公开(公告)号：US09456531B2

公开(公告)日：2016-09-27

申请号：US13668461

申请日：2012-11-05

Applicant: DELPHI TECHNOLOGIES, INC.

Inventor： Chris R. Snider ,  Mark A. Jackson

IPC: H05K7/20 ,  H05K9/00 ,  H04B1/08 ,  H05K1/02 ,  H05K5/02 ,  H05K13/00 ,  H04R1/02 ,  B29C59/16 ,  G06F11/00 ,  B60R11/02 ,  H05K1/14

CPC classification number: H05K9/0007 ,  B29C59/16 ,  B60R11/02 ,  G06F11/00 ,  H04B1/082 ,  H04R1/02 ,  H05K1/0215 ,  H05K1/141 ,  H05K5/0217 ,  H05K5/0221 ,  H05K5/0226 ,  H05K7/20409 ,  H05K7/20418 ,  H05K7/20436 ,  H05K9/0047 ,  H05K9/0079 ,  H05K9/0081 ,  H05K13/00 ,  H05K2201/09081 ,  H05K2201/10386 ,  H05K2201/10446 ,  Y10T16/547 ,  Y10T16/5476 ,  Y10T29/49002 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49169 ,  Y10T29/49172 ,  Y10T29/4957 ,  Y10T29/49826 ,  Y10T29/49861 ,  Y10T29/5313 ,  Y10T74/20396 ,  Y10T403/70 ,  Y10T403/77 ,  Y10T428/24289

Abstract: A lightweight audio player for vehicular application is virtually “fastenerless” and includes a fold-up case formed of polymer based material molded to provide details to accept audio devices, as well as the circuit boards required for electrical control and display. The case is of composite structure, including an insert molded electrically conductive wire mesh screen. The wire mesh provides shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. Side wall closure members define self-engaging attachment features for affixing to the case, providing electrical self-grounding with the wire screen and thermal grounding with internal power devices. The major components and subassemblies are self-fixturing during the final assembly process, eliminating the need for dedicated tools, fixtures and assembly equipment.

Abstract translation: 用于车辆应用的轻便音频播放器实际上是“无紧固件”，并且包括由聚合物基材料形成的折叠盒，以形成用于接收音频设备的细节以及用于电气控制和显示所需的电路板。 这种情况是复合结构，包括一个插入模制的导电丝网。 丝网通过暴露的金属丝网垫和相邻的接地夹提供电路板的屏蔽和接地。 侧壁关闭构件限定自身接合附件特征，用于固定到壳体，提供与电线屏蔽的电自身接地和与内部功率器件的热接地。 主要组件和组件在最终组装过程中是自固定的，无需专用工具，夹具和组装设备。

公开(公告)号：US09437947B2

公开(公告)日：2016-09-06

申请号：US14547497

申请日：2014-11-19

Applicant: Douglas M. Johnescu ,  Gregory A. Hull

Inventor： Douglas M. Johnescu ,  Gregory A. Hull

IPC: H01R13/60 ,  H01R12/70 ,  H05K3/30 ,  H01R12/72 ,  H01R13/518

CPC classification number: H01R12/7047 ,  H01R12/724 ,  H01R13/518 ,  H05K3/306 ,  H05K2201/10295 ,  H05K2201/10409 ,  H05K2201/10446 ,  H05K2201/10598 ,  Y10T29/49147

Abstract: An electrical connector include a movable hold down member that is configured to receive a fastener so as to secure the electrical connector to an underlying substrate to which the electrical connector is mounted.

Abstract translation: 电连接器包括可移动的压紧构件，其被配置为接收紧固件，以将电连接器固定到安装有电连接器的下面的基板。

公开(公告)号：US20160088723A1

公开(公告)日：2016-03-24

申请号：US14838355

申请日：2015-08-27

Applicant: KUANG YING COMPUTER EQUIPMENT CO., LTD.

Inventor： HSUAN-HO CHUNG ,  CHIEN-LING TSENG

IPC: H05K1/02 ,  H05K1/14

CPC classification number: H05K1/144 ,  H05K1/0219 ,  H05K1/0225 ,  H05K1/0245 ,  H05K1/117 ,  H05K2201/042 ,  H05K2201/09336 ,  H05K2201/09718 ,  H05K2201/10189 ,  H05K2201/10446

Abstract: A stack structure of a high frequency printed circuit, mainly includes a transmission conductor pin group in a form of single row, where each signal pair and each transmission pair of the transmission conductor pin group respectively have a through hole portion thereon, and the inner layer of the circuit board has a trace portion in electric connection with the through hole portion, allowing each four terminals to be formed into one group. Utilizing the clever arrangement of the through hole portions and trace portions separates each terminal properly, thereby increasing the property of transmitted signals, and, at the same time, reducing noise interferences such as EMI and RFI.

