公开(公告)号：US20170099737A1

公开(公告)日：2017-04-06

申请号：US15380957

申请日：2016-12-15

Applicant: V TECHNOLOGY CO., LTD.

Inventor： Koichi KAJIYAMA ,  Michinobu MIZUMURA

IPC: H05K3/10 ,  B05D1/32 ,  B05D1/02

CPC classification number: H05K3/108 ,  B05D1/02 ,  B05D1/32 ,  C23C24/08 ,  H01L51/0003 ,  H05K1/097 ,  H05K3/0076 ,  H05K2201/0108 ,  H05K2201/0257 ,  H05K2201/0326 ,  H05K2201/10151 ,  H05K2203/0557 ,  H05K2203/101 ,  H05K2203/1105

Abstract: The present invention includes the steps of applying a liquid deposition material on a display surface of a display panel through a metal mask which is in close contact with the display surface of the display panel, while heating the metal mask; and forming thin film patterns by heating and baking the applied liquid deposition material.

公开(公告)号：US20170086301A1

公开(公告)日：2017-03-23

申请号：US15310729

申请日：2015-01-08

Applicant: ECOLE POLYTECHNIQUE FEDERALE DE LAUSANNE (EPFL)

Inventor： Ivan Rusev MINEV ,  Stephanie P. LACOUR

IPC: H05K3/00 ,  H05K1/02 ,  H05K3/12 ,  H05K1/09 ,  H05K3/40 ,  H05K3/28

CPC classification number: H05K3/007 ,  A61B5/04001 ,  A61B2562/046 ,  A61B2562/125 ,  A61N1/0476 ,  A61N1/0531 ,  A61N1/0551 ,  H01B1/22 ,  H01L23/4985 ,  H01L23/5387 ,  H01L2924/0002 ,  H05K1/0272 ,  H05K1/0283 ,  H05K1/092 ,  H05K3/005 ,  H05K3/12 ,  H05K3/28 ,  H05K3/284 ,  H05K3/4038 ,  H05K3/4069 ,  H05K2201/0108 ,  H05K2201/0133 ,  H05K2201/0215 ,  H05K2201/0257 ,  H05K2201/0314 ,  H05K2201/0329 ,  H05K2203/0537 ,  H05K2203/1305 ,  H05K2203/1322 ,  H05K2203/166 ,  Y10T29/49165 ,  H01L2924/00

Abstract: A method produces a conductive paste comprising 15-20% by weight of PDMS and 80-85% by weight of metallic micro-nano particles, wherein the conductive paste is obtained by repeated addition of singular doses of PDMS to a heptane diluted PDMS low viscosity liquid containing the metallic micro-nano particles, wherein the heptane fraction is allowed to evaporate after addition of each of the singular doses of PDMS. A method forms a conductive path on a support layer, wherein the conductive path is encapsulated by an encapsulation layer comprising at least one via through which at least one portion of the conductive path is exposed, the method comprising filling the at least one via with the conductive paste.

公开(公告)号：US09565748B2

公开(公告)日：2017-02-07

申请号：US14524894

申请日：2014-10-27

Applicant: Flextronics AP, LLC

Inventor： Michael James Glickman

IPC: H05K1/03 ,  H05K1/00 ,  H05K1/09 ,  H05K1/11 ,  H05K1/02 ,  H05K3/00

CPC classification number: H05K1/0206 ,  H05K3/0094 ,  H05K2201/0257 ,  H05K2201/0266

Abstract: A method of and device for forming vias on an electronic board (such as a PCB board) comprises forming one or more holes on the electronic board, placing a nanomaterial inside the one or more holes, and forming one or more filled holes on the electronic board. The nanomaterial can be nanocopper, which can be either push/pull into the holes on the electronic board or a combination of push and pull. The push/pull can be performed by using a mechanical device or by a person. A capping layer can be on both side of the via. The vias formed by using the nanomaterials provides a high efficient vertical heat transferring path from one side of the electronic board to the other side of the electronic board.

