公开(公告)号：US08674715B2

公开(公告)日：2014-03-18

申请号：US13010234

申请日：2011-01-20

Applicant: Bryan J. Root ,  William A. Funk

Inventor： Bryan J. Root ,  William A. Funk

IPC: G01R31/20

CPC classification number: G01R31/2889 ,  G01R1/07378 ,  G01R3/00 ,  G01R31/2886 ,  H05K1/117 ,  H05K3/325 ,  H05K2201/09027 ,  H05K2201/09063 ,  H05K2201/09227 ,  H05K2203/167 ,  Y10T29/49126 ,  Y10T29/49128

Abstract: A probe core includes a frame, a wire guide connected to the frame, a probe tile, and a plurality of probe wires supported by the wire guide and probe tile. Each probe wire includes an end configured to probe a device, such as a semiconductor wafer. Each probe wire includes a signal transmitting portion and a guard portion. The probe core further includes a lock mechanism supported by the frame. The lock mechanism is configured to allow the probe core to be connected and disconnected to another test equipment or component, such as a circuit board. As one example, the probe core is configured to connect and disconnect from the test equipment or component in a rotatable lock and unlock operation or twist lock/unlock operation, where the frame is rotated relative to remainder of the core to lock/unlock the probe core.

Abstract translation: 探针芯包括框架，连接到框架的导线引导件，探针瓦片和由导线器和探针瓦片支撑的多个探针线。 每个探针线包括构造成探测诸如半导体晶片的器件的端部。 每个探针线包括信号传输部分和防护部分。 探针芯还包括由框架支撑的锁定机构。 锁定机构被配置为允许探针芯与诸如电路板的另一个测试设备或部件连接和断开。 作为一个示例，探针芯被配置为在可旋转的锁定和解锁操作或扭转锁定/解锁操作中连接和断开测试设备或组件，其中框架相对于芯的其余部分旋转以锁定/解锁探针 核心。

公开(公告)号：US20140063769A1

公开(公告)日：2014-03-06

申请号：US13598308

申请日：2012-08-29

Applicant: Michael B. Wittenberg ,  Jared M. Kole ,  Sawyer I. Cohen ,  Shayan Malek

Inventor： Michael B. Wittenberg ,  Jared M. Kole ,  Sawyer I. Cohen ,  Shayan Malek

IPC: H05K3/34 ,  H05K1/03 ,  H05K1/18 ,  H05K1/14

CPC classification number: H05K3/341 ,  H05K3/0052 ,  H05K2201/0394 ,  H05K2201/09063 ,  H05K2201/1031 ,  H05K2201/1034 ,  Y02P70/611 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: Components may be mounted to printed circuit substrates using solder. A breakaway support tab may be detachably connected to a component and may help prevent the component from shifting or toppling over during reflow operations. The component and breakaway support tab may be formed from sheet metal. The interface that links the component to the breakaway support tab may be perforated or half sheared to allow the breakaway support tab to be easily separated from the component following reflow operations. The breakaway support tab may be fixed in place during reflow operations by mechanically coupling the breakaway support tab to a fixture or by mounting the breakaway support tab to an unused portion of a panel of printed circuit substrates. A breakaway support tab may be mechanically coupled between two components on a printed circuit substrate and may be used to maintain a distance between the components during reflow operations.

Abstract translation: 组件可以使用焊料安装到印刷电路基板上。 分离的支撑片可以可拆卸地连接到部件，并且可以有助于防止在回流操作期间部件移动或翻倒。 部件和分离支撑片可以由金属片形成。 将组件连接到分离支撑片的接口可以是穿孔的或半剪切的，以允许分离支撑片在回流操作之后容易地与部件分离。 分离式支撑片可以在回流操作期间通过将分离支撑片机械地联接到固定装置或通过将分离的支撑片安装到印刷电路板的面板的未使用部分来固定到位。 分离的支撑片可以机械耦合在印刷电路基板上的两个部件之间，并且可以用于在回流操作期间保持部件之间的距离。

公开(公告)号：US08649183B2

公开(公告)日：2014-02-11

申请号：US13024818

申请日：2011-02-10

Applicant: Rodney Austin Green ,  Kevin Craig Bellette ,  Perry Arthur Kelly

Inventor： Rodney Austin Green ,  Kevin Craig Bellette ,  Perry Arthur Kelly

IPC: H05K1/18

CPC classification number: H05K3/30 ,  H01L2924/0002 ,  H05K1/182 ,  H05K13/04 ,  H05K2201/09063 ,  H05K2201/09645 ,  H05K2201/10583 ,  H01L2924/00

Abstract: An electronic assembly that includes a circuit board having a substrate in which an open space is defined, and a component having a housing and a plurality of leads, the open space being large enough to receive the housing of the component at least partially.

