公开(公告)号：US11751336B2

公开(公告)日：2023-09-05

申请号：US17994551

申请日：2022-11-28

Applicant: LUMET TECHNOLOGIES LTD.

Inventor： Benzion Landa ,  Haim Touitou ,  Stanislav Thygelbaum ,  Naomi Elfassy

IPC: H05K3/20 ,  H05K3/38 ,  B41M1/12 ,  H01L31/0224 ,  H05K3/34 ,  H05K1/03 ,  H05K1/09 ,  H01L31/0216 ,  H01L31/0392 ,  H01L31/20 ,  H05K1/16

CPC classification number: H05K3/207 ,  B41M1/12 ,  H01L31/02167 ,  H01L31/022425 ,  H01L31/022433 ,  H01L31/03926 ,  H01L31/206 ,  H05K1/0393 ,  H05K1/092 ,  H05K3/3485 ,  H05K3/386 ,  H05K1/165 ,  H05K2201/0195 ,  H05K2201/035 ,  H05K2201/0338 ,  H05K2201/0391 ,  H05K2201/10098 ,  H05K2203/0139 ,  H05K2203/1105 ,  H05K2203/1131 ,  H05K2203/1476 ,  H05K2203/1545 ,  Y02E10/50

Abstract: An apparatus is disclosed for transferring a pattern of a composition containing particles of an electrically conductive material and a thermally activated adhesive from a surface of a flexible web to a surface of a substrate. The apparatus comprises:



respective drive mechanisms for advancing the web and the substrate to a nip through which the web and the substrate pass at the same time and where a pressure roller acts to press the surfaces of the web and the substrate against one another,
a heating station for heating at least one of the web and the substrate prior to, or during, passage through the nip, to a temperature at which the adhesive in the composition is activated,
a cooling station for cooling the web after passage through the nip, and
a separating device for peeling the web away from the substrate after passage through the cooling station, to leave the pattern of composition adhered to the surface of the substrate.

公开(公告)号：US11646246B2

公开(公告)日：2023-05-09

申请号：US16461970

申请日：2017-11-17

Applicant: SAMTEC INC.

Inventor： Tim Mobley ,  Roupen Leon Keusseyan

IPC: H01L29/40 ,  H01L29/06 ,  H01L23/48 ,  H01L21/00 ,  H01K3/10 ,  H01L23/15 ,  H01L23/498 ,  H05K3/40 ,  H05K3/46 ,  H05K3/10 ,  H01L21/48 ,  C03C4/14 ,  C03C8/04 ,  C03C8/18 ,  H01B1/22 ,  H05K1/16 ,  H05K1/03 ,  H05K1/09 ,  H05K3/42 ,  H05K3/00 ,  H01L23/367

CPC classification number: H01L23/481 ,  C03C4/14 ,  C03C8/04 ,  C03C8/18 ,  H01B1/22 ,  H01L21/486 ,  H01L23/15 ,  H01L23/49827 ,  H01L23/49883 ,  H05K3/101 ,  H05K3/102 ,  H05K3/107 ,  H05K3/4061 ,  H05K3/4076 ,  H05K3/4614 ,  H05K3/4629 ,  C03C2204/00 ,  C03C2205/00 ,  H01L23/367 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/49838 ,  H05K1/0306 ,  H05K1/095 ,  H05K1/097 ,  H05K1/16 ,  H05K1/162 ,  H05K1/167 ,  H05K3/0029 ,  H05K3/403 ,  H05K3/423 ,  H05K2201/0272 ,  H05K2201/0391 ,  H05K2201/068 ,  H05K2201/09254 ,  H05K2201/09836 ,  H05K2201/09854 ,  H05K2201/1006 ,  H05K2203/0182 ,  H05K2203/107 ,  H05K2203/1126 ,  H05K2203/1131 ,  H05K2203/1461 ,  H05K2203/1476

Abstract: Pastes are disclosed that are configured to coat a passage of a substrate. When the paste is sintered, the paste becomes electrically conductive so as to transmit electrical signals from a first end of the passage to a second end of the passage that is opposite the first end of the passage. The metallized paste contains a lead-free glass frit, and has a coefficient of thermal expansion sufficiently matched to the substrate so as to avoid cracking of the sintered paste, the substrate, or both, during sintering.