Abstract translation: 在电子板（例如PCB板）上形成通孔的方法和装置包括在电子板上形成一个或多个孔，将纳米材料放置在一个或多个孔内，并在电子板上形成一个或多个填充的孔 板。 纳米材料可以是纳米孔，其可以是推/拉入电子板上的孔或者推拉的组合。 推/拉可以通过使用机械装置或人员进行。 覆盖层可以在通孔的两侧。 通过使用纳米材料形成的通孔提供从电子板的一侧到电子板的另一侧的高效的垂直传热路径。

公开(公告)号：US20160338201A1

公开(公告)日：2016-11-17

申请号：US15225379

申请日：2016-08-01

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Shinya KIYONO ,  Toshitaka HAYASHI ,  Sho FUJITA

IPC: H05K1/18 ,  H05K1/09 ,  H01L23/00 ,  H05K3/32

CPC classification number: H05K1/181 ,  B22F1/0059 ,  B22F7/064 ,  B23K35/025 ,  B23K35/302 ,  H01B1/22 ,  H01L23/3121 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13194 ,  H01L2224/13347 ,  H01L2224/13487 ,  H01L2224/16227 ,  H01L2224/16501 ,  H01L2224/2732 ,  H01L2224/29294 ,  H01L2224/29347 ,  H01L2224/2939 ,  H01L2224/29487 ,  H01L2224/81075 ,  H01L2224/81193 ,  H01L2224/81359 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/8184 ,  H01L2224/83075 ,  H01L2224/8384 ,  H01L2924/12044 ,  H05K1/097 ,  H05K3/32 ,  H05K2201/0257 ,  H05K2201/10015 ,  H05K2203/1131 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/0541 ,  H01L2924/01029 ,  H01L2924/01046

Abstract: An electronic component module formed with the use of a copper particle paste which can ensure that even the inner part of a joint material is sintered, where copper particles are excellent in oxidation resistance, and a joint part is provided with high joint reliability; and a method for manufacturing the module.

Abstract translation: 一种电子部件模块，其特征在于，使用能够确保铜粒子的耐氧化性优异的连接材料的内部甚至烧结的铜粒子糊，并且接合部具有高的接头可靠性; 以及该模块的制造方法。

公开(公告)号：US20160192483A1

公开(公告)日：2016-06-30

申请号：US14918711

申请日：2015-10-21

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Weonho SHIN ,  Yun Sung WOO ,  Daejin YANG ,  Jinyoung HWANG ,  Chan KWAK ,  Hyeon Cheol PARK ,  Jae-Young CHOI

IPC: H05K1/09

CPC classification number: H05K1/09 ,  B82Y30/00 ,  H05K1/095 ,  H05K2201/0108 ,  H05K2201/0257 ,  H05K2201/026 ,  H05K2201/0326

Abstract: A transparent electrode includes: a substrate; an electrically conductive layer disposed on the substrate and including a plurality of nano-sized conductors; and an organic/inorganic composite layer directly disposed on the electrically conductive layer and including a cross-linked polymer and nano-sized inorganic oxide particles, wherein the nano-sized inorganic oxide particles are included in an amount of greater than or equal to about 1 part by weight and less than about 35 parts by weight, relative to 100 parts by weight of the cross-linked polymer. Also an electronic device including the same.

Abstract translation: 透明电极包括：基板; 导电层，其设置在所述基板上并且包括多个纳米尺寸的导体; 以及直接设置在导电层上并包含交联聚合物和纳米级无机氧化物颗粒的有机/无机复合层，其中纳米尺寸无机氧化物颗粒的含量大于或等于约1 相对于100重量份的交联聚合物，重量份小于约35重量份。 也是包括其的电子设备。

公开(公告)号：US09315687B2

公开(公告)日：2016-04-19

申请号：US13511369

申请日：2010-11-23

Applicant: Manuel Arturo Lopez Quintela

Inventor： Manuel Arturo Lopez Quintela

IPC: H01B1/02 ,  C09D11/52 ,  C09D5/24 ,  C09D7/12 ,  C09D11/38 ,  H05K1/09 ,  C08K3/08

CPC classification number: C09D11/52 ,  C08K3/08 ,  C09D5/24 ,  C09D7/67 ,  C09D7/68 ,  C09D11/38 ,  H01B1/02 ,  H05K1/097 ,  H05K2201/0257 ,  H05K2201/0266 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31692 ,  Y10T428/31699 ,  Y10T428/31703

