公开(公告)号：US20020093091A1

公开(公告)日：2002-07-18

申请号：US09838521

申请日：2001-04-19

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chien-Ping Huang ,  Zong-Da Ho ,  Che-Jung Chang

IPC: H01L021/44 ,  H01L021/48 ,  H01L021/50 ,  H01L023/34 ,  H01L023/52

CPC classification number: H05K1/116 ,  H01L23/36 ,  H01L23/49816 ,  H01L24/11 ,  H01L2924/14 ,  H05K1/112 ,  H05K3/3478 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/09663 ,  H05K2201/10734 ,  H05K2203/041 ,  H05K2203/043 ,  H05K2203/1178 ,  H01L2924/00

Abstract: A method for fabricating a ground-ball bonding structure on a TBGA package is proposed, which is characterized by the forming of a plurality of air vents around the ground-ball pad and cut all the way into the tape until reaching the bottommost surface of the tape. During solder-reflow process, this allows the trapped air in the via hole due to solder material being filled into the via hole to the outside atmosphere during solder-reflow process. Compared to the prior art, since the proposed method allows substantially no air-filled voids to be left in the via hole, the resulted ground ball would be fully collapsed against the heat sink and therefore coplanarized with respect to the signal ball. The coplanarity of the overall ball grid array would allow the TBGA package to be mounted properly onto a printed circuit board during SMT (Surface Mount Technology) process. In addition, the proposed method allows a reliable bonding between the ground ball and the heat sink thus assuring the grounding effect of the resulted TBGA package.

Abstract translation: 提出了一种在TBGA封装上制造地球接合结构的方法，其特征在于在地球垫周围形成多个通风孔，并将其全部切入带中，直至达到 胶带。 在焊锡回流工艺期间，由于在焊料回流过程中由于焊料材料被填充到通孔中而导致通孔中的被捕获的空气进入外部大气。 与现有技术相比，由于所提出的方法基本上没有空气填充的空隙留在通孔中，因此所产生的磨球将完全折叠在散热片上，因此相对于信号球共面。 整个球栅阵列的共面性将允许在SMT（表面贴装技术）工艺中将TBGA封装适当地安装到印刷电路板上。 此外，所提出的方法允许接地球和散热器之间的可靠接合，从而确保所得TBGA封装的接地效果。

公开(公告)号：US06349038B1

公开(公告)日：2002-02-19

申请号：US09400025

申请日：1999-09-21

Applicant: Jeffery C. Hailey

Inventor： Jeffery C. Hailey

IPC: H05K111

CPC classification number: H05K1/0216 ,  H05K2201/09245 ,  H05K2201/093 ,  H05K2201/09663

Abstract: An apparatus for use with data processing systems. The apparatus provides a split metallic conducting plane having a split formed by a substantially-dielectric-filled moat spanning a width of a side of a first metallic conducting part running substantially parallel to a side of a second metallic conducting part, with the moat structured such that the side of the first metallic part has at least two indentations and such that the side of the second metallic part has at least two indentations, and where a metallic trace is located proximate to the split metallic conducting plane.

Abstract translation: 一种与数据处理系统一起使用的设备。 该装置提供了一种裂开的金属导电平面，其具有由基本上介电填充的护城河形成的裂缝，跨越宽度基本上平行于第二金属导电部分的一侧延伸的第一金属导电部分的宽度， 第一金属部件的侧面具有至少两个压痕，并且使得第二金属部件的侧面具有至少两个压痕，并且其中金属迹线位于分开的金属导电平面附近。

公开(公告)号：US20020012240A1

公开(公告)日：2002-01-31

申请号：US09400025

申请日：1999-09-21

Inventor： JEFFERY C. HAILEY

IPC: H05K009/00 ,  H04B003/32

CPC classification number: H05K1/0216 ,  H05K2201/09245 ,  H05K2201/093 ,  H05K2201/09663

Abstract: An apparatus for use with data processing systems. The apparatus provides a split metallic conducting plane having a split formed by a substantially-dielectric-filled moat spanning a width of a side of a first metallic conducting part running substantially parallel to a side of a second metallic conducting part, with the moat structured such that the side of the first metallic part has at least two indentations and such that the side of the second metallic part has at least two indentations, and where a metallic trace is located proximate to the split metallic conducting plane.

