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    Electronic assembly
    172.
    发明授权
    Electronic assembly 有权
    电子组装

    公开(公告)号：US09538655B2

    公开(公告)日：2017-01-03

    申请号：US14460357

    申请日：2014-08-15

    Applicant: HTC Corporation

    Inventor： Hsin-Chih Liu ,  Ying-Yen Cheng ,  Yu-Jing Liao

    IPC: H05K1/09 ,  H05K1/11 ,  H05K1/14 ,  H05K3/32 ,  H05K3/36 ,  H05K1/02 ,  H05K1/00

    CPC classification number: H05K1/118 ,  H05K1/095 ,  H05K1/11 ,  H05K1/147 ,  H05K3/323 ,  H05K3/368 ,  H05K2201/058 ,  H05K2201/09409

    Abstract: An electronic assembly includes an electronic module, a rigid board, a first flexible board, a second flexible board and a conductive adhesive layer. The first flexible board extends from the electronic module and has a first connection end and a first pad arrangement at the first connection end. The first pad arrangement has a plurality of first pads. The second flexible board is connected to the rigid board and has a second connection end and a second pad arrangement at the second connection end. The second pad arrangement has a plurality of second pads. The first pads are structurally and electrically connected to the second pads through the conductive adhesive layer.

    Abstract translation: 电子组件包括电子模块，刚性板，第一柔性板，第二柔性板和导电粘合剂层。 第一柔性板从电子模块延伸，并且在第一连接端具有第一连接端和第一焊盘装置。 第一垫排列具有多个第一垫。 第二柔性板连接到刚性板，并且在第二连接端具有第二连接端和第二垫布置。 第二垫布置具有多个第二垫。 第一焊盘通过导电粘合剂层在结构上和电连接到第二焊盘。

    Wireless communication terminal
    174.
    发明授权
    Wireless communication terminal 有权
    无线通信终端

    公开(公告)号：US09379758B2

    公开(公告)日：2016-06-28

    申请号：US14505348

    申请日：2014-10-02

    Applicant: Sony Corporation

    Inventor： Kenichiro Kodama

    IPC: H01M10/00 ,  H04B1/3827 ,  H01M10/48 ,  H01M2/10 ,  H04W88/06

    CPC classification number: H04B1/385 ,  G04G17/04 ,  G04R20/26 ,  G04R60/00 ,  G06F1/163 ,  G06F1/1698 ,  H01M2/1022 ,  H01M10/48 ,  H01Q1/243 ,  H01Q1/273 ,  H01Q1/48 ,  H01Q1/52 ,  H01Q5/321 ,  H01Q21/28 ,  H04W88/06 ,  H05K1/147 ,  H05K2201/058

    Abstract: A wireless communication apparatus, includes: a second circuit board; a wireless communication processing circuit accommodated in the second circuit board; a first signal line that connects a first ground potential portion of the first circuit board with a first antenna feed point of the wireless communication processing circuit, wherein the first signal line and the first ground potential portion are configured to operate as a first antenna; a second signal line that connects the first circuit board with the second circuit board and is configured to convey a baseband signal; and a circuit element that is connected to the second signal line and is configured to block RF signals that are sent and received by the wireless communication processing circuit.

    Abstract translation: 一种无线通信装置，包括：第二电路板; 容纳在第二电路板中的无线通信处理电路; 第一信号线，其将所述第一电路板的第一接地电位部分与所述无线通信处理电路的第一天线馈电点连接，其中，所述第一信号线和所述第一接地电位部分被配置为用作第一天线; 第二信号线，其将所述第一电路板与所述第二电路板连接并且被配置为传送基带信号; 以及电路元件，其连接到所述第二信号线，并且被配置为阻止由所述无线通信处理电路发送和接收的RF信号。

    SIGNAL TRANSMISSION COMPONENT AND ELECTRONIC DEVICE
    175.
    发明申请
    SIGNAL TRANSMISSION COMPONENT AND ELECTRONIC DEVICE 有权
    信号传输组件和电子设备

    公开(公告)号：US20160064793A1

    公开(公告)日：2016-03-03

    申请号：US14938881

    申请日：2015-11-12

    Applicant: Murata Manufacturing Co., Ltd.

