公开(公告)号：US20150103504A1

公开(公告)日：2015-04-16

申请号：US14579464

申请日：2014-12-22

Applicant: Edward Maxwell Yokley ,  Yaw Samuel Obeng

Inventor： Edward Maxwell Yokley ,  Yaw Samuel Obeng

IPC: H05K1/18

CPC classification number: H05K1/185 ,  B05D1/62 ,  B05D3/142 ,  B05D3/144 ,  B29C59/14 ,  C03C23/006 ,  C03C2218/31 ,  H05K3/284 ,  H05K2201/0104 ,  H05K2201/0195 ,  H05K2201/09872 ,  H05K2203/095

Abstract: An electronic device comprising a substrate having a component-side surface and a moisture protection film covering the component-side surface. The moisture protection film includes a first water layer bonded to component-side surface that is an activated surface, wherein the activated surface has a lower water contact angle than the substrate surface before the surface activation. The film includes a first graphed layer of a plasma-reacted first set of precursor molecules graphed to the first water layer, wherein the first water layer forms a first bonding link between the substrate surface and the reacted first set precursor molecules. The film includes a second water layer bonded to the first graphed layer. The film includes a second graphed layer of a plasma-reacted second set of precursor molecules graphed to the second water layer, wherein the second water layer forms a second bonding link between the second water layer and the reacted second set of precursor molecules.

Abstract translation: 一种电子设备，包括具有组件侧表面的基板和覆盖所述元件侧表面的防潮膜。 防潮膜包括结合到作为活化表面的组分侧表面的第一水层，其中活化表面在表面活化之前具有比衬底表面更低的水接触角。 薄膜包括第一层图形化的第一组前体分子，其绘制在第一水层上，其中第一水层形成衬底表面和反应的第一组前体分子之间的第一键合连接。 膜包括结合到第一图形层的第二水层。 薄膜包括被绘制到第二水层的等离子体反应的第二组前体分子的第二图形层，其中第二水层在第二水层和反应的第二组前体分子之间形成第二键合连接。

公开(公告)号：US20150077947A1

公开(公告)日：2015-03-19

申请号：US14556116

申请日：2014-11-29

Applicant: Cytec Industries Inc.

Inventor： Richard David Jordan, JR. ,  Thomas C. Scanlon, IV

IPC: H05K1/02 ,  H05K7/14

CPC classification number: H05K7/1427 ,  C08G18/246 ,  C08G18/4825 ,  C08G18/7664 ,  C08G18/8067 ,  C08G59/00 ,  C08G59/184 ,  C08G77/04 ,  C08L33/08 ,  C08L33/10 ,  C09D133/08 ,  C09D133/10 ,  C09D175/04 ,  C09D183/04 ,  H05K3/284 ,  H05K3/285 ,  H05K2201/09872 ,  C08G18/10 ,  C08G18/36

Abstract: Electrical circuit assemblies flood coated with polymeric flood coat compositions as described or exemplified herein are provided. The flood coat composition is characterized as having a sufficient gel time and thixotropic index as to substantially cover or encapsulate the electrical circuit assembly as a fixed mass upon cure such that the thickness of the polymeric coating on surfaces horizontal to the assembly is from 20 mils to 75 mils, and the thickness on surfaces vertical to the assembly is from 4 mils to 20 mils. Such flood coated assemblies and devices containing same are advantageous over conventional potting materials or conformal coatings because they require less material thereby reducing weight and cost, and they are able to withstand extreme environmental stresses such as from temperature and/or vibrations.

Abstract translation: 提供了如本文所述或示例的聚合物防水涂料组合物泛涂的电路组件。 泛涂层组合物的特征在于具有足够的凝胶时间和触变指数，以便在固化时基本上将电路组件覆盖或封装为固定质量，使得水平于组件的表面上的聚合物涂层的厚度为20密耳至 75密耳，垂直于组件的表面上的厚度为4密耳至20密耳。 这种包覆涂层的组件和包含其的装置优于常规灌封材料或保形涂层，因为它们需要更少的材料，从而减轻重量和成本，并且它们能够承受极端的环境应力，例如温度和/或振动。

公开(公告)号：US20150060110A1

公开(公告)日：2015-03-05

申请号：US14230639

申请日：2014-03-31

Applicant: Apple Inc.

