公开(公告)号：US20190045635A1

公开(公告)日：2019-02-07

申请号：US15759604

申请日：2016-08-30

Applicant: AUTONETWORKS TECHNOLOGIES, LTD. ,  SUMITOMOT WIRING SYSTEMS, LTD. ,  SUMITOMO ELECTRIC INDUSTRIES, LTD.

Inventor： Tou Chin ,  Arinobu NAKAMURA

IPC: H05K1/18 ,  H02G3/16 ,  H05K1/02 ,  H02G3/03 ,  H05K3/34

CPC classification number: H05K1/186 ,  H02G3/03 ,  H02G3/16 ,  H05K1/0203 ,  H05K3/3452 ,  H05K3/3494 ,  H05K7/1432 ,  H05K2201/066 ,  H05K2201/10166 ,  H05K2201/10272 ,  H05K2201/10409

Abstract: A circuit assembly includes a circuit board provided with a connection opening, a plurality of busbars provided on a back surface of the circuit board, an electronic component provided with connection terminals that are soldered to the corresponding busbar exposed through the connection opening, and a solder restricting layer that is provided between the circuit board and the plurality of busbars and includes a pattern surrounding a soldering region of the busbar to which the connection terminals are soldered.

公开(公告)号：US20180295716A1

公开(公告)日：2018-10-11

申请号：US15866062

申请日：2018-01-09

Applicant: LSIS CO., LTD.

Inventor： Deok-Young Lim ,  Chun-Suk Yang

IPC: H05K1/02 ,  H05K3/32

CPC classification number: H05K1/0239 ,  H02M1/44 ,  H05K1/0215 ,  H05K1/0216 ,  H05K1/0233 ,  H05K1/0243 ,  H05K1/0256 ,  H05K1/0263 ,  H05K3/222 ,  H05K3/32 ,  H05K2201/10409

Abstract: Disclosed herein is a board apparatus including a printed circuit board, including a first ground wiring disposed on one surface of the printed circuit board; a second ground wiring disposed on the other surface of the printed circuit board; and a switch module disposed in an overlapped region between the first ground wiring and the second ground wiring, and including a bolt which penetrates through the printed circuit board and a nut which is in contact with the second ground wiring and is coupled to a screw of the bolt.

公开(公告)号：US20180278034A1

公开(公告)日：2018-09-27

申请号：US15763513

申请日：2016-09-09

Applicant: AutoNetworks Technologies, Ltd. ,  Sumitomo Wiring Systems, Ltd. ,  SUMITOMO ELECTRIC INDUSTRIES, LTD.

Inventor： Tou Chin ,  Arinobu Nakamura

IPC: H02G3/16 ,  H02G3/03 ,  H05K1/11 ,  H05K1/14 ,  H05K1/18 ,  B60R16/023

CPC classification number: H02G3/16 ,  B60R16/0238 ,  H02G3/03 ,  H02G3/081 ,  H05K1/115 ,  H05K1/144 ,  H05K1/183 ,  H05K7/02 ,  H05K2201/041 ,  H05K2201/066 ,  H05K2201/10166 ,  H05K2201/10272 ,  H05K2201/10409

Abstract: A circuit assembly includes an electronic component including a plurality of terminals, a first board that is constituted by an insulating plate provided with a conductive path and an insertion hole into which the electronic component is inserted, a busbar that overlaps the first board, and a second board that is constituted by an insulating plate provided with a conductive path and overlapping the first board, at least a portion of the second board being arranged on the same level as the busbar. The plurality of terminals of the electronic component is connected to the busbar and the conductive path of the second board.

公开(公告)号：US20180270965A1

公开(公告)日：2018-09-20

申请号：US15677034

申请日：2017-08-15

Applicant: Wistron Corporation

Inventor： Heng-Min Liu ,  Chun-Wang Lin ,  Chin-Chung Hung ,  Tsung-Hsien Chen ,  Shih-Wei Tung

IPC: H05K5/00 ,  H05K1/02 ,  H05K5/02 ,  H05K5/03

CPC classification number: H05K5/0056 ,  G06F1/182 ,  H04N5/64 ,  H05K1/0271 ,  H05K5/0017 ,  H05K5/0021 ,  H05K5/0052 ,  H05K5/0065 ,  H05K5/0204 ,  H05K5/0217 ,  H05K5/0247 ,  H05K5/03 ,  H05K7/142 ,  H05K2201/09063 ,  H05K2201/10409

Abstract: A shock absorbing structure includes at least one protruding column and at least one resilient module. The at least one protruding column is fixed on an electronic device and passes through a circuit board of the electronic device. The at least one resilient module is disposed between the at least one protruding column and the circuit board. When the electronic device is affected by an external shock load, the at least one resilient module is forced by the circuit board to be deformed for generating a resilient force. When the at least one resilient module is not forced by the circuit board any more, the resilient force generated by the at least one resilient module drives the circuit board to recover.