    Inventor： Kuniaki YOSUI

    IPC: H01P3/08

    CPC classification number: H01P3/08 ,  H01L23/12 ,  H01L23/66 ,  H01L2924/0002 ,  H01P3/085 ,  H01P5/028 ,  H05K1/0251 ,  H05K1/0253 ,  H05K1/118 ,  H05K1/147 ,  H05K2201/0191 ,  H05K2201/058 ,  H05K2201/0919 ,  H05K2201/09445 ,  H05K2201/09727 ,  H05K2201/09845 ,  H05K2201/10189 ,  H01L2924/00

    Abstract: A signal transmission cable as a signal transmission component includes a laminate including a first thin portion on one of the opposite ends in a first direction and a second thin portion on the other end in the first direction. A portion between the first thin portion and the second thin portion in the laminate is a main line portion. The thickness of the first and second thin portions is thinner than the thickness of the main line portion. The surface on one end in the thickness direction of the laminate defined by the main line portion and the first and second thin portions is a continuous flat surface. A connector for external connection is arranged on the surfaces of the first and second thin portions, on the sides in which each of the thin portions and the main line portion have a difference in level.

    Abstract translation: 作为信号传输部件的信号传输电缆包括层压体，其包括在第一方向上的相对端中的一个上的第一薄部分和在第一方向上的另一端的第二薄部分。 层叠体中的第一薄部分和第二薄部分之间的部分是主线部分。 第一和第二薄部分的厚度比主线部分的厚度薄。 由主线部分和第一和第二薄部分限定的层压体的厚度方向上的一端的表面是连续的平坦表面。 用于外部连接的连接器布置在第一和第二薄部分的表面上，其中每个薄部分和主线部分具有水平差。

    CABLE EXIT METHODS FOR PCIE CARDS
    177.
    发明申请
    CABLE EXIT METHODS FOR PCIE CARDS 审中-公开
    电缆出线方法PCIE卡

    公开(公告)号：US20140087570A1

    公开(公告)日：2014-03-27

    申请号：US13624534

    申请日：2012-09-21

    Applicant: LSI CORPORATION

    Inventor： Jason Stuhlsatz ,  Gregory Shogan ,  Lakshmana Anupindi ,  Patrick Haverty

    IPC: H01R12/75

    CPC classification number: H01R12/75 ,  H01R12/716 ,  H01R13/56 ,  H05K1/02 ,  H05K2201/058 ,  H05K2201/09145 ,  H05K2201/10356

    Abstract: The present disclosure is directed to an apparatus configured for providing a plurality of exit routes to a single type of cable. The apparatus includes a board configured to have a notch. The notch is dimensioned to have a first predetermined distance from a lowest edge of the notch to a pin A1 location on the board and a second predetermined distance from an edge of the board to the pin A1 location. The apparatus also includes a plurality of connectors configured for receiving a cable of the plurality of the single type of cable. Each cable is inserted into a respective connector, and each cable exits the board through the notch. The cable may exit the board through a plurality of routes without requiring changes to the dimension of the board or placement of the connectors.

    Abstract translation: 本公开涉及一种被配置为向单一类型的电缆提供多个退出路线的装置。 该装置包括配置成具有凹口的板。 凹口的尺寸被设计成具有从凹口的最低边缘到板上的销A1位置的第一预定距离以及距离板的边缘到销A1位置的第二预定距离。 该设备还包括多个连接器，其被配置为接收多个单一类型的电缆的电缆。 每个电缆插入到相应的连接器中，并且每个电缆通过凹口离开电路板。 电缆可以通过多条路线离开电路板，而不需要改变电路板的尺寸或连接器的放置。

