公开(公告)号：US07781679B1

公开(公告)日：2010-08-24

申请号：US11340298

申请日：2006-01-26

Applicant: Christopher Schreiber ,  Christopher Dunn

Inventor： Christopher Schreiber ,  Christopher Dunn

IPC: H05K1/00

CPC classification number: H05K3/44 ,  H05K1/056 ,  H05K3/16 ,  H05K3/4076 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09827 ,  Y10T428/30 ,  Y10T428/31678

Abstract: A disk drive suspension interconnect, and method therefor. The interconnect has a metal grounding layer, a metal conductive layer and an insulative layer between the metal grounding layer and the conductive metal layer. A circuit component such as a slider is electrically connected to the conductive layer along a grounding path from the circuit component and the conductive layer to the metal grounding layer through an aperture in the insulative layer. For improved electrical connection a tie layer is provided through the insulative layer onto the grounding layer in bonding relation with the ground layer. A conductor is deposited onto both the conductive metal layer and the tie layer in conductive metal layer and tie layer bonding relation, and the circuit component is thus bonded to the grounding layer by the conductor.

Abstract translation: 磁盘驱动器悬挂互连及其方法。 互连在金属接地层和导电金属层之间具有金属接地层，金属导电层和绝缘层。 诸如滑块的电路部件沿着从电路部件和导电层到金属接地层的通过绝缘层的孔的接地路径电连接到导电层。 为了改善电连接，通过绝缘层将接合层提供到与接地层结合的接地层上。 导电体以导电金属层和连接层结合关系沉积在导电金属层和连接层两者上，并且电路部件因此被导体结合到接地层。

公开(公告)号：US20100116540A1

公开(公告)日：2010-05-13

申请号：US12611261

申请日：2009-11-03

Applicant: Jun ISHII ,  Toshiki NAITOU ,  Mitsuru HONJO

Inventor： Jun ISHII ,  Toshiki NAITOU ,  Mitsuru HONJO

IPC: H05K1/11 ,  B05D5/12

CPC classification number: H05K3/4685 ,  G11B5/484 ,  G11B5/486 ,  H05K1/0228 ,  H05K1/0245 ,  H05K1/025 ,  H05K1/0265 ,  H05K1/056 ,  H05K3/06 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/09509 ,  H05K2201/09554 ,  H05K2201/09627 ,  H05K2201/0979 ,  H05K2203/0323 ,  Y10T29/49155

Abstract: An end of a first line and an end of a second line of a first write wiring pattern are arranged on both sides of a third line of a second write wiring pattern. Circular connection portions are provided at the ends of the first line and the second line. In addition, through holes are formed in respective portions of a base insulating layer below the connection portions. Each connection portion comes in contact with a connecting region of a suspension body within the through hole.

Abstract translation: 第一写入布线图案的第一行的一端和第二行的末端布置在第二写入布线图案的第三行的两侧。 圆形连接部设置在第一线和第二线的端部。 此外，在连接部分下方的基底绝缘层的各个部分中形成通孔。 每个连接部分与通孔内的悬架体的连接区域接触。

公开(公告)号：US07649254B2

公开(公告)日：2010-01-19

申请号：US11381093

申请日：2006-05-01

Applicant: Bhret Graydon ,  Steve Frandrup

Inventor： Bhret Graydon ,  Steve Frandrup

IPC: H01L23/49

CPC classification number: H05K1/118 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H05K1/0218 ,  H05K1/0393 ,  H05K3/0061 ,  H05K3/321 ,  H05K3/386 ,  H05K2201/09554 ,  H05K2201/10977 ,  H05K2201/2009 ,  Y10T428/13 ,  Y10T428/28 ,  H01L2924/00

Abstract: A structure is disclosed for connecting an electrically-connectable metal stiffener to a ground connection within a flexible substrate, the stiffener comprising nickel-gold plated stainless steel. In one embodiment the stiffener is secured to the flexible substrate by a non-conducting adhesive which includes an opening over a ground connection, the adhesive opening being filled by a conductive epoxy. A sequence for applying the disclosed materials discloses a method for attaching the stiffening structure to the flexible substrate.

