公开(公告)号：US10076037B2

公开(公告)日：2018-09-11

申请号：US15687763

申请日：2017-08-28

Applicant: CANON KABUSHIKI KAISHA

Inventor： Kunihiko Minegishi

IPC: H05K1/02 ,  H05K1/16 ,  H05K1/18 ,  H05K1/11 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K1/181 ,  B23K35/0222 ,  B23K35/0244 ,  B23K35/262 ,  B23K35/3613 ,  H05K1/111 ,  H05K3/305 ,  H05K3/341 ,  H05K3/3436 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/09409 ,  H05K2201/2081 ,  Y02P70/613

Abstract: Provided is a printed circuit board including: an electronic component having a bottom face and a side face, in which first lands are provided on the bottom face; a printed wiring board having a mounting face, in which second lands corresponding to the first lands are provided on the mounting face, and in which the electronic component is mounted such that the bottom face faces the mounting face; a solder aggregation member provided outside the second lands on the mounting face; pieces of first solder each of which joins each of the first lands to corresponding one of the second lands; second solder formed on the solder aggregation member; and a thermosetting resin adhered to the bottom face of the electronic component outside the first lands and to the mounting face of the printed wiring board outside the second lands.

公开(公告)号：US09980398B2

公开(公告)日：2018-05-22

申请号：US15365920

申请日：2016-11-30

Applicant: Samsung Display Co., Ltd.

Inventor： Byoungyong Kim ,  Inseok Yeo

IPC: H05K5/00 ,  H05K1/11 ,  H05K1/18 ,  H05K3/32

CPC classification number: H05K5/0017 ,  G02F1/1333 ,  G06F1/16 ,  H05K1/111 ,  H05K1/113 ,  H05K1/115 ,  H05K1/147 ,  H05K1/181 ,  H05K3/323 ,  H05K2201/09409 ,  H05K2201/09781 ,  H05K2201/10128

Abstract: A printed circuit board includes: a base substrate having a plurality of pad group areas arranged in a first direction on the base substrate, each of the pad group areas being divided into first, second, and third pad areas that are sequentially arranged in a second direction crossing the first direction; first and second row pads disposed within each of the pad group areas and arranged in a third direction crossing the first and second directions; first lines respectively connected to the first row pads; and lower dummy lines on a same layer as that of the first lines. Some of the first row pads are in the first pad area, rest of the first row pads and some of the second row pads are in the second pad area, and rest of the second row pads are in the third pad area.

公开(公告)号：US09979145B2

公开(公告)日：2018-05-22

申请号：US15408752

申请日：2017-01-18

Applicant: FOXCONN INTERCONNECT TECHNOLOGY LIMITED

Inventor： Jerry Wu ,  Jun Chen ,  Fan-Bo Meng

IPC: H01B9/02 ,  H01R24/60 ,  H05K1/11 ,  H01R12/53 ,  H01R13/6471 ,  H01R13/6591

CPC classification number: H01R24/60 ,  H01R12/53 ,  H01R13/6471 ,  H01R13/6591 ,  H05K1/111 ,  H05K2201/09409 ,  H05K2201/10189 ,  Y02P70/611

Abstract: A cable includes: plural wires including plural pairs of differential signal wires, a detection signal wire, at least one auxiliary signal wire, a plurality of low speed signal wires, and two power wires arranged adjacent to the low speed signal wires; and a jacket enclosing the plurality of wires; wherein the differential signal wires, the detection signal wire, and the at least one auxiliary signal wire are arranged at an outer periphery of and enclosing the low speed signal wires and the two power wires, and every two adjacent differential signal wire pairs are separated by one of the detection signal wire and the at least one auxiliary signal wire.

