公开(公告)号：US20240333107A1

公开(公告)日：2024-10-03

申请号：US18623721

申请日：2024-04-01

Applicant: MILWAUKEE ELECTRIC TOOL CORPORATION

Inventor： Lucas A. Rutowski ,  Maxwell L. Merget ,  Douglas R. Fieldbinder

IPC: H02K11/215 ,  H02K5/22 ,  H02K11/00 ,  H05K1/18

CPC classification number: H02K11/215 ,  H02K5/225 ,  H02K11/0094 ,  H05K1/181 ,  H05K2201/1009 ,  H05K2201/10166 ,  H05K2201/10272

Abstract: A power tool that includes a motor and a printed circuit board (“PCB”). The motor includes a rotor and a stator. The stator includes a plurality of stator terminals. The PCB is electrically connected to the stator. The PCB includes a switch and an embedded busbar. A first end of the embedded busbar is electrically connected to the switch. The embedded busbar extends away from the PCB. A second end of the embedded busbar electrically connects to a stator terminal of the plurality of stator terminals for providing power to the motor using the switch. The embedded bus bar is embedded between two layers of the printed circuit board.

公开(公告)号：US20230308039A1

公开(公告)日：2023-09-28

申请号：US18183278

申请日：2023-03-14

Applicant: Vacon Oy

Inventor： Jani Matti Perkiö ,  Juho Kari

IPC: H02P27/06 ,  H05K1/02

CPC classification number: H02P27/06 ,  H05K1/0298 ,  H05K2201/1009 ,  H05K2201/10272

Abstract: The present disclosure is directed at an AC drive for driving an electric motor. The AC drive has a 3-phase diode bridge, an inverter and a snubber board with multilayer printed circuit board elements, wherein the power lane in every layer of every element is connected to only one potential DC- or DC+, each element includes two capacitors of inverted polarity, wherein each element includes two C-shaped bus bars and wherein the C-shaped bus bars of two neighbouring elements are placed in close proximity to each other.

公开(公告)号：US20180103543A1

公开(公告)日：2018-04-12

申请号：US15782269

申请日：2017-10-12

Applicant: Intel Corporation

Inventor： Fabian Oberndorfer ,  Klaus Doth ,  Raffael Lustig ,  Jan Nicolaas Zelhorst

IPC: H05K1/02 ,  H05K5/00 ,  H05K3/00 ,  H05K3/28 ,  H05K3/30 ,  H02K11/00 ,  B64C39/02

CPC classification number: H05K1/0278 ,  B64C25/00 ,  B64C39/024 ,  B64C2201/108 ,  B64D47/08 ,  H02K11/0094 ,  H02K11/33 ,  H05K1/0271 ,  H05K3/0044 ,  H05K3/285 ,  H05K3/303 ,  H05K5/0017 ,  H05K5/0039 ,  H05K2201/09063 ,  H05K2201/09263 ,  H05K2201/1009 ,  H05K2201/10189 ,  H05K2201/10318 ,  H05K2203/0228

Abstract: Flexible printed circuit boards and related methods are disclosed herein. An example printed circuit board includes a controller interface coupled to a surface of the printed circuit board between a first end of the printed circuit board and a second end of the printed circuit board. The example printed circuit board includes a connector coupled to the surface proximate to the first end. The example printed circuit board includes a notch formed between the controller interface and the connector. The notch is to form a narrowed portion of the printed circuit board to enable the printed circuit board to bend at the narrowed portion.

公开(公告)号：US09773964B2

公开(公告)日：2017-09-26

申请号：US14369677

申请日：2012-12-26

Applicant: Kyocera Corporation

Inventor： Akira Oikawa ,  Eiji Sakata

IPC: H01L41/053 ,  H03H9/10 ,  H01L41/047 ,  H05K1/18 ,  H01L23/31 ,  H03H9/00 ,  H03H9/05

CPC classification number: H01L41/053 ,  H01L23/3121 ,  H01L41/047 ,  H01L2924/0002 ,  H03H9/0038 ,  H03H9/059 ,  H03H9/1064 ,  H03H9/1085 ,  H05K1/185 ,  H05K2201/1009 ,  H05K2201/10196 ,  H01L2924/00

Abstract: An electronic component has a support member, an SAW element which is mounted on the support member with a space S therebetween and which has a facing surface which faces the support member, and a resin portion which covers the SAW element and which is provided so as to seal the space S. The SAW element has a piezoelectric substrate, an IDT provided on the facing surface of the piezoelectric board, an wiring (an outer wiring) which is provided on the facing surface of the piezoelectric board and extends from the IDT toward the periphery side of the piezoelectric board, and a dam member which is adjacent to a lateral edge portion of the wiring and which is provided locally relative to the circumferential direction which surrounds the IDT.

