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公开(公告)号：US11757428B2
公开(公告)日：2023-09-12
申请号：US17853987
申请日：2022-06-30
Applicant: YEDA RESEARCH AND DEVELOPMENT CO. LTD. , B. G. NEGEV TECHNOLOGIES AND APPLICATIONS LTD., at Ben-Gurion University
Inventor： Reshef Tenne , Ernesto Joselevich , Yiftach Divon , Roi Levi , Assaf Yaakobovitz , Dan Yudilevich
CPC classification number: H03H9/2463 , B82B1/002 , H03B5/30 , H03H9/02259 , B81B2201/0271 , H03H2009/02322
Abstract: This invention provides electromechanical resonators based on metal chalcogenide nanotubes. The invention further provides methods of fabrication of electromechanical resonators and methods of use of such electromechanical resonators.
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公开(公告)号：US11746000B2
公开(公告)日：2023-09-05
申请号：US17161724
申请日：2021-01-29
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Yutaka Kishimoto , Shinsuke Ikeuchi , Katsumi Fujimoto , Tetsuya Kimura , Fumiya Kurokawa
CPC classification number: B81B3/00 , B81B7/02 , B81B2201/0271 , B81B2203/04
Abstract: A MEMS device includes a membrane portion, a piezoelectric layer made of a piezoelectric single crystal, a first electrode on a first surface of the piezoelectric layer, a second electrode on a second surface of the piezoelectric layer opposite to the first direction, and a first layer covering the first surface of the piezoelectric layer. At least a portion of the piezoelectric layer is included in the membrane portion. Each of the first electrode and the second electrode has a tapered cross-sectional shape with a width which decreases with increasing distance from the piezoelectric layer on a cross section along a plane vertical to the surface in the first direction.
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公开(公告)号：US11703356B1
公开(公告)日：2023-07-18
申请号：US18097298
申请日：2023-01-16
Applicant: NATIONAL UNIVERSITY OF DEFENSE TECHNOLOGY
Inventor： Kun Lu , Dingbang Xiao , Yan Shi , Xuezhong Wu , Xiang Xi , Yongmeng Zhang
CPC classification number: G01C25/00 , B81B7/02 , B81C1/00626 , G01C19/56 , B81B2201/0242 , B81B2201/0271 , B81C2201/0143
Abstract: An online trimming device and method for a micro-shell resonator gyroscope is provided. A micro-shell resonator gyroscope fixing fixture and a mode test circuit in the device are placed in a vacuum test cavity provided with a circuit interface. The mode test circuit and a host computer are connected through a circuit interface on the vacuum test cavity. The gyroscope fixing fixture is provided with a signal interface, and the electrodes on the gyroscope substrate are connected to the signal interface. The signal interface on the fixture is connected to the mode test circuit. The laser etching module is located at the top of the device. An opening is formed in the gyroscope fixing fixture. The vacuum test cavity is provided with a transparent trimming window. The laser acts on the edge of the resonant structure of the gyroscope through the trimming window and the through hole of the fixture.
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公开(公告)号：US11667517B2
公开(公告)日：2023-06-06
申请号：US16908243
申请日：2020-06-22
Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
Inventor： Yu-Chia Liu , Chia-Hua Chu , Chun-Wen Cheng
CPC classification number: B81B7/0006 , B81B7/0051 , B81C1/00246 , B81B2201/0257 , B81B2201/0264 , B81B2201/0271 , B81C2201/0132 , B81C2201/0133 , B81C2201/0176 , B81C2201/0181 , B81C2201/112 , B81C2203/0714 , B81C2203/0735
Abstract: Representative methods for sealing MEMS devices include depositing insulating material over a substrate, forming conductive vias in a first set of layers of the insulating material, and forming metal structures in a second set of layers of the insulating material. The first and second sets of layers are interleaved in alternation. A dummy insulating layer is provided as an upper-most layer of the first set of layers. Portions of the first and second set of layers are etched to form void regions in the insulating material. A conductive pad is formed on and in a top surface of the insulating material. The void regions are sealed with an encapsulating structure. At least a portion of the encapsulating structure is laterally adjacent the dummy insulating layer, and above a top surface of the conductive pad. An etch is performed to remove at least a portion of the dummy insulating layer.
