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公开(公告)号:US20110315882A1
公开(公告)日:2011-12-29
申请号:US12876352
申请日:2010-09-07
Applicant: CHUN-HUA HU , CHANG-HONG LIU , SHOU-SHAN FAN
Inventor: CHUN-HUA HU , CHANG-HONG LIU , SHOU-SHAN FAN
IPC: G01J5/00
CPC classification number: G01J5/16 , B82Y30/00 , G01J1/1626 , G01J5/02 , G01J5/023 , G01J5/04 , G01J5/048 , G01J5/12 , G01J5/14 , G01J2005/065 , G01J2005/068 , G01N2201/022 , H01L35/32 , H01L51/0048 , H01L51/441 , H01L51/448 , H01L2031/0344
Abstract: An infrared detector includes a detecting element, a first electrode, a second electrode, and a covering structure. The detecting element defines an absorbing part and a non-absorbing part. The detecting element includes a first end and a second end opposite with the first end. The first end is disposed in the absorbing part. The second end is disposed in the non-absorbing part. The first electrode is electrically connected with the first end. The second electrode is electrically connected with the second end. The covering structure covers the non-absorbing part.
Abstract translation: 红外检测器包括检测元件,第一电极,第二电极和覆盖结构。 检测元件限定吸收部分和非吸收部分。 检测元件包括第一端和与第一端相对的第二端。 第一端设置在吸收部中。 第二端设置在非吸收部。 第一电极与第一端电连接。 第二电极与第二端电连接。 覆盖结构覆盖非吸收部分。
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公开(公告)号:US20110266445A1
公开(公告)日:2011-11-03
申请号:US12799628
申请日:2010-04-28
Applicant: Howard Beratan
Inventor: Howard Beratan
IPC: G01J5/02 , H01L21/50 , H01L27/144
CPC classification number: H01L37/00 , G01J1/02 , G01J1/0204 , G01J1/04 , G01J1/0411 , G01J1/0429 , G01J1/0488 , G01J4/04 , G01J5/02 , G01J5/0215 , G01J5/023 , G01J5/024 , G01J5/06 , G01J5/08 , G01J5/0806 , G01J5/0825 , G01J5/0862 , G01J5/20 , G01J2005/065 , G01N21/3581 , H01L27/14621 , H01L27/14627 , H01L27/14669 , H01L27/14683
Abstract: A thermal absorption structure of a radiation thermal detector element may include an optically transitioning material configured such that optical conductivity of the thermal absorption structure is temperature sensitive and such that the detector element absorbs radiation less efficiently as its temperature increases, thus reducing its ultimate maximum temperature.
Abstract translation: 辐射热检测器元件的热吸收结构可以包括光学过渡材料,其被配置为使得热吸收结构的光学导电性是温度敏感的,并且使得检测器元件随着其温度升高而更低效地吸收辐射,从而降低其最终最高温度 。
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13.
公开(公告)号:US20090266988A1
公开(公告)日:2009-10-29
申请号:US12094964
申请日:2006-11-24
Applicant: Yoshiaki Honda , Takayuki Nishikawa , Tomohiro Kamitsu
Inventor: Yoshiaki Honda , Takayuki Nishikawa , Tomohiro Kamitsu
IPC: G01J5/08
CPC classification number: G01J5/08 , G01J5/024 , G01J5/06 , G01J5/0806 , G01J5/0831 , G01J5/0875 , G01J5/0881 , G01J2005/065 , G02B3/00 , G02B3/0056 , G02B5/281 , H01L31/0203 , H01L31/02164 , H01L31/02325 , H01L2224/48091 , H01L2924/00014
Abstract: An infrared detection unit includes a base carrying an infrared sensor element, and a cap configured to be fitted on the base to surround the infrared sensor element. The cap has a top wall with a window in which a semiconductor lens is fitted to collect an infrared radiation onto the infrared sensor element. The semiconductor optical lens is formed from a semiconductor substrate to have a convex lens and a flange which surround said convex lens. An infrared barrier is formed on the semiconductor lens to block the infrared radiation from passing through the boundary between the circumference of the convex lens and the window. Accordingly, the infrared sensor element can receive only the infrared radiation originating from a detection area intended by the convex lens.