公开(公告)号：US09679826B2

公开(公告)日：2017-06-13

申请号：US15178632

申请日：2016-06-10

Applicant: Amtek Semiconductors Co., Ltd.

Inventor： Chien-Ping Huang

IPC: H04L21/00 ,  H01L23/467 ,  H01L21/71 ,  H05K1/02 ,  H05K1/16 ,  H01L21/48 ,  H01L21/56 ,  H01L21/78 ,  H01L23/498 ,  H01L23/522 ,  H01L23/31 ,  H05K3/28

CPC classification number: H01L23/467 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/4882 ,  H01L21/565 ,  H01L21/71 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0209 ,  H05K1/0272 ,  H05K1/165 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2201/1009 ,  H01L2924/00014

Abstract: A semiconductor package is provided, including a substrate having a top surface, a bottom surface opposing the top surface, a via communicating the top surface with the bottom surface, and a stator set formed by circuits; an axial tube axially installed in the via of the substrate; a plurality of electronic components mounted on the top surface of the substrate and electrically connected to the substrate; an encapsulant formed on the top surface of the substrate for encapsulating the electronic components and the axial tube; and an impeller axially coupled to the axial tube via the bottom surface of the substrate. In the semiconductor package, the stator set is formed in the substrate by a patterning process. Therefore, the thickness of the semiconductor package is reduced significantly.

公开(公告)号：US20160329774A1

公开(公告)日：2016-11-10

申请号：US15109832

申请日：2014-05-22

Applicant: MITSUBISHI ELECTRIC CORPORATION

Inventor： Rei ARAKI ,  Yu KAWANO ,  Yoshihito ASAO

IPC: H02K5/24 ,  H02K11/33 ,  H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H02K11/21 ,  H02K11/25

CPC classification number: H02K5/24 ,  H02K11/21 ,  H02K11/25 ,  H02K11/33 ,  H05K1/0201 ,  H05K1/0216 ,  H05K1/115 ,  H05K1/181 ,  H05K2201/062 ,  H05K2201/09063 ,  H05K2201/09972 ,  H05K2201/1009 ,  H05K2201/10507

Abstract: A board includes a separating zone in an area closer to the edge than to the center of the board, the separating zone including one elongated through hole. A first group of electronic components that is a source of heat or electric noise is placed in a first area on the center side with respect to the separating zone of the board. On the other hand, a second group of electronic components from which influence of heat or electric noise from other components needs to be eliminated to a maximum extent is placed in a second area on the edge side with respect to the separating zone of the board.

Abstract translation: 板包括在靠近边缘的区域比板的中心更远的区域，分离区包括一个细长的通孔。 作为热或电噪声源的第一组电子部件被放置在相对于电路板的分离区域的中心侧的第一区域中。 另一方面，从第二组电子部件放置到相对于电路板的分离区域的边缘侧的第二区域中，来自其他部件的热或电噪声的影响需要最大程度地消除。

公开(公告)号：US20160284625A1

公开(公告)日：2016-09-29

申请号：US15178632

申请日：2016-06-10

Applicant: Amtek Semiconductors Co., Ltd.

Inventor： Chien-Ping Huang

IPC: H01L23/467 ,  H01L23/522 ,  H01L21/78 ,  H01L23/498 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/467 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/4882 ,  H01L21/565 ,  H01L21/71 ,  H01L21/78 ,  H01L23/3121 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/5227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H05K1/0209 ,  H05K1/0272 ,  H05K1/165 ,  H05K3/284 ,  H05K2201/09063 ,  H05K2201/1009 ,  H01L2924/00014

Abstract: A semiconductor package is provided, including a substrate having a top surface, a bottom surface opposing the top surface, a via communicating the top surface with the bottom surface, and a stator set formed by circuits; an axial tube axially installed in the via of the substrate; a plurality of electronic components mounted on the top surface of the substrate and electrically connected to the substrate; an encapsulant formed on the top surface of the substrate for encapsulating the electronic components and the axial tube; and an impeller axially coupled to the axial tube via the bottom surface of the substrate. In the semiconductor package, the stator set is formed in the substrate by a patterning process. Therefore, the thickness of the semiconductor package is reduced significantly.