Abstract: The invention relates to conductive inks obtained by combining AQCs and metal nanoparticles. Atomic quantum clusters (AQCs), which melt at temperatures of less than 150° C., are used as low-temperature “flux” for the formulation of conductive inks. The combination of AQCs with bimodal and trimodal mixtures of nanoparticles of various sizes guarantees the elimination of free volumes in the final sintering of the nanoparticles in order to achieve electronic structures with very low resistivity (close to that of the bulk material) with low-temperature thermal treatments (

Abstract translation: 本发明涉及通过组合AQC和金属纳米粒子而获得的导电油墨。 在低于150℃的温度下熔化的原子量子簇（AQC）用作导电油墨配方的低温“通量”。 AQC与各种尺寸的纳米颗粒的双峰和三峰混合物的组合确保了在纳米颗粒的最终烧结中消除自由体积，以便实现具有低电阻率（接近散装材料的电阻率）的电子结构，其具有低温 热处理（<150°C）。

公开(公告)号：US20160073508A1

公开(公告)日：2016-03-10

申请号：US14819432

申请日：2015-08-06

Applicant: Wistron NeWeb Corp.

Inventor： Tzu-Wen Chuang ,  Babak Radi ,  Shih-Hong Chen ,  Jing-Wen Chen

IPC: H05K3/18 ,  H05K1/03 ,  H05K1/09

CPC classification number: H05K3/184 ,  H05K3/0032 ,  H05K2201/0257 ,  H05K2203/0716 ,  H05K2203/072 ,  H05K2203/107

Abstract: A method for forming a metal pattern on a substrate having at least one metal component is provided. By performing the surface passivation treatment on the at least metal component, the surface of the at least metal component becomes an anti-plating surface via an anti-plating coating. Hence, the metal pattern can be selectively formed in the following electroless plating processes.

Abstract translation: 提供了在具有至少一种金属成分的基板上形成金属图案的方法。 通过对至少金属成分进行表面钝化处理，至少金属成分的表面经由防镀层成为防镀面。 因此，金属图案可以在以下的无电解电镀工艺中选择性地形成。

公开(公告)号：US20160007477A1

公开(公告)日：2016-01-07

申请号：US14769574

申请日：2014-03-06

Applicant: DIS CORPORATION

Inventor： Sunao Yoshihara ,  Haruhiko Katsuta ,  Yoshinori Katayama ,  Jun Shirakami ,  Akira Murakawa ,  Wataru Fujikawa ,  Yukie Saitou

IPC: H05K3/18 ,  C25D5/02 ,  H05K3/12 ,  H05K1/09 ,  H05K1/03 ,  C25D5/56 ,  C25D7/00

CPC classification number: H05K3/188 ,  C25D5/02 ,  C25D5/56 ,  C25D7/00 ,  H05K1/0313 ,  H05K1/097 ,  H05K3/12 ,  H05K3/207 ,  H05K3/246 ,  H05K2201/0203 ,  H05K2201/0224 ,  H05K2201/0257 ,  H05K2201/09218 ,  H05K2203/0108 ,  H05K2203/097

Abstract: There is provided a method for forming an electrically conductive ultrafine pattern which has an excellent pattern cross-sectional shape is provided by a composite technique including a printing process and a plating process, and furthermore, by imparting excellent adhesion to each interface of a laminate including a plating core pattern, an electrically conductive ultrafine pattern which can be preferably used as a highly accurate electric circuit and a method for manufacturing the same are also provided. The method includes (1) a step of applying a resin composition to form a receiving layer on a substrate; (2) a step of printing an ink containing plating core particles by a reverse offset printing method to form a plating core pattern on the receiving layer; and (3) a step of depositing a metal on the plating core pattern formed in the step (2) by an electrolytic plating method.