Abstract translation: 一种电子组件，其包括具有限定开放空间的基板的电路板和具有壳体和多个引线的部件，所述开放空间足够大以至少部分地接收所述部件的壳体。

公开(公告)号：US08644660B2

公开(公告)日：2014-02-04

申请号：US13409422

申请日：2012-03-01

Applicant: Akiko Nagafuji ,  Yuichi Tsujita ,  Masayuki Hodono ,  Masami Inoue

Inventor： Akiko Nagafuji ,  Yuichi Tsujita ,  Masayuki Hodono ,  Masami Inoue

IPC: G02B6/26 ,  G02B6/36 ,  G02B6/42 ,  G02B6/10

CPC classification number: G02B6/42 ,  G02B6/138 ,  G02B6/4214 ,  G02B6/423 ,  G02B6/4257 ,  G02B6/428 ,  H05K1/0274 ,  H05K1/181 ,  H05K3/002 ,  H05K2201/09063 ,  H05K2201/09072 ,  H05K2201/09081 ,  H05K2201/10121 ,  Y02P70/611 ,  Y10T29/49 ,  Y10T29/49126

Abstract: Provided are an opto-electric hybrid board and a manufacturing method. The opto-electric hybrid board includes an optical waveguide unit and an electric circuit unit having an optical element mounted thereon. The optical waveguide unit includes socket portions for locating the electric circuit unit, which are formed on a surface of an undercladding layer and formed of the same material as a core. The socket portions are located at predetermined locations with respect to one end surface of a core. The electric circuit unit includes bent portions which are formed by bending a part of an electric circuit board so as to stand, for fitting into the socket portions. The bent portions are located at predetermined locations with respect to the optical element. The optical waveguide unit and the electric circuit unit are coupled in a state in which the bent portions fit into the socket portions.

Abstract translation: 提供了一种光电混合板和制造方法。 光电混合基板包括光波导单元和安装有光学元件的电路单元。 光波导单元包括用于定位电路单元的插座部分，其形成在下包层的表面上并且由与芯相同的材料形成。 插座部分相对于芯的一个端面位于预定位置处。 电路单元包括通过使电路板的一部分弯曲成立以形成以弯曲的弯曲部分，用于装配到插座部分中。 弯曲部分相对于光学元件位于预定位置。 光波导单元和电路单元在弯曲部分配合到插座部分的状态下耦合。

公开(公告)号：US08642892B2

公开(公告)日：2014-02-04

申请号：US13235451

申请日：2011-09-18

Applicant: Hai-Qing Zhou

Inventor： Hai-Qing Zhou

IPC: H05K1/03

CPC classification number: G06F1/186 ,  H05K1/02 ,  H05K2201/09063 ,  H05K2201/10227 ,  H05K2201/10409

Abstract: The circuit board includes a main body, at least one handle, and at least one connecting element. The main body defines at least one through hole. One end of each of the at least one handle defines a positioning portion. The positioning portion of each of the at least one handle extends through a corresponding one of the at least one through hole and is engaged with one of the at least one connecting elements.

Abstract translation: 电路板包括主体，至少一个把手和至少一个连接元件。 主体限定至少一个通孔。 所述至少一个手柄中的每一个的一端限定定位部分。 所述至少一个手柄中的每一个的定位部分延伸穿过所述至少一个通孔中的对应的一个，并且与所述至少一个连接元件中的一个接合。

公开(公告)号：US20140029206A1

公开(公告)日：2014-01-30

申请号：US13610701

申请日：2012-09-11

Applicant: Michael B. Wittenberg ,  Miguel C. Christophy ,  Shayan Malek

Inventor： Michael B. Wittenberg ,  Miguel C. Christophy ,  Shayan Malek

IPC: H05K1/18 ,  H05K3/00 ,  H05K3/30 ,  H05K7/02

CPC classification number: H05K1/18 ,  G06F1/1658 ,  G06K13/0825 ,  H04M2250/14 ,  H05K1/117 ,  H05K1/183 ,  H05K3/00 ,  H05K3/30 ,  H05K7/02 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09163 ,  Y10T29/49124 ,  Y10T29/4913

