公开(公告)号：US20180315911A1

公开(公告)日：2018-11-01

申请号：US15769893

申请日：2016-10-24

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Bojan Tesanovic ,  Peter Riel

IPC: H01L33/62 ,  H01L31/02 ,  H01L33/54 ,  H01L31/0203 ,  H01L33/58 ,  H01L31/0232 ,  H01L31/18

CPC classification number: H05K3/425 ,  H05K3/0014 ,  H05K3/007 ,  H05K3/284 ,  H05K2201/09118 ,  H05K2201/09845 ,  H05K2201/10121 ,  H05K2203/0733 ,  H05K2203/1461 ,  H05K2203/1476

Abstract: An electrical-contact assembly includes electrical contacts with first and second electrical-contact surfaces on opposing sides of the assembly. The electrical-contact assembly is manufactured by a structurable process (e.g., photo-structurable process) and by electroplating. The first and second electrical-contact surfaces can be positioned with respect to each other with an accuracy, for example, of at least 5 microns. Further, the thickness of the electrical-contact assembly can be at most 17 microns in some cases. The electrical-contact assembly can include integrated active optoelectronic elements, overmolds, optical elements and non-transparent walls.

公开(公告)号：US20180302989A1

公开(公告)日：2018-10-18

申请号：US16018127

申请日：2018-06-26

Applicant: TactoTek Oy

Inventor： Mikko Heikkinen ,  Jarmo Sääski ,  Jarkko Torvinen ,  Paavo Niskala ,  Mikko Sippari ,  Pasi Raappana ,  Antti Keränen

IPC: H05K3/00 ,  H05K1/03 ,  H05K1/02

CPC classification number: H05K3/0014 ,  B29C45/1418 ,  B29C45/14639 ,  B29C45/14811 ,  B29C45/14819 ,  B29C2045/14237 ,  B29L2031/3425 ,  B29L2031/3481 ,  H05K1/0284 ,  H05K1/0393 ,  H05K2201/0129 ,  H05K2201/09118 ,  H05K2203/1105

Abstract: An apparatus for carrying out a manufacturing method of an electromechanical structure apparatus includes an entity for producing conductors on a flat film, an entity for attaching electronic elements at locations on the flat film in relation to the desired three-dimensional shape of the flat film, the electronic elements including a number of SMT components, the locations of the electronic elements on the flat film selected such that the locations omit substantial deformation during subsequent 3D forming of the flat film, an entity for forming the flat film into a three-dimensional film and an entity for injection molding.

公开(公告)号：US20180199431A1

公开(公告)日：2018-07-12

申请号：US15740378

申请日：2016-05-20

Applicant: OSRAM GmbH

Inventor： Michael Schoewel ,  Peter Helbig ,  Jozsef Szekely ,  Sven Seifritz

IPC: H05K1/02 ,  H05K1/18 ,  H05K3/00 ,  H05K3/20 ,  H05K13/00 ,  F21S41/19

CPC classification number: H05K1/0296 ,  F21S41/19 ,  F21V21/00 ,  H05K1/181 ,  H05K3/0014 ,  H05K3/202 ,  H05K3/4092 ,  H05K13/0069 ,  H05K2201/0367 ,  H05K2201/0397 ,  H05K2201/09063 ,  H05K2201/09118 ,  H05K2201/10113 ,  H05K2201/10318 ,  H05K2203/166

Abstract: Various embodiments relate to a circuit support for an electronic circuit. The circuit support may include at least one conductor track, and an insulating matrix that is injection-molded over the at least one conductor path in such a way as to leave open at least a first region for connecting at least one electronic component of the electronic circuit. The circuit support may include at least one fastening aid that is formed from the material for the insulating matrix and/or from the material of the at least one conductor.

公开(公告)号：US20180092215A1

公开(公告)日：2018-03-29

申请号：US15562921

申请日：2016-03-22

Applicant: OMRON CORPORATION

Inventor： Wakahiro KAWAI

IPC: H05K1/18 ,  H05K3/00 ,  H05K3/12

CPC classification number: H05K1/185 ,  H01L21/568 ,  H01L23/12 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/82102 ,  H01L2224/82104 ,  H01L2224/96 ,  H01L2924/14 ,  H01L2924/1815 ,  H01L2924/351 ,  H05K1/183 ,  H05K3/0014 ,  H05K3/007 ,  H05K3/125 ,  H05K3/1258 ,  H05K5/00 ,  H05K2201/09036 ,  H05K2201/09118 ,  H05K2201/10636 ,  H05K2203/0156 ,  H05K2203/1469 ,  H05K2203/308 ,  Y02P70/611

Abstract: Provided is a circuit structure in which the occurrence of wiring line breakage due to deformation of a resin molded body is suppressed. A circuit structure (1) includes an electronic component (3) having an electrode (31, 32), a resin molded body (2) in which the electronic component (3) is embedded, and a wiring line (41, 42) connected to the electrode (31, 32). A groove (21) is formed around the electronic component (3) in the resin molded body (2), and the wiring line (41, 42) is provided so as to extend into the groove (21).

