公开(公告)号：US09955577B2

公开(公告)日：2018-04-24

申请号：US15133352

申请日：2016-04-20

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngjin Cho ,  Hyeon Cheol Park ,  Kwanghee Kim ,  Weonho Shin ,  Daejin Yang

IPC: H05K1/09 ,  H05K1/02 ,  H01L51/52 ,  G06F3/047

CPC classification number: H05K1/09 ,  G06F3/041 ,  G06F3/047 ,  G06F2203/04102 ,  H01B1/02 ,  H01B1/023 ,  H01B1/026 ,  H01B1/16 ,  H01L51/5206 ,  H01L51/5234 ,  H01L2251/301 ,  H01L2251/5338 ,  H05K1/0274 ,  H05K2201/0108 ,  H05K2201/0323 ,  H05K2201/0338 ,  H05K2201/0373 ,  H05K2201/0379 ,  H05K2201/0391 ,  H05K2201/09681 ,  H05K2201/10128

Abstract: A conductive component including: a substrate, a first layer comprising a plurality of island structures disposed on the substrate, wherein the island structures include graphene; and a second layer disposed on the first layer, wherein the second layer includes a plurality of conductive nanowires. Also, an electronic device including the conductive component.

公开(公告)号：US09867284B2

公开(公告)日：2018-01-09

申请号：US15501829

申请日：2015-08-04

Applicant: AT & S Austria Technologie & Systemtechnik Aktiengesellschaft

Inventor： Elisabeth Kreutzwiesner ,  Gernot Schulz

IPC: H05K1/03 ,  H05K1/02 ,  H05K3/46 ,  H05K3/14 ,  H05K3/16 ,  H05K3/12

CPC classification number: H05K1/0271 ,  H05K1/0207 ,  H05K3/12 ,  H05K3/146 ,  H05K3/16 ,  H05K3/4602 ,  H05K3/4608 ,  H05K3/4688 ,  H05K2201/0195 ,  H05K2201/0323 ,  H05K2201/068 ,  H05K2201/09136

Abstract: A mounting device for mounting electronic components, wherein the mounting device comprises an electrically conductive structure having a first value of thermal expansion in at least one pre-defined spatial direction, an electrically insulating structure having a second value of thermal expansion in the at least one pre-defined spatial direction being different from the first value and being arranged on the electrically conductive structure, and a thermal expansion adjustment structure having a third value of thermal expansion in the at least one pre-defined spatial direction, wherein the third value is selected and the thermal expansion adjustment structure is located so that thermally induced warpage of the mounting device resulting from a difference between the first value and the second value is at least partially compensated by the thermal expansion adjustment structure.

公开(公告)号：US09826629B2

公开(公告)日：2017-11-21

申请号：US14729806

申请日：2015-06-03

Applicant: Samsung Display Co., Ltd.

Inventor： Won Il Choi ,  Jong Ho Hong

IPC: H05K1/00 ,  H05K1/02

CPC classification number: H05K1/0283 ,  H05K2201/0311 ,  H05K2201/0323 ,  H05K2201/0329 ,  H05K2201/0373 ,  H05K2201/0391 ,  H05K2201/09263 ,  H05K2201/09272 ,  H05K2201/09736

Abstract: An electronic device including a stretchable/contractible base and a wiring formed on the base, the wiring being divided into a first region having a shape extending in a proceeding direction and a second region in which the proceeding direction is curved. The wiring includes a first conductive layer and a second conductive layer formed of a material that makes the second conductive layer easier to be curved than the first conductive layer. The first conductive layer is formed in the first region and the second conductive layer is formed in the second region.

公开(公告)号：US20170311441A1

公开(公告)日：2017-10-26

申请号：US15646203

申请日：2017-07-11

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Katsuyuki NAITO ,  Norihiro YOSHINAGA ,  Tianyi YANG ,  Yoshihiro AKASAKA

IPC: H05K1/02 ,  H01L33/42 ,  H01L33/62 ,  H05K1/14 ,  H01L33/48

CPC classification number: H05K1/0274 ,  H01L33/42 ,  H01L33/486 ,  H01L33/62 ,  H05K1/144 ,  H05K2201/0108 ,  H05K2201/0323 ,  H05K2201/0379

Abstract: According to one embodiment, a transparent conductor includes a transparent substrate; a metal nanowire layer disposed on the transparent substrate and including a plurality of metal nanowires; a graphene oxide layer covering the metal nanowire layer; and an electrical insulating resin layer disposed in contact with the graphene oxide layer.