Abstract: Electronic devices are provided with ejectable component assemblies. Each ejectable component assembly may include a tray that can be loaded with one or more types of removable module, such as a mini-SIM card and a micro-SIM card, and inserted into the device. Each assembly may also include a cover coupled to a circuit board. The tray may be inserted through an opening in the electronic device and into a space between the cover and the circuit board. A portion of the space is contained within the pocket. A portion of the tray may be contained within the pocket when the tray is inserted into the device for holding the module at a functional insertion position within the device.

Abstract translation: 电子设备设置有可喷射部件组件。 每个可弹出的部件组件可以包括托盘，该托盘可以装载有一个或多个类型的可拆卸模块，例如mini-SIM卡和微型SIM卡，并插入到该装置中。 每个组件还可以包括联接到电路板的盖。 托盘可以插入电子设备中的开口并进入盖和电路板之间的空间。 空间的一部分被包含在口袋内。 当托盘插入设备中时，托盘的一部分可以容纳在口袋内，用于将模块保持在设备内的功能插入位置。

公开(公告)号：US20140028501A1

公开(公告)日：2014-01-30

申请号：US13671086

申请日：2012-11-07

Applicant: LOGITECH EUROPE S.A.

Inventor： Laurent Cariou ,  Frédéric Fortin ,  Darragh Luttrell ,  Vilasinh Vilaylack

IPC: H01Q9/04

CPC classification number: H05K3/30 ,  H01Q1/2275 ,  H01Q1/44 ,  H01Q9/42 ,  H05K1/18 ,  H05K3/3405 ,  H05K2201/09063 ,  H05K2201/10098 ,  H05K2201/10287 ,  H05K2201/10446 ,  Y10T29/4913 ,  Y10T29/49144

Abstract: A wireless communications apparatus includes a housing having a first portion and a second portion. The first portion is adapted for insertion into a socket of an electronic device and the second portion includes an end cap. The wireless communications apparatus also includes a printed circuit board (PCB) enclosed within the housing, the PCB having a mounting surface and an antenna joined to the PCB and enclosed within the end cap. The antenna is oriented perpendicular to the mounting surface of the PCB.

Abstract translation: 无线通信装置包括具有第一部分和第二部分的壳体。 第一部分适于插入到电子设备的插座中，并且第二部分包括端盖。 无线通信设备还包括封装在壳体内的印刷电路板（PCB），PCB具有安装表面和连接到PCB并封闭在端盖内的天线。 天线垂直于PCB的安装表面定向。

公开(公告)号：US20140022751A1

公开(公告)日：2014-01-23

申请号：US13901631

申请日：2013-05-24

Applicant: FUJITSU LIMITED

Inventor： Mamoru Kurashina ,  Daisuke Mizutani ,  Taiga Fukumori

IPC: H05K1/14 ,  H05K3/46

CPC classification number: H05K1/144 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/4985 ,  H01L24/14 ,  H01L24/17 ,  H01L2924/15311 ,  H05K1/024 ,  H05K1/147 ,  H05K3/3436 ,  H05K3/363 ,  H05K3/4697 ,  H05K2201/0154 ,  H05K2201/042 ,  H05K2201/09063 ,  H05K2201/10734 ,  H05K2201/2009 ,  H05K2203/167 ,  Y02P70/613 ,  Y10T29/49126

Abstract: An electric circuit apparatus includes: a first-circuit board that includes a first-through-hole, and a first-electrode disposed on a front side of the first-circuit-board; a second-circuit-board that is disposed on a back side of the first-circuit-board, the second-circuit-board including on the front side of the second-circuit-board a second-electrode associated with the first-through-hole; a semiconductor device that is disposed on the front side of the first-circuit-board, the semiconductor device including on a back side a third-electrode-associated with the first-electrode, and a fourth-electrode-associated with the second-electrode; a first-bonding-material that bonds the first-electrode and the-third-electrode; a second-bonding-material that bonds the second-electrode and the fourth-electrode while passing through the first-through-hole; and a support body that is disposed between the first-electrode and the second-circuit-board and that supports the first-circuit-board.