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公开(公告)号：US20180312399A1
公开(公告)日：2018-11-01
申请号：US15768531
申请日：2016-10-06
Applicant: AGENCY FOR SCIENCE, TECHNOLOGY AND RESEARCH
Inventor： Navab SINGH , Jae Wung LEE , Srinivas MERUGU
CPC classification number: B81C1/00246 , B06B1/0666 , B81B7/008 , B81B2201/0271 , B81B2203/0127 , B81B2203/0307 , B81B2203/0315 , B81B2203/04 , B81B2207/015 , B81B2207/07 , B81C1/00039 , B81C2203/0735
Abstract: Various embodiments may provide a device arrangement. The device arrangement may include a substrate including a conductive layer. The device arrangement may further include a microelectromechanical systems (MEMS) device monolithically integrated with the substrate, wherein the MEMS device may be electrically coupled to the conductive layer. A cavity may be defined through the conductive layer for acoustically isolating the MEMS device MEMS device from the substrate. At least one anchor structure may be defined by the conductive layer to support the MEMS device.
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Patent Agency Ranking
公开(公告)号：US20180183404A1
公开(公告)日：2018-06-28
申请号：US15850453
申请日：2017-12-21
Applicant: Commissariat A L'Energie Atomique Et Aux Energies Alternatives , Safran Electronics & Defense
Inventor： Guillaume Jourdan , Guillaume Lehee
CPC classification number: H03H9/02448 , B81B3/0045 , B81B2201/0235 , B81B2201/0242 , B81B2201/0271 , G01P15/003 , G01P15/0802 , G01P2015/0882 , H03H3/0072 , H03H9/02338 , H03H9/2452 , H03H2009/02307
Abstract: Microelectronic structure comprising a mobile mass mechanically linked to a first and to a second mechanical element by first and second mechanical linking device respectively, a polarisation source for the second mechanical linking device. The second mechanical linking means comprises two linking elements and a thermal reservoir placed between the linking elements, where at least one of the linking elements is made of piezoresistive material, where at least one of the first and second linking elements exhibit thermoelasticity properties. The thermal reservoir exhibits a thermal capacity which is different from those of the linking elements. The second linking device and the mobile mass are arranged relative to each other such that displacement of the mobile mass applies a mechanical stress to the second linking means.
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公开(公告)号：US10006888B2
公开(公告)日：2018-06-26
申请号：US15135210
申请日：2016-04-21
Applicant: The Boeing Company
Inventor： Keith D. Humfeld , Morteza Safai
CPC classification number: G01N29/262 , B06B1/045 , B06B2201/53 , B81B2201/0271 , B81C3/001 , B82Y30/00 , C01B32/16 , C01B32/168 , C01B2202/08 , G01N29/043 , G01N29/2431 , G01N2291/023 , G01N2291/0427 , G01N2291/044 , G01N2291/106 , G01N2291/2632 , G01N2291/2638
Abstract: A plurality of micro-electro-mechanical system (MEMS) transducers in a phased array are coupled to a flexible substrate using carbon nanotubes (CNTs) for conformal ultrasound scanning. Each transducer comprises a cantilever, magnetic material deposited on the cantilever, and a solenoid positioned relative to the magnetic material. The carbon nanotubes are grown on the cantilever and mechanically couple the transducer to one side of the flexible substrate. The other side of the flexible substrate is applied to a surface of a part under inspection, and the transducers are electrically connected to a processer to cause movement of the cantilevers when the solenoids are energized by the processor. The movement of the cantilevers results in movement of the carbon nanotubes, which imparts a force to the flexible substrate that results in ultrasound waves, which permeate the part. Returns from the ultrasound waves are interpreted by the processor to generate images of the part.
