公开(公告)号：US08808837B2

公开(公告)日：2014-08-19

申请号：US12125156

申请日：2008-05-22

Applicant: Sang Gon Lee ,  Dae Sung Kim ,  Woo Hyuck Chang

Inventor： Sang Gon Lee ,  Dae Sung Kim ,  Woo Hyuck Chang

IPC: B32B3/10

CPC classification number: H05K3/361 ,  G02F1/13452 ,  H01L2224/16225 ,  H01L2924/12044 ,  H05K1/189 ,  H05K3/181 ,  H05K2201/09063 ,  H05K2201/10128 ,  H05K2201/10681 ,  H05K2203/166 ,  H05K2203/167 ,  Y10T428/1055 ,  Y10T428/24322 ,  H01L2924/00

Abstract: A flexible film is provided. The flexible film includes a dielectric film, a metal layer disposed on the dielectric film, and at least one hole formed through the dielectric film and the metal layer. Therefore, it is possible to facilitate the alignment of circuit patterns on a flexible film with an electrode of a panel of a display device or a circuit of a driving unit of a display device.

Abstract translation: 提供柔性膜。 柔性膜包括电介质膜，设置在电介质膜上的金属层和通过电介质膜和金属层形成的至少一个孔。 因此，可以利用显示装置的面板的电极或显示装置的驱动单元的电路来促进柔性膜上的电路图案的对准。

公开(公告)号：US20140210463A1

公开(公告)日：2014-07-31

申请号：US14343143

申请日：2012-09-06

Applicant: Philippe Klein

Inventor： Philippe Klein

IPC: G01R19/00 ,  G01R33/00

CPC classification number: G01R19/0092 ,  G01R15/185 ,  G01R33/00 ,  G01R33/0052 ,  G01R33/04 ,  G01R33/045 ,  G01R33/05 ,  H01F38/30 ,  H01F2027/2809 ,  H05K1/0239 ,  H05K1/165 ,  H05K3/46 ,  H05K2201/086 ,  H05K2201/09063 ,  H05K2201/09263 ,  H05K2201/09672 ,  H05K2201/097 ,  H05K2201/10151

Abstract: A printed circuit includes a hole, a stack, one or more first coils, a magnetic core, and a pad. The hole passes through the vertically through the board to receive a conducting wire. The stack comprises metallization layers vertically stacked and separated mechanically from one another by electrically insulating layers. The first coils fulfill functions of a measurement coil and of an excitation coil. Each first coil has turns wound solely around the magnetic core. The magnetic core forms a first magnetic ring surrounding the hole and extending horizontally between metallization layers. Each turn of each first coil is formed by two conducting tracks produced, respectively, in metallization layers situated above and below the first magnetic ring. The pad passes through an insulating layer and passes through an interior of the magnetic ring, electrically linking the two conducting tracks.

Abstract translation: 印刷电路包括孔，堆叠，一个或多个第一线圈，磁芯和衬垫。 孔穿过板垂直穿过，以接收导线。 堆叠包括垂直堆叠并通过电绝缘层彼此机械分离的金属化层。 第一线圈满足测量线圈和励磁线圈的功能。 每个第一线圈都绕着磁芯绕过卷绕。 磁芯形成围绕孔的第一磁环并且在金属化层之间水平延伸。 每个第一线圈的每一圈由分别在位于第一磁环上方和下方的金属化层中产生的两个导电轨道形成。 焊盘穿过绝缘层并穿过磁环的内部，电连接两个导电轨道。

公开(公告)号：US20140209360A1

公开(公告)日：2014-07-31

申请号：US14162773

申请日：2014-01-24

Applicant: Industrial Technology Research Institute

Inventor： Yi-Cheng Peng ,  Chang-An Ho

IPC: H05K1/02

CPC classification number: H05K1/028 ,  G09F9/33 ,  G09F13/22 ,  H05K1/189 ,  H05K2201/09063 ,  H05K2201/10106 ,  H05K2201/10128

Abstract: A flexible electronic device of the disclosure may include a component portion and at least one folded portion connected to the component portion, wherein the flexible electronic device has a plurality of flexed lines located on the single folded portion and a plurality of stress relief holes, the stress relief holes are separated from each other, and at least a part of the stress relief holes is located on at least one of the flexed lines.