Abstract translation: 高频印刷电路的堆叠结构主要包括单列形式的发送导体引脚组，其中每个信号对和发送导体引脚组的每个传输对在其上分别具有通孔部分，并且内层 电路板具有与通孔部分电连接的迹线部分，允许将四个端子形成为一组。 利用通孔部分和迹线部分的巧妙布置正确地分离每个端子，从而增加了传输信号的性质，同时降低了EMI和RFI等噪声干扰。

公开(公告)号：US09173332B2

公开(公告)日：2015-10-27

申请号：US14030739

申请日：2013-09-18

Applicant: DELPHI TECHNOLOGIES, INC.

Inventor： Vineet Gupta ,  Joseph K. Huntzinger ,  Michael G. Coady ,  Curtis Allen Stapert ,  Kevin Earl Meyer ,  Timothy D. Garner ,  Jeffrey T. Bell ,  Robert L. Vadas ,  Donald G. Moeschberger ,  Rick L. Hatcher ,  Quan N. Nguyen

IPC: H04R1/00 ,  H05K9/00 ,  H04B1/08 ,  H05K1/02 ,  H05K7/20 ,  H05K5/02 ,  H05K13/00 ,  H04R1/02 ,  B29C59/16 ,  G06F11/00 ,  B60R11/02 ,  H05K1/14

CPC classification number: H05K9/0007 ,  B29C59/16 ,  B60R11/02 ,  G06F11/00 ,  H04B1/082 ,  H04R1/02 ,  H05K1/0215 ,  H05K1/141 ,  H05K5/0217 ,  H05K5/0221 ,  H05K5/0226 ,  H05K7/20409 ,  H05K7/20418 ,  H05K7/20436 ,  H05K9/0047 ,  H05K9/0079 ,  H05K9/0081 ,  H05K13/00 ,  H05K2201/09081 ,  H05K2201/10386 ,  H05K2201/10446 ,  Y10T16/547 ,  Y10T16/5476 ,  Y10T29/49002 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49169 ,  Y10T29/49172 ,  Y10T29/4957 ,  Y10T29/49826 ,  Y10T29/49861 ,  Y10T29/5313 ,  Y10T74/20396 ,  Y10T403/70 ,  Y10T403/77 ,  Y10T428/24289

Abstract: A lightweight radio/CD player for vehicular application includes a case and frontal interface formed of polymer based material molded to provide details to accept audio devices and radio receivers, as well as the circuit boards required for electrical control and display. The case and frontal interface are of composite structure, including an insert molded electrically conductive wire mesh screen that has been pre-formed to contour with the molding operation. The wire mesh provides shielding and grounding of the circuit boards via exposed wire mesh pads and adjacent ground clips. The PCB architecture is bifurcated into a first board carrying common circuit components in a surface mount configuration suitable for high volume production, and a second board carrying application specific circuit components in a wave soldered stick mount configuration.

Abstract translation: 用于车辆应用的轻量级无线电/ CD播放器包括由聚合物基材料模制的壳体和正面接口，以提供接收音频设备和无线电接收器的细节以及电气控制和显示所需的电路板。 外壳和正面接口为复合结构，包括已经通过模制操作预先形成轮廓的镶嵌模制导电丝网。 丝网通过暴露的金属丝网垫和相邻的接地夹提供电路板的屏蔽和接地。 PCB结构分为第一板，其承载具有适合于大批量生产的表面安装配置中的公共电路部件，以及第二板，其以波焊焊棒安装配置的方式承载特定于应用的电路部件。

公开(公告)号：US20150264820A1

公开(公告)日：2015-09-17

申请号：US14721973

申请日：2015-05-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Hyojae BANG ,  Dogeun KIM ,  Hongkyun KIM ,  Youngbok JEON

IPC: H05K5/00 ,  H05K1/18 ,  G06F1/18

CPC classification number: H05K5/0026 ,  G06F1/18 ,  G06F1/185 ,  G06K7/0047 ,  H01R12/57 ,  H01R12/721 ,  H01R13/00 ,  H01R23/70 ,  H01R27/00 ,  H05K1/0295 ,  H05K1/11 ,  H05K1/117 ,  H05K1/181 ,  H05K3/10 ,  H05K3/303 ,  H05K3/3405 ,  H05K7/02 ,  H05K13/00 ,  H05K2201/09409 ,  H05K2201/09709 ,  H05K2201/09954 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10446 ,  Y10S439/946 ,  Y10S439/951 ,  Y10T29/49124 ,  Y10T29/49147

Abstract: Example embodiments are directed to circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same, which are common to at least two different form factors.

Abstract translation: 示例性实施例涉及电路板，连接器，外壳，电路板组件，壳体组件，其制造方法及其制造方法，这对于至少两种不同的形状因子是共同的。

公开(公告)号：US20150245465A1

公开(公告)日：2015-08-27

申请号：US14188555

申请日：2014-02-24

Applicant: Honeywell International Inc.

