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    REDUCING TRACE LENGTH AND INSERTION LOSS OF HIGH SPEED SIGNALS ON A NETWORK SWITCH BOARD
    11.
    发明申请
    REDUCING TRACE LENGTH AND INSERTION LOSS OF HIGH SPEED SIGNALS ON A NETWORK SWITCH BOARD 审中-公开
    降低网络开关板上的高速信号的跟踪长度和插入损耗

    公开(公告)号：US20160183402A1

    公开(公告)日：2016-06-23

    申请号：US14581962

    申请日：2014-12-23

    Applicant: Intel Corporation

    Inventor： Vladimir Tamarkin ,  William F. Federer ,  Thomas W. Genetti

    IPC: H05K7/14 ,  H04L12/935

    CPC classification number: H04L49/30 ,  H05K1/117 ,  H05K2201/0784 ,  H05K2201/09163 ,  H05K2201/09227

    Abstract: An electrical device can include a printed circuit board (PCB), an electrical component integrated therewith, and connectors that are each integrated with a certain edge of the PCB. Traces can provide electrical channels between the connectors and the electrical component. Some of the connectors can be integrated at a first edge of the PCB and within a first plane, and other connectors can be integrated at a second edge of the PCB and within a second plane that is distinct from the first plane.

    Abstract translation: 电气设备可以包括印刷电路板（PCB），与其集成的电气部件，以及每个与PCB的某一边缘集成的连接器。 轨迹可以在连接器和电气部件之间提供电气通道。 一些连接器可以集成在PCB的第一边缘处并在第一平面内，并且其它连接器可以集成在PCB的第二边缘处并且在与第一平面不同的第二平面内。

    Connector for multi-layered board
    12.
    发明授权
    Connector for multi-layered board 有权
    多层板连接器

    公开(公告)号：US09318820B2

    公开(公告)日：2016-04-19

    申请号：US14227574

    申请日：2014-03-27

    Applicant: Molex, LLC

    Inventor： Toshihiro Niitsu ,  Motohisa Haga

    IPC: H01R13/62 ,  H01R12/52 ,  H01R12/79 ,  H05K1/11 ,  H05K3/36 ,  H05K3/32 ,  H05K3/40

    CPC classification number: H01R12/523 ,  H01R12/79 ,  H05K1/117 ,  H05K3/326 ,  H05K3/365 ,  H05K3/368 ,  H05K3/403 ,  H05K2201/0367 ,  H05K2201/09163 ,  H05K2201/0919 ,  H05K2201/09863 ,  H05K2201/10303 ,  H05K2201/10386

    Abstract: A connector for a multilayered board to connect a flat cable to a middle layer of a multilayered board while minimizing the impact due to variations in the dimensional precision and strength of multilayered boards and/or preventing deformation of the multilayered board and improving contact stability. The connector includes a board-side connecting portion and a cable-side connecting portion. The board-side connecting portion includes a column-shaped terminal, and the cable-side connecting portion includes flat terminals. The column-shaped terminal protrudes from the middle layer of the multilayered board in the thickness direction. The flat terminals include resilient contact portions, contacting a side surface portion of the column-shaped terminal from the width direction of the insertion slot in response to insertion of the cable-side connecting portion into the insertion slot.

    Abstract translation: 一种用于多层板的连接器，用于将扁平电缆连接到多层板的中间层，同时最小化由于多层板的尺寸精度和强度的变化引起的冲击和/或防止多层板的变形并提高接触稳定性。 连接器包括板侧连接部和电缆侧连接部。 板侧连接部包括柱状端子，电缆侧连接部包括扁平端子。 柱状端子在厚度方向从多层板的中间层突出。 扁平端子包括弹性接触部分，其响应于电缆侧连接部分插入到插槽中而从插入槽的宽度方向接触到柱状端子的侧表面部分。

    Mounting devices for optical devices, and related sub-assemblies, apparatuses, and methods
    14.
    发明授权
    Mounting devices for optical devices, and related sub-assemblies, apparatuses, and methods 有权
    用于光学装置的安装装置，以及相关子组件，装置和方法

