公开(公告)号：US20050130480A1

公开(公告)日：2005-06-16

申请号：US11039964

申请日：2005-01-24

Applicant: Tonglong Zhang

Inventor： Tonglong Zhang

IPC: H05K3/00 ,  H05K3/40 ,  H05K3/42 ,  H01R13/625

CPC classification number: H05K1/115 ,  H01R12/523 ,  H05K3/0047 ,  H05K3/403 ,  H05K3/42 ,  H05K3/429 ,  H05K2201/09181 ,  H05K2201/09645 ,  H05K2201/09854 ,  H05K2203/1476

Abstract: A via provides a plurality of electrical connections between conductors on different layers of a circuit board. The via includes an opening through the circuit board formed by a plurality of substantially partially overlapping bores. An electrically conductive plating is formed on an inner surface of the opening. The plating forms a plurality of distinct electrically conductive paths.

Abstract translation: 通孔在电路板的不同层上的导体之间提供多个电连接。 通孔包括通过由多个基本上部分重叠的孔形成的电路板的开口。 在开口的内表面上形成导电电镀。 电镀形成多个不同的导电路径。

公开(公告)号：US06835601B2

公开(公告)日：2004-12-28

申请号：US10409972

申请日：2003-04-09

Applicant: Masaya Wajima

Inventor： Masaya Wajima

IPC: H01L2144

CPC classification number: H05K3/403 ,  H01L21/4846 ,  H01L2924/0002 ,  H05K1/0243 ,  H05K1/092 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/4061 ,  H05K2201/09181 ,  H05K2201/09854 ,  H05K2201/10068 ,  H01L2924/00

Abstract: An apparatus and method for manufacturing substrate elements includes providing a mother substrate, and forming a plurality of through-holes on first lines and second lines opposing each other across sections on the mother substrate. The sections define each of the substrate elements to be formed. The through-holes on the first lines are disposed alternately with respect to the through-holes on the second lines. Electrodes are also provided on the principal plane of the mother substrate and on the inner surfaces of the through-holes. Then, the mother substrate is cut along cut lines in the vertical and horizontal directions.

Abstract translation: 用于制造衬底元件的装置和方法包括提供母体衬底，以及在母体衬底上的部分上彼此相对的第一线和第二线上形成多个通孔。 这些部分限定要形成的每个基板元件。 第一线上的通孔相对于第二线上的通孔交替设置。 电极也设置在母基板的主平面上和通孔的内表面上。 然后，沿着垂直和水平方向的切割线切割母基板。

公开(公告)号：US20030213767A1

公开(公告)日：2003-11-20

申请号：US10426326

申请日：2003-04-29

Inventor： Robert Edward Belke JR. ,  Vivek A. Jairazbhoy ,  Thomas B. Krautheim ,  William F. Quitty JR.

IPC: H01B013/00

CPC classification number: H05K3/44 ,  H05K3/4038 ,  H05K2201/0305 ,  H05K2201/0361 ,  H05K2201/09554 ,  H05K2201/09745 ,  H05K2201/0979 ,  H05K2201/09854 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49156

Abstract: A multi-layer electronic circuit board design 10 having selectively formed apertures or cavities 26 which have improved solder-wetting characteristics.

Abstract translation: 具有选择性地形成的具有改善的焊料润湿特性的孔或腔26的多层电子电路板设计10。

公开(公告)号：US20030207546A1

公开(公告)日：2003-11-06

申请号：US10409972

申请日：2003-04-09

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Masaya Wajima

IPC: H01L021/44

CPC classification number: H05K3/403 ,  H01L21/4846 ,  H01L2924/0002 ,  H05K1/0243 ,  H05K1/092 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/4061 ,  H05K2201/09181 ,  H05K2201/09854 ,  H05K2201/10068 ,  H01L2924/00

Abstract: An apparatus and method for manufacturing substrate elements includes providing a mother substrate, and forming a plurality of through-holes on first lines and second lines opposing each other across sections on the mother substrate. The sections define each of the substrate elements to be formed. The through-holes on the first lines are disposed alternately with respect to the through-holes on the second lines. Electrodes are also provided on the principal plane of the mother substrate and on the inner surfaces of the through-holes. Then, the mother substrate is cut along cut lines in the vertical and horizontal directions.