公开(公告)号：US09788421B2

公开(公告)日：2017-10-10

申请号：US14736407

申请日：2015-06-11

Applicant: Tyco Electronics AMP Korea Ltd

Inventor： Yang Yoon Choi ,  Ok Ky Beak

IPC: H05K1/05 ,  H05K3/38 ,  H05K1/02 ,  H05K1/09 ,  H05K3/28 ,  H05K3/42 ,  H05K3/46 ,  H05K3/06

CPC classification number: H05K1/053 ,  H05K1/0201 ,  H05K1/0207 ,  H05K1/0278 ,  H05K1/09 ,  H05K3/06 ,  H05K3/285 ,  H05K3/385 ,  H05K3/421 ,  H05K3/425 ,  H05K3/429 ,  H05K3/4608 ,  H05K2201/0323 ,  H05K2203/072 ,  H05K2203/0723 ,  H05K2203/073

Abstract: A printed circuit board has a core made of an aluminum material; a bonding member positioned on opposite surfaces of the core; a base layer bonded to the opposite surface of the core through the bonding member; a receiving hole extending through the core, the bonding member, and the base layer; a zinc substitution layer positioned on a surface of the base layer and a portion of the base layer exposed on an inner surface of the receiving hole; and a plating layer positioned on the zinc substitution layer, and having a circuit pattern.

公开(公告)号：US20170290167A1

公开(公告)日：2017-10-05

申请号：US15090703

申请日：2016-04-05

Applicant: Compass Technology Company Limited

Inventor： Kelvin Po Leung Pun ,  Chee Wah Cheung

IPC: H05K3/00 ,  H05K1/03 ,  H05K1/09 ,  H05K1/02

CPC classification number: H05K3/0041 ,  G06F3/041 ,  H05K1/0278 ,  H05K1/0306 ,  H05K1/0326 ,  H05K1/0346 ,  H05K1/09 ,  H05K1/144 ,  H05K3/0064 ,  H05K3/025 ,  H05K3/027 ,  H05K3/381 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0154 ,  H05K2201/0323 ,  H05K2201/042 ,  H05K2203/0152 ,  H05K2203/0376 ,  H05K2203/095 ,  H05K2203/1545

Abstract: A process for forming a graphene circuit pattern on an object is described. A graphene layer is grown on a metal foil. A bonding layer is formed on a protective film and a surface of the bonding layer is roughened. The graphene layer is transferred onto the roughened surface of the bonding layer. The protective film is removed and the bonding layer is laminated to a first core dielectric substrate. The metal foil is etched away. Thereafter the graphene layer is etched using oxygen plasma etching to form graphene circuits on the first core dielectric substrate. The first core dielectric substrate having graphene circuits thereon is bonded together with a second core dielectric substrate wherein the graphene circuits are on a side facing the second core dielectric substrate wherein an air gap is left therebetween.

公开(公告)号：US09777197B2

公开(公告)日：2017-10-03

申请号：US14512535

申请日：2014-10-13

Applicant: SunRay Scientific LLC

Inventor： S. Kumar Khanna

IPC: C09J9/02 ,  C09J9/00 ,  H05K13/04 ,  H05K3/30 ,  H05K3/32 ,  H01L23/00 ,  C08K9/02

CPC classification number: C09J9/02 ,  C08K9/02 ,  C08K2201/001 ,  C08K2201/01 ,  C09J9/00 ,  H01L24/29 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/16227 ,  H01L2224/2929 ,  H01L2224/29298 ,  H01L2224/29355 ,  H01L2224/29357 ,  H01L2224/2936 ,  H01L2224/29388 ,  H01L2224/29393 ,  H01L2224/29499 ,  H01L2224/29562 ,  H01L2224/2957 ,  H01L2224/29639 ,  H01L2224/29644 ,  H01L2224/32013 ,  H01L2224/32057 ,  H01L2224/32225 ,  H01L2224/75253 ,  H01L2224/75265 ,  H01L2224/75266 ,  H01L2224/75734 ,  H01L2224/75735 ,  H01L2224/81193 ,  H01L2224/83192 ,  H01L2224/83851 ,  H01L2224/83874 ,  H01L2224/8393 ,  H01L2924/00014 ,  H05K3/323 ,  H05K2201/0218 ,  H05K2201/0221 ,  H05K2201/0323 ,  H05K2201/083 ,  H05K2203/104 ,  H01L2924/2064 ,  H01L2924/0665 ,  H01L2224/0401

Abstract: Illustrative embodiments of anisotropic conductive adhesive (ACA) and associated methods are disclosed. In one illustrative embodiment, the ACA may comprise a binder curable using UV light and a plurality of particles suspended in the binder. Each of the plurality of particles may comprise a ferromagnetic material coated with a layer of electrically conductive material. The electrically conducting material may form electrically conductive and isolated parallel paths when the ACA is cured using UV light after being subjected to a magnetic field.