Abstract translation: 本公开的柔性电子设备可以包括部件部分和连接到部件部分的至少一个折叠部分，其中柔性电子设备具有位于单个折叠部分上的多个弯曲线和多个应力消除孔， 应力释放孔彼此分离，并且至少一部分应力消除孔位于至少一条挠曲线上。

公开(公告)号：US08767405B2

公开(公告)日：2014-07-01

申请号：US13093593

申请日：2011-04-25

Applicant: Kota Tokuda ,  Sadahiro Tamai

Inventor： Kota Tokuda ,  Sadahiro Tamai

IPC: H05K5/00

CPC classification number: H05K1/189 ,  G06F1/1616 ,  H05K3/0064 ,  H05K2201/09063 ,  H05K2201/2009

Abstract: According to one embodiment, an electronic apparatus includes a housing and a flexible printed circuit board accommodated in the housing. The flexible printed circuit board includes a base portion, an electrically conductive portion, a first adhesive portion, a cover portion, a rigid reinforcement plate, and a second adhesive portion. The electrically conductive portion is laminated to the base portion. The first adhesive portion is laminated to the conductive portion and includes a first opening. The cover portion is laminated to the first adhesive portion and includes a second opening continuous with the first opening. The rigid reinforcement plate is opposed to the cover portion. The second adhesive portion penetrates the first and second openings and is interposed between the cover portion and the reinforcement plate.

Abstract translation: 根据一个实施例，电子设备包括容纳在壳体中的壳体和柔性印刷电路板。 柔性印刷电路板包括基部，导电部分，第一粘合部分，盖部分，刚性加强板和第二粘合部分。 导电部分层压到基部。 第一粘合部分层压到导电部分并且包括第一开口。 盖部分层压到第一粘合剂部分并且包括与第一开口连续的第二开口。 刚性加强板与盖部相对。 第二粘合剂部分穿透第一和第二开口并插入在盖部分和加强板之间。

公开(公告)号：US20140103794A1

公开(公告)日：2014-04-17

申请号：US14118595

申请日：2012-01-31

Applicant: Yasuhisa Ueda ,  Kazuhiro Kawabata ,  Masahiro Miki ,  Takaari Uemoto

Inventor： Yasuhisa Ueda ,  Kazuhiro Kawabata ,  Masahiro Miki ,  Takaari Uemoto

IPC: F21K99/00 ,  F21V23/00

CPC classification number: F21K9/1355 ,  F21K9/23 ,  F21K9/238 ,  F21K9/27 ,  F21K9/60 ,  F21K9/65 ,  F21V3/00 ,  F21V23/001 ,  F21V23/002 ,  F21V23/02 ,  F21Y2103/10 ,  F21Y2115/10 ,  H05K3/3447 ,  H05K2201/09063 ,  H05K2201/10106 ,  H05K2201/10287 ,  H05K2201/10492 ,  H05K2201/10962

Abstract: A lamp includes an LED module, a drive unit supplying power to the LED module, and a base via which power is fed from an external power supply to the drive unit. The drive unit is located between the LED module and the base. The drive unit includes a circuit board having a main surface on which lead-type electronic components are mounted, lead wires (first lead wires) extending from the main surface of the circuit board and connected to the LED module, and lead wires (second lead wires) extending from the main surface of the circuit board and connected to the base. The circuit board has a through-hole extending from the main surface to an opposite surface thereof. The lead wires pass through the through-hole.