Abstract translation: 用于制造衬底元件的装置和方法包括提供母体衬底，以及在母体衬底上的部分上彼此相对的第一线和第二线上形成多个通孔。 这些部分限定要形成的每个基板元件。 第一线上的通孔相对于第二线上的通孔交替设置。 电极也设置在母基板的主平面上和通孔的内表面上。 然后，沿着垂直和水平方向的切割线切割母基板。

公开(公告)号：US20030136656A1

公开(公告)日：2003-07-24

申请号：US10056240

申请日：2002-01-23

Inventor： John Edmund Dunne ,  Martin John Tatara

IPC: H01H009/00

CPC classification number: H01H9/0271 ,  H01H1/5805 ,  H01H11/0006 ,  H01H11/0031 ,  H05K1/0286 ,  H05K1/119 ,  H05K3/308 ,  H05K2201/049 ,  H05K2201/09854 ,  H05K2201/1059 ,  H05K2201/10818

Abstract: An interchangeable printed circuit board having electrical components is attached externally proximate to the base of a switch to customize switch performance. The circuit board includes openings which slide over and electrically engage the terminals of the switch proximate the base, leaving the remainder of the terminals exposed and available for plug-in or solder electrical connection within an electrical system. The openings may be copper contact members having fingers which engage and electrically connect to the switch terminals.

公开(公告)号：US06570280B2

公开(公告)日：2003-05-27

申请号：US09920863

申请日：2001-08-03

Applicant: Hideyuki Takahashi

Inventor： Hideyuki Takahashi

IPC: H05K334

CPC classification number: H05K3/3447 ,  H01R12/58 ,  H02K3/50 ,  H02K11/33 ,  H05K3/4046 ,  H05K2201/09854 ,  H05K2201/1078 ,  H05K2201/10818 ,  H05K2201/10856

Abstract: A bonding portion of a connector terminal includes embossed portions and a slit. Each embossed portion is formed by embossing the bonding portion in a thicknesswise direction of the bonding portion to provide an embossed recess on one of opposed sides of the bonding portion. Each embossed recess communicates opposed open ends of an elongated hole provided in a circuit board with each other when the bonding portion is inserted to a predetermined position in the elongated hole. The slit penetrates through the bonding portion. The slit extends over at least one of the opposed open ends of the elongated hole in the thickensswise direction of the circuit board when the bonding portion is inserted to the predetermined position in the elongated hole.

公开(公告)号：US20020130739A1

公开(公告)日：2002-09-19

申请号：US10046323

申请日：2002-01-14

Inventor： Martin A. Cotton

IPC: H01P003/08

CPC classification number: H05K1/0218 ,  H01L23/552 ,  H01L2223/6622 ,  H01L2224/16225 ,  H01L2924/00014 ,  H01L2924/15192 ,  H05K1/0221 ,  H05K1/115 ,  H05K3/0035 ,  H05K3/0041 ,  H05K3/4652 ,  H05K2201/09036 ,  H05K2201/09354 ,  H05K2201/09509 ,  H05K2201/09854 ,  H05K2201/09981 ,  H01L2224/0401

Abstract: Construction of printed circuit boards (PCBs) containing electromagnetic shielding and conductive tubes forming signal lines and/or waveguides. The method of construction calls for forming of grooves through layers of the PCB and coating the interior surfaces of these grooves with conductive material. These conductor-coated groove walls serve as conductive surfaces between embedded conductive surfaces on different layers. The conductive surfaces thus joined form a continuous electrically conductive surface that can be configured to act as an electromagnetic shield. Such conductive surfaces may be configured with internal conductors to act as a signal line, or without internal conductors to act as a waveguide.

Abstract translation: 构造包含电磁屏蔽和形成信号线和/或波导的导电管的印刷电路板（PCB）。 施工方法要求通过PCB的层形成凹槽，并用导电材料涂覆这些凹槽的内表面。 这些导体涂覆的槽壁用作不同层上的嵌入的导电表面之间的导电表面。 这样连接的导电表面形成连续的导电表面，该表面可配置为充当电磁屏蔽。 这样的导电表面可以配置有内部导体以用作信号线，或者不具有用作波导的内部导体。

公开(公告)号：US20020076903A1

公开(公告)日：2002-06-20

申请号：US10007703

申请日：2001-12-10

Inventor： Koji Kondo ,  Tetsuaki Kamiya ,  Toshikazu Harada ,  Ryuichi Onoda ,  Yasutaka Kamiya ,  Gentaro Masuda ,  Yoshitaro Yazaki ,  Tomohiro Yokochi