Abstract translation: 电路装置包括：第一电路板，包括第一通孔，第一电极设置在第一电路板的正面上; 布置在所述第一电路板背面的第二电路板，所述第二电路板在所述第二电路板的前侧包括与所述第一电路板相关联的第二电极， 孔; 设置在所述第一电路板的前侧的半导体器件，所述半导体器件在背面包括与所述第一电极相关联的第三电极，以及与所述第二电极相关联的第四电极 ; 键合第一电极和第三电极的第一键合材料; 第二接合材料，其在通过所述第一通孔时接合所述第二电极和所述第四电极; 以及支撑体，其设置在所述第一电极和所述第二电路板之间并且支撑所述第一电路板。

公开(公告)号：US20140014409A1

公开(公告)日：2014-01-16

申请号：US13690344

申请日：2012-11-30

Applicant: ADVANCED FLEXIBLE CIRCUITS CO., LTD.

Inventor： GWUN-JIN LIN ,  KUO-FU SU

IPC: H02G15/08

CPC classification number: H02G15/08 ,  H05K1/0219 ,  H05K1/0225 ,  H05K1/0245 ,  H05K1/0253 ,  H05K1/117 ,  H05K1/118 ,  H05K1/147 ,  H05K2201/0715 ,  H05K2201/09063 ,  H05K2201/09254

Abstract: A differential mode signal transmission module includes a first section having an external connection end on which at least a pair of differential mode signal transmission terminals are formed and includes a grounding terminal, a first differential mode signal terminal, and a second differential mode signal terminal. The extension connection end of the first section forms a counterpart signal terminals corresponding to those of the external connection end. At least one first conductive connection line is formed on the first section. The conductive connection line connects the grounding terminal of the external connection end of the first section to a collective grounding point. The extension connection end of the first section is connected to an extension section. The extension section is further connected to a second section opposite to the first section. The extension section includes at least one slit line in order to form a bundled section. The first section, the second section, and the extension section include at least one fold line.

Abstract translation: 差分模式信号传输模块包括具有外部连接端的第一部分，在该第一部分上形成有至少一对差模信号传输端子，并且包括接地端子，第一差分模式信号端子和第二差分模式信号端子。 第一部分的延伸连接端形成与外部连接端对应的对应信号端子。 在第一部分上形成至少一个第一导电连接线。 导电连接线将第一部分的外部连接端的接地端子连接到集合接地点。 第一部分的延伸连接端连接到扩展部分。 延伸部分进一步连接到与第一部分相对的第二部分。 延伸部分包括至少一条狭缝线以形成捆扎部分。 第一部分，第二部分和扩展部分包括至少一个折线。

公开(公告)号：US08627563B2

公开(公告)日：2014-01-14

申请号：US12526032

申请日：2008-02-06

Applicant: Kenneth E. Wing ,  Scott T. Carroll

Inventor： Kenneth E. Wing ,  Scott T. Carroll

IPC: H05K3/30

CPC classification number: H01R13/5219 ,  B29C45/14639 ,  H01R13/53 ,  H01R24/76 ,  H01R2101/00 ,  H05K1/0254 ,  H05K1/182 ,  H05K3/284 ,  H05K3/3421 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2201/10651 ,  H05K2203/1316

Abstract: A process relating to a one step low pressure injection molding method of encapsulating high voltage circuitry while incorporating a unique recessed high voltage connector contact means within the injection molding material, greatly reducing the component size, while increasing the capabilities of this type of circuitry. The process reduces the manufacturing time and maintains a clean sealed contact point for repeated usage by the means of a conductive rubber slug. An additional advantage is by creating cavities through the circuit board; axially leaded high voltage components may be conveniently mounted without additional assembly components while being fully encapsulated.

Abstract translation: 涉及一种低压注塑成型方法，该方法包括高压电路，同时在注射成型材料中结合独特的凹陷式高压连接器接触装置，大大降低了部件尺寸，同时增加了这种类型的电路的能力。 该方法减少了制造时间并保持了清洁的密封接触点，以通过导电橡胶块的方式重复使用。 额外的优点是通过电路板产生空腔; 轴向引线的高压部件可以方便地安装，而无需额外的组装部件，同时完全封装。