公开(公告)号：US09101046B2

公开(公告)日：2015-08-04

申请号：US13753117

申请日：2013-01-29

Applicant: MediGuide Ltd.

Inventor： Lior Sobe

IPC: H05K1/00 ,  H05K9/00 ,  H05K1/02 ,  A61B5/00 ,  A61B5/06 ,  H05K3/46 ,  A61B6/12 ,  A61B5/0402 ,  A61B6/00

CPC classification number: A61B5/0422 ,  A61B5/0402 ,  A61B5/062 ,  A61B5/068 ,  A61B5/6847 ,  A61B5/6851 ,  A61B5/6852 ,  A61B6/12 ,  A61B6/487 ,  A61B2562/0223 ,  A61B2562/125 ,  A61B2562/182 ,  A61B2562/222 ,  A61B2562/227 ,  H05K1/0245 ,  H05K3/4685 ,  H05K9/0073 ,  H05K2201/0715 ,  H05K2201/097 ,  H05K2203/0548 ,  H05K2203/30

Abstract: An apparatus for transmitting electrical signals is disclosed. The apparatus includes a substrate and a twisted pair of conductors located on the substrate. The twisted pair of conductors has a first layer comprising conductive material, a second layer comprising nonconductive material, and a third player comprising conductive material. The first layer has a plurality of segments separated by a plurality of gaps. The second layer is positioned in said gaps and electrically insulates a portion of the segments positioned within the gaps. The third layer is positioned over the second layer. The third layer is configured to electrically connects an end of one segment to an end of another segment. The twisted pair of conductors formed by the three dimensional structure comprises two electrically isolated conductors twisted about each other.

Abstract translation: 公开了一种用于发送电信号的装置。 该装置包括基板和位于基板上的双绞导线。 所述双绞线导体具有包括导电材料的第一层，包含非导电材料的第二层和包含导电材料的第三播放器。 第一层具有由多个间隙隔开的多个段。 第二层定位在所述间隙中并且电绝缘位于间隙内的段的一部分。 第三层位于第二层上。 第三层被配置为将一个段的末端电连接到另一段的末端。 由三维结构形成的双绞导体包括两个彼此扭曲的电隔离导体。

公开(公告)号：US20150157862A1

公开(公告)日：2015-06-11

申请号：US14563778

申请日：2014-12-08

Applicant: Second Sight Medical Products, Inc.

Inventor： Robert J. Greenberg ,  Neil H. Talbot ,  James S. Little

IPC: A61N1/36 ,  A61N1/05 ,  A61N1/375 ,  A61N1/372

CPC classification number: H05K3/282 ,  A61B5/0006 ,  A61B5/0478 ,  A61B5/4836 ,  A61B5/6868 ,  A61B2562/0209 ,  A61B2562/046 ,  A61B2562/125 ,  A61N1/0529 ,  A61N1/0531 ,  A61N1/0534 ,  A61N1/3606 ,  A61N1/36071 ,  A61N1/36082 ,  A61N1/36139 ,  A61N1/375 ,  A61N1/3752 ,  A61N1/3754 ,  H01L23/055 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48465 ,  H05K1/02 ,  H05K1/0271 ,  H05K1/028 ,  H05K1/0281 ,  H05K1/0306 ,  H05K1/092 ,  H05K1/11 ,  H05K1/111 ,  H05K1/145 ,  H05K1/147 ,  H05K1/189 ,  H05K3/0044 ,  H05K3/005 ,  H05K3/0058 ,  H05K3/28 ,  H05K3/321 ,  H05K3/363 ,  H05K3/4015 ,  H05K3/4061 ,  H05K2201/0245 ,  H05K2201/053 ,  H05K2201/055 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/09163 ,  H05K2201/097 ,  H05K2201/09981 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10674 ,  H05K2201/10795 ,  H05K2201/10931 ,  H05K2201/2009 ,  H05K2203/0195 ,  H05K2203/025 ,  H05K2203/0278 ,  H05K2203/0307 ,  H05K2203/068 ,  H05K2203/082 ,  H05K2203/1322 ,  H05K2203/1327 ,  H05K2203/1394 ,  H05K2203/1461 ,  H05K2203/1476 ,  H05K2203/162 ,  H05K2203/304 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The present invention consists of an implantable device with at least one package that houses electronics that sends and receives data or signals, and optionally power, from an external system through at least one coil attached to at least one package and processes the data, including recordings of neural activity, and delivers electrical pulses to neural tissue through at least one array of multiple electrodes that are attached to the at least one package. The device is adapted to electrocorticographic (ECoG) and local field potential (LFP) signals. A brain stimulator, preferably a deep brain stimulator, stimulates the brain in response to neural recordings in a closed feedback loop. The device is advantageous in providing neuromodulation therapies for neurological disorders such as chronic pain, post traumatic stress disorder (PTSD), major depression, or similar disorders. The invention and components thereof are intended to be installed in the head, or on or in the cranium or on the dura, or on or in the brain.