IPC: H01L021/30 ,  H01L021/46 ,  H01L021/4763

CPC classification number: H05K3/4638 ,  H05K3/0035 ,  H05K3/281 ,  H05K3/4069 ,  H05K3/4617 ,  H05K3/4632 ,  H05K2201/0129 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09245 ,  H05K2201/096 ,  H05K2201/09854 ,  H05K2203/063 ,  H05K2203/065 ,  H05K2203/1476 ,  H05K2203/1572 ,  Y10T156/1064

Abstract: Single-sided conductor patterned films are prepared, each of which has a conductor pattern formed only one side of a resin film and via hole filled with conductive paste. A single-sided conductor patterned film which has a conductor pattern formed only one side of a resin film and an opening formed in the resin film so as to expose an electrode is laminated on the single-sided conductor patterned films. Moreover, a cover layer with an opening to expose an electrode is laminated on a bottom surface of the single-sided conductor patterned films to form a laminate. Then, by pressing while heating the laminate, a multilayer substrate having the electrodes at both sides thereof can be produced.

Abstract translation: 制备单面导体图案化膜，其每一个具有只形成树脂膜的一侧的导体图案和填充有导电浆料的通孔。 在单面导体图案化膜上层叠单面导体图案膜，其具有仅形成树脂膜的一侧的导体图案和形成在树脂膜中以露出电极的开口。 此外，在单面导体图案化膜的底面上层叠具有露出电极的开口的覆盖层，以形成层压体。 然后，通过在加热层叠体的同时按压，可以制造在其两侧具有电极的多层基板。

公开(公告)号：US06407343B1

公开(公告)日：2002-06-18

申请号：US09615942

申请日：2000-07-13

Applicant: Shinji Tanaka

Inventor： Shinji Tanaka

IPC: H05K111

CPC classification number: H05K1/114 ,  H01L23/5384 ,  H01L23/5386 ,  H01L2224/16225 ,  H01L2924/15312 ,  H05K1/0289 ,  H05K1/115 ,  H05K2201/09627 ,  H05K2201/09709 ,  H05K2201/09854 ,  H05K2201/10674

Abstract: A wiring layer on which X-directional signal lines 20 to 22 are arranged is formed on a multilayer board. Rectangular power-source conductive patterns 10c are arranged each in which via holes 12c are formed longitudinally or in the wiring direction of the X-directional signal lines 20 to 22. The area (hatched with broken lines) acts as a wiring channel for the X-directional signal line 22.

Abstract translation: 在多层基板上形成配置有X方向信号线20〜22的布线层。 矩形电源导体图案10c布置成沿X方向信号线20至22的纵向或布线方向形成有通孔12c。用虚线划线的区域用作X的布线通道 双向信号线22。

公开(公告)号：US06400028B1

公开(公告)日：2002-06-04

申请号：US09119467

申请日：1998-07-20

Applicant: Edward Allyn Burton

Inventor： Edward Allyn Burton

IPC: H01L2940

CPC classification number: H05K1/115 ,  H05K1/0231 ,  H05K1/114 ,  H05K3/4602 ,  H05K2201/0792 ,  H05K2201/09509 ,  H05K2201/09854

Abstract: An improvement is presented for connecting conductive components of a built-up circuit board. Rather than using vias or micro vias to connect a conductive layer to a conductive component separated by an insulating layer, an elongated via is used. In one embodiment, the elongated via has a length that is sufficient to directly coupled a first layer to the edge of a via in a lower layer. Thus, it can be said that the elongated via “self-aligns” with the via in the lower layer. In doing so, electrical connections from one side of a circuit board to a component coupled to the other side of the circuit board are more direct leading to a reduction in parasitic induction.

Abstract translation: 提出了用于连接积层电路板的导电部件的改进。 不是使用通孔或微通孔将导电层连接到由绝缘层分离的导电部件，而是使用细长的通孔。 在一个实施例中，细长通孔具有足以将第一层直接耦合到下层中的通孔的边缘的长度。 因此，可以说细长通孔与下层中的通孔“自对准”。 在这样做时，从电路板的一侧到耦合到电路板的另一侧的部件的电连接更直接地导致寄生感应的减小。