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    Flexible Printed Circuit Connector Protection Structures
    11.
    发明申请
    Flexible Printed Circuit Connector Protection Structures 审中-公开
    柔性印刷电路连接器保护结构

    公开(公告)号：US20140140018A1

    公开(公告)日：2014-05-22

    申请号：US13682402

    申请日：2012-11-20

    Applicant: APPLE INC.

    Inventor： Shayan Malek ,  Michael B. Wittenberg ,  Warren Z. Jones

    IPC: H05K1/14 ,  H05K7/14

    CPC classification number: H05K1/147 ,  H04M1/0277 ,  H04M1/185 ,  H05K1/118 ,  H05K3/363 ,  H05K2201/055 ,  H05K2201/09445 ,  H05K2201/10378 ,  H05K2201/10393 ,  H05K2201/10409

    Abstract: Protection structures may be provided to protect connectors, printed circuits, and other internal device components from damage. Components may shift within a device if the device is unexpectedly dropped. Protection structures can shield printed circuit connectors and other structures so that component movement during a drop event does not dislodge a printed circuit connector or otherwise damage a device. A cowling can be used to hold a board-to-board connector or other connector together. The cowling may have a protruding portion that is bent to form a protective wall. Plastic structures may be molded onto the cowling to form protective walls. Protection structures for printed circuit connectors and other internal device components may be formed from spring-based structures that clip onto the edge of a printed circuit board.

    Abstract translation: 可以提供保护结构以保护连接器，印刷电路和其他内部装置部件免受损坏。 如果设备意外掉落，组件可能在设备内移动。 保护结构可以屏蔽印刷电路连接器和其他结构，使得在跌落事件期间的部件移动不会移除印刷电路连接器或以其他方式损坏设备。 整流罩可用于将板对板连接器或其他连接器固定在一起。 整流罩可以具有弯曲以形成保护壁的突出部分。 塑料结构可以模塑到整流罩上以形成保护壁。 印刷电路连接器和其他内部器件部件的保护结构可以由夹在印刷电路板的边缘上的基于弹簧的结构形成。

    CONNECTING STRUCTURE AND CONNECTING METHOD FOR FLEXIBLE FLAT CABLE
    14.
    发明申请
    CONNECTING STRUCTURE AND CONNECTING METHOD FOR FLEXIBLE FLAT CABLE 有权
    用于柔性平板电缆的连接结构和连接方法

    公开(公告)号：US20120100750A1

    公开(公告)日：2012-04-26

    申请号：US13381113

    申请日：2010-06-18

    Applicant: Shoichi Nomura ,  Goro Nakamura

    Inventor： Shoichi Nomura ,  Goro Nakamura

    IPC: H01R12/59 ,  H01R43/00

    CPC classification number: H01R12/613 ,  H01R13/5208 ,  H05K3/361 ,  H05K3/363 ,  H05K2201/041 ,  H05K2201/09154 ,  H05K2201/09445 ,  H05K2201/09472 ,  H05K2201/09709 ,  H05K2203/0264 ,  Y10T29/49194

    Abstract: A flexible flat cable connecting structure for connecting a flexible flat cable in which a plurality of rectangular conductors are provided in parallel and a plurality of connector terminals arranged at an array pitch different from that of the rectangular conductors comprises an intermediate cable arranging member one end of which is coupled to the connector terminals and in which a plurality of branch conductors are provided in parallel which are set to have mutually different longitudinal dimensions according to the array pitch. The intermediate cable arranging member is laid on the flexible flat cable so that the intermediate cable arranging member and the flexible flat cable are in the same plane and form an angle. The other ends of the branch conductors of the intermediate cable arranging member are connected to the respective rectangular conductors.

    Abstract translation: 一种柔性扁平电缆连接结构，用于连接其中平行设置多个矩形导体的柔性扁平电缆和以矩形导线不同的阵列间距排列的多个连接器端子，包括中间电缆排列构件 其连接到连接器端子，并且其中多个分支导体平行设置，根据阵列间距设置成具有相互不同的纵向尺寸。 中间电缆排列构件放置在柔性扁平电缆上，使得中间电缆排列构件和柔性扁平电缆处于同一平面并形成一个角度。 中间电缆排列构件的分支导体的另一端连接到相应的矩形导体。

    High Capacity Thin Module System
    18.
    发明申请
    High Capacity Thin Module System 有权
    大容量薄模块系统

    公开(公告)号：US20090046431A1

    公开(公告)日：2009-02-19

    申请号：US12258189

    申请日：2008-10-24

    Applicant: James Douglas Wehrly, Jr. ,  James Wilder ,  Paul Goodwin ,  Mark Wolfe

    Inventor： James Douglas Wehrly, Jr. ,  James Wilder ,  Paul Goodwin ,  Mark Wolfe

    IPC: H05K7/20

    CPC classification number: H05K1/189 ,  H05K1/0203 ,  H05K1/11 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572

    Abstract: Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.

