Abstract:
A device (20) for interconnecting electrical bundles, includes a plurality of pluggable connection and cross-connect cards (34 to 38) for the electrical bundles. The device further includes a “main” printed circuit (28, 28b) fitted with connectors or slots (29 to 33) designed and arranged to receive the pluggable cards, the printed circuit having a plurality of parallel tracks (46), each enabling two tracks (61 to 63, 68) or tracks starters (70 to 72) provided respectively on two distinct pluggable cards plugged in the connectors of the main printed circuit to be put to the same potential, each of the parallel tracks (46) being in contact with a respective pin (50, 150) of a plurality of connectors of the main printed circuit.
Abstract:
A power plane including a supply power pin receptacle, a first connector power pin receptacle, and a second power pin receptacle, where a first electrical resistance between the supply power pin receptacle and the first connector power pin receptacle is substantially equal to a second electrical resistance between the supply power pin receptacle and the second connector power pin receptacle.
Abstract:
An apparatus for buffering power transients in a supply power for expansion cards inserted into expansion slots on a computer motherboard. The apparatus comprises a printed circuit board, a connector on the printed circuit board, and at least one capacitor on the printed circuit board. The connector is configured to fit into one of the expansion slots on the motherboard, and comprises at least one power pin and at least one ground pin. The at least one capacitor is connected to the power and ground pins of the connector and has sufficient capacitance to buffer power transients within the supply power to the expansion slots.
Abstract:
A circuit and system for improving signal integrity in a memory system. The circuit has a transmission line having a dampening impedance between a driver and a branch point of the transmission line. The circuit also has a termination impedance having one end coupled to the transmission line between the dampening impedance and the branch point. The transmission line has branches coupled to memory module interfaces. The branches have respective lengths between the branch point and the memory module interfaces to be configured symmetrically, wherein the branch point is at a point to balance signal transmission on the branches.
Abstract:
A novel backplane interconnection system that is useful in the telecommunication and data process industries for ultra high speed backplane systems. It is capable of transmitting digital signals with bandwidths of 10 GHz and beyond. The invention provides high performance at a low cost of manufacture. It is suitable for use in a wide variety of system applications. One embodiment of the invention comprises an air dielectric and copper conductor matched impedance transmission line system that interconnects daughter cards in a conventional backplane configuration. The high speed transmission-line structure is continuous through the backplane-daughter card and return path. Such embodiment are also integrated with conventional printed circuit backplanes or be a stand-alone device.
Abstract:
An article and a method for testing the assembly of that article are disclosed. The article includes a plurality of modules, at least two of the modules are capable of being placed in two different positions in the article, each module having a correct position in the article. Each module includes an aperture at a location determined by the desired position for that module in the article. The apertures are placed such that the apertures will be aligned to form a transparent channel when the modules are arranged in a predetermined pattern with respect to one another, but not when arranged in any of the possible incorrect orders. The article can be tested for assembly errors by transmitting a test light signal into the first end and testing for light that traversed all of said first transparent channel.
Abstract:
The embodiments of the present invention relate to an improved printed circuit board having additional rows of ground vias to reduce crosstalk in the board. A printed circuit board according to one embodiment of the present invention comprises a first row of vias and a second row of vias, each having a plurality of signal vias. The circuit board also comprises a plurality of rows of vias being coupled to a ground plane between the first row of signal vias and the second row of signal vias. According to one embodiment, the plurality of rows of vias being coupled to a ground plane comprise rows of vias having different sizes. Some of the vias are designed to receive a component, while others are generally smaller and designed to provide a return current path for the signal vias.
Abstract:
A memory system includes a controller chip and a memory module coupled to the controller chip. A signal line carries a signal that traverses the signal line until reaching a termination at an end of the signal line. A clock line carries a clock signal that traverses the clock line to reach a second termination at an end of the clock line. The module includes a first memory device connected to the signal line and the clock line such that the signal and the clock signal arrive at the first memory device at substantially the same time. The module includes a second memory device connected to the signal line and the clock line such that the signal and the clock signal arrive at the second memory device at substantially the same time and after the signal and the clock signal arrive at the first memory device.
Abstract:
A first connector on a first side of a midplane circuit board may be offset from a second connector on a second side of the midplane circuit board. The first and second connectors may be substantially identical connectors, each with straight mounting contacts, to create an electrical interconnection therebetween without using a common signal via. Each side of the midplane may have the same footprint. Accordingly, substantially identical connectors may be used on both sides of the midplane circuit board.
Abstract:
A memory system includes a controller chip and a memory module coupled to the controller chip. A signal line carries a signal that traverses the signal line until reaching a termination at an end of the signal line. A clock line carries a clock signal that traverses the clock line to reach a second termination at an end of the clock line. The module includes a first memory device connected to the signal line and the clock line such that the signal and the clock signal arrive at the first memory device at substantially the same time. The module includes a second memory device connected to the signal line and the clock line such that the signal and the clock signal arrive at the second memory device at substantially the same time and after the signal and the clock signal arrive at the first memory device.