOKYO INSTITUTE OF TECHNOLOGY ,  JX NIPPON OIL & ENERGY CORPORATION

Inventor： Koichi Sakajiri ,  Keisuke Azuma ,  Hidetoshi Matsumoto ,  Junji Watanabe ,  Masatoshi Tokita

IPC: H05K1/09 ,  H05K3/02

CPC classification number: H05K1/097 ,  G02F1/13439 ,  G06F3/041 ,  G06F2203/04102 ,  G06F2203/04103 ,  H01B1/023 ,  H01L31/022466 ,  H05K3/02 ,  H05K2201/05

Abstract: There are provided a conductive nanowire network, a conductive board and transparent electrode utilizing it, and a method for producing the same. The conductive nanowire network of the invention has essentially unbroken, continuous conductive nanowires randomly formed into a network. In the method for producing a conductive nanowire network according to the invention, nanofibers are applied in a random network-like fashion onto a substrate covered with a conductive layer, the conductive layer regions that are not covered with the nanofibers are removed, and then the nanofibers are removed. The network structure (wire diameter and network density) are also controlled to obtain a transparent electrode exhibiting both transparency and conductivity.

Abstract translation: 提供导电纳米线网络，导电板和利用它的透明电极及其制造方法。 本发明的导电纳米线网络具有基本上不间断的连续导电纳米线，其随机形成网络。 在根据本发明的导电纳米线网络的制造方法中，将纳米纤维以随机网状方式施加到被导电层覆盖的基板上，除去未被纳米纤维覆盖的导电层区域，然后 纳米纤维被去除。 还控制网络结构（线径和网络密度），以获得透明和透明的透明电极。

公开(公告)号：US20150357733A1

公开(公告)日：2015-12-10

申请号：US14300855

申请日：2014-06-10

Applicant: Apple Inc.

Inventor： Emery A. Sanford ,  Tyson B. Manullang ,  David G. Havskjold ,  Tyler S. Bushnell ,  Eric S. Jol ,  Anthony S. Montevirgen ,  John Raff

IPC: H01R12/61

CPC classification number: H01R12/62 ,  H01R12/52 ,  H05K1/14 ,  H05K1/142 ,  H05K1/147 ,  H05K1/148 ,  H05K2201/046 ,  H05K2201/05 ,  H05K2201/10325 ,  H05K2201/1034 ,  H05K2201/10681

Abstract: An electrical board-to-board connector including a flexible cable assembly having a low profile or dimensionally reduced configuration. The connector body of a cable assembly may be widened to provide the structural rigidity sufficient to support an array of solder lead connections. Other support elements may be omitted from the cable assembly, which results in a reduced height dimension. The flexible cable assembly may also include a cowling used to retain the cable assembly against a circuit board. The cowling may also be configured to reduce the dimensions or dimensional footprint of the connection.

Abstract translation: 一种电路板对板连接器，包括具有低轮廓或尺寸减小的构造的柔性电缆组件。 电缆组件的连接器主体可以被加宽以提供足以支持焊锡引线连接阵列的结构刚度。 可以从电缆组件中省略其它支撑元件，这导致减小的高度尺寸。 柔性电缆组件还可以包括用于将电缆组件保持抵靠电路板的整流罩。 整流罩也可以被配置成减小连接的尺寸或尺寸。

公开(公告)号：US20150305156A1

公开(公告)日：2015-10-22

申请号：US14690827

申请日：2015-04-20

Applicant: NITTO DENKO CORPORATION

Inventor： Yoshito FUJIMURA ,  Naohiro TERADA

IPC: H05K1/11 ,  H05K1/18

CPC classification number: H05K1/112 ,  H05K1/0281 ,  H05K1/056 ,  H05K1/181 ,  H05K2201/05 ,  H05K2201/10083 ,  Y02P70/611

Abstract: A suspension board with circuit includes a pad portion configured to be bonded to an electronic element. The pad portion includes a conductive layer; in the pad portion, a through hole passing through the pad portion with its periphery closed by the pad portion is formed; and at least a part of an inner peripheral surface facing the through hole in the pad portion is divided only by the conductive layer.

Abstract translation: 具有电路的悬挂板包括被配置为结合到电子元件的焊盘部分。 焊盘部分包括导电层; 在焊盘部分中形成有通过焊盘部分的通孔，其周边被焊盘部分封闭; 并且面对焊盘部分中的通孔的内周面的至少一部分仅被导电层分开。

公开(公告)号：US20150201492A1

公开(公告)日：2015-07-16

申请号：US14335710

申请日：2014-07-18

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Yang-Wan Kim ,  Won-Kyu Kwak

IPC: H05K1/11 ,  H05K1/02

CPC classification number: H05K1/028 ,  H05K1/0277 ,  H05K1/0283 ,  H05K1/118 ,  H05K1/147 ,  H05K1/189 ,  H05K3/361 ,  H05K2201/05 ,  H05K2201/055 ,  H05K2201/09027 ,  H05K2201/09418 ,  H05K2201/10128 ,  H05K2201/10681

Abstract: Provided is a display apparatus. The display apparatus includes a display panel including a substrate including a display region in which a display unit is located, a non-display region that extends outward from the display region and in which a plurality of pads are located, and a sealing portion that covers the display unit. The display apparatus also includes a circuit board including a flexible film and a plurality of terminals on the flexible film that are electrically coupled to the plurality of pads. The plurality of pads are spaced from each other along a first direction of the display panel and pad central points of the plurality of pads are located at at least two different locations along the first direction.