Abstract translation: 红外线检测单元包括承载红外线传感器元件的基座和被配置为安装在基座上以包围红外线传感器元件的帽。 盖具有顶壁,其中安装有半导体透镜以将红外辐射收集到红外传感器元件上的窗口。 半导体光学透镜由半导体衬底形成为具有凸透镜和围绕所述凸透镜的凸缘。 在半导体透镜上形成红外阻挡层,以阻挡红外辐射通过凸透镜的圆周与窗口之间的边界。 因此,红外线传感器元件仅能够接收来自凸透镜所预期的检测区域的红外线辐射。
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14.
公开(公告)号:US20240192059A1
公开(公告)日:2024-06-13
申请号:US18554076
申请日:2022-05-06
Applicant: trinamiX GmbH
Inventor: Tobias BAUMGARTNER , Sourabh KULKARNI , Celal Mohan OEGUEN
CPC classification number: G01J5/28 , G01J5/06 , G01J5/52 , G01J2005/065 , G01J2005/283
Abstract: The present invention refers to a device (112) for monitoring an emission temperature of at least one radiation emitting element (114), a heating system (110) for heating at the least one radiation emitting element (114) to emit thermal radiation at an emission temperature, a method for monitoring an emission temperature of at least one radiation emitting element (114) and method for heating the at least one radiation emitting element (114) to emit thermal radiation at an emission temperature. Herein, the device (112) for monitoring an emission temperature of at least one radiation emitting element (114) comprises—at least one light source (125), wherein the light source is configured to emit optical radiation at least partially towards the at least one radiation emitting element (114); —at least one radiation sensitive element (126), wherein the at least one radiation sensitive element (126) has at least one sensor region (128), wherein the at least one sensor region (128) comprises at least one photosensitive material selected from at least one photoconductive material, wherein the at least one sensor region (128) is designated for generating at least one sensor signal depending on an intensity of the thermal radiation emitted by the at least one radiation emitting element (114) and received by the sensor region (128) within at least one wavelength range, wherein the sensor region (128) is further designated for generating at least one further sensor signal depending on an intensity of the optical radiation emitted by the at least one light source (125) and received by the sensor region (128) within at least one further wavelength range, wherein the at least one radiation sensitive element (126) is arranged in a manner that the thermal radiation travels through at least one transition material (116) prior to being received by the at least one radiation sensitive element (126), wherein at least one of the at least one light source (125) and the at least one radiation sensitive element (126) is arranged in a manner that the optical radiation travels through the at least one transition material (116) and impinges the at least one radiation emitting element (114) prior to being received by the at least one radiation sensitive element (126); and—at least one evaluation unit (138), wherein the at least one evaluation unit (138) is configured to determine the emission temperature of the at least one radiation emitting element (114) by using values for the intensity of the thermal radiation and the optical radiation.
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公开(公告)号:US20230204432A1
公开(公告)日:2023-06-29
申请号:US18088611
申请日:2022-12-25
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor: Hyunguk YOO , Injo JEONG , Jeahyuck LEE , Seongwook JO , Younghyun KIM , Seungwon LEE
Abstract: An electronic device includes a housing including a first area provided to transmit light and a sensor hole formed in the first area. A circuit board is disposed inside the housing, a first sensor is connected to the circuit board, and a shield member is configured to block the sensor hole and provide a heat transfer path from exterior of the housing to the first sensor. A conductive material for heat conduction is disposed on at least a portion of the housing surrounding the sensor hole.
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公开(公告)号:US20180299329A1
公开(公告)日:2018-10-18
申请号:US15485942
申请日:2017-04-12
Applicant: RAYTHEON COMPANY
Inventor: Paolo Masini , John William Devitt
CPC classification number: G01J5/046 , B81B3/0081 , B81B2201/0207 , G01J5/0245 , G01J5/045 , G01J5/06 , G01J5/20 , G01J5/22 , G01J2005/065 , H01L31/02164
Abstract: Methods and apparatus for preventing solar damage, and other heat-related damage, to uncooled microbolometer pixels. In certain examples, at least some of the pixels of an uncooled microbolometer are configured with a bimetallic thermal shorting structure that protects the pixel(s) from excessive heat damage. In other examples a thermochroic membrane that becomes highly reflective at temperatures above a certain threshold is applied over the microbolometer pixels to prevent the pixels from being damaged by excessive heat.
