Semiconductor apparatus
    12.
    发明授权

    公开(公告)号:US11594601B2

    公开(公告)日:2023-02-28

    申请号:US16764622

    申请日:2018-11-15

    Applicant: FLOSFIA INC.

    Abstract: A semiconductor apparatus capable of reducing the leakage current in the reverse direction, and keeping characteristics thereof, even when using n type semiconductor (gallium oxide, for example) or the like having a low-loss at a high voltage and having much higher dielectric breakdown electric field strength than SiC is provided. A semiconductor apparatus includes a crystalline oxide semiconductor having a corundum structure as a main component, and an electric field shield layer and a gate electrode that are respectively laminated directly or through other layers on the n type semiconductor layer, wherein the electric field shield layer includes a p type oxide semiconductor, and is embedded in the n type semiconductor layer deeper than the gate electrode.

    Semiconductor device
    13.
    发明授权

    公开(公告)号:US11495695B2

    公开(公告)日:2022-11-08

    申请号:US17259630

    申请日:2019-07-10

    Applicant: FLOSFIA INC.

    Abstract: A semiconductor device with enhanced semiconductor characteristics that is useful for power devices. A semiconductor device, including: an n-type semiconductor layer; an electrode; two or more p-type semiconductors provided between the n-type semiconductor layer and the electrode, the n-type semiconductor layer containing a corundum-structured crystallin oxide semiconductor as a major component, a number of the two or more p-type semiconductor that is equal to or more than three, and the two or more p-type semiconductors that are embedded in the n-type semiconductor layer.

    Multilayer structure and method of forming the same

    公开(公告)号:US11462746B2

    公开(公告)日:2022-10-04

    申请号:US15941165

    申请日:2018-03-30

    Applicant: FLOSFIA INC.

    Abstract: In a first aspect of a present inventive subject matter, a multilayer structure includes a base with a surface and an electrically-conductive metal oxide film that is positioned directly or via another layer on the base. At least a part of the surface of the base contains as a major component at least one selected from the group of copper, copper alloy, aluminum, aluminum alloy, magnesium, magnesium alloy, and stainless steel. The electrically-conductive metal oxide film is 30 nm or more in thickness. The multilayer structure is electrically-conductive and has a contact resistance that is 100 mΩcm2 or less.

    SEMICONDUCTOR ELEMENT AND SEMICONDUCTOR DEVICE

    公开(公告)号:US20220231174A1

    公开(公告)日:2022-07-21

    申请号:US17711342

    申请日:2022-04-01

    Applicant: FLOSFIA INC.

    Inventor: Osamu IMAFUJI

    Abstract: Provided is a semiconductor element including at least a multilayer structure including a semiconductor layer, a first metal layer, a second metal layer and a third metal layer, the semiconductor layer including an oxide semiconductor film, the first metal layer, the second metal layer and the third metal layer being arranged on the semiconductor layer, the first metal layer, the second metal layer and the third metal layer respectively including one or two or more different metals, the first metal layer being in ohmic contact with the semiconductor layer, the second metal layer being disposed between the first metal layer and the third metal layer, and the second metal layer containing Pt or/and Pd.

    OXIDE SEMICONDUCTOR FILM AND SEMICONDUCTOR DEVICE

    公开(公告)号:US20220140083A1

    公开(公告)日:2022-05-05

    申请号:US17573790

    申请日:2022-01-12

    Applicant: FLOSFIA INC.

    Inventor: Ryohei KANNO

    Abstract: A first raw material solution containing at least aluminum is atomized to generate first atomized droplets and a second raw material solution containing at least gallium and a dopant is atomized to generate second atomized droplets, and subsequently, the first atomized droplets are carried into a film forming chamber using a first carrier gas and the second atomized droplets are carried into the film forming chamber using a second carrier gas, and then the first atomized droplets and the second atomized droplets are mixed in the film forming chamber, and the mixed atomized droplets are thermally reacted in the vicinity of a surface of the base to form an oxide semiconductor film on the base, the oxide semiconductor film including, as a major component, a metal oxide containing at least aluminum and gallium, wherein the oxide semiconductor film has a mobility of no less than 5 cm2/Vs.

Patent Agency Ranking