Inventor： Nicholas G. MERZ ,  Scott A. MYERS ,  Gregory N. STEPHENS ,  Joseph C. POOLE

IPC: H05K1/02 ,  H05K3/28 ,  C23C16/50

CPC classification number: H05K1/0216 ,  C23C16/042 ,  C23C16/50 ,  H05K3/282 ,  H05K3/284 ,  H05K2201/0715 ,  H05K2201/09872 ,  H05K2201/10189 ,  H05K2201/10371

Abstract: Methods for applying a hydrophobic coating to various components within a computing device are disclosed. More specifically, a hydrophobic coating can be applied by a plasma assisted chemical vapor deposition (PACVD) process to a fully assembled circuit board. Frequently, a fully assembled circuit board can have various components such as electromagnetic interference (EMI) shields which cover water sensitive electronics. A method is disclosed for perforating portions of the EMI shields that overlay the water sensitive electronics. Methods of sealing board to board connectors are also disclosed. In one embodiment solder leads of the board to board connectors can be covered by a silicone seal.

Abstract translation: 公开了将疏水涂层施加到计算装置内的各种部件的方法。 更具体地，疏水涂层可以通过等离子体辅助化学气相沉积（PACVD）方法施加到完全组装的电路板上。 通常，完全组装的电路板可以具有各种部件，例如覆盖水敏电子器件的电磁干扰（EMI）屏蔽。 公开了一种用于穿透覆盖水敏电子器件的EMI屏蔽部分的穿孔方法。 还公开了板对板连接器的密封方法。 在一个实施例中，板对板连接器的焊接引线可以被硅树脂密封覆盖。

公开(公告)号：US08769811B2

公开(公告)日：2014-07-08

申请号：US12611376

申请日：2009-11-03

Applicant: Josh Wurzel ,  Shawn Robert Gettemy ,  Ahmad Al-Dahle ,  Carlin James Vieri ,  Wei Yao

Inventor： Josh Wurzel ,  Shawn Robert Gettemy ,  Ahmad Al-Dahle ,  Carlin James Vieri ,  Wei Yao

IPC: H05K3/30

CPC classification number: H05K9/0024 ,  H01L23/552 ,  H01L2924/0002 ,  H05K1/0218 ,  H05K1/181 ,  H05K3/284 ,  H05K9/0084 ,  H05K2201/09872 ,  H05K2201/10689 ,  Y10T29/49117 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49146 ,  Y10T156/1052 ,  H01L2924/00

Abstract: An electronic circuit component is provided with shielding for electromagnetic interference (“EMI”) by covering at least part of the component with a layer of electrical insulation that conforms to the shape of the surface to which the insulation is applied. At least part of the surface of the insulation is then covered by a layer of EMI shielding that conforms to the shape of the surface of the insulation to which the shielding is applied.

Abstract translation: 通过用符合施加绝缘层的表面形状的电绝缘层覆盖部件的至少一部分，电子电路部件具有屏蔽电磁干扰（“EMI”）。 绝缘体表面的至少一部分然后被符合屏蔽层所应用绝缘层表面形状的EMI屏蔽层覆盖。

公开(公告)号：US08718701B2

公开(公告)日：2014-05-06

申请号：US13355161

申请日：2012-01-20

Applicant: Fan Li ,  Tong Liu

Inventor： Fan Li ,  Tong Liu

IPC: H04M1/00

CPC classification number: H05K1/0218 ,  H04M1/0277 ,  H05K3/284 ,  H05K2201/0715 ,  H05K2201/09872 ,  H05K2203/1311 ,  Y10T29/49124

Abstract: A mobile wireless communications device may include a portable housing, a printed circuit board (PCB) carried by the portable housing, and at least one electronic component carried by PCB and extending upwardly therefrom. The mobile wireless communications device may also include a conformable, shape-retaining film being vacuum formed onto the at least one electronic component and may include a peripheral edge secured to the PCB and a body portion conforming to the at least one electronic component.

