公开(公告)号：US20150162680A1

公开(公告)日：2015-06-11

申请号：US14098285

申请日：2013-12-05

Applicant: Tyco Electronics Corporation

Inventor： Brian Patrick Costello ,  Christopher David Ritter ,  Steven Lee Flickinger ,  Evan Charles Wickes

IPC: H01R12/72

CPC classification number: H01R9/2408 ,  G02B6/3897 ,  G02B6/4257 ,  H01R12/724 ,  H01R13/6471 ,  H01R13/74 ,  H01R23/70 ,  H05K2201/044 ,  H05K2201/1034

Abstract: Daughter card assembly including a circuit board and leading and trailing connectors mounted to the circuit board. The leading and trailing connectors have mating ends that face in different directions along a board plane. The daughter card assembly also includes a support wall that is coupled to the circuit board and extends orthogonal to the circuit board. The support wall has a wall opening therethrough. The trailing connector is positioned on the circuit board such that the mating end substantially aligns with the wall opening. The daughter card assembly also includes a retention shroud that projects from an exterior surface of the support wall. The retention shroud defines a shroud passage that aligns with the wall opening. The shroud and wall openings form a receiving passage for receiving at least one of the trailing connector or a corresponding cable connector that mates with the trailing connector.

Abstract translation: 子卡组件，包括电路板和安装在电路板上的前后连接器。 前导和后退连接器具有沿着板平面面向不同方向的配合端。 子卡组件还包括耦合到电路板并且垂直于电路板延伸的支撑壁。 支撑壁具有穿过其的壁开口。 拖尾连接器定位在电路板上，使得配合端基本上与壁开口对准。 子卡组件还包括从支撑壁的外表面突出的保持罩。 保持罩限定了与壁开口对准的护罩通道。 护罩和壁开口形成接收通道，用于接收与拖尾连接器配合的拖尾连接器或相应的电缆连接器中的至少一个。

公开(公告)号：US08579636B2

公开(公告)日：2013-11-12

申请号：US13370053

申请日：2012-02-09

Applicant: Wayne Samuel Davis ,  Robert Neil Whiteman, Jr.

Inventor： Wayne Samuel Davis ,  Robert Neil Whiteman, Jr.

IPC: H01R12/00

CPC classification number: H01R12/716 ,  H01R12/7082 ,  H01R12/737 ,  H01R13/6587 ,  H05K1/141 ,  H05K3/366 ,  H05K2201/044 ,  H05K2201/10295

Abstract: A receptacle assembly for a midplane connector system has a receptacle housing having openings receiving signal contacts and ground shields of a header assembly. The receptacle assembly includes contact modules coupled to the receptacle housing that each have a leadframe, a dielectric frame and a ground shield. The leadframe has signal contacts arranged in pairs carrying differential signals that are generally arranged along a leadframe plane with mating portions at ends thereof that have at least two points of contact electrically connected to a corresponding signal contact of the header assembly. The dielectric frame holds the signal contacts. The ground shield is coupled to a side of the dielectric frame and has ground tabs extending into the dielectric frame to provide electrical shielding between the pairs of signal contacts and grounding beams electrically connected to ground shields of the header assembly.

Abstract translation: 用于中平面连接器系统的插座组件具有插座壳体，其具有容纳头部组件的信号触头和接地屏蔽的开口。 插座组件包括联接到插座壳体的接触模块，其中每个具有引线框架，电介质框架和接地屏蔽件。 引线框架具有成对布置的具有差分信号的信号触点，其通常沿着引线框架平面布置，其端部处的配合部分具有电连接到插头组件的相应信号触头的至少两个接点。 电介质框架保持信号触点。 接地屏蔽耦合到电介质框架的一侧，并且具有延伸到电介质框架中的接地片，以在电连接到插头组件的接地屏蔽的信号触点对和接地梁之间提供电屏蔽。

公开(公告)号：US08488920B2

公开(公告)日：2013-07-16

申请号：US12873980

申请日：2010-09-01

Applicant: Richard C. A. Pitwon

Inventor： Richard C. A. Pitwon

IPC: G02B6/12 ,  H01S3/00

CPC classification number: G02B6/12004 ,  G02B6/138 ,  H01S3/0637 ,  H01S3/094061 ,  H01S3/1603 ,  H01S3/1605 ,  H01S3/1606 ,  H01S3/1615 ,  H01S3/168 ,  H01S3/178 ,  H01S3/2308 ,  H01S3/2383 ,  H05K1/0274 ,  H05K1/142 ,  H05K2201/044

Abstract: The invention provides an optical printed circuit board, comprising: plural polymer waveguide sections from independent waveguides, each of the sections being doped with an amplifying dopant; an optical pump source to pump the plural polymer waveguide sections, wherein the plural waveguide sections are arranged close or adjacent to one another such that a the optical pump source is able to pump plural of the optical waveguide sections.