Abstract translation: 提供一种半导体封装，包括具有顶表面，与顶表面相对的底表面的衬底，将顶表面与底表面连通的通孔以及由电路形成的定子组; 轴向管轴向安装在基板的通路中; 安装在所述基板的顶表面上并电连接到所述基板的多个电子部件; 形成在所述基板的顶表面上用于封装所述电子部件和所述轴向管的密封剂; 以及经由衬底的底表面轴向联接到轴向管的叶轮。 在半导体封装中，通过图案化工艺在基板中形成定子组。 因此，半导体封装的厚度显着降低。

公开(公告)号：US09072183B2

公开(公告)日：2015-06-30

申请号：US13328048

申请日：2011-12-16

Applicant: Nicholas Lee Mawhinney ,  Andrew Malcolm Haig ,  Michael Zaitz

Inventor： Nicholas Lee Mawhinney ,  Andrew Malcolm Haig ,  Michael Zaitz

IPC: H02K11/02 ,  H05K7/06 ,  H02K5/14 ,  H05K9/00 ,  H05K1/02 ,  H02K5/22

CPC classification number: H05K7/06 ,  H02K5/145 ,  H02K5/225 ,  H02K11/026 ,  H02K2211/03 ,  H05K1/0231 ,  H05K9/00 ,  H05K2201/1009

Abstract: An electromagnetic compatibility (EMC) shielding printed circuit board (PCB) has at least a routing layer and a ground layer. The shielding PCB has an opening that receives a motor bushing and at least one opening that receives motor terminals.

Abstract translation: 电磁兼容性（EMC）屏蔽印刷电路板（PCB）至少具有布线层和接地层。 屏蔽PCB具有接收电机衬套的开口和接收电动机端子的至少一个开口。

公开(公告)号：US09030840B2

公开(公告)日：2015-05-12

申请号：US13635606

申请日：2011-03-16

Applicant: Michael Heim ,  Sigmund Braun

Inventor： Michael Heim ,  Sigmund Braun

IPC: H05K7/06 ,  H05K3/32 ,  H05K1/18

CPC classification number: H05K3/325 ,  H01L2224/4903 ,  H01L2224/49175 ,  H05K1/18 ,  H05K3/326 ,  H05K2201/0397 ,  H05K2201/0969 ,  H05K2201/1009 ,  H05K2201/10401 ,  H05K2201/10568 ,  H05K2201/1059 ,  H05K2201/1081 ,  H05K2201/10863

Abstract: The invention relates to an arrangement comprising an electric and/or electronic module (10) and a circuit carrier (12), wherein at least one electric connecting line (14) of the electric and/or electronic module (10) can be accommodated in a recess (16) of the circuit carrier (12). The arrangement comprises at least one clamping element (18a, 18b, 18c, 18d) which immobilizes the at least one connecting line (14) in the recess (16) once it has been introduced into the recess (16).

Abstract translation: 本发明涉及一种包括电和/或电子模块（10）和电路载体（12）的装置，其中电和/或电子模块（10）的至少一个电连接线（14）可以容纳在 电路载体（12）的凹部（16）。 该装置包括至少一个夹紧元件（18a，18b，18c，18d），一旦其已经被引入到凹部（16）中就将至少一个连接线（14）固定在凹部（16）中。

公开(公告)号：US20140055967A1

公开(公告)日：2014-02-27

申请号：US13958983

申请日：2013-08-05

Applicant: Sony Corporation

Inventor： Junichi Sato

IPC: H05K1/18 ,  H05K3/46

CPC classification number: H05K1/184 ,  H01L2224/16225 ,  H01L2924/15311 ,  H05K1/0271 ,  H05K1/183 ,  H05K3/4602 ,  H05K3/4644 ,  H05K2201/09136 ,  H05K2201/1009

Abstract: There is provided a wiring board including a first stiffener, one face of which is bonded to a circuit board, a second stiffener having a disposition hole in which an electronic component is disposed, and a laminate that is formed by laminating a plurality of insulating layers and a plurality of wiring layers between the other face of the first stiffener and one face of the second stiffener, and includes a terminal connection part that is connected to the wiring layers, positioned in the disposition hole, and connected to a terminal part of the electronic component.

Abstract translation: 提供了一种布线板，包括：第一加强件，其一面接合到电路板;第二加强件，具有布置有电子部件的布置孔;以及叠层体，其通过层叠多个绝缘层 以及在所述第一加强件的另一面和所述第二加强件的一个面之间的多个布线层，并且包括连接到布线层的端子连接部，所述端子连接部位于所述布置孔中，并且连接到所述布线层的端子部 电子元件