Abstract translation: 公开了用于将可电连接的金属加强件连接到柔性基板内的接地连接件的结构，该加强件包括镀镍的不锈钢。 在一个实施例中，加强件通过非导电粘合剂固定到柔性基底上，该非导电粘合剂包括在接地连接上的开口，粘合剂开口由导电环氧树脂填充。 用于应用所公开的材料的顺序公开了一种将加强结构附接到柔性基底的方法。

公开(公告)号：US20090277679A1

公开(公告)日：2009-11-12

申请号：US12219660

申请日：2008-07-25

Applicant: Ha Yong Jung ,  Dek Gin Yang ,  Cheol Ho Heo ,  Chan-Yeup Chung ,  Keun Ho Kim ,  Seoung Jae Lee

Inventor： Ha Yong Jung ,  Dek Gin Yang ,  Cheol Ho Heo ,  Chan-Yeup Chung ,  Keun Ho Kim ,  Seoung Jae Lee

IPC: H05K3/42 ,  H05K1/11

CPC classification number: H05K3/44 ,  H05K1/056 ,  H05K3/429 ,  H05K2201/09554 ,  H05K2203/073

Abstract: Provided is a method of manufacturing a PCB, the method comprising: providing a substrate including an aluminum core; forming a via hole passing through the substrate; substituting the surface of the aluminum core with a zinc film by performing a zincate treatment on the inner surface of the via hole; substituting the zinc film with a metal film by performing substitution plating on the zinc film; forming a first plated film on the surface of the via hole, where the metal film is formed, through electroless plating; and forming a second plated film on the first plated film through electroplating.

Abstract translation: 提供一种制造PCB的方法，该方法包括：提供包括铝芯的基板; 形成通过所述基板的通孔; 通过在通孔的内表面上进行锌酸盐处理，用锌膜代替铝芯的表面; 通过在锌膜上进行取代电镀用金属膜代替锌膜; 在形成金属膜的通孔的表面上通过无电镀形成第一镀膜; 以及通过电镀在所述第一镀膜上形成第二镀膜。

公开(公告)号：US20090218117A1

公开(公告)日：2009-09-03

申请号：US12291892

申请日：2008-11-14

Applicant: Nobuyuki Sakai

Inventor： Nobuyuki Sakai

IPC: H05K1/00 ,  H05K3/10

CPC classification number: H05K3/0061 ,  H05K1/0393 ,  H05K1/056 ,  H05K3/005 ,  H05K3/321 ,  H05K3/4069 ,  H05K3/4084 ,  H05K3/44 ,  H05K2201/091 ,  H05K2201/09554 ,  H05K2203/063 ,  Y10T29/49153 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: The insulation base side of single-sided FPC is turned to the die side, and the mounting surface side of ground circuit is turned to the upper side, and the FPC is placed on die (a). When the portion of ground circuit where the conduction is realized and metal reinforcing plate are punched by punch of which the clearance dimension is made to be 50 to 95% of the thickness of the material to be punched, hole sagging will be formed (b). The insulation base 1 side is turned up, electrically conductive adhesive and metal reinforcing plate are laminated in this order, heating pressing is performed with the press apparatus for metal reinforcing plate to be laminated (c). Thereby, laminated FPC is formed (d). At this time, since electrically conductive adhesive is injected into hole sagging by press pressing, the electrical connection of metal reinforcing plate and ground circuit can be attained by the interlaminar conduction by means of electrically conductive adhesive, and there is also no residual air.

Abstract translation: 单面FPC的绝缘基底侧向模具侧转动，接地电路的安装面侧向上侧转动，将FPC放置在模具（a）上。 当实现导通的接地电路的部分和金属加强板用冲孔冲压成冲孔材料厚度的50％至95％时，将形成孔下垂（b） 。 将绝缘基体1侧翻转，依次层压导电性粘合剂和金属加强板，用层叠（c）的金属加强板用加压装置进行加压加压。 由此形成层叠FPC（d）。 此时，由于通过压制将导电性粘合剂注入到孔下垂中，所以可以通过导电性粘合剂进行层间导电，可以实现金属加强板与接地电路的电连接，也不会有残留空气。

公开(公告)号：US20090135572A1

公开(公告)日：2009-05-28

申请号：US12064996

申请日：2006-08-30

Applicant: Sadamichi Takakusaki ,  Noriaki Sakamoto

Inventor： Sadamichi Takakusaki ,  Noriaki Sakamoto

IPC: H05K1/11 ,  H05K13/04

CPC classification number: H01L25/162 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/056 ,  H05K1/142 ,  H05K3/284 ,  H05K3/4046 ,  H05K2201/09554 ,  H05K2201/10287 ,  H05K2201/1034 ,  H05K2201/10924 ,  Y10T29/5313 ,  H01L2924/00 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Provided is a circuit device in which an electronic circuit to be incorporated therein operates stably. A hybrid integrated circuit device includes multiple circuit boards which are disposed on approximately the same plane. An electronic circuit including a conductive pattern and a circuit element is formed on each top surface of the circuit boards. Furthermore, these circuit boards are integrally supported by a sealing resin. Moreover, a lead connected to the electronic circuit formed on the surface of the circuit board is led out from the sealing resin to the outside.