    Abstract translation: 灵活的电路填充有沿其主要侧面或其两侧设置的集成电路。 沿柔性电路分布的触点提供模块与应用环境之间的连接。 电路填充的柔性电路围绕刚性衬底的边缘设置，从而将集成电路放置在衬底的一侧或两侧，在衬底的一侧或两侧上具有一层或两层集成电路。 衬底形式优选地由导热材料设计，并且当柔性电路绕在衬底上时，包括设置在较高热能器件（例如AMB）附近的高导热性芯或区域。 其他变型包括将模块的相对侧上的相应IC夹持的导热夹子，以进一步从IC分流热量。 来自衬底主体或衬底芯的优选延伸部件促进模块集成电路之间的热变化减小。

    Memory module system and method
    19.
    发明申请
    Memory module system and method 有权
    内存模块系统和方法

    公开(公告)号：US20080278901A9

    公开(公告)日：2008-11-13

    申请号：US11077952

    申请日：2005-03-11

    Applicant: Paul Goodwin

    Inventor： Paul Goodwin

    IPC: G06F1/16

    CPC classification number: G11C5/04 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09081 ,  H05K2201/09445 ,  H05K2203/1572

    Abstract: Memory module flex circuitry is devised to accommodate packaged integrated circuit devices (ICs) of varying heights or thicknesses. The invention may be employed to advantage in a variety of modules that employ flex circuitry including, but not limited to, fully-buffered, registered or more simple memory modules. Many such modules may replace conventionally-constructed DIMMs without change to the system in which the module is employed. Regions of the flex circuitry devised to provide one or more mounting locales for ICs are delineated, in part, from the main body of the flex circuit. The delineation may be implemented in a preferred embodiment by separating a designated IC mounting area or peninsula from the main body of the flex circuitry either with isolating areas or separations or with tabs that extend from the primary perimeter of the flex circuitry.

    Abstract translation: 存储器模块柔性电路被设计为适应不同高度或厚度的封装集成电路器件（IC）。 本发明可以用于采用柔性电路的各种模块，包括但不限于完全缓冲的，注册的或更简单的存储器模块。 许多这样的模块可以替代传统构造的DIMM而不改变使用模块的系统。 设计用于为IC提供一个或多个安装区域的柔性电路的区域部分地从柔性电路的主体描绘。 描述可以在优选实施例中通过从柔性电路的主体分离指定的IC安装区域或半岛，或者具有隔离区域或间隔，或者与柔性电路的主周边延伸的突出部分分离。

    High Capacity Thin Module System and Method
    20.
    发明申请
    High Capacity Thin Module System and Method 有权
    高容量薄模块系统和方法

    公开(公告)号：US20080094803A1

    公开(公告)日：2008-04-24

    申请号：US11961477

    申请日：2007-12-20

    Applicant: James Wehrly ,  James Wilder ,  Paul Goodwin ,  Mark Wolfe

    Inventor： James Wehrly ,  James Wilder ,  Paul Goodwin ,  Mark Wolfe

    IPC: H05K7/20

    CPC classification number: H05K1/189 ,  H05K1/0203 ,  H05K1/11 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/09445 ,  H05K2201/10159 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2203/1572

    Abstract: Flexible circuitry is populated with integrated circuitry disposed along one or both of its major sides. Contacts distributed along the flexible circuitry provide connection between the module and an application environment. The circuit-populated flexible circuitry is disposed about an edge of a rigid substrate thus placing the integrated circuitry on one or both sides of the substrate with one or two layers of integrated circuitry on one or both sides of the substrate. The substrate form is preferably devised from thermally conductive materials and includes a high thermal conductivity core or area that is disposed proximal to higher thermal energy devices such as an AMB when the flex circuit is brought about the substrate. Other variations include thermally-conductive clips that grasp respective ICs on opposite sides of the module to further shunt heat from the ICs. Preferred extensions from the substrate body or substrate core encourage reduced thermal variations amongst the integrated circuits of the module.

    Abstract translation: 灵活的电路填充有沿其主要侧面或其两侧设置的集成电路。 沿柔性电路分布的触点提供模块与应用环境之间的连接。 电路填充的柔性电路围绕刚性衬底的边缘设置，从而将集成电路放置在衬底的一侧或两侧，在衬底的一侧或两侧上具有一层或两层集成电路。 衬底形式优选地由导热材料设计，并且当柔性电路绕在衬底上时，包括设置在较高热能器件（例如AMB）附近的高导热性芯或区域。 其他变型包括将模块的相对侧上的相应IC夹持的导热夹子，以进一步从IC分流热量。 来自衬底主体或衬底芯的优选延伸部件促进模块集成电路之间的热变化减小。

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