Abstract translation: 提供了一种显示装置。 显示装置包括：显示面板，包括：显示单元所在的显示区域的基板;从显示区域向外延伸并且多个焊盘位于的非显示区域;以及覆盖 显示单元。 显示装置还包括电路板，其包括柔性膜和柔性膜上的多个端子，其电耦合到多个焊盘。 多个焊盘沿着显示面板的第一方向彼此间隔开，并且多个焊盘的焊盘中心点位于沿着第一方向的至少两个不同位置。

公开(公告)号：US20120056796A1

公开(公告)日：2012-03-08

申请号：US13294310

申请日：2011-11-11

Applicant: Noboru KATO ,  Jun SASAKI

Inventor： Noboru KATO ,  Jun SASAKI

IPC: H01Q1/38 ,  H01Q7/08

CPC classification number: H01Q7/06 ,  H01L23/5387 ,  H01L23/66 ,  H01L2223/6677 ,  H01L2924/0002 ,  H01L2924/3011 ,  H01Q1/20 ,  H01Q1/38 ,  H01Q7/00 ,  H05K1/0233 ,  H05K1/0243 ,  H05K1/025 ,  H05K1/0281 ,  H05K1/165 ,  H05K1/189 ,  H05K3/4632 ,  H05K2201/05 ,  H05K2201/09336 ,  H05K2201/10098 ,  H05K2201/10189 ,  H01L2924/00

Abstract: A circuit board and a circuit module more accurately provide impedance matching between an antenna coil and an electronic component electrically connected to the antenna coil, and include a board body including board portions and a plurality of laminated insulating material layers made of a flexible material. An antenna coil includes coil conductors provided in the board portion. Wiring conductors are provided in the board portion and electrically connected to the antenna coil. The board portion has a structure that is less likely to deform than the board portion. An integrated circuit electrically connected to the wiring conductors is mounted on the board portion.

Abstract translation: 电路板和电路模块更准确地提供天线线圈和与天线线圈电连接的电子部件之间的阻抗匹配，并且包括板主体，其包括由柔性材料制成的板部分和多个层叠绝缘材料层。 天线线圈包括设置在板部分中的线圈导体。 配线导体设置在电路板部分中并电连接到天线线圈。 板部分具有不如板部分变形的结构。 电连接到布线导体的集成电路安装在基板部分上。

公开(公告)号：US12101873B2

公开(公告)日：2024-09-24

申请号：US17660618

申请日：2022-04-25

Applicant: Microsoft Technology Licensing, LLC

Inventor： Jaejin Lee ,  Edward Charles Leacock ,  Charbel Khawand

IPC: G06F1/16 ,  H05K1/02 ,  H05K1/03 ,  H05K1/18

CPC classification number: H05K1/0218 ,  G06F1/1681 ,  H05K1/0216 ,  H05K1/0393 ,  H05K1/18 ,  H05K1/189 ,  H05K2201/05 ,  H05K2201/08 ,  H05K2201/083

Abstract: An FPC cable assembly is provided that includes a first ground layer, a second ground layer, and at least one signal line sandwiched by the first and second ground layers. The FPC cable assembly further includes an electromagnetic shielding structure including a first magnetic layer at least partially covering and electrically grounded to the first ground layer, a second magnetic layer at least partially covering and electrically grounded to the second ground layer, and a plurality of magnetic rings magnetically engaged with and electrically contacting the first magnetic layer and the second magnetic layer so as to surround the first and second ground layers, the at least one signal line, and the first and second magnetic layers, thereby providing electromagnetic shielding of the at least one signal line.

公开(公告)号：US12089334B2

公开(公告)日：2024-09-10

申请号：US17426125

申请日：2021-05-31

Applicant: TCL China Star Optoelectronics Technology Co., Ltd.

Inventor： Jinfeng Liu

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18

CPC classification number: H05K1/18 ,  H05K1/028 ,  H05K1/11 ,  H05K1/142 ,  H05K2201/05 ,  H05K2201/10128 ,  H05K2201/10212

Abstract: The present application discloses a display panel and a display device. The display panel includes a display panel main body, a flexible wiring board, and a printed circuit board. The display panel main body includes a plurality of wires, and the display panel main body is connected to an end of the flexible wiring board. The printed circuit board is connected to another end of the flexible wiring board. The printed circuit board includes a driver chip, and the driver chip is electrically connected to the wires.