Inventor： Lance LeRoy Sundstrom

IPC: H05K1/02 ,  H05K3/30 ,  H05K1/18 ,  H01L23/367 ,  H05K1/11

CPC classification number: H05K1/0207 ,  H01L23/36 ,  H01L23/3675 ,  H01L23/485 ,  H01L23/49822 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L25/16 ,  H01L2224/04026 ,  H01L2224/05571 ,  H01L2224/06051 ,  H01L2224/06102 ,  H01L2224/29078 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/32268 ,  H01L2224/83191 ,  H01L2224/8323 ,  H01L2224/83815 ,  H01L2224/83855 ,  H01L2224/83885 ,  H01L2224/83986 ,  H01L2924/10158 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H05K1/0203 ,  H05K1/111 ,  H05K1/181 ,  H05K1/183 ,  H05K3/303 ,  H05K3/305 ,  H05K3/3442 ,  H05K2201/10446 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/01051 ,  H01L2924/0665 ,  H01L2924/00014

Abstract: An assembly including a substrate that includes a plurality of conductive plane layers including a first group and a second group of common conductive plane layers, where electrically isolated first and second attach pads are on an edge surface of the substrate and at least thermally coupled to the first and second groups of common conductive plane layers, respectively. A surface mount technology (SMT) component, such as a thermal jumper, mounted on the first and second attach pads such that the SMT component is at least thermally coupled to the first and second groups of common conductive plane layers via the first and second attach pads, respectively. Methods of forming such an assembly also are disclosed.

Abstract translation: 一种包括衬底的组件，其包括包括第一组和第二组公共导电平面层的多个导电平面层，其中电隔离的第一和第二附接焊盘位于衬底的边缘表面上，并且至少热耦合到 第一组和第二组共同导电平面层。 安装在第一和第二附接焊盘上的表面贴装技术（SMT）部件，例如热跳线，使得SMT部件至少经由第一和第二连接热耦合到第一和第二组公共导电平面层 垫片。 公开了形成这种组件的方法。

公开(公告)号：US20150156876A1

公开(公告)日：2015-06-04

申请号：US14622328

申请日：2015-02-13

Applicant: Hyojae BANG ,  Dogeun KIM ,  Hongkyun KIM ,  Youngbok JEON

Inventor： Hyojae BANG ,  Dogeun KIM ,  Hongkyun KIM ,  Youngbok JEON

IPC: H05K1/11

CPC classification number: H05K5/0026 ,  G06F1/18 ,  G06F1/185 ,  G06K7/0047 ,  H01R12/57 ,  H01R12/721 ,  H01R13/00 ,  H01R23/70 ,  H01R27/00 ,  H05K1/0295 ,  H05K1/11 ,  H05K1/117 ,  H05K1/181 ,  H05K3/10 ,  H05K3/303 ,  H05K3/3405 ,  H05K7/02 ,  H05K13/00 ,  H05K2201/09409 ,  H05K2201/09709 ,  H05K2201/09954 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10446 ,  Y10S439/946 ,  Y10S439/951 ,  Y10T29/49124 ,  Y10T29/49147

Abstract: Example embodiments are directed to circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same, which are common to at least two different form factors.

公开(公告)号：US09012782B2

公开(公告)日：2015-04-21

申请号：US13960287

申请日：2013-08-06

Applicant: Harris Corporation

Inventor： Anders P. Pedersen ,  Daniel A. Robison ,  Alan W. Mast

IPC: H05K1/11 ,  H05K1/14 ,  H05K3/36 ,  H05K3/40 ,  H05K1/02 ,  H05K3/30

CPC classification number: H05K1/144 ,  H05K1/0219 ,  H05K1/111 ,  H05K1/117 ,  H05K1/142 ,  H05K3/301 ,  H05K3/366 ,  H05K3/403 ,  H05K2201/09145 ,  H05K2201/0919 ,  H05K2201/09481 ,  H05K2201/09809 ,  H05K2201/10446

Abstract: A method is for making a printed wiring board (PWB) assembly. The method may include forming a first PWB having a plurality of first electrically conductive pads, forming a second PWB including a plurality of electrically conductive traces having exposed ends on an edge surface of the second PWB, and covering the edge surface of the second PWB with an electrically conductive layer. The method may also include selectively removing portions of the electrically conductive layer to define a plurality of second electrically conductive pads electrically connected to corresponding ones of the exposed ends of the electrically conductive traces, and assembling the first and second PWBs together so that the first and second electrically conductive pads are electrically coupled together to define the PWB assembly.