Abstract translation: 提供了一种形成导电超细纹图案的方法，其具有优异的图案横截面形状，其通过包括印刷工艺和电镀工艺的复合技术提供，此外，通过赋予层压体的每个界面优异的粘附性，包括 还提供了电镀芯图案，可优选用作高精度电路的导电超细图案及其制造方法。 该方法包括（1）在基板上涂布树脂组合物以形成接收层的步骤; （2）通过反胶印方法印刷含有电镀芯颗粒的油墨的步骤，以在接收层上形成电镀芯图案; 和（3）通过电解电镀法在步骤（2）中形成的镀覆芯图案上沉积金属的步骤。

公开(公告)号：US20150382476A1

公开(公告)日：2015-12-31

申请号：US14766749

申请日：2014-02-18

Applicant: ORBOTECH LTD.

Inventor： Michael Zenou ,  Marc Altman ,  Claudio Rottman ,  Zvi Kotler

IPC: H05K3/12 ,  H05K3/22

CPC classification number: H05K3/12 ,  G03F7/039 ,  G03F7/40 ,  H05K1/097 ,  H05K3/02 ,  H05K3/027 ,  H05K3/1283 ,  H05K3/1291 ,  H05K3/227 ,  H05K2201/0257 ,  H05K2201/2054 ,  H05K2203/0514 ,  H05K2203/107 ,  H05K2203/108 ,  H05K2203/111 ,  H05K2203/1131 ,  H05K2203/1194 ,  H05K2203/1476 ,  H05K2203/1484

Abstract: A method for manufacturing includes coating a substrate (22) with a matrix (28) containing a material to be patterned on the substrate. A pattern (42) is fixed in the matrix by directing an energy beam to impinge on the coated substrate so as to fix the pattern in the matrix without fully sintering the pattern. The matrix remaining on the substrate outside the fixed pattern is removed, and after removing the matrix, the material in the pattern is sintered.

Abstract translation: 一种制造方法包括用在衬底上含有要图案化的材料的基体（28）涂覆衬底（22）。 通过将能量束引导到涂覆的基底上以将图案固定在基体中而不完全烧结图案，将图案（42）固定在矩阵中。 除去残留在固定图案外的基板上的基体，在除去基体之后，将图案中的材料烧结。

公开(公告)号：US20150273510A1

公开(公告)日：2015-10-01

申请号：US14202801

申请日：2014-03-10

Applicant: NDSU RESEARCH FOUNDATION

Inventor： Justin Hoey

IPC: B05B17/06 ,  B05D1/02 ,  B05B1/30 ,  B05B1/28 ,  B05B1/14

CPC classification number: B05B7/066 ,  B05B7/0012 ,  B05B7/0815 ,  B05B17/063 ,  H05K3/14 ,  H05K2201/0257 ,  H05K2203/0285 ,  H05K2203/1344 ,  Y10T428/25

Abstract: An aerosol deposition system that uses a liquid ink, fed directly to an ultrasonic source at or near a nozzle to form an aerosolized ink, which may be transported via a carrier gas to a sheath gas insertion location is presented. The sheath gas may direct or focus the atomized ink through a nozzle. Alternatively, a deposition head may be adapted to the ultrasonic source so that aerosolization of the ink occurs inside the deposition head, where the sheath gas flows around the ultrasonic source, transporting the aerosolized ink through a nozzle and toward a substrate ˜2 mm distant. The substrate may be translated to form features of controlled shape such as lines with widths from ≦30 μm to 100 μm. Variations of this system may yield systems where a carrier gas is unnecessary, and all aerosolized ink is transported via the sheath gas.

Abstract translation: 提供了一种气溶胶沉积系统，其使用液体墨水，其直接在喷嘴处或附近被供给到超声波源，以形成可通过载气传输到鞘气体插入位置的雾化墨。 护套气体可以通过喷嘴引导或聚焦雾化的油墨。 或者，沉积头可以适用于超声波源，从而在沉积头内部发生油墨雾化，其中护套气体围绕超声波源流动，将气雾化的油墨通过喷嘴输送并且朝向远离2mm的衬底传送。 衬底可以被平移以形成受控形状的特征，例如具有从＆lt; nE;30μm到100μm的宽度的线。 该系统的变化可以产生不需要载气的系统，并且所有雾化的油墨都经由护套气体输送。