公开(公告)号：US20180289946A1

公开(公告)日：2018-10-11

申请号：US15765987

申请日：2016-10-28

Applicant: ECOLE POLYTECHNIQUE FEDERALE DE LAUSANNE (EPFL)

Inventor： Arthur HIRSCH ,  Hadrien MICHAUD ,  Ivan Rusev MINEV ,  Stephanie P. LACOUR

IPC: A61N1/04 ,  A61N1/05 ,  H01B1/02 ,  H05K1/02 ,  H05K1/09 ,  A61B5/0408

CPC classification number: A61N1/0496 ,  A61B5/0408 ,  A61B5/0478 ,  A61B2562/125 ,  A61B2562/166 ,  A61N1/0456 ,  A61N1/05 ,  C22C1/005 ,  C22C5/02 ,  C22C28/00 ,  H01B1/02 ,  H05K1/0283 ,  H05K1/09 ,  H05K2201/0391 ,  H05K2203/128

Abstract: A method for manufacturing an electrical conductor includes: depositing a solid metal conductive layer or film on a substrate 30; depositing a liquid metal on the solid layer; and allowing the liquid metal and the solid layer 40 to alloy by diffusion of the liquid metal into the solid layer or film so as to form a solid conductive layer or film of the alloy; as well as allowing the liquid metal to further infiltrate the alloy so as to form percolating paths and/or droplets of the liquid metal in the the solid conductive layer or film, thus forming a biphasic conductive layer.

公开(公告)号：US09996787B2

公开(公告)日：2018-06-12

申请号：US14781411

申请日：2014-03-31

Applicant: Heraeus Deutschland GmbH & Co. KG

Inventor： Frank Puttkammer

IPC: G06F17/00 ,  G06K19/073 ,  B42D25/29 ,  B42D25/00 ,  B32B27/00 ,  H05K1/09 ,  H05K1/03 ,  B42D25/373 ,  G06K7/10 ,  G06Q30/00 ,  H05K1/11 ,  H05K3/00 ,  B41M1/10 ,  B41M1/12 ,  B41M3/00 ,  B41M3/14 ,  H05K1/02 ,  H05K3/40 ,  H05K3/46

CPC classification number: G06K19/07345 ,  B32B27/00 ,  B41M1/10 ,  B41M1/12 ,  B41M3/006 ,  B41M3/14 ,  B42D25/00 ,  B42D25/29 ,  B42D25/373 ,  B42D2033/10 ,  B42D2033/22 ,  B42D2033/30 ,  B42D2033/32 ,  B42D2033/46 ,  G06K7/10118 ,  G06Q30/0185 ,  H05K1/0268 ,  H05K1/0275 ,  H05K1/0293 ,  H05K1/0298 ,  H05K1/0333 ,  H05K1/0386 ,  H05K1/095 ,  H05K1/115 ,  H05K3/0064 ,  H05K3/4053 ,  H05K3/4644 ,  H05K3/4688 ,  H05K2201/0329 ,  H05K2201/0391

Abstract: The invention relates to a layered structure (10) comprising the following layers: a) a first substrate layer (2), wherein the first substrate layer (2) has a first surface (4) and a second surface (6) and is configured as a dielectric; b) a first electrically conductive layer (8) which overlaps at least in part the first substrate layer (2) at least on the first surface (4) of the first substrate layer (2), wherein the first electrically conductive layer (8) comprises an electrically conductive polymer, wherein the first electrically conductive layer (8) has at least one first part region (18) and at least one further part region (20), wherein the at least one first part region (18) has a higher bonding strength to the substrate layer (2) than to the at least one further part region (20).

公开(公告)号：US09930773B2

公开(公告)日：2018-03-27

申请号：US15188453

申请日：2016-06-21

Applicant: Microsoft Technology Licensing, LLC

Inventor： James David Holbery ,  Siyuan Ma ,  Michael David Dickey

IPC: H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K1/09 ,  H05K3/10 ,  H05K3/46 ,  G06F1/16

CPC classification number: H05K1/0272 ,  G06F1/1613 ,  H01R12/59 ,  H01R12/77 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/03 ,  H05K1/092 ,  H05K1/148 ,  H05K3/10 ,  H05K3/1275 ,  H05K3/361 ,  H05K3/4644 ,  H05K2201/032 ,  H05K2201/0338 ,  H05K2201/0391 ,  H05K2201/055 ,  H05K2201/09009 ,  H05K2201/09736 ,  H05K2203/0776

Abstract: Examples are provided for a flexible circuit element including a flexible insulating support structure, a solid metal trace extending at least partially between a first connector and a second connector on the flexible insulating support structure, and a liquid metal conductor disposed in contact with the solid metal trace in a region of the trace configured to repeatedly flex when installed in a device.

公开(公告)号：US20180070440A1

公开(公告)日：2018-03-08

申请号：US15560439

申请日：2016-03-17

Applicant: STANLEY ELECTRIC CO., LTD.

Inventor： Akihiko HANYA

IPC: H05K1/02

CPC classification number: H05K1/0231 ,  H01L2224/16225 ,  H05K1/0265 ,  H05K1/095 ,  H05K1/097 ,  H05K3/125 ,  H05K3/1275 ,  H05K3/1283 ,  H05K3/3494 ,  H05K2201/0108 ,  H05K2201/0391 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2203/1131 ,  H05K2203/1581

Abstract: An electronic device capable of supplying a large current to a circuit pattern containing conductive nanoparticles includes a substrate, a region provided on the substrate, configured to mount an electronic component therein, a first circuit pattern placed within the region and electrically connected to the electronic component, a second circuit pattern connected to the first circuit pattern and configured to supply current to the first circuit pattern from outside of the region. At least a part of the first circuit pattern includes a layer obtained by sintering conductive nanosized particles with a diameter of less than 1 μm. The second circuit pattern is thicker than the first circuit pattern.