公开(公告)号：US20180120968A1

公开(公告)日：2018-05-03

申请号：US15795200

申请日：2017-10-26

Applicant: Jui-Jen Yueh ,  Chung-Wen Yen ,  Chao-Hsiang Wang

Inventor： Jui-Jen Yueh ,  Chung-Wen Yen ,  Chao-Hsiang Wang

IPC: G06F3/041 ,  H05K1/11 ,  H05K3/40

CPC classification number: G06F3/041 ,  G06F3/0416 ,  G06F2203/04103 ,  H05K1/0271 ,  H05K1/0281 ,  H05K1/115 ,  H05K1/116 ,  H05K3/245 ,  H05K3/4053 ,  H05K2201/09409 ,  H05K2201/09727 ,  H05K2201/09745 ,  H05K2201/09781 ,  H05K2201/10128

Abstract: An electronic device is provided. The electronic device includes a substrate, a first contacting element, a second contacting element and a connecting element. The substrate has a first surface and a second surface. The substrate has a through hole located between the first surface and the second surface. At least a part of the connecting element is disposed in the through hole. The first contacting element is disposed on the first surface. The second contacting element is disposed on the second surface. The first contacting element electrically connects the second contacting element through the connecting element.

公开(公告)号：US20180110122A1

公开(公告)日：2018-04-19

申请号：US15671819

申请日：2017-08-08

Applicant: Samsung Display Co., Ltd.

Inventor： Young Hoon LEE

IPC: H05K1/14 ,  H01L27/32 ,  H05K1/11 ,  H05K1/18 ,  H05K1/02

CPC classification number: H05K1/14 ,  H01L27/124 ,  H01L27/3276 ,  H01L51/0097 ,  H01L51/52 ,  H01L2251/5338 ,  H05K1/028 ,  H05K1/113 ,  H05K1/118 ,  H05K1/147 ,  H05K1/189 ,  H05K3/363 ,  H05K3/365 ,  H05K2201/09409 ,  H05K2201/09481 ,  H05K2201/09709

Abstract: A display device includes: a substrate including a display area positioned on a first surface and displaying an image and a peripheral area positioned around the display area; a first pad portion disposed on a second surface of the substrate as a surface opposite to the first surface of the substrate; a plurality of through-holes disposed on the peripheral area and penetrating the substrate; a plurality of connection wires disposed on the peripheral area and connecting the display area and the first pad portion through the plurality of through-holes; and a printed circuit board including a second pad portion coupled with the first pad portion.

公开(公告)号：US20180063954A1

公开(公告)日：2018-03-01

申请号：US15679095

申请日：2017-08-16

Applicant: Samsung Display Co., Ltd.

Inventor： Byoung Yong KIM ,  Jeong Ho HWANG

IPC: H05K1/11 ,  H01L27/12 ,  H05K1/18 ,  H05K1/02

CPC classification number: H05K1/111 ,  G02F1/13452 ,  G02F1/13458 ,  G02F1/136286 ,  H01L27/124 ,  H01L27/1248 ,  H01L27/3276 ,  H01L51/0096 ,  H05K1/0268 ,  H05K1/113 ,  H05K1/18 ,  H05K2201/09381 ,  H05K2201/094 ,  H05K2201/09409 ,  H05K2201/09781 ,  H05K2201/10128 ,  H05K2201/10136

Abstract: A display device including: a display substrate including a display area configured to display an image and a pad area positioned on the periphery of the display area; a first pad part positioned above the pad area and including first pad terminals arranged in a first direction; and a printed circuit board including a base film and a second pad part positioned at one side of the base film and coupled with the first pad part, the second pad part includes first contact terminals coupled with first pad terminals, each of first contact terminals includes first contact pad terminals arranged along a first row forming a first inclination angle with the first direction, and second contact pad terminals spaced from first contact pad terminals and arranged along a second row forming a second inclination angle with the first direction.

公开(公告)号：US09907187B1

公开(公告)日：2018-02-27

申请号：US15657254

申请日：2017-07-24

Applicant: SIMULA TECHNOLOGY INC.

Inventor： Te-Chih Tseng

IPC: H01L23/48 ,  H05K3/34 ,  H05K1/11 ,  H01R12/72 ,  H01R13/6473

CPC classification number: H05K3/341 ,  H01R12/72 ,  H01R13/6473 ,  H05K1/111 ,  H05K1/117 ,  H05K2201/09409 ,  H05K2201/09418 ,  H05K2201/10325

Abstract: A PCB with two rows of solder pads including both SMT-based and DIP-based structures is configured to be mounted with a USB Type-C connector by soldering, has two rows of solder pads on its top side, and is characterized in that at least one solder pad in one of the rows is a DIP-based structure while the remaining solder pads in the same row are SMT-based structures, and that all the solder pads in each row that are used to transmit high-frequency signals are SMT-based structures. Once the connector is mounted to the PCB, an inspector can directly examine the soldering quality of the DIP-based-structure solder pad and of the corresponding connection terminal simply by inspecting the bottom side of the PCB. Moreover, since all the solder pads configured for transmitting high-frequency signals are SMT-based structures, better transmission will be provided to the connector, accordingly.