    IMPLEMENTING INTERLEAVED-DIELECTRIC JOINING OF MULTI-LAYER LAMINATES
    178.
    发明申请
    IMPLEMENTING INTERLEAVED-DIELECTRIC JOINING OF MULTI-LAYER LAMINATES 审中-公开
    实施多层叠层的交互式电介质接合

    公开(公告)号：US20130221068A1

    公开(公告)日：2013-08-29

    申请号：US13860374

    申请日：2013-04-10

    Applicant: International Business Machines Corporation

    Inventor： Philip R. Germann ,  Mark J. Jeanson

    IPC: B23K31/00 ,  B32B37/00

    CPC classification number: B23K31/00 ,  B23K20/04 ,  B23K2103/16 ,  B32B37/0076 ,  B32B43/00 ,  B32B2457/08 ,  H05K3/328 ,  H05K3/368 ,  H05K3/4691 ,  H05K2201/058 ,  H05K2201/09109

    Abstract: A method and apparatus are provided for implementing interleaved-dielectric joining of multi-layer laminates. First and second multi-layer laminates are provided, each having with a laminated portion and an unlaminated portion. The first and second multi-layer laminates are joined together at the unlaminated portions by interleaving a plurality of dielectric layers of the first and second multi-layer laminates. Respective conductors carried by adjacent dielectric layers are connected. The interleaved unlaminated portions are laminated together with heat and pressure, to create a larger laminate of the joined first and second multi-layer laminates.

    Abstract translation: 提供了一种用于实现多层层压体的交错电介质接合的方法和装置。 提供第一和第二多层层叠体，每层具有层压部分和未层压部分。 第一和第二多层层叠体通过交织第一和第二多层层压体的多个介电层而在未层压部分连接在一起。 连接由相邻电介质层承载的各导线。 交织的未层压部分通过热和压力层压在一起，以形成接合的第一和第二多层层压体的较大层压体。

    Display device with bended signal transmission structure and method for manufacture thereof
    179.
    发明授权
    Display device with bended signal transmission structure and method for manufacture thereof 有权
    具有弯曲信号传输结构的显示装置及其制造方法

    公开(公告)号：US08520161B2

    公开(公告)日：2013-08-27

    申请号：US12205336

    申请日：2008-09-05

    Applicant: Jui-Lin Lai ,  Che-Chih Chang ,  Chih-Chung Chao

    Inventor： Jui-Lin Lai ,  Che-Chih Chang ,  Chih-Chung Chao

    IPC: G02F1/1333 ,  G02F1/1345

    CPC classification number: H05K5/0017 ,  G02F1/13338 ,  G02F1/13452 ,  G02F2001/133612 ,  H05K1/147 ,  H05K1/189 ,  H05K3/363 ,  H05K2201/053 ,  H05K2201/056 ,  H05K2201/058

    Abstract: This invention provides a display device and the assembly method thereof. The display device includes a first electronic module and a second electronic module partly overlapping each other. The first electronic module includes a first signal transmission unit with one side extending to form a first extension section. The second electronic module includes a second signal transmission unit partly overlapping the first signal transmission unit and having a side extending to form a first connection section. The first extension section overlaps and is electrically connected to the first connection section. Part of the overlapping first extension section and first connection section are bent to partly overlap the second signal transmission unit. Thus the second signal transmission unit is able to accept and to transmit signals via the first signal transmission unit of the first electronic device.

    Abstract translation: 本发明提供一种显示装置及其组装方法。 显示装置包括第一电子模块和彼此部分重叠的第二电子模块。 第一电子模块包括第一信号传输单元，其一侧延伸以形成第一延伸部分。 第二电子模块包括与第一信号传输单元部分重叠并且具有延伸以形成第一连接部分的一侧的第二信号传输单元。 第一延伸部分重叠并且电连接到第一连接部分。 重叠的第一延伸部分和第一连接部分的一部分被弯曲以部分地与第二信号传输单元重叠。 因此，第二信号传输单元能够经由第一电子设备的第一信号传输单元接收和发送信号。

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