Abstract translation: 灯包括LED模块，向LED模块供电的驱动单元以及从外部电源向驱动单元供电的底座。 驱动单元位于LED模块和底座之间。 驱动单元包括具有主表面的电路板，引线型电子部件安装在该主表面上，从电路板的主表面延伸并连接到LED模块的引线（第一引线）和引线（第二引线 电线），其从电路板的主表面延伸并连接到基座。 电路板具有从主表面延伸到其相对表面的通孔。 引线穿过通孔。

公开(公告)号：US08692386B2

公开(公告)日：2014-04-08

申请号：US13327120

申请日：2011-12-15

Applicant: Toshiya Akamatsu

Inventor： Toshiya Akamatsu

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC classification number: H01L25/0657 ,  H01L21/76898 ,  H01L23/481 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0652 ,  H01L25/50 ,  H01L29/0657 ,  H01L2224/02372 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/05567 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/11002 ,  H01L2224/1147 ,  H01L2224/13006 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/13027 ,  H01L2224/1308 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/14181 ,  H01L2224/16141 ,  H01L2224/16147 ,  H01L2224/16148 ,  H01L2224/16238 ,  H01L2224/1624 ,  H01L2224/1703 ,  H01L2224/17051 ,  H01L2224/17181 ,  H01L2224/45144 ,  H01L2224/48095 ,  H01L2224/48227 ,  H01L2224/48599 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/81136 ,  H01L2224/8114 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81815 ,  H01L2224/81986 ,  H01L2224/83102 ,  H01L2224/9201 ,  H01L2224/94 ,  H01L2224/96 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06572 ,  H01L2225/06575 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/15159 ,  H01L2924/15321 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/351 ,  H05K1/18 ,  H05K1/181 ,  H05K2201/09063 ,  H05K2201/1053 ,  H05K2201/10545 ,  H05K2201/10674 ,  H01L2224/13099 ,  H01L2224/11 ,  H01L2224/05099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2224/48624 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device includes a semiconductor element and an electronic element. The semiconductor element has a first protruding electrode, and the electronic element has a second protruding electrode. A substrate is disposed between the semiconductor element and the electronic element. The substrate has a through-hole in which the first and second protruding electrodes are fitted. The first and second protruding electrodes are connected together inside the through-hole of the substrate.

Abstract translation: 半导体器件包括半导体元件和电子元件。 半导体元件具有第一突出电极，电子元件具有第二突出电极。 衬底设置在半导体元件和电子元件之间。 基板具有安装第一和第二突出电极的通孔。 第一和第二突出电极在衬底的通孔内连接在一起。

公开(公告)号：US08692126B2

公开(公告)日：2014-04-08

申请号：US12805710

申请日：2010-08-16

Applicant: Jun Ishii ,  Hirotoshi Iguchi

Inventor： Jun Ishii ,  Hirotoshi Iguchi

IPC: H05K1/03

CPC classification number: H05K3/303 ,  G11B5/484 ,  H05K1/056 ,  H05K1/189 ,  H05K2201/09063 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/09854 ,  H05K2203/0323 ,  H05K2203/0369 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/49126

Abstract: A wired circuit board includes a metal supporting layer, an insulating layer formed on the metal supporting layer, and a conductive layer formed on the insulating layer. In the metal supporting layer, a reference hole for positioning is formed, and a stepped portion is formed so as to surround the reference hole.

Abstract translation: 布线电路板包括金属支撑层，形成在金属支撑层上的绝缘层和形成在绝缘层上的导电层。 在金属支撑层中，形成用于定位的基准孔，并且形成有围绕基准孔的阶梯部。

公开(公告)号：US20140087586A1

公开(公告)日：2014-03-27

申请号：US13626658

申请日：2012-09-25

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Kevin M. O'Connell ,  Arvind K. Sinha ,  Kory W. Weckman

IPC: H01R13/73 ,  H05K3/30 ,  H05K7/02

CPC classification number: H01R12/7064 ,  H05K1/181 ,  H05K3/303 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/09136 ,  H05K2201/10545 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/4913

Abstract: According to embodiments of the invention, an assembly having first and second components may be provided. The first component may include one or more connectors corresponding to one or more through-holes of a circuit board. The second component may include one or more receptacles to fixedly receive the connectors, wherein the first and second components are adapted to be located on opposing sides of the circuit board in an assembled position. In some embodiments, the first and second components may include electrical connectors soldered to the circuit board. In some embodiments, the connectors may include one or more pawls and the receptacles may include one or more ratchets. In other embodiments, the connectors may be threaded members and the receptacles may be threaded apertures.