Abstract translation: 一种与数据处理系统一起使用的设备。 该装置提供了一种裂开的金属导电平面，其具有由基本上介电填充的护城河形成的裂缝，跨越宽度基本上平行于第二金属导电部分的一侧延伸的第一金属导电部分的宽度， 第一金属部件的侧面具有至少两个压痕，并且使得第二金属部件的侧面具有至少两个压痕，并且其中金属迹线位于分开的金属导电平面附近。

公开(公告)号：US20020008326A1

公开(公告)日：2002-01-24

申请号：US09847370

申请日：2001-05-03

Applicant: NEC Corporation

Inventor： Manabu Mizusaki

IPC: H01L023/48

CPC classification number: H05K3/3436 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2224/0401 ,  H01L2224/05001 ,  H01L2224/0554 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/15311 ,  H05K2201/09036 ,  H05K2201/09472 ,  H05K2201/09663 ,  H05K2203/1178 ,  Y02P70/613 ,  H01L2924/00014

Abstract: It is an object to provide an electrode structure of a carrier substrate of a semiconductor device in which the strength and the reliability of the joint portion between an electrode of a semiconductor package and an electrode of a main substrate are improved. A soldering land (103) that is an electrode of a carrier substrate (102) is hemispheric having a concentric hemispheric face hollow portion thereinside, a flange portion is provided in the circumferential portion thereof, and the outer diameter of the flange portion corresponds to the outer diameter of the conventional cylinder. Two slits (104) are provided in the flange portion and parts of a wall surface adjacent to the flange portion for venting air. A hemispheric face recess is provided in the carrier substrate (102) toward an outer surface, and the soldering land (103) is fixedly attached to the carrier substrate (102) so that the soldering land (103) is fitted into the recess and the flange portion abuts the outer surface of the carrier substrate.

Abstract translation: 本发明的目的是提供一种半导体器件的载体衬底的电极结构，其中半导体封装的电极和主衬底的电极之间的接合部分的强度和可靠性得到改善。 作为载体基板（102）的电极的焊接区域（103）是具有其内侧的同心半球面中空部的半球体，在其周向部设置有凸缘部，凸缘部的外径对应于 常规圆筒的外径。 两个狭缝（104）设置在凸缘部分和与凸缘部分相邻的壁表面的部分，用于排出空气。 在载体基板（102）中朝向外表面设置半球面凹部，并且将焊接台（103）固定地安装在载体基板（102）上，使得焊盘（103）嵌入凹部 凸缘部分邻接载体基板的外表面。

公开(公告)号：US06331883B1

公开(公告)日：2001-12-18

申请号：US09195539

申请日：1998-11-19

Applicant: Tatsuya Hasegawa ,  Masaichi Ohkubo ,  Yoshihiro Ito ,  Sanae Tokunaga

Inventor： Tatsuya Hasegawa ,  Masaichi Ohkubo ,  Yoshihiro Ito ,  Sanae Tokunaga

IPC: G02F11343

CPC classification number: G02F1/13452 ,  H05K1/0269 ,  H05K1/117 ,  H05K3/323 ,  H05K3/361 ,  H05K2201/0108 ,  H05K2201/09663 ,  H05K2201/09781 ,  H05K2203/166

Abstract: An object of this invention is to provide manufacturing method of a flat panel display device, in which, to match the position of a lead 30 of a TCP 12 with that of a land 32 of a PCB 14, light is irradiated from a lighting device 22 located substantially just above an axis line of a lead 30 and a shadow is photographed by a camera 20 so as to match the position thereof. As a result, this makes it possible to match the positions of the TCP having leads having a fine pitch with those of the lands of the PCB.

Abstract translation: 本发明的目的是提供一种平板显示装置的制造方法，其中为了使TCP 12的引线30与PCB 14的焊盘32的位置相匹配，从照明装置照射光 22基本上位于引线30的轴线上方，并且通过照相机20拍摄阴影以便匹配其位置。 结果，这使得可以将具有细间距的引线的TCP的位置与PCB的焊盘的位置相匹配。