Abstract translation: 本发明提供了一种光学印刷电路板，包括：来自独立波导的多个聚合物波导部分，每个部分掺杂有放大掺杂剂; 用于泵浦多个聚合物波导部分的光泵浦源，其中多个波导部分彼此靠近或相邻地布置，使得光泵浦源能够泵浦多个光波导部分。

公开(公告)号：US08456857B2

公开(公告)日：2013-06-04

申请号：US12293777

申请日：2007-03-21

Applicant: Uwe Gröschner ,  Falk Steiner ,  Stefan Asch

Inventor： Uwe Gröschner ,  Falk Steiner ,  Stefan Asch

IPC: H05K1/11

CPC classification number: H05K7/1439 ,  H05K1/14 ,  H05K1/144 ,  H05K2201/044 ,  H05K2201/045 ,  H05K2201/10409

Abstract: A backplane arrangement is provided for an electronic mounting rack with a base backplane with several contact strips, wherein a free space, into which at least one additional backplane can be inserted, is provided on the base backplane.

Abstract translation: 为具有带有多个接触条的基座背板的电子安装架提供背板布置，其中可在其上插入有至少一个附加背板的自由空间设置在基底板上。

公开(公告)号：US20130038998A1

公开(公告)日：2013-02-14

申请号：US13655135

申请日：2012-10-18

Applicant: INTERNATIONAL BUSINESS MACHINES CORP

Inventor： Mark E. Andresen ,  Virginia Ott

IPC: H05K7/06 ,  G06F1/16

CPC classification number: H05K3/308 ,  H05K3/0047 ,  H05K2201/044 ,  H05K2201/09509 ,  H05K2201/10303 ,  H05K2201/10545 ,  H05K2201/10871 ,  H05K2203/0207 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49165

Abstract: A printed circuit board having one or more holes that are controllably drilled to extend into the printed circuit board substrate to a predetermined depth intermediate first and second faces. A mechanical locating pin is received into each of the one or more holes to mechanically align a first component for electronically interfacing with the printed circuit board substrate. A second component is installed on the second face directly opposite of the one or more holes such that the second component is in electronic communication with conductive traces or interconnects formed on the second face directly opposite of the hole.

Abstract translation: 一种印刷电路板，其具有一个或多个可控制钻孔以扩展到印刷电路板基板中的第一和第二面的预定深度的孔。 机械定位销被接收到一个或多个孔中的每一个中，以机械对准用于与印刷电路板基板电子接口的第一部件。 第二部件安装在与一个或多个孔直接相对的第二面上，使得第二部件与形成在与孔直接相对的第二面上的导电迹线或互连电子连通。

公开(公告)号：US08365399B2

公开(公告)日：2013-02-05

申请号：US12630677

申请日：2009-12-03

Applicant: Mark E. Andresen ,  Virginia Ott

Inventor： Mark E. Andresen ,  Virginia Ott

IPC: H05K3/30

CPC classification number: H05K3/308 ,  H05K3/0047 ,  H05K2201/044 ,  H05K2201/09509 ,  H05K2201/10303 ,  H05K2201/10545 ,  H05K2201/10871 ,  H05K2203/0207 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49165

Abstract: A printed circuit board and method of making a print circuit board having one or more holes that are controllably drilled to extend into the printed circuit board substrate to a predetermined depth intermediate first and second faces. A mechanical locating pin is received into each of the one or more holes to mechanically align a first component for electronically interfacing with the printed circuit board substrate. A second component is installed on the second face directly opposite of the one or more holes such that the second component is in electronic communication with conductive traces or interconnects formed on the second face directly opposite of the hole.

Abstract translation: 一种印刷电路板和制造具有一个或多个孔的印刷电路板的方法，所述孔被可控制地钻出以延伸到印刷电路板基板中到第一和第二面之间的预定深度。 机械定位销被接收到一个或多个孔中的每一个中，以机械对准用于与印刷电路板基板电子接口的第一部件。 第二部件安装在与一个或多个孔直接相对的第二面上，使得第二部件与形成在与孔直接相对的第二面上的导电迹线或互连电子连通。

公开(公告)号：US08358511B2

公开(公告)日：2013-01-22

申请号：US12205492

申请日：2008-09-05

Applicant: Harald Huels ,  Dieter Staiger

Inventor： Harald Huels ,  Dieter Staiger

IPC: H01R12/16

CPC classification number: H05K1/14 ,  H01R12/52 ,  H01R12/737 ,  H05K1/144 ,  H05K7/1458 ,  H05K7/1492 ,  H05K2201/044

Abstract: The invention relates to an electronic-board arrangement, comprising at least two electronic boards, particularly integrated circuit boards, which are attached to a backplane which provides electrical interconnection between the at least two electronic boards. An electronic interconnect board providing electrical interconnect between the at least two electronic boards is arranged in a space in between the at least two electronic boards and the backplane.