公开(公告)号：US20180053736A1

公开(公告)日：2018-02-22

申请号：US15795511

申请日：2017-10-27

Applicant: ROHM CO., LTD.

Inventor： Takuma SHIMOICHI ,  Yasuhiro KONDO

IPC: H01L23/66 ,  H01L49/02 ,  H01L27/01

CPC classification number: H01L23/66 ,  H01L27/016 ,  H01L28/10 ,  H01L28/20 ,  H01L28/60 ,  H01L2223/6672 ,  H01L2924/0002 ,  H05K1/0289 ,  H05K1/029 ,  H05K1/162 ,  H05K1/165 ,  H05K1/167 ,  H05K3/107 ,  H05K3/146 ,  H05K2201/0317 ,  H05K2201/0338 ,  H05K2201/0376 ,  H05K2201/0391 ,  H05K2201/09263 ,  H05K2201/09981 ,  H05K2201/10181 ,  H05K2203/0353 ,  H05K2203/1338 ,  H01L2924/00

Abstract: A chip part includes a substrate, a first electrode and a second electrode which are formed apart from each other on the substrate and a circuit network which is formed between the first electrode and the second electrode. The circuit network includes a first passive element including a first conductive member embedded in a first trench formed in the substrate and a second passive element including a second conductive member formed on the substrate outside the first trench.

公开(公告)号：US09854687B2

公开(公告)日：2017-12-26

申请号：US14923034

申请日：2015-10-26

Applicant: FINISAR CORPORATION

Inventor： Maziar Amirkiai ,  Yunpeng Song ,  Hongyu Deng

IPC: H05K3/46 ,  H05K3/30 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K3/4682 ,  H05K1/0242 ,  H05K1/113 ,  H05K3/303 ,  H05K3/4667 ,  H05K3/467 ,  H05K3/4688 ,  H05K2201/0391 ,  H05K2201/094 ,  H05K2201/09727 ,  H05K2201/09736 ,  H05K2201/10121

Abstract: This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to header subassemblies and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a header subassembly that can include: a multi-layer substrate with a bottom layer, a top layer having top thin film signal lines, and one or more intermediate layers having thick film traces between the top layer and the bottom layer, the thick film traces electrically coupled to the top thin film signal lines; and optoelectronic components positioned over the multi-layer substrate and electrically coupled with the signal lines.

公开(公告)号：US09706668B2

公开(公告)日：2017-07-11

申请号：US14921633

申请日：2015-10-23

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Da-Hee Kim ,  Sung-Won Jeong ,  Gi-Ho Han

IPC: H05K7/20 ,  H05K3/40 ,  H05K1/02 ,  H01L23/473 ,  H05K3/00 ,  H05K3/42 ,  H05K3/46

CPC classification number: H05K3/4038 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15311 ,  H05K1/0204 ,  H05K1/0206 ,  H05K3/0035 ,  H05K3/0097 ,  H05K3/423 ,  H05K3/4614 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/0379 ,  H05K2201/0391 ,  H05K2203/0723 ,  H05K2203/1476 ,  H05K2203/1536 ,  H01L2924/00014

Abstract: A printed circuit board, an electronic module and a method of manufacturing the printed circuit board are provided. The printed circuit board includes a plurality of insulation layers, metal layers formed on the plurality of insulation layers, a via formed for interlayer electrical connection of the metal layers, a trench penetrating the insulation layers, and a heat-transfer structure formed in the trench.

公开(公告)号：US09693452B2

公开(公告)日：2017-06-27

申请号：US13536201

申请日：2012-06-28

Applicant: Aaron B. Konvisser ,  Mohammad Ali Mockarram-Dorri ,  Pasi Laine

Inventor： Aaron B. Konvisser ,  Mohammad Ali Mockarram-Dorri ,  Pasi Laine

IPC: G06F3/041 ,  H05K1/09 ,  H05K1/02 ,  G06F1/16 ,  H04M1/02

CPC classification number: H05K1/09 ,  G06F1/1626 ,  G06F1/1656 ,  G06F3/041 ,  G06F2203/04102 ,  G06F2203/04103 ,  H04M1/0202 ,  H04M2250/22 ,  H05K1/028 ,  H05K2201/0326 ,  H05K2201/0391 ,  H05K2201/0979 ,  Y10T29/4913

Abstract: An apparatus including a substrate; at least one conductive path extending over the substrate and including a first portion of indium tin oxide connected in electrical series to a second portion of a different conductor.