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    Field programmable circuit module
    11.
    发明授权
    Field programmable circuit module 失效
    现场可编程电路模块

    公开(公告)号：US5640308A

    公开(公告)日：1997-06-17

    申请号：US560154

    申请日：1995-11-17

    Applicant: Robert Osann, Jr. ,  George A. Shaw, Jr. ,  Amr M. Mohsen

    Inventor： Robert Osann, Jr. ,  George A. Shaw, Jr. ,  Amr M. Mohsen

    IPC: H01L23/538 ,  H05K1/00 ,  H05K1/11 ,  H05K7/02 ,  H01L29/00

    CPC classification number: H01L23/5382 ,  H05K1/0289 ,  H01L2224/49171 ,  H01L2924/10253 ,  H05K1/112 ,  H05K2201/09945 ,  H05K2201/10689 ,  H05K2203/175

    Abstract: The invention uses a programmable interconnect substrate having a plurality of conductive and interconnectable vias located on one or both surfaces thereof. A customized pattern of bonding pads is then formed over the one or both surfaces of the substrate which correspond to the terminal footprints of specific surface mounted packages intended to be mounted on the substrate. A generalized pattern of bonding pads may also be formed on the surfaces of the substrate for electrically connecting terminals of bare dice thereto by means of thin wire. All bonding pads are electrically connected to one or more vias by direct electrical contact or by a conductive trace extending from the bonding pad to a nearby via.

    Abstract translation: 本发明使用具有位于其一个或两个表面上的多个导电和互连通孔的可编程互连基板。 然后在衬底的一个或两个表面上形成定制的接合焊盘图案，其对应于期望安装在衬底上的特定表面安装封装的端子脚印。 也可以在基板的表面上形成接合焊盘的一般化图案，用于通过细线电连接裸裸片的端子。 所有接合焊盘通过直接电接触或通过从接合焊盘延伸到附近的通孔的导电迹线电连接到一个或多个通孔。

    Multilayer thin-film wiring board
    12.
    发明授权
    Multilayer thin-film wiring board 失效
    多层薄膜接线板

    公开(公告)号：US5608192A

    公开(公告)日：1997-03-04

    申请号：US506918

    申请日：1995-07-26

    Applicant: Kiyokazu Moriizumi ,  Kiyotaka Seyama

    Inventor： Kiyokazu Moriizumi ,  Kiyotaka Seyama

    IPC: H05K3/46 ,  H01L23/12 ,  H01L23/538 ,  H05K1/00 ,  H05K1/03 ,  H05K3/42

    CPC classification number: H01L23/5386 ,  H01L23/5384 ,  H05K1/0287 ,  H01L2924/0002 ,  H05K1/0289 ,  H05K1/0298 ,  H05K1/0306 ,  H05K2201/09454 ,  H05K2201/09945 ,  H05K2203/061 ,  H05K3/429 ,  H05K3/4644 ,  H05K3/467

    Abstract: A multilayer thin-film wiring board formed by laminating at least three wiring layers including first, second, and third wiring layers together with a dielectric layer. The first wiring layer includes a first pattern having a plurality of first windows arranged with the same pitch both in a lateral direction and in a longitudinal direction of the wiring board, and a plurality of first island patterns each located at a substantially central portion of each first window. Similarly, the second wiring layer includes a second pattern having a plurality of second windows, and a plurality of second island patterns each located at a substantially central portion of each second window. The second windows are shifted from the first windows by half the pitch both in the lateral direction and in the longitudinal direction. The third wiring layer includes first and second via pads formed on a surface of the wiring board. The first via pad, the first pattern, and at least one of the second island patterns are connected together by a first via. The second via pad, the second pattern, and at least one of the first island patterns are connected together by a second via.

    Abstract translation: 通过将包括第一，第二和第三布线层的至少三个布线层与电介质层层叠而形成的多层薄膜布线板。 第一布线层包括第一图案，其具有在布线板的横向和纵向方向上以相同的间距布置的多个第一窗口，以及多个第一岛状图案，每个第一窗口位于每个第一窗口的大致中央部分 第一窗口 类似地，第二布线层包括具有多个第二窗口的第二图案和分别位于每个第二窗口的大致中心部分的多个第二岛状图案。 第二窗口在横向和纵向方向上从第一窗口偏移了一半的距离。 第三布线层包括形成在布线板的表面上的第一和第二通孔焊盘。 第一通孔焊盘，第一图案以及第二岛状图案中的至少一个通过第一通孔连接在一起。 第二通孔焊盘，第二图案以及第一岛状图案中的至少一个通过第二通孔连接在一起。

    Arrangement for connecting electrical circuits
    15.
    发明授权
    Arrangement for connecting electrical circuits 失效
    连接电路的安排

    公开(公告)号：US3895181A

    公开(公告)日：1975-07-15

    申请号：US49938474

    申请日：1974-08-21

    Applicant: HONEYWELL INF SYSTEMS

    Inventor： LAGRANGE JEAN-PAUL ,  DAVY GERALD ,  PROUIN JEAN-CLAUDE ,  LE GOVIC BERNARD ,  SANDOZ JEAN

    IPC: H05K1/00 ,  H05K1/02 ,  H05K3/42

    CPC classification number: H05K1/0228 ,  H05K1/0289 ,  H05K1/0296 ,  H05K1/0298 ,  H05K3/429 ,  H05K2201/044 ,  H05K2201/09236 ,  H05K2201/09263 ,  H05K2201/09609 ,  H05K2201/09945

    Abstract: An improved arrangement for connecting electrical circuits is formed by a plurality of superimposed insulating sheets joined together. At least one face of each of the sheets carries networks of conductive strips. The arrangement concludes linking members for electrically coupling conductive strips situated at different ones of said sheets and connecting members which connect the strips to the electrical circuits. The linking and connecting members are arranged in rows and columns defining corridors through which must pass the conductive strips. The general directions of the conductive strips are parallel to each other and to the corridors. At least one strip out of two is in the form of an offset line such that the average distance between two adjacent strips along their substantially parallel paths is greater than the distance which would separate them if they were entirely straight.

    Abstract translation: 通过连接在一起的多个叠加的绝缘片形成用于连接电路的改进布置。 每个片的至少一个面承载导电条的网络。 该布置总结了用于将位于不同的所述片材的导电条和用于将条连接到电路的连接部件的电连接的连接部件。 连接和连接构件被布置成行和列，其限定通道，通过该走廊必须通过导电条。 导电条的一般方向彼此平行并且与走廊相平行。 两个中的至少一个条带是偏移线的形式，使得沿着它们基本上平行的路径的两个相邻条之间的平均距离大于如果它们完全是直的则将分离它们的距离。

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