Abstract translation: 本发明涉及一种电子板装置，其包括至少两个电子板，特别是集成电路板，其连接到提供至少两个电子板之间的电互连的背板。 在所述至少两个电子板和所述背板之间的空间中布置有在所述至少两个电子板之间提供电互连的电子互连板。

公开(公告)号：US08248177B2

公开(公告)日：2012-08-21

申请号：US12599086

申请日：2008-05-29

Applicant: Frédéric Broyde ,  Evelyne Clavelier

Inventor： Frédéric Broyde ,  Evelyne Clavelier

IPC: H01P5/12

CPC classification number: H04L25/0272 ,  H04L25/0298 ,  H05K1/0216 ,  H05K2201/044 ,  H05K2201/09236

Abstract: The invention relates to a method and a device for pseudo-differential transmission in interconnections used for sending a plurality of electrical signals. The ends of an interconnection having 4 transmission conductors and a return conductor distinct from the reference conductor are each connected to a termination circuit. Three damping circuits are connected between the return conductor and the reference conductor. The transmitting circuits receive at their inputs the signals from the 4 channels of the two sources, and are connected to the conductors of the interconnection. The receiving circuits are connected to the conductors of the interconnection, each receiving circuit being such that the 4 channels of a source connected to a transmitting circuit in the activated state are sent to the four channels of the destinations without noticeable external crosstalk.

Abstract translation: 本发明涉及用于发送多个电信号的互连中的伪差分传输的方法和装置。 具有4个发送导体和不同于参考导体的返回导体的互连的端部各自连接到终端电路。 在回路导体和参考导体之间连接有三个阻尼电路。 发射电路在其输入端接收来自两个源的4个通道的信号，并连接到互连的导体。 接收电路连接到互连的导体，每个接收电路使得连接到处于激活状态的发射电路的源的4个信道被发送到目的地的四个信道，而没有明显的外部串扰。

公开(公告)号：US08231390B2

公开(公告)日：2012-07-31

申请号：US12818770

申请日：2010-06-18

Applicant: Steven J. Millard ,  Dustin G. Rowe ,  Bruce A. Champion ,  Justin A. Pickel

Inventor： Steven J. Millard ,  Dustin G. Rowe ,  Bruce A. Champion ,  Justin A. Pickel

IPC: H01R12/00

CPC classification number: H05K3/366 ,  H05K1/0231 ,  H05K1/025 ,  H05K1/0281 ,  H05K1/147 ,  H05K3/4691 ,  H05K2201/044 ,  H05K2201/09481

Abstract: A flexible circuit is provided. The flexible circuit includes a circuit board mating end and a flexible body extending from the circuit board mating end. A conductive pathway extends through the flexible body to electrically couple circuit boards. A connector pad is positioned on the circuit board mating end. The conductive pathway electrically engages the connector pad. The connector pad is configured to electrically couple the flexible circuit to one of the circuit boards. A layer of uncured material extends between the connector pad and the conductive pathway. The layer of uncured material increases an impedance of the connector pad.

Abstract translation: 提供了一个灵活的电路。 柔性电路包括电路板配合端和从电路板配合端延伸的柔性体。 导电通路延伸穿过柔性体以电耦合电路板。 连接器垫位于电路板配合端。 导电通路电连接连接器垫。 连接器焊盘被配置为将柔性电路电耦合到电路板之一。 一层未固化的材料在连接器焊盘和导电通路之间延伸。 未固化的材料层增加了连接器焊盘的阻抗。

公开(公告)号：US20120175160A1

公开(公告)日：2012-07-12

申请号：US13265323

申请日：2009-04-17

Applicant: Rachid M. Kadri ,  Stephen F. Contreras

Inventor： Rachid M. Kadri ,  Stephen F. Contreras

IPC: H05K1/16 ,  H05K3/30

CPC classification number: H05K1/181 ,  G11C5/066 ,  H05K1/0237 ,  H05K1/114 ,  H05K1/14 ,  H05K2201/044 ,  H05K2201/09227 ,  H05K2201/10189 ,  H05K2201/10545 ,  Y02P70/611 ,  Y10T29/49147

Abstract: A method and system are disclosed to reduce trace length and capacitance in a large memory footprint. When more dual in-line memory module (DIMM) connectors are used per memory channel, the overall bus bandwidth may be affected by trace length and trace capacitance. In order to reduce the overall trace length and trace capacitance, the system and method use a palm tree topology placement, i.e., back-to-back DIMM placement, to place surface mount technology (SMT) DIMM connectors (instead of through-hole connectors) back-to-back in a mirror fashion on each side of a printed circuit board (PCB). The system and method may improve signal propagation time when compared to the commonly used traditional topology placements in which all DIMM connectors are placed on one side of the PCB.

Abstract translation: 公开了一种方法和系统，以在大的存储器占用空间中减少迹线长度和电容。 当每个存储器通道使用更多的双列直插存储器模块（DIMM）连接器时，总线带宽可能会受到迹线长度和迹线电容的影响。 为了减少总体走线长度和跟踪电容，系统和方法使用棕榈树拓扑布局，即背对背DIMM放置，放置表面贴装技术（SMT）DIMM连接器（而不是通孔连接器 ）以印刷电路板（PCB）的每一面以镜面方式背对背。 与所有DIMM连接器放置在PCB一侧的常用传统拓扑布局相比，该系统和方法可以提高信号传播时间。