    公开(公告)号：US08855456B2

    公开(公告)日：2014-10-07

    申请号：US13405559

    申请日：2012-02-27

    Applicant: Hubert Blair Beamon ,  Terry Dean Cox

    Inventor： Hubert Blair Beamon ,  Terry Dean Cox

    IPC: G02B6/00 ,  G02B6/38 ,  G02B6/42 ,  H05K1/02 ,  G02B6/44

    CPC classification number: G02B6/3897 ,  G02B6/4246 ,  G02B6/4277 ,  G02B6/4452 ,  G02B6/4453 ,  G02B6/4454 ,  G02B6/4455 ,  H05K1/0274 ,  H05K2201/09163 ,  H05K2201/10098 ,  H05K2201/10121 ,  Y10T29/49133

    Abstract: Mounting devices for optical devices, and related sub-assemblies, apparatuses, and methods are disclosed. The mounting devices may be employed to secure optical devices that are configured to convert optical signals to electrical signals, or electrical signals to optical signals. The mounting devices may be configured to secure optical devices to an electronics board, such as a printed circuit board (PCB) as an example. To preserve signal integrity, the mounting devices may also be configured to align the optical devices with electrical lead connections on the electronics board. The mounting devices may also be configured to improve grounding of the optical devices to provide and improve radio frequency (RF) shielding to avoid degradation of signal-to-noise (S/N) ratios from RF interference from electronic devices on the electronics board and other nearby electronic devices.

    Abstract translation: 公开了用于光学装置的安装装置，以及相关的子组件，装置和方法。 可以使用安装装置来确保被配置为将光信号转换成电信号或将电信号转换成光信号的光学装置。 作为示例，安装装置可以被配置为将光学装置固定到电子板，例如印刷电路板（PCB）。 为了保持信号完整性，安装装置还可以被配置为使光学装置与电子板上的电引线连接对准。 安装设备还可以被配置为改善光学设备的接地，以提供和改善射频（RF）屏蔽，以避免与电子板上的电子设备的RF干扰相比的信噪比（S / N）比的降低，以及 其他附近的电子设备。

    MOUNTING DEVICES FOR OPTICAL DEVICES, AND RELATED SUB-ASSEMBLIES, APPARATUSES, AND METHODS
    17.
    发明申请
    MOUNTING DEVICES FOR OPTICAL DEVICES, AND RELATED SUB-ASSEMBLIES, APPARATUSES, AND METHODS 有权
    用于光学设备的安装设备及相关的子组件，设备和方法

    公开(公告)号：US20120219263A1

    公开(公告)日：2012-08-30

    申请号：US13405559

    申请日：2012-02-27

    Applicant: Hubert Blair Beamon ,  Terry Dean Cox

    Inventor： Hubert Blair Beamon ,  Terry Dean Cox

    IPC: G02B6/46 ,  H05K3/34

    CPC classification number: G02B6/3897 ,  G02B6/4246 ,  G02B6/4277 ,  G02B6/4452 ,  G02B6/4453 ,  G02B6/4454 ,  G02B6/4455 ,  H05K1/0274 ,  H05K2201/09163 ,  H05K2201/10098 ,  H05K2201/10121 ,  Y10T29/49133

    Abstract: Mounting devices for optical devices, and related sub-assemblies, apparatuses, and methods are disclosed. The mounting devices may be employed to secure optical devices that are configured to convert optical signals to electrical signals, or electrical signals to optical signals. The mounting devices may be configured to secure optical devices to an electronics board, such as a printed circuit board (PCB) as an example. To preserve signal integrity, the mounting devices may also be configured to align the optical devices with electrical lead connections on the electronics board. The mounting devices may also be configured to improve grounding of the optical devices to provide and improve radio frequency (RF) shielding to avoid degradation of signal-to-noise (S/N) ratios from RF interference from electronic devices on the electronics board and other nearby electronic devices.

    Abstract translation: 公开了用于光学装置的安装装置，以及相关的子组件，装置和方法。 可以使用安装装置来确保被配置为将光信号转换成电信号或将电信号转换成光信号的光学装置。 作为示例，安装装置可以被配置为将光学装置固定到电子板，例如印刷电路板（PCB）。 为了保持信号完整性，安装装置还可以被配置为使光学装置与电子板上的电引线连接对准。 安装设备还可以被配置为改善光学设备的接地，以提供和改善射频（RF）屏蔽，以避免与电子板上的电子设备的RF干扰相比的信噪比（S / N）比的降低，以及 其他附近的电子设备。