Abstract translation: 移动无线通信设备可以包括便携式外壳，由便携式外壳承载的印刷电路板（PCB）以及由PCB承载并从其向上延伸的至少一个电子部件。 移动无线通信设备还可以包括真空形成在至少一个电子部件上的适形的形状保持膜，并且可以包括固定到PCB的外围边缘和符合至少一个电子部件的主体部分。

公开(公告)号：US20130286609A1

公开(公告)日：2013-10-31

申请号：US13460400

申请日：2012-04-30

Applicant: Nicholas Merz

Inventor： Nicholas Merz

IPC: H05K7/06 ,  H05K3/00 ,  B23K1/20 ,  B05D3/06 ,  B23K31/02 ,  H05K3/12 ,  H05K1/00 ,  B05D3/10

CPC classification number: H05K1/0216 ,  C23C14/086 ,  C23C14/185 ,  H05K3/284 ,  H05K2201/09872

Abstract: Systems and methods for shielding circuitry from interference with conformal coating are disclosed. Systems having conformal EMI shields according to embodiments are provided by applying insulating and conductive layers to areas of a printed circuit board (PCB). This produces systems that may be thinner and also smaller in surface area, and that may be suitable as part of electronic devices.

Abstract translation: 公开了用于屏蔽电路不受保形涂层干扰的系统和方法。 通过将绝缘和导电层施加到印刷电路板（PCB）的区域来提供具有根据实施例的共形EMI屏蔽的系统。 这产生的系统可以更薄并且表面积也更小，并且可以适合作为电子设备的一部分。

公开(公告)号：US20130190060A1

公开(公告)日：2013-07-25

申请号：US13355161

申请日：2012-01-20

Applicant: Fan Li ,  Tong Liu

Inventor： Fan Li ,  Tong Liu

IPC: H04W88/02 ,  H05K3/00

CPC classification number: H05K1/0218 ,  H04M1/0277 ,  H05K3/284 ,  H05K2201/0715 ,  H05K2201/09872 ,  H05K2203/1311 ,  Y10T29/49124

Abstract: A mobile wireless communications device may include a portable housing, a printed circuit board (PCB) carried by the portable housing, and at least one electronic component carried by PCB and extending upwardly therefrom. The mobile wireless communications device may also include a conformable, shape-retaining film being vacuum formed onto the at least one electronic component and may include a peripheral edge secured to the PCB and a body portion conforming to the at least one electronic component.

Abstract translation: 移动无线通信设备可以包括便携式外壳，由便携式外壳承载的印刷电路板（PCB）以及由PCB承载并从其向上延伸的至少一个电子部件。 移动无线通信设备还可以包括真空形成在至少一个电子部件上的适形的形状保持膜，并且可以包括固定到PCB的外围边缘和符合至少一个电子部件的主体部分。

公开(公告)号：US08486533B2

公开(公告)日：2013-07-16

申请号：US12696328

申请日：2010-01-29

Applicant: Dylan Joseph Boday ,  Joseph Kuczynski ,  Mark Anthony Marnell ,  Robert Ernst Meyer, III ,  Timothy Jerome Tofil

Inventor： Dylan Joseph Boday ,  Joseph Kuczynski ,  Mark Anthony Marnell ,  Robert Ernst Meyer, III ,  Timothy Jerome Tofil

IPC: B05D1/02 ,  B05D1/18 ,  B05D3/02 ,  B32B15/04 ,  B32B25/20 ,  B32B27/30 ,  B32B27/38 ,  C08G77/30

CPC classification number: H05K3/284 ,  B32B15/08 ,  B32B27/30 ,  B32B27/38 ,  C08G77/395 ,  C08K5/5313 ,  C09D5/086 ,  C09D7/63 ,  H05K3/285 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2201/09872 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T428/31504 ,  Y10T428/31529 ,  Y10T428/31663 ,  Y10T428/31678 ,  Y10T428/31699 ,  Y10T428/31935

Abstract: An apparatus includes an electronic component mounted on a substrate and metal conductors electrically connecting the electronic component. A conformal coating overlies the metal conductors and comprises a polymer into which a phosphine compound is impregnated and/or covalently bonded. Accordingly, the conformal coating is able to protect the metal conductors from corrosion caused by sulfur components (e.g., elemental sulfur, hydrogen sulfide, and/or sulfur oxides) in the air. That is, the phosphine compound in the polymer reacts with any corrosion inducing sulfur component in the air and prevents the sulfur component from reacting with the underlying metal conductors. Preferably, the phosphine compound in the polymer does not react with other components in the air (e.g., carbon dioxide) which would otherwise deplete its availability for the target reaction. The phosphine compound may be rendered completely non-volatile by covalently bonding it directly into the polymer backbone.