Abstract translation: 本发明包括具有至少一个封装的可植入装置，该封装装置容纳通过连接到至少一个封装件的至少一个线圈从外部系统发送和接收数据或信号并可选地供电的电子装置，并处理数据，包括记录 的神经活动，并且通过连接到所述至少一个包装的多个电极的至少一个阵列将电脉冲递送给神经组织。 该器件适用于电皮质（ECoG）和局部场电位（LFP）信号。 大脑刺激器，优选深部脑刺激器，在闭合反馈环路中响应于神经记录而刺激大脑。 该装置有利于为神经障碍如慢性疼痛，创伤后应激障碍（PTSD），主要抑郁症或类似疾病提供神经调节疗法。 本发明及其组分旨在安装在头部，或者在头颅或硬脑膜上，或在脑中或脑中。

公开(公告)号：US09040337B2

公开(公告)日：2015-05-26

申请号：US13840299

申请日：2013-03-15

Applicant: Electronics and Telecommunications Research Institute

Inventor： Chan Woo Park ,  Jae Bon Koo ,  Sang Chul Lim ,  Ji-Young Oh ,  Soon-Won Jung

IPC: H01L21/76 ,  H05K1/02 ,  H01L21/768 ,  H01L23/538 ,  H05K3/46

CPC classification number: H05K1/0283 ,  H01L21/76898 ,  H01L23/5387 ,  H01L29/78603 ,  H01L2924/0002 ,  H05K3/4644 ,  H05K2201/097 ,  H01L2924/00

Abstract: Provided are a stretchable electronic device and a method of manufacturing the same. The manufacturing method includes forming coil interconnection on a first substrate, forming a first stretchable insulating layer that covers the coil interconnection, forming a second substrate on the first stretchable insulating layer, separating the first substrate from the coiling interconnection and the first stretchable insulating layer, and forming a transistor on the coil interconnection.

Abstract translation: 提供一种可拉伸电子装置及其制造方法。 该制造方法包括在第一基板上形成线圈互连，形成覆盖线圈互连的第一可拉伸绝缘层，在第一可拉伸绝缘层上形成第二基板，将第一基板与卷绕互连和第一可拉伸绝缘层分离， 以及在线圈互连上形成晶体管。

公开(公告)号：US08890519B2

公开(公告)日：2014-11-18

申请号：US13606486

申请日：2012-09-07

Applicant: Philippe Klein

Inventor： Philippe Klein

IPC: G01R33/00 ,  G01R33/02 ,  H01F27/28 ,  H01F5/00 ,  G01R33/04 ,  G01R33/05 ,  H05K1/16 ,  H02K3/26 ,  H05K3/46 ,  H05K1/02 ,  H02K35/02

CPC classification number: H05K1/165 ,  G01R33/0052 ,  G01R33/04 ,  G01R33/045 ,  G01R33/05 ,  H01F5/003 ,  H02K3/26 ,  H02K35/02 ,  H05K1/0239 ,  H05K3/46 ,  H05K2201/086 ,  H05K2201/09263 ,  H05K2201/09672 ,  H05K2201/097

Abstract: A printed circuit in which, in going from one end to another, a same conductive line is wound successively: around the first winding axis to form at least one half-turn of a first coil, then around the second winding axis to form at least one half-turn of a second coil, then around the first winding axis to form at least one half-turn of a first coil, then around the second winding axis to form at least one half-turn of a second coil.

Abstract translation: 一个印刷电路，其中从一端到另一端，相同的导电线依次缠绕：围绕第一卷绕轴线形成第一线圈的至少一个半圈，然后围绕第二绕组轴线形成，以形成至少 然后围绕第一绕组轴线形成第一线圈的至少一个半匝，然后围绕第二绕组轴线形成第二线圈的至少一个半匝。

公开(公告)号：US08766434B2

公开(公告)日：2014-07-01

申请号：US13743175

申请日：2013-01-16

Applicant: Frank Lambrecht

Inventor： Frank Lambrecht

IPC: H01L23/34

CPC classification number: H01L23/48 ,  G11C5/025 ,  G11C5/04 ,  G11C7/1057 ,  G11C7/1084 ,  H01L25/18 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/181 ,  H05K2201/097 ,  H05K2201/10159 ,  H05K2203/1572 ,  Y02P70/611 ,  H01L2924/00

Abstract: The semiconductor module includes a plurality of memory die on a first side of a substrate and a plurality of buffer die on a second side of the substrate. Each of the memory die is disposed opposite and electrically coupled to one of the buffer die.