公开(公告)号：US20180063967A1

公开(公告)日：2018-03-01

申请号：US15249148

申请日：2016-08-26

Applicant: Tyco Electronics Corporation

Inventor： Miguel A. Morales ,  Leonard H. Radzilowski ,  Barry C. Mathews ,  Michael A. Oar

IPC: H05K3/34 ,  H05K1/03 ,  H05K1/11 ,  H05K1/09 ,  B23K1/00 ,  B23K20/00 ,  B23K35/26 ,  C08J7/04

CPC classification number: C08J7/047 ,  B23K1/0016 ,  B23K1/005 ,  B23K1/0056 ,  B23K1/20 ,  B23K1/203 ,  B23K35/02 ,  B23K35/26 ,  B23K35/262 ,  B23K2101/32 ,  B23K2101/42 ,  B23K2103/172 ,  H05K1/0284 ,  H05K1/0373 ,  H05K1/092 ,  H05K1/097 ,  H05K3/1283 ,  H05K3/341 ,  H05K3/3489 ,  H05K3/3494 ,  H05K2201/09118 ,  H05K2201/10287 ,  Y02P70/613

Abstract: A method of connecting a wire to a conductive trace formed on a substrate having a predetermined softening point and the functional layered composite formed therefrom. The method comprises applying a conductive ink onto the substrate; curing, drying, or sintering the conductive ink to form the conductive trace with at least one connection pad; applying an activated rosin-type flux and solder to the connection pad and to one end of a metallic wire; placing the end of the wire in contact with the connection pad; applying a source of heat to the wire; melting the solder material to form an interconnection between the wire and the connection pad; removing the source of heat; and allowing the interconnection to cool before moving the wire. The melting point of the solder is either below the softening point of the substrate or above the softening point by about 20° C. or less.

公开(公告)号：US20170273185A1

公开(公告)日：2017-09-21

申请号：US15615158

申请日：2017-06-06

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Shao-Tzu Tang ,  Ying-Chou Tsai

IPC: H05K3/00 ,  H05K1/11

CPC classification number: H05K3/0014 ,  H05K1/116 ,  H05K2201/09118 ,  H05K2201/09545 ,  H05K2201/09563 ,  Y10T29/49167

Abstract: A circuit structure is provided, which includes a plurality of conductive posts, and a plurality of first and second conductive pads formed on two opposite end surfaces of the conductive posts, respectively. A length of each of the first conductive pads is greater than a width of the first conductive pad so as to reduce an occupation area of the first conductive pad along the width and increase a distance between adjacent first conductive pads, thereby increasing the wiring density and meeting the wiring demand.

公开(公告)号：US09736944B2

公开(公告)日：2017-08-15

申请号：US14771512

申请日：2014-01-31

Applicant: Sharp Kabushiki Kaisha

Inventor： Nozomu Hikino ,  Hiroyuki Takebe

IPC: H05K1/00 ,  H05K3/00 ,  H01Q1/24 ,  H05K1/11 ,  H05K3/36 ,  B29C45/14 ,  B29C45/16 ,  H04M1/02 ,  H05K1/03 ,  H05K1/02 ,  B29K55/02 ,  B29K69/00 ,  B29L9/00 ,  B29L31/34 ,  B29C45/00 ,  H05K1/16

CPC classification number: H05K3/0014 ,  B29C45/14 ,  B29C45/16 ,  B29C45/1671 ,  B29C2045/0079 ,  B29C2045/1687 ,  B29K2055/02 ,  B29K2069/00 ,  B29L2009/00 ,  B29L2031/3456 ,  B29L2031/3481 ,  H01Q1/243 ,  H04M1/0202 ,  H04M1/0249 ,  H05K1/0284 ,  H05K1/032 ,  H05K1/119 ,  H05K1/165 ,  H05K3/36 ,  H05K2201/09018 ,  H05K2201/09045 ,  H05K2201/09118 ,  H05K2201/09472 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/0999 ,  H05K2201/10098 ,  H05K2201/10265 ,  H05K2201/2036 ,  H05K2203/1322 ,  H05K2203/1476

Abstract: A first resin layer (1) has: a covered region which is covered by a second resin layer (2) and an exposed region (1a); a contact part (1b) which is provided in the exposed region (1a); and a bend part (1c) which is provided between (a) a boundary between the covered region and the exposed region (1a) and (b) the contact part (1b).