公开(公告)号：US09763320B2

公开(公告)日：2017-09-12

申请号：US14639318

申请日：2015-03-05

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Katsuyuki Naito ,  Norihiro Yoshinaga ,  Tianyi Yang ,  Yoshihiro Akasaka

IPC: H01L29/22 ,  H05K1/02 ,  H01L33/48 ,  H01L33/62 ,  H05K1/14 ,  H01L33/42

CPC classification number: H05K1/0274 ,  H01L33/42 ,  H01L33/486 ,  H01L33/62 ,  H05K1/144 ,  H05K2201/0108 ,  H05K2201/0323 ,  H05K2201/0379

Abstract: According to one embodiment, a transparent conductor includes a transparent substrate; a metal nanowire layer disposed on the transparent substrate and including a plurality of metal nanowires; a graphene oxide layer covering the metal nanowire layer; and an electrical insulating resin layer disposed in contact with the graphene oxide layer.

公开(公告)号：US09721726B2

公开(公告)日：2017-08-01

申请号：US15076856

申请日：2016-03-22

Applicant: Elwha LLC

Inventor： Jeffrey A. Bowers ,  Alistair K. Chan ,  Geoffrey F. Deane ,  Roderick A. Hyde ,  Nathan Kundtz ,  Nathan P. Myhrvold ,  David R. Smith ,  Lowell L. Wood, Jr.

IPC: H01G4/008 ,  H05K1/03 ,  H05K1/02 ,  H05K1/09 ,  H05K1/18 ,  B32B37/14 ,  H05K3/00 ,  B32B9/00 ,  B32B5/18 ,  H01L29/16 ,  H01G4/005 ,  H01G4/002 ,  H01L29/786 ,  H01L27/12 ,  B82Y30/00

CPC classification number: H01G4/008 ,  B32B5/18 ,  B32B9/007 ,  B32B37/14 ,  B32B2266/04 ,  B32B2266/057 ,  B32B2266/126 ,  B32B2307/202 ,  B32B2457/08 ,  B82Y30/00 ,  H01G4/002 ,  H01G4/005 ,  H01L27/12 ,  H01L29/1606 ,  H01L29/78603 ,  H05K1/02 ,  H05K1/0274 ,  H05K1/0306 ,  H05K1/032 ,  H05K1/09 ,  H05K1/097 ,  H05K1/181 ,  H05K3/00 ,  H05K2201/0323 ,  H05K2201/10007 ,  H05K2201/10121 ,  Y10S977/734 ,  Y10T29/49128 ,  Y10T29/49826 ,  Y10T156/10 ,  Y10T428/24331 ,  Y10T428/24777 ,  Y10T428/24996 ,  Y10T428/249981 ,  Y10T428/24999 ,  Y10T428/30

Abstract: An apparatus having reduced phononic coupling between a graphene monolayer and a substrate is provided. The apparatus includes an aerogel substrate and a monolayer of graphene coupled to the aerogel substrate.

公开(公告)号：US09717151B2

公开(公告)日：2017-07-25

申请号：US14865061

申请日：2015-09-25

Applicant: IBIDEN CO., LTD.

Inventor： Hirotaka Taniguchi ,  Dongdong Wang ,  Michimasa Takahashi

IPC: H05K3/46 ,  H05K1/02

CPC classification number: H05K3/4691 ,  H05K1/0206 ,  H05K1/0207 ,  H05K2201/0323 ,  H05K2201/096

Abstract: A flex-rigid wiring board includes a flexible substrate, a first non-flexible substrate positioned on a first side of the flexible substrate, a second non-flexible substrate positioned on a second side of the flexible substrate, a first insulation layer laminated on first surfaces of the flexible substrate and first and second non-flexible substrates, and a second insulation layer laminated on second surfaces of the flexible substrate and first and second non-flexible substrates. Each of the first and second insulation layers has an opening portion exposing a portion of the flexible substrate such that the portion of the flexible substrate forms a flexible section connecting non-flexible rigid sections, and the first and second non-flexible substrates include a heat dissipating portion including a heat dissipating material having thermal conductivity which is higher than thermal conductivity of the first and second insulation layers.