Abstract translation: 半导体模块包括在衬底的第一侧上的多个存储器管芯和在衬底的第二侧上的多个缓冲管芯。 每个存储器管芯相对设置并电耦合到缓冲管芯之一。

公开(公告)号：US20140083858A1

公开(公告)日：2014-03-27

申请号：US13624288

申请日：2012-09-21

Applicant: Weng Hong Teh ,  Kevin Lin ,  Feras Eid ,  Qing Ma

Inventor： Weng Hong Teh ,  Kevin Lin ,  Feras Eid ,  Qing Ma

IPC: B01D43/00 ,  H05K3/30

CPC classification number: H05K1/0272 ,  H01L21/568 ,  H01L24/19 ,  H01L24/20 ,  H01L25/50 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2924/1815 ,  H01L2924/18162 ,  H05K1/0212 ,  H05K1/185 ,  H05K3/0097 ,  H05K2201/097 ,  H05K2203/1536 ,  H05K2203/308 ,  Y10T29/4913

Abstract: Methods of forming a microelectronic packaging structure and associated structures formed thereby are described. Those methods may include attaching a microfluidic die to a package structure, wherein the microfluidic die comprises a plurality of asymmetric electrodes that may be coupled with signal pads disposed within the package structure.

Abstract translation: 描述了形成微电子封装结构的方法及由此形成的相关结构。 这些方法可以包括将微流体管芯附接到封装结构，其中微流体管芯包括可以与设置在封装结构内的信号焊盘耦合的多个不对称电极。

公开(公告)号：US20130027172A1

公开(公告)日：2013-01-31

申请号：US13644964

申请日：2012-10-04

Applicant: Chipbond Technology Corporation

Inventor： Chih-Ming Kuo ,  You-Ming Hsu

IPC: H01F5/00

CPC classification number: H01F5/00 ,  H01F5/003 ,  H05K1/165 ,  H05K3/465 ,  H05K2201/097 ,  Y10T29/4902 ,  Y10T29/49069 ,  Y10T29/49071 ,  Y10T29/49073 ,  Y10T29/49155

Abstract: A method for fabricating a carrier with a three-dimensional inductor comprises the steps of providing a substrate having a protective layer; forming a first photoresist layer on the protective layer; patterning the first photoresist layer to form a second opening and a plurality of disposing slots; forming a first metal layer in second opening and disposing slots; removing the first photoresist layer; forming a first dielectric layer on the protective layer; forming a second photoresist layer on the first dielectric layer; patterning the second photoresist layer to form a plurality of slots; forming a second metal layer in slots to form a plurality of inductive portions; removing the second photoresist layer; forming a second dielectric layer on the first dielectric layer; forming a third photoresist layer on the second dielectric layer; patterning the third photoresist layer to form a plurality of slots; and forming a third metal layer in slots.

Abstract translation: 一种制造具有三维电感器的载体的方法包括以下步骤：提供具有保护层的衬底; 在保护层上形成第一光致抗蚀剂层; 图案化第一光致抗蚀剂层以形成第二开口和多个布置槽; 在第二开口中形成第一金属层并设置槽; 去除第一光致抗蚀剂层; 在所述保护层上形成第一介电层; 在所述第一介电层上形成第二光致抗蚀剂层; 图案化第二光致抗蚀剂层以形成多个槽; 在槽中形成第二金属层以形成多个感应部分; 去除所述第二光致抗蚀剂层; 在所述第一电介质层上形成第二电介质层; 在所述第二介电层上形成第三光致抗蚀剂层; 图案化第三光致抗蚀剂层以形成多个狭缝; 以及在槽中形成第三金属层。

公开(公告)号：US08253672B2

公开(公告)日：2012-08-28

申请号：US12186348

申请日：2008-08-05

Applicant: Sung-Kyu Lee ,  On-Sik Choi ,  Do-Wan Kim ,  Sung-Wook Kang

Inventor： Sung-Kyu Lee ,  On-Sik Choi ,  Do-Wan Kim ,  Sung-Wook Kang

IPC: H01L23/04

CPC classification number: H05K1/0245 ,  H05K1/0228 ,  H05K2201/09236 ,  H05K2201/09245 ,  H05K2201/09672 ,  H05K2201/097

Abstract: One or more embodiments of the present disclosure relate to a circuit board having a substrate and a plurality of differential signal lines formed on the substrate and transmitting differential signals. The differential signal lines include a first signal line and a second signal line. The first signal line and the second signal line extend along at least two paths that are parallel to each other. The paths of the first signal line and the second signal line switch at path change portions, and the path change portions of neighboring differential signal lines are positioned at different distances away from an edge of the circuit board along the length direction of the differential signal line.