公开(公告)号：US20170231095A1

公开(公告)日：2017-08-10

申请号：US15163045

申请日：2016-05-24

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chih-Hsien Chiu ,  Chia-Yang Chen ,  Ying-Wei Lu ,  Jyun-Yuan Jhang ,  Ming-Fan Tsai

IPC: H05K1/18

CPC classification number: H05K1/185 ,  G06K19/07777 ,  H01L25/00 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/1815 ,  H05K1/165 ,  H05K1/186 ,  H05K3/0014 ,  H05K3/107 ,  H05K3/207 ,  H05K3/4602 ,  H05K3/465 ,  H05K2201/09118 ,  H05K2201/10098 ,  H05K2203/1327 ,  H01L2924/00014

Abstract: An electronic package is provided, which includes: a substrate, an electronic element disposed on the substrate, and an antenna structure disposed on the substrate. The antenna structure has a base portion and at least a support portion, the base portion including a plurality of openings and a frame separating the openings from one another, and the support portion supporting the base portion over the substrate. Therefore, no additional area is required to be defined on a surface of the substrate, and the miniaturization requirement of the electronic package is thus met.

公开(公告)号：US20170215276A1

公开(公告)日：2017-07-27

申请号：US15327785

申请日：2015-07-20

Applicant: KRALLMANN KUNSTSTOFFVERARBEITUNG GMBH ß

Inventor： Eduard ENGELMANN

IPC: H05K1/02 ,  H05K1/11 ,  H05K1/03 ,  H05K3/00

CPC classification number: H05K1/0284 ,  B29C45/16 ,  B29C2045/169 ,  B29C2045/1696 ,  H01H1/021 ,  H01H2011/065 ,  H05K1/0278 ,  H05K1/0296 ,  H05K1/0313 ,  H05K1/11 ,  H05K1/117 ,  H05K1/119 ,  H05K3/0014 ,  H05K3/101 ,  H05K3/107 ,  H05K3/4092 ,  H05K2201/09081 ,  H05K2201/09118 ,  H05K2201/09754 ,  H05K2201/2072

Abstract: A plastic component with at least one electrical contact element has a plastic body and at least one electrical strip conductor, by which the electrical contact element can be electrically connected. Provisions are made for the plastic component to be manufactured by a combined injection molding and metal casting method, in which the plastic body is manufactured by an injection molding method and the at least one electrical strip conductor is manufactured by a metal casting or metal injection molding method one after another. The component formed last is molded onto the component formed first. Further, a method for manufacturing a corresponding plastic component is described.

公开(公告)号：US20170208685A1

公开(公告)日：2017-07-20

申请号：US15477667

申请日：2017-04-03

Applicant: MITSUBISHI CHEMICAL EUROPE GMBH

Inventor： Bernardus Antonius Gerardus SCHRAUWEN

IPC: H05K1/03 ,  C23C18/16 ,  C23C18/20 ,  H05K3/18 ,  H01Q1/36 ,  H05K3/00 ,  H05K3/10 ,  C08K3/22 ,  C23C18/38

CPC classification number: C08K3/22 ,  C08K3/2279 ,  C08K2003/2231 ,  C08K2003/2241 ,  C23C18/1608 ,  C23C18/1612 ,  C23C18/1641 ,  C23C18/1646 ,  C23C18/204 ,  C23C18/38 ,  H01Q1/36 ,  H05K1/0373 ,  H05K3/0014 ,  H05K3/105 ,  H05K3/181 ,  H05K2201/0129 ,  H05K2201/0215 ,  H05K2201/09118 ,  H05K2203/107

Abstract: A thermoplastic composition including a) a thermoplastic resin and b) a laser direct structuring (LDS) additive in an amount of at least 1 wt. % with respect to the weight of the total composition, wherein the LDS additive includes a mixed metal oxide including at least tin and a second metal selected from the group consisting of antimony, bismuth, aluminium and molybdenum, wherein the LDS additive includes at least 40 wt. % of tin and wherein the weight ratio of the second metal to tin is at least 0.02:1.