Abstract translation: 提供一种其中并入其中的电子电路稳定地工作的电路装置。 混合集成电路装置包括设置在大致相同平面上的多个电路板。 在电路板的每个顶表面上形成包括导电图案和电路元件的电子电路。 此外，这些电路板由密封树脂一体地支撑。 此外，连接到形成在电路板表面上的电子电路的引线从密封树脂引出到外部。

公开(公告)号：US07533955B2

公开(公告)日：2009-05-19

申请号：US11903979

申请日：2007-09-25

Applicant: Isao Kobayashi

Inventor： Isao Kobayashi

IPC: B41J29/377

CPC classification number: B41J2/14201 ,  B41J2002/14491 ,  B41J2202/08 ,  H05K1/0206 ,  H05K1/0393 ,  H05K1/148 ,  H05K3/0061 ,  H05K2201/0305 ,  H05K2201/09554

Abstract: A recording apparatus, including: a recording head including an actuator; a head holder holding the head; a circuit board disposed on the holder and configured to be connected to an external signal source; a drive circuit operable to drive the actuator; a flexible wiring member which includes wires that connect the actuator and the circuit board, which is elongated in a direction in which the wires extend, which is connected to the actuator and the circuit board at longitudinally opposite ends thereof, respectively, and on which the drive circuit is mounted between the longitudinal opposite ends, the wires including (a) a common voltage wire which connects common-voltage portions of the drive circuit and the circuit board and (b) a drive signal wire for driving the actuator; and a radiator having heat conductivity and electric conductivity and disposed between the head and the circuit board so as to extend along the wiring member, the radiator being heat-conductively and electrically joined to: (a) the common voltage wire in the vicinity of the drive circuit; (b) at least one portion of the common voltage wire intermediate between the drive circuit and the circuit board; and (c) at least one of (c-1) the common voltage wire in the vicinity of the circuit board and (c-2) the common-voltage portion of the circuit board connected to the common voltage wire of the wiring member.

Abstract translation: 一种记录装置，包括：包括致动器的记录头; 持有头部的头架; 设置在所述保持器上并且被配置为连接到外部信号源的电路板; 可操作以驱动致动器的驱动电路; 柔性布线构件，其包括连接致动器和电路板的导线，所述导线在导线延伸的方向上延伸，其分别在其纵向相对端连接到致动器和电路板，并且其上 驱动电路安装在纵向相对端之间，导线包括（a）连接驱动电路的公共电压部分和电路板的公共电压线和（b）用于驱动致动器的驱动信号线; 以及散热器，其具有导热性和导电性，并且设置在所述头部和所述电路板之间，沿着所述布线构件延伸，所述散热器被导热和电接合到：（a）所述公共电压线在 驱动电路; （b）在驱动电路和电路板之间的中间的公共电压线的至少一部分; 和（c）电路板附近的公共电压线中的（c-1）和（c-2）连接到配线部件的公共电压线的电路板的公共电压部分中的至少一个。

公开(公告)号：US07465884B2

公开(公告)日：2008-12-16

申请号：US11785873

申请日：2007-04-20

Applicant: Yasunari Ooyabu ,  Jun Ishii

Inventor： Yasunari Ooyabu ,  Jun Ishii

IPC: H05K1/00

CPC classification number: H05K1/0259 ,  G11B5/486 ,  H05K1/056 ,  H05K1/167 ,  H05K3/28 ,  H05K2201/09554

Abstract: The wired circuit board includes a metal supporting board, an insulating base layer formed on the metal supporting board, a conductive pattern formed on the insulating base layer, a semiconductive layer formed on the insulating base layer so as to cover the conductive pattern, and a ground connecting portion formed on the metal supporting board to be in contact with the metal supporting board and the semiconductive layer.