Abstract translation: 本公开的一个或多个实施例涉及具有衬底和形成在衬底上并传输差分信号的多个差分信号线的电路板。 差分信号线包括第一信号线和第二信号线。 第一信号线和第二信号线沿着彼此平行的至少两个路径延伸。 第一信号线和第二信号线开关在路径改变部分的路径，并且相邻差分信号线的路径变化部分位于与差分信号线的长度方向上离电路板边缘不同的距离处 。

公开(公告)号：US20120178217A1

公开(公告)日：2012-07-12

申请号：US13418883

申请日：2012-03-13

Applicant: Li-Tien Chang

Inventor： Li-Tien Chang

IPC: H01L21/50

CPC classification number: H05K1/0231 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/50 ,  H01L2924/0002 ,  H01L2924/15311 ,  H01L2924/19105 ,  H05K1/0224 ,  H05K1/162 ,  H05K2201/093 ,  H05K2201/097 ,  H05K2201/0979 ,  H01L2924/00

Abstract: Provided is an interleaved or wavy spatial arrangement of the micro-vias providing the electrical pathways for the power and ground leads are described. The spatial arrangement increases the coupling pairs between power and ground vias or leads. This spatial arrangement is maintained even as the micro-vias transition across a plane from a direction of travel. Thus, the charge from the decoupling capacitor is able to more efficiently be delivered as the inductances are minimized through this design.

Abstract translation: 提供了提供用于电源和接地引线的电路径的微通孔的交错或波浪空间布置。 空间布置增加了电源和接地通孔或引线之间的耦合对。 即使微通孔从行进方向跨过平面过渡，也保持这种空间布置。 因此，通过该设计，通过使电感最小化，来自去耦电容器的电荷能够更有效地传递。

公开(公告)号：US08187013B2

公开(公告)日：2012-05-29

申请号：US13188238

申请日：2011-07-21

Applicant: Hiroyuki Saito ,  Kyoko Saito

Inventor： Hiroyuki Saito ,  Kyoko Saito

IPC: H01R27/00

CPC classification number: H04N5/2251 ,  H05K1/0219 ,  H05K1/0245 ,  H05K1/118 ,  H05K1/147 ,  H05K2201/097 ,  H05K2201/10189

Abstract: An electronic apparatus including a first wiring board formed having a first area, a second area, and a third area, wherein the first area is formed extending in a first direction from the third area, and the second area is formed extending in a second direction, which is opposite to the first direction, from the third area, a second wiring board connected to the first wiring board, a first connector for connection to an external device, wherein the first connector is mounted on the first area of the first wiring board, a second connector for connection to an external device, wherein the second connector is mounted on the second area of the first wiring board, and a third connector connected to the second wiring board, wherein the third connector is mounted on the third area of the first wiring board, and is formed with a first terminal array and a second terminal array facing each other, wherein on the first wiring board a first differential transmission line is formed in a region from the first connector to the first terminal array, and a second differential transmission line is formed in a region from the second connector to the second terminal array.

Abstract translation: 一种电子设备，包括形成有第一区域，第二区域和第三区域的第一布线板，其中所述第一区域形成为从所述第三区域沿第一方向延伸，并且所述第二区域形成为沿第二方向 与第一方向相反的第一连接器，从第三区域连接到与第一布线板连接的第二布线板，用于连接到外部设备的第一连接器，其中第一连接器安装在第一布线板的第一区域上 ，用于连接到外部设备的第二连接器，其中所述第二连接器安装在所述第一布线板的第二区域上，以及连接到所述第二布线板的第三连接器，其中所述第三连接器安装在所述第二布线板的第三区域上 第一布线板，并且形成有彼此面对的第一端子阵列和第二端子阵列，其中在第一布线板上形成有第一差分传输线， 并且在从第二连接器到第二端子阵列的区域中形成第二差分传输线。