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公开(公告)号:US10054490B2
公开(公告)日:2018-08-21
申请号:US15869259
申请日:2018-01-12
Applicant: Helen of Troy Limited
Inventor: Aleksan Yildizyan , James Christopher Gorsich
CPC classification number: G01J5/0806 , G01J5/0011 , G01J5/06 , G01J5/0809 , G01J5/0831 , G01J2005/065
Abstract: A medical thermometer including a curved mirror and a radiation sensor is disclosed. The radiation sensor is disposed relative to the mirror in a configuration whereby the mirror reflects away from the sensor radiation that passes through the radiation entrance and that is oriented outside a range of angles relative to the mirror, and reflects toward the sensor radiation that passes through the radiation entrance and that is oriented within a range of angles relative to the mirror.
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公开(公告)号:US20180106680A1
公开(公告)日:2018-04-19
申请号:US15568869
申请日:2016-05-24
Applicant: HAMAMATSU PHOTONICS K.K.
Inventor: Tomonori NAKAMURA
CPC classification number: G01J5/06 , G01J5/0003 , G01J5/0096 , G01J5/061 , G01J5/0831 , G01J5/46 , G01J5/48 , G01J5/522 , G01J5/524 , G01J2005/0048 , G01J2005/0077 , G01J2005/065 , G01K15/002
Abstract: A shield plate is a shield plate related to non-contact measurement of temperature of a semiconductor apparatus, and includes a base of which temperature is adjustable, in which the amount of thermal radiation of a blackbody surface located on one side of the base is larger than the amount of thermal radiation of a reflective surface located on a side opposite to the blackbody surface, and the blackbody surface is a blackbody surface that emits infrared rays.
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公开(公告)号:US09891111B2
公开(公告)日:2018-02-13
申请号:US14755126
申请日:2015-06-30
Applicant: Rosemount Inc.
Inventor: Andrew John Kitzman , Sascha Ulrich Kienitz , Jason Harold Rud
CPC classification number: G01J5/048 , G01J5/0037 , G01J5/061 , G01J5/0803 , G01J5/10 , G01J2005/065
Abstract: A thermowell assembly for measuring a process temperature includes an elongate thermowell having a proximal end and a distal end. A bore extends between the two ends with the thermowell assembly configured to extend into a process fluid. An infrared sensor detects infrared radiation from the distal end through the bore of the thermowell and responsively provides a sensor output. A configuration is provided in which infrared radiation received by the infrared sensor from a wall of the bore is reduced and or radiation received from the distal end of the bore is increased.
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公开(公告)号:US20170335782A1
公开(公告)日:2017-11-23
申请号:US15263867
申请日:2016-09-13
Applicant: HYUNDAI MOTOR COMPANY
Inventor: Han Sang KIM
IPC: F02D41/22 , F02D41/00 , G01J5/10 , F02D41/26 , G01J5/06 , F02B37/00 , F02D41/30 , G01J5/00 , G01J5/08
CPC classification number: F02D41/22 , F02B37/00 , F02D41/0007 , F02D41/10 , F02D41/1447 , F02D41/1475 , F02D41/26 , F02D41/3005 , F02D2041/228 , F02D2200/0404 , F02D2200/602 , G01J5/0088 , G01J5/06 , G01J5/0818 , G01J5/10 , G01J2005/065 , G01K11/00 , Y02T10/144
Abstract: A device for measuring temperature of a turbine wheel in a turbocharger includes: a guide that passes infrared ray generated from the turbine wheel and includes a coolant path; a protection unit that protects an optical head which senses the infrared ray; and a signal processing unit that measures a temperature of the turbine wheel by processing a signal corresponding to the sensed infrared ray.
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