公开(公告)号：US20010035799A1

公开(公告)日：2001-11-01

申请号：US09805250

申请日：2001-03-14

Inventor： Osamu Ueno ,  Hitoshi Arakaki

IPC: H01P003/08

CPC classification number: H05K1/0231 ,  H01L2224/16225 ,  H01L2924/19105 ,  H05K1/0227 ,  H05K1/0234 ,  H05K1/112 ,  H05K2201/093 ,  H05K2201/09309 ,  H05K2201/09336 ,  H05K2201/09663 ,  H05K2201/10022 ,  H05K2201/10522 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A circuit board device suppress with a small number of terminal elements unwanted irradiation originating between a power supply layer and a ground layer, even when a configuration of the power supply layer and the ground layer on the circuit board is complex, and a design support device thereof. The circuit board device has a power supply layer and a ground layer disposed in opposition to one another. A dielectric is disposed between the power supply layer and the ground layer. A power supply surface is divided into two power supply surfaces and by a slit having a generally T-shaped configuration to form power supply surface edges. The power supply surface edges retain across a predetermined length L a characteristic impedance present between the power supply layer and the ground layer. A terminal load is connected to a terminal portion of the power supply surface edges.

Abstract translation: 电路板装置即使在电源层和电路板上的接地层的配置复杂的情况下也抑制少量端子元件产生电源层和接地层之间的不需要的照射，并且设计支持装置 其中。 电路板装置具有彼此相对设置的电源层和接地层。 电介质设置在电源层和接地层之间。 电源表面被分成两个电源表面和通常具有大致T形构造的狭缝以形成电源表面边缘。 电源表面边缘在预定长度L之间保持存在于电源层和接地层之间的特征阻抗。 端子负载连接到电源表面边缘的端子部分。

公开(公告)号：US20010019176A1

公开(公告)日：2001-09-06

申请号：US09282415

申请日：1999-03-31

Inventor： TAISUKE AHIKO ,  TAKAYA ISHIGAKI ,  HIROKI SATO ,  KAMIYA TAKASHI ,  MASANORI YAMAMOTO

IPC: H01L023/495 ,  H01L023/48 ,  H01L023/52 ,  H01L029/40 ,  H01L023/29 ,  H01L023/34

CPC classification number: H01G4/012 ,  H01G4/232 ,  H05K3/3442 ,  H05K2201/09181 ,  H05K2201/09381 ,  H05K2201/09663 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: A ceramic substrate (1) has two side surfaces (64, 65) in a lengthwise direction (X) and two side surfaces (66, 67) in a widthwise direction Y intersecting each other, and is also provided with at least one flat surface (68) in a thicknesswise direction (Z). Internal electrode films (2 to 11) are embedded in the ceramic substrate (1) with film surfaces thereof extending roughly parallel to the flat surface (68) of the ceramic substrate (1). External electrodes (44, 55) are each provided on the flat surface (68) of the ceramic substrate (1) toward one of the two ends of the ceramic substrate (1) in the lengthwise direction (X), are electrically continuous with the internal electrode films (2 to 11) and are formed over distances (d11, d12) and (d21, d22) from the two side surfaces (66, 67) in the widthwise direction (Y).

Abstract translation: 陶瓷基板（1）在长度方向（X）上具有两个侧表面（64,65）和在宽度方向Y上彼此相交的两个侧表面（66,67），并且还设置有至少一个平坦表面 （68）在厚度方向（Z）上。 内部电极膜（2〜11）嵌入在陶瓷基板（1）中，其膜表面大致平行于陶瓷基板（1）的平坦表面（68）延伸。 在陶瓷基板（1）的平坦表面（68）上沿着长度方向（X）朝向陶瓷基板（1）的两端之一设置外部电极（44,45），与陶瓷基板 内部电极膜（2〜11），并且在宽度方向（Y）上从两个侧面（66,67）的距离（d11，d12）和（d21，d22）形成。

公开(公告)号：US20010012723A1

公开(公告)日：2001-08-09

申请号：US09837173

申请日：2001-04-19

Applicant: KYOSHIN KOGYO CO., LTD.

Inventor： Ryoji Tanaka

IPC: H01R031/08

CPC classification number: H01R13/2435 ,  H01R13/2492 ,  H05K3/325 ,  H05K3/3426 ,  H05K3/368 ,  H05K2201/0311 ,  H05K2201/09663 ,  H05K2201/1031 ,  H05K2201/2036 ,  Y02P70/611 ,  Y10S439/94

Abstract: A connecting terminal assembly, including a covering tape heat-sealed to a mount base so as to cover a number of connecting terminals received in recessed portions of the mount base, is mounted to a surface mounter. Each connecting terminal has two fixed-contact sections, and a central section thereof having leg portions vertically extending from inner ends of the fixed-contact sections and a major portion extending between upper ends of the leg portions. Free-contact sections extend from outer ends of the fixed-contact sections vertically of and longitudinally in an inward direction of the connecting terminal. While the covering tape is being peeled off, each of the connecting terminals received in the recessed portions of the mount base is picked up at its major portion by suction and transferred to be positioned on a first printed circuit board at a desired position and with a desired orientation, by mean of a suction nozzle of the mounter. The connecting terminal having its fixed-contact sections separated by the central section is electrically connected to conductor portions of the circuit board, without being displaced on molten solder. By pressing a second printed circuit board against the free-contact sections to flex them, electrical connection is established therebetween with a sufficient contact pressure.