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公开(公告)号：US20180155186A1
公开(公告)日：2018-06-07
申请号：US15805031
申请日：2017-11-06
Applicant: SiTime Corporation
Inventor： Pavan Gupta , Aaron Partridge , Markus Lutz
IPC: B81B7/00
CPC classification number: B81B7/0083 , B81B7/007 , B81B7/0077 , B81B2201/0271 , B81B2207/07 , B81B2207/094 , B81C1/0023 , B81C1/00301 , B81C1/00333 , B81C1/00341 , B81C2201/016 , B81C2203/0118 , B81C2203/0154 , H01L23/3107 , H01L23/34 , H01L23/498 , H01L2224/48091 , H01L2224/48245 , H01L2224/48247 , H01L2224/73265 , H01L2924/01019 , H01L2924/10253 , H01L2924/1461 , H01L2924/181 , H01L2924/00 , H01L2924/00014 , H01L2924/00012
Abstract: A low-profile packaging structure for a microelectromechanical-system (MEMS) resonator system includes an electrical lead having internal and external electrical contact surfaces at respective first and second heights within a cross-sectional profile of the packaging structure and a die-mounting surface at an intermediate height between the first and second heights. A resonator-control chip is mounted to the die-mounting surface of the electrical lead such that at least a portion of the resonator-control chip is disposed between the first and second heights and wire-bonded to the internal electrical contact surface of the electrical lead. A MEMS resonator chip is mounted to the resonator-control chip in a stacked die configuration and the MEMS resonator chip, resonator-control chip and internal electrical contact and die-mounting surfaces of the electrical lead are enclosed within a package enclosure that exposes the external electrical contact surface of the electrical lead at an external surface of the packaging structure.
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公开(公告)号：US20180151622A1
公开(公告)日：2018-05-31
申请号：US15494272
申请日：2017-04-21
Applicant: Silterra Malaysia Sdn. Bhd.
CPC classification number: H01L27/20 , B81B2201/0271 , B81B2207/015 , B81C1/00246 , H03H9/0538 , H03H9/173 , H03H9/25
Abstract: Monolithic integrated device having an architecture that allows an acoustic device to transduce either surface acoustic waves or bulk acoustic waves, comprising: a substrate layer being the base of the device; an inter-layer dielectric disposed on top of the substrate layer; an electronic circuitry substantially formed in the inter-layer dielectric and supported by the substrate layer, the electronic circuitry comprises a plurality of metal layers; and a piezoelectric layer being sandwiched between a top electrode and a bottom electrode within the inter-layer dielectric. The top electrode is an upper metal layer belonging to the electronic circuitry and the bottom electrode is a lower metal layer belonging to the electronic circuitry. To transduce the bulk acoustic waves, the inter-layer dielectric is formed with a top cavity above the top electrode and a bottom cavity below the bottom electrode.
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公开(公告)号：US09969606B2
公开(公告)日：2018-05-15
申请号：US15064879
申请日：2016-03-09
Applicant: MURATA MANUFACTURING CO., LTD.
Inventor： Matti Liukku , Jaakko Ruohio , Hannu Vesterinen
IPC: B81B3/00 , G01P15/125 , H01G5/14 , G01P15/08
CPC classification number: B81B3/0045 , B81B3/0056 , B81B3/0086 , B81B2201/0221 , B81B2201/0271 , G01P15/125 , G01P2015/0814 , H01G5/14
Abstract: A MEMS structure that provides an improved way to selectively control electromechanical properties of a MEMS device with an applied voltage. The MEMS structure includes a capacitor element that comprises at least one stator element, and at least one rotor element suspended for motion parallel to a first direction in relation to the stator element. The stator element and the rotor element form at least one capacitor element, the capacitance of which varies according to displacement of the rotor element from an initial position. The stator element and the rotor element are mutually oriented such that in at least one range of displacements of the rotor element from an initial position, the second derivative of the capacitance with respect to the displacement has negative values.
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