    HIGH SPEED NETWORK INTERFACE
    18.
    发明申请
    HIGH SPEED NETWORK INTERFACE 有权
    高速网络接口

    公开(公告)号：US20120176756A1

    公开(公告)日：2012-07-12

    申请号：US13342929

    申请日：2012-01-03

    Applicant: Mark W. Gailus ,  Stephen W. Ellsworth ,  Prescott B. Atkinson

    Inventor： Mark W. Gailus ,  Stephen W. Ellsworth ,  Prescott B. Atkinson

    IPC: H05K7/00 ,  H05K1/18 ,  H01F27/28

    CPC classification number: H01R13/6633 ,  H01R24/64 ,  H01R2107/00 ,  H05K1/0243 ,  H05K2201/09163 ,  H05K2201/10189 ,  H05K2201/10446

    Abstract: A network interface adapted for high speed networks. The interface includes isolation circuits with a transformer containing two primary coils and two secondary coils. A wire making up each primary coil may be twisted with a wire making up a secondary. These two coils may then be co-wound on a common core. The transformer may be connected to a common mode choke. The isolation circuit may be packaged such that the transformer and coil are in a line, with isolation circuits for a plurality of pairs arranged in parallel. The interface circuit may be packaged in a connector housing, which also may be adapted for high speed performance. The housing may receive multiple isolation circuits in parallel. The housing may also include a mating contact portion in which mating contacts for signal conductors of each pair are positioned along the same side of a cavity.

    Abstract translation: 适用于高速网络的网络接口。 该接口包括具有包含两个初级线圈和两个次级线圈的变压器的隔离电路。 构成每个初级线圈的线可以用组成二次线的线扭绞。 然后可以将这两个线圈共同缠绕在共同的芯上。 变压器可以连接到共模扼流圈。 隔离电路可以被封装成使得变压器和线圈处于一条直线上，并具有用于多个并联布置的隔离电路。 接口电路可以封装在连接器壳体中，该壳体也可适用于高速性能。 外壳可以并联接收多个隔离电路。 壳体还可以包括配合接触部分，其中每对信号导体的配合触点沿着空腔的同一侧定位。

    CIRCUIT BOARD WITH INTEGRATED RFID MICROCHIP
    19.
    发明申请
    CIRCUIT BOARD WITH INTEGRATED RFID MICROCHIP 有权
    具有集成式RFID MICROCHIP的电路板

    公开(公告)号：US20120104104A1

    公开(公告)日：2012-05-03

    申请号：US13283360

    申请日：2011-10-27

    Applicant: Arne Hofmann

    Inventor： Arne Hofmann

    IPC: G06K19/077

    CPC classification number: H05K1/0266 ,  H05K1/183 ,  H05K2201/09163 ,  H05K2201/10098 ,  H05K2201/10446

    Abstract: The present disclosure relates to a circuit board including a supporting material and having conductive tracks on a top surface, wherein the circuit board has a recess in the supporting material, which opens into a lateral surface adjoining the top surface and into which an RFID microchip is inserted.

    Abstract translation: 本公开涉及一种包括支撑材料并且在顶表面上具有导电轨迹的电路板，其中所述电路板在所述支撑材料中具有凹槽，所述凹槽通向邻近所述顶表面的侧表面，并且RFID微芯片是 插入。

    SOLDERING PREFORM
    20.
    发明申请
    SOLDERING PREFORM 审中-公开
    焊接优先

    公开(公告)号：US20120074210A1

    公开(公告)日：2012-03-29

    申请号：US13270655

    申请日：2011-10-11

    Applicant: Franc DUGAL

    Inventor： Franc DUGAL

    IPC: B23K1/20 ,  B23K35/14

    CPC classification number: B23K35/0244 ,  B23K35/38 ,  H05K3/341 ,  H05K3/3478 ,  H05K2201/0373 ,  H05K2201/09163 ,  H05K2203/0415

    Abstract: A soldering preform for soldering in a reducing atmosphere is substantially disc-shaped and has two soldering surfaces each for being in contact with an object to be soldered, respectively, and with at least one recess on at least one soldering surfaces for constituting a channel open to a surface of the object.

    Abstract translation: 用于在还原气氛中焊接的焊接预成型件基本上是圆盘形的，并且具有分别与待焊接物体接触的两个焊接表面，并且在至少一个焊接表面上具有用于构成通道开口的至少一个凹部 到物体的表面。

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