公开(公告)号：US09851763B1

公开(公告)日：2017-12-26

申请号：US14040924

申请日：2013-09-30

Applicant: The United States of America, as represented by the Administrator of the National Aeronautics and Space Administration

Inventor： David J. Petrick ,  Alessandro Geist ,  Michael R. Lin ,  Gary R. Crum

IPC: H05K1/18 ,  G06F1/18 ,  H05K1/02 ,  H05K1/11

CPC classification number: G06F1/185 ,  G06F1/189 ,  H02H3/087 ,  H02J1/00 ,  H05K1/0298 ,  H05K1/113 ,  H05K1/115 ,  H05K1/181 ,  H05K3/4644 ,  H05K2201/09409 ,  H05K2201/10189 ,  H05K2201/10409 ,  H05K2201/10446 ,  H05K2201/10545 ,  H05K2201/10568 ,  H05K2201/10628 ,  Y02P70/611

Abstract: A single board computer system radiation hardened for space flight includes a printed circuit board having a top side and bottom side; a reconfigurable field programmable gate array (FPGA) processor device disposed on the top side; a connector disposed on the top side; a plurality of peripheral components mounted on the bottom side; and wherein a size of the single board computer system is not greater than approximately 7 cm×7 cm.

公开(公告)号：US09832891B2

公开(公告)日：2017-11-28

申请号：US14622328

申请日：2015-02-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyojae Bang ,  Dogeun Kim ,  Hongkyun Kim ,  Youngbok Jeon

IPC: H05K5/00 ,  G06K7/00 ,  H01R12/57 ,  H01R12/50 ,  H05K1/11 ,  H01R13/00 ,  H05K3/10 ,  H05K3/30 ,  H05K7/02 ,  H05K13/00 ,  G06F1/18 ,  H05K1/18 ,  H01R27/00 ,  H05K1/02 ,  H05K3/34

CPC classification number: H05K5/0026 ,  G06F1/18 ,  G06F1/185 ,  G06K7/0047 ,  H01R12/57 ,  H01R12/721 ,  H01R13/00 ,  H01R23/70 ,  H01R27/00 ,  H05K1/0295 ,  H05K1/11 ,  H05K1/117 ,  H05K1/181 ,  H05K3/10 ,  H05K3/303 ,  H05K3/3405 ,  H05K7/02 ,  H05K13/00 ,  H05K2201/09409 ,  H05K2201/09709 ,  H05K2201/09954 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10446 ,  Y10S439/946 ,  Y10S439/951 ,  Y10T29/49124 ,  Y10T29/49147

Abstract: Example embodiments are directed to circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same, which are common to at least two different form factors. In an example embodiment, the SSD includes a circuit board that is smaller than a case, and the circuit board is secured to the bottom surface of the case by the securing element. The securing element is spaced apart from edges of the case to allow using a circuit board that is smaller than the case.

公开(公告)号：US09775248B2

公开(公告)日：2017-09-26

申请号：US14862549

申请日：2015-09-23

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Dong-Ho Kim

IPC: H05K1/00 ,  H05K1/18 ,  H05K1/14 ,  H05K1/11 ,  H01L27/32

CPC classification number: H05K1/189 ,  H01L27/3276 ,  H05K1/111 ,  H05K1/147 ,  H05K2201/09409 ,  H05K2201/09418 ,  H05K2201/10128 ,  Y02P70/611

Abstract: A display device including a flexible circuit board including an insulation film, the insulation film including an input pad part and an output pad part on a first side thereof; a printed circuit board including a first pad part, the first pad part being connected to the input pad part; and a display panel including a second pad part, the second pad part being connected to the output pad part, wherein the input pad part includes a plurality of input pads that are arranged in at least two pad columns, and the flexible circuit board includes a plurality of dummy layers aligned with the plurality of input pads on a second side of the insulation film, the second side being an opposite side to the first side.