Abstract translation: 连接端子组件，其包括热封到安装基座的覆盖带，以覆盖容纳在安装基座的凹部中的多个连接端子，安装到表面安装机。 每个连接端子具有两个固定接触部分，其中心部分具有从固定接触部分的内端垂直延伸的腿部和在腿部的上端之间延伸的主要部分。 自由接触部分在固定接触部分的外端部从连接端子的向内方向垂直延伸。 当覆盖带被剥离时，容纳在安装基座的凹陷部分中的每个连接端子通过抽吸在其主要部分被拾取并转移到位于期望位置的第一印刷电路板上，并且具有 通过安装器的吸嘴的平均取向。 具有由中央部分隔开的固定接触部分的连接端子电连接到电路板的导体部分，而不会在熔融焊料上移位。 通过将第二印刷电路板压靠在自由接触部分上以使它们挠曲，在它们之间建立电连接并具有足够的接触压力。

公开(公告)号：US20010008442A1

公开(公告)日：2001-07-19

申请号：US09793611

申请日：2001-02-27

Inventor： Eiichi Miyake

IPC: G03B027/42

CPC classification number: H05K1/0269 ,  G03F9/00 ,  H05K3/0082 ,  H05K2201/09509 ,  H05K2201/09663 ,  H05K2201/09918 ,  H05K2201/09927

Abstract: Each positioning mark comprises a plurality of mark elements. The mark elements are adapted to be individually determined for their respective positions and configurations. A reference point of the positioning mark is located on the basis of data obtained by determining respective positions and configurations of the mark elements.

Abstract translation: 每个定位标记包括多个标记元件。 标记元件适于根据其各自的位置和构造单独确定。 基于通过确定标记元件的相应位置和配置获得的数据来定位定位标记的参考点。

公开(公告)号：US06225571B1

公开(公告)日：2001-05-01

申请号：US09252741

申请日：1999-02-19

Applicant: Jeffrey L. Bream ,  Stephen A. Ferranti ,  Madhu Ganesa-Pillai ,  Leon Klafter ,  Alan M. Lyons ,  John Paul Mello ,  Steven J. Vargo

Inventor： Jeffrey L. Bream ,  Stephen A. Ferranti ,  Madhu Ganesa-Pillai ,  Leon Klafter ,  Alan M. Lyons ,  John Paul Mello ,  Steven J. Vargo

IPC: H05K118

CPC classification number: H05K3/341 ,  H01L23/36 ,  H01L23/3736 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0203 ,  H05K1/056 ,  H05K1/141 ,  H05K2201/066 ,  H05K2201/09663 ,  H05K2201/09809 ,  H05K2201/10166 ,  H05K2201/10969 ,  H05K2203/048 ,  Y02P70/613 ,  H01L2924/00

Abstract: The present invention provides a heatsink for use with a heat-generating electrical component. The heatsink comprises a spine having opposing sides, cooling fins extending from the spine, and a dielectric layer adhered to at least one of the opposing sides. The dielectric layer has a thermal conductivity of at least about 1 W/m° C. The heatsink may further comprise a metal layer adhered to the dielectric layer. The metal layer provides a surface to which an electric component can be adhered. The heatsink can further include a heat-generating component adhered to the metal layer. In another aspect, the heat-generating component is a surface-mount electrical component adhered to the metal layer with solder.

Abstract translation: 本发明提供一种与发热电气部件一起使用的散热器。 散热器包括具有相对侧的脊柱，从脊部延伸的冷却片，以及粘附到至少一个相对侧的电介质层。 电介质层具有至少约1W / m℃的热导率。散热器还可以包括附着到电介质层的金属层。 金属层提供可以粘附电气部件的表面。 散热器还可以包括附着在金属层上的发热部件。 在另一方面，发热部件是用焊料粘附到金属层的表面安装电子部件。