Abstract translation: 布线电路板包括金属支撑板，形成在金属支撑板上的绝缘基底层，形成在绝缘基底层上的导电图案，形成在绝缘基底层上以覆盖导电图案的半导体层，以及 接地连接部分形成在金属支撑板上以与金属支撑板和半导体层接触。

公开(公告)号：US20080022523A1

公开(公告)日：2008-01-31

申请号：US11868148

申请日：2007-10-05

Applicant: Alan Wang ,  Kevin Olson

Inventor： Alan Wang ,  Kevin Olson

IPC: H05K3/00 ,  H01K3/10

CPC classification number: H05K3/445 ,  H01L2224/16225 ,  H05K1/056 ,  H05K3/002 ,  H05K3/0052 ,  H05K3/403 ,  H05K3/426 ,  H05K3/44 ,  H05K3/4614 ,  H05K3/4641 ,  H05K3/4644 ,  H05K2201/0129 ,  H05K2201/0166 ,  H05K2201/0397 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2201/09181 ,  H05K2201/0919 ,  H05K2201/09554 ,  H05K2201/09645 ,  H05K2201/09827 ,  H05K2203/1105 ,  H05K2203/135 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A circuit board includes an electrically conductive sheet having an insulative coating surrounding the conductive sheet, with a surface of the insulative coating around an edge of the conductive sheet having an arcuate or rounded shape. At least one electrical conductor is conformally deposited on at least the rounded insulative coating around the edge of the conductive sheet and defined via photolithographic and metallization techniques. Each electrical conductor on the insulative coating thereon around the edge of the conductive sheet conforms to the arcuate or rounded shape of the insulative coating and, therefore, has an arcuate or rounded shape.

Abstract translation: 电路板包括具有围绕导电片的绝缘涂层的导电片，绝缘涂层的表面围绕导电片的边缘具有弓形或圆形形状。 至少一个电导体被共形沉积在导电片的边缘周围的至少圆形绝缘涂层上，并通过光刻和金属化技术限定。 导电片边缘周围的绝缘涂层上的每个电导体符合绝缘涂层的弧形或圆形形状，因此具有弓形或圆形形状。

公开(公告)号：US20080022519A1

公开(公告)日：2008-01-31

申请号：US11865794

申请日：2007-10-02

Applicant: Donald Farquhar ,  James Herard ,  Michael Klodowski ,  David Questad ,  Der-jin Woan

Inventor： Donald Farquhar ,  James Herard ,  Michael Klodowski ,  David Questad ,  Der-jin Woan

IPC: H05K3/36

CPC classification number: H05K3/4641 ,  H01L21/4853 ,  H01L21/4857 ,  H01L23/3735 ,  H01L23/49822 ,  H01L23/49894 ,  H01L24/16 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/12044 ,  H01L2924/15311 ,  H01L2924/30105 ,  H01L2924/3011 ,  H01L2924/3025 ,  H01L2924/351 ,  H05K1/0271 ,  H05K1/114 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4608 ,  H05K3/4623 ,  H05K3/4626 ,  H05K3/4632 ,  H05K3/4688 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0191 ,  H05K2201/0209 ,  H05K2201/068 ,  H05K2201/09509 ,  H05K2201/09536 ,  H05K2201/09554 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/10378 ,  H05K2203/061 ,  H05K2203/068 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49163 ,  Y10T29/49165 ,  H01L2924/00

Abstract: A laminating method. A structure that includes first and second dielectric layers respectively positioned on opposing surfaces of a thermally conductive layer is pressurized between 1000 and 3000 psi concurrent with being subjected to a thermal process, including the steps of: (a) heating the structure from ambient room temperature to a temperature between 670° F. to 695° F. in a heatup stage of duration 42 to 57 minutes; (b) after step (a), maintaining the structure at an approximately constant temperature between 670° F. and 695° F. in a dwell stage of duration 105 to 125 minutes; (c) after step (b), cooling the structure to 400° F. in a slow cool stage of duration of 120 to 150 minutes, wherein step (c) is performed after step (b); and (d) after step (3), cooling the structure to ambient room temperature in a rapid cool stage of duration less than 180 minutes.

Abstract translation: 层压方法。 包括分别位于导热层的相对表面上的第一和第二电介质层的结构在1000和3000psi之间被加压，同时进行热处理，包括以下步骤：（a）从环境室温 在持续时间为42至57分钟的加热阶段中温度在670°F至695°F之间; （b）在步骤（a）之后，在持续105至125分钟的停留阶段中，将结构保持在670°F和695°F之间的近似恒定温度; （c）在步骤（b）之后，在120至150分钟的缓慢冷却阶段中将结构冷却至400°F，其中步骤（c）在步骤（b）之后进行; 和（d）在步骤（3）之后，在持续时间小于180分钟的快速冷却阶段中将结构冷却至环境室温。