Abstract translation: 一种制造印刷电路板（PWB）组件的方法。 该方法可以包括形成具有多个第一导电焊盘的第一PWB，形成第二PWB，第二PWB包括在第二PWB的边缘表面上具有暴露端的多个导电迹线，并且用第二PWB的边缘表面覆盖第二PWB的边缘表面 导电层。 该方法还可以包括选择性地去除导电层的部分以限定电连接到导电迹线的相应的暴露端的多个第二导电焊盘，以及将第一和第二PWB组合在一起，使得第一和 第二导电焊盘电耦合在一起以限定PWB组件。

公开(公告)号：US09011177B2

公开(公告)日：2015-04-21

申请号：US13987296

申请日：2011-02-14

Applicant: Brian Keith Lloyd ,  Christopher David Hirschy ,  Munawar Ahmad ,  Eran J. Jones ,  Stephen W. Hamblin ,  Darian Ross Schulz ,  Todd David Ward ,  Gregory B. Walz ,  Ebrahim Abunasrah ,  Rehan M. Khan

Inventor： Brian Keith Lloyd ,  Christopher David Hirschy ,  Munawar Ahmad ,  Eran J. Jones ,  Stephen W. Hamblin ,  Darian Ross Schulz ,  Todd David Ward ,  Gregory B. Walz ,  Ebrahim Abunasrah ,  Rehan M. Khan

IPC: H01R13/58 ,  H01B11/00 ,  H01R13/6593 ,  H05K1/02 ,  H05K3/22

CPC classification number: H01R13/6461 ,  H01B11/00 ,  H01R13/6471 ,  H01R13/6592 ,  H01R13/6593 ,  H05K1/0243 ,  H05K3/222 ,  H05K2201/10189 ,  H05K2201/10356 ,  H05K2201/10446 ,  H05K2201/10674

Abstract: A cable bypass assembly is disclosed for use in providing a high speed transmission line for connecting a board mounted connector of an electronic device to a chip on the device board. The bypass cable assembly has a structure that permits it, where it is terminated to the board mounted connector and the chip member, or closely proximate thereto to replicate closely the geometry of the cable. The connector terminals are arranged in alignment with the cable signal conductors and shield extensions are provided so that shielding can be provided up to and over the termination between the cable signal conductors and the board connector terminal tails. Likewise, a similar termination structure is provided at the opposite end of the cable where a pair of terminals are supported by a second connector body and enclosed in a shield collar. The shield collar has an extension that engages the second end of the cable.

Abstract translation: 公开了一种电缆旁路组件，用于提供用于将电子设备的板安装的连接器连接到设备板上的芯片的高速传输线。 旁路电缆组件具有允许它的结构，其中它终止于板安装的连接器和芯片构件，或者紧靠其附近，以紧密地复制电缆的几何形状。 连接器端子布置成与电缆信号导体对准，并且设置屏蔽延伸部，使得可以在电缆信号导体和电路板连接器端子尾部之间的终端之间提供屏蔽。 类似地，在电缆的相对端处提供类似的端接结构，其中一对端子由第二连接器主体支撑并封闭在屏蔽环中。 屏蔽套环具有接合电缆第二端的延伸部。

公开(公告)号：US20150082626A1

公开(公告)日：2015-03-26

申请号：US14258985

申请日：2014-04-22

Applicant: Permlight Products, Inc.

Inventor： John Popovich ,  Gregory W. Honegger

IPC: F21V15/01 ,  H05K3/32 ,  F21K99/00

CPC classification number: F21V29/70 ,  A47C7/725 ,  F21K9/00 ,  F21K9/60 ,  F21K9/90 ,  F21V7/0025 ,  F21V7/005 ,  F21V19/001 ,  F21V29/507 ,  F21V29/74 ,  F21V29/89 ,  F21Y2103/10 ,  F21Y2115/10 ,  G09F9/33 ,  G09F13/22 ,  H05K1/0203 ,  H05K3/0061 ,  H05K3/32 ,  H05K2201/10106 ,  H05K2201/10446 ,  H05K2201/10598 ,  Y10S362/80 ,  Y10T29/49133 ,  Y10T29/49826

Abstract: A modular light emitting diode (LED) mounting configuration is provided including a light source module having a plurality of pre-packaged LEDs arranged in a serial array. The module includes a heat conductive body portion adapted to conduct heat generated by the LEDs to an adjacent heat sink. As a result, the LEDs are able to be operated with a higher current than normally allowed. Thus, brightness and performance of the LEDs is increased without decreasing the life expectancy of the LEDs. The LED modules can be used in a variety of illumination applications employing one or more modules.

Abstract translation: 提供了一种模块化发光二极管（LED）安装配置，其包括具有以串联阵列布置的多个预先封装的LED的光源模块。 该模块包括适于将由LED产生的热量传导到相邻散热器的导热体部分。 因此，LED能够以比正常允许的更高的电流工作。 因此，增加LED的亮度和性能而不降低LED的寿命。 LED模块可用于采用一个或多个模块的各种照明应用。