Abstract translation: 根据本发明的实施例，可以提供具有第一和第二部件的组件。 第一部件可以包括对应于电路板的一个或多个通孔的一个或多个连接器。 第二部件可以包括一个或多个插座以固定地接收连接器，其中第一和第二部件适于位于组装位置的电路​​板的相对侧上。 在一些实施例中，第一和第二部件可以包括焊接到电路板的电连接器。 在一些实施例中，连接器可以包括一个或多个棘爪，并且插座可以包括一个或多个棘爪。 在其他实施例中，连接器可以是螺纹构件，并且容座可以是螺纹孔。

公开(公告)号：US20140085843A1

公开(公告)日：2014-03-27

申请号：US14094240

申请日：2013-12-02

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshihito Otsubo

IPC: H05K1/18 ,  H05K3/30

CPC classification number: H05K1/181 ,  H01L21/561 ,  H01L23/13 ,  H01L23/295 ,  H01L23/3107 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/552 ,  H01L24/16 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15162 ,  H01L2924/1532 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19106 ,  H01L2924/3511 ,  H05K1/0271 ,  H05K3/0097 ,  H05K3/284 ,  H05K3/303 ,  H05K2201/09063 ,  H05K2201/10318 ,  H05K2203/1316 ,  H05K2203/1572 ,  Y10T29/4913 ,  H01L2224/81 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A mounting-completed core parent substrate in which surface mount devices are mounted on both principal surfaces of the core parent substrate including a plurality of the core individual substrates and having a through hole formed in each core individual substrate so as to extend therethrough is formed. Then, resin layers in a partially cured state are formed on both the principal surfaces of the core parent substrate and the resin layers on both the principal surfaces are joined through the through holes so that the resin layers on both principal surfaces of each core individual substrate are joined and integrated to each other at a predetermined region, each core individual substrate being obtained by dividing the core parent substrate. After that, the resin layers are subjected to main curing. Thereafter, the core parent substrate is divided at a predetermined position and separated into the core individual substrates.

Abstract translation: 形成安装完成的芯母基板，其中表面安装器件安装在包括多个芯单独基板的芯母基板的两个主表面上，并且具有形成在每个芯单独基板中以便穿过其中的通孔。 然后，在芯母基板的两个主表面上形成部分固化状态的树脂层，并且两个主表面上的树脂层通过通孔接合，使得每个芯单独基板的两个主表面上的树脂层 在预定区域彼此结合并且彼此集成，每个芯单独基板通过分离芯母基板获得。 之后，对树脂层进行主固化。 此后，将芯母基板分割成预定位置并分离成芯单独基板。

公开(公告)号：US08681504B2

公开(公告)日：2014-03-25

申请号：US13250903

申请日：2011-09-30

Applicant: Yeon-Tae Kim ,  Sam-Ju Choi ,  Seung-Jin Lee

Inventor： Yeon-Tae Kim ,  Sam-Ju Choi ,  Seung-Jin Lee

IPC: H05K7/20 ,  G09G3/32

CPC classification number: H05K7/20954 ,  G02F1/133382 ,  G02F1/13452 ,  G02F2001/133311 ,  G02F2001/133334 ,  H05K1/0203 ,  H05K1/147 ,  H05K2201/09063

Abstract: A display apparatus that facilitates shielding of electromagnetic waves and heat dissipation is disclosed. The display apparatus may include: i) a substrate, ii) a sealing member disposed to face the substrate, iii) a display unit disposed between the substrate and the sealing member, iv) a driving chip disposed on the substrate and transmitting an electric signal to the display unit and v) a circuit board including a signal line that is electrically connected to the driving chip, and a conductive cover layer disposed to cover the driving chip. In one embodiment, the circuit board includes a heat sink for dissipating heat generated by the driving chip.

Abstract translation: 公开了一种有助于屏蔽电磁波和散热的显示装置。 显示装置可以包括：i）基板，ii）设置成面对基板的密封构件，iii）设置在基板和密封构件之间的显示单元，iv）设置在基板上并传输电信号的驱动芯片 并且v）包括电连接到驱动芯片的信号线的电路板和设置成覆盖驱动芯片的导电覆盖层。 在一个实施例中，电路板包括用于散发由驱动芯片产生的热量的散热器。