Abstract translation: 一种装置包括安装在基板上的电子部件和电连接电子部件的金属导体。 保形涂层覆盖在金属导体上并且包含聚合物，磷化合物被浸渍和/或共价键合到该聚合物中。 因此，保形涂层能够保护金属导体免受空气中的硫成分（例如元素硫，硫化氢和/或硫氧化物）引起的腐蚀。 也就是说，聚合物中的膦化合物与空气中的任何腐蚀诱导硫成分反应，并防止硫成分与下面的金属导体反应。 优选地，聚合物中的膦化合物不与空气中的其它组分（例如二氧化碳）反应，否则其将耗尽其用于目标反应的可用性。 膦化合物可以通过将其直接共价键合到聚合物主链中而使其完全不挥发。

公开(公告)号：US20130154058A1

公开(公告)日：2013-06-20

申请号：US13327971

申请日：2011-12-16

Applicant: Dylan J. Boday ,  Joseph Kuczynski ,  Timothy J. Tofil

Inventor： Dylan J. Boday ,  Joseph Kuczynski ,  Timothy J. Tofil

IPC: C07F9/50 ,  C09D7/12 ,  H01L27/02

CPC classification number: C07F9/5022 ,  C09D7/62 ,  H01C1/14 ,  H01C1/16 ,  H01L23/295 ,  H01L27/016 ,  H01L28/20 ,  H01L2924/0002 ,  H05K3/284 ,  H05K3/285 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2201/09872 ,  H05K2201/10636 ,  Y02P70/611 ,  H01L2924/00

Abstract: A high surface area filler, a conformal coating composition, and an apparatus. The high surface area filler comprises an amorphous silicon dioxide powder and a phosphine compound bonded to the amorphous silicon dioxide powder. The conformal coating composition comprises a conformal coating and the high surface area filler. The apparatus includes an electronic component mounted on a substrate and metal conductors electrically connecting the electronic component. The conformal coating composition overlies the metal conductors and comprises a conformal coating and the high surface area filler. Accordingly, the conformal coating composition is able to protect the metal conductors from corrosion caused by sulfur components (e.g., elemental sulfur, hydrogen sulfide, and/or sulfur oxides) in the air.

Abstract translation: 高表面积填料，保形涂料组合物和装置。 高表面积填料包括无定形二氧化硅粉末和结合到无定形二氧化硅粉末的膦化合物。 保形涂料组合物包含保形涂层和高表面积填料。 该装置包括安装在基板上的电子部件和电连接电子部件的金属导体。 保形涂层组合物覆盖在金属导体上并且包括保形涂层和高表面积填料。 因此，保形涂料组合物能够保护金属导体免受空气中硫成分（例如元素硫，硫化氢和/或硫氧化物）引起的腐蚀。

公开(公告)号：US20130114228A1

公开(公告)日：2013-05-09

申请号：US13631156

申请日：2012-09-28

Applicant: Apple Inc.

Inventor： Nicholas G. Merz ,  Hong Wang ,  Michael M. Nikkhoo ,  Dennis R. Pyper ,  Christopher Matthew Werner

IPC: H05K9/00 ,  H05K3/30 ,  H05K7/06

CPC classification number: H05K1/0218 ,  H05K3/284 ,  H05K2201/0317 ,  H05K2201/09618 ,  H05K2201/09872 ,  H05K2201/09909 ,  H05K2201/10371 ,  H05K2201/2018 ,  Y10T29/4913 ,  Y10T29/49146

Abstract: Methods and apparatuses are disclosed for fabricating a printed circuit board (PCB) having electromagnetic interference (EMI) shielding and also having reduced volume over conventional frame-and-shield approaches. Some embodiments include fabricating the PCB by mounting an integrated circuit to the PCB, outlining an area corresponding to the integrated circuit with a number of grounded vias, selectively applying an insulating layer over the PCB such that at least one of the grounded vias are exposed, and selectively applying a conductive layer over the PCB such that the conductive layer covers at least a portion of the integrated circuit and such that the conductive layer is coupled to the at least one of the grounded vias that are exposed.

Abstract translation: 公开了用于制造具有电磁干扰（EMI）屏蔽的印刷电路板（PCB）的方法和装置，并且与传统的框架 - 屏蔽方法相比也具有减小的体积。 一些实施例包括通过将集成电路安装到PCB来制造PCB，通过多个接地通孔来概括对应于集成电路的区域，在PCB上选择性地施加绝缘层，使得接地通孔中的至少一个暴露， 以及选择性地在所述PCB上施加导电层，使得所述导电层覆盖所述集成电路的至少一部分，并且使得所述导电层耦合到暴露的所述接地通孔中的至少一个。