公开(公告)号：US20180183206A1

公开(公告)日：2018-06-28

申请号：US15851784

申请日：2017-12-22

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Masayoshi Nishita ,  Atsushi Yamamoto ,  Atsushi Shinozaki

IPC: H01S5/042 ,  H01S5/024 ,  H05K1/18 ,  H05K1/02 ,  H01R12/57

CPC classification number: H01S5/0425 ,  H01R12/57 ,  H01S5/02216 ,  H01S5/02284 ,  H01S5/02469 ,  H05K1/0203 ,  H05K1/117 ,  H05K1/183 ,  H05K1/184 ,  H05K3/0061 ,  H05K2201/10121 ,  H05K2201/10409 ,  H05K2201/2036

Abstract: An optical device includes: an optical module provided with an electrical pin; a printed wiring board that is connected to the electrical pin of the optical module, on which a control circuit for controlling the optical module is mounted, and on which an opening is formed; a first plate-shaped member to which the printed wiring board is fixed; a first fixing member that is inserted into the opening of the printed wiring board, and that fixes the printed wiring board with the first plate-shaped member; a second plate-shaped member that is disposed such that the printed wiring board is interposed between the second plate-shaped member and the first plate-shaped member; and a second fixing member that fixes the first fixing member with the second plate-shaped member such that the optical module is retained between the first plate-shaped member and the second plate-shaped member.

公开(公告)号：US09980381B2

公开(公告)日：2018-05-22

申请号：US14571369

申请日：2014-12-16

Applicant: MOTOROLA SOLUTIONS, INC

Inventor： Seng Huan Chuah ,  Friedrich Josef Bollmann ,  Khai Jin Choo ,  Weng Kong Hor ,  Sih Hau Tan

IPC: H05K1/11 ,  H05K1/14 ,  H04M1/02 ,  H05K5/06 ,  H05K1/02

CPC classification number: H05K1/144 ,  H04M1/0277 ,  H05K1/0215 ,  H05K1/0224 ,  H05K1/14 ,  H05K5/064 ,  H05K2201/041 ,  H05K2201/042 ,  H05K2201/043 ,  H05K2201/045 ,  H05K2201/10371 ,  H05K2201/10409 ,  H05K2201/2018

Abstract: A method and circuit board arrangement for an intrinsically safe portable device includes two or more circuit boards having a frame structure that forms a contiguous boundary around a space between the circuit boards. In the space there are circuit components mounted on both circuit boards, and a connector that connect the two circuit boards. An encapsulant material fills the space bounded by the frame structure between the circuit boards to exclude airborne material from coming into contact with the encapsulated circuit components.

公开(公告)号：US09954293B2

公开(公告)日：2018-04-24

申请号：US14996855

申请日：2016-01-15

Applicant: INVENTEC (PUDONG) TECHNOLOGY CORPORATION ,  INVENTEC CORPORATION

Inventor： Ji-Peng Xu ,  Guang-Zhao Tian ,  Yang-Qiu Lai ,  Xiang-Biao Sha

IPC: H05K3/32 ,  H01R12/70 ,  H01R12/71 ,  H05K1/02

CPC classification number: H01R12/7047 ,  H01R12/7088 ,  H01R12/712 ,  H05K1/0263 ,  H05K3/325 ,  H05K2201/09063 ,  H05K2201/10272 ,  H05K2201/1031 ,  H05K2201/10409 ,  H05K2201/10962 ,  H05K2203/167 ,  Y02P70/611

Abstract: A circuit board assembly includes a circuit board, at least one metal sheet, at least one bus and at least one fixed member. The circuit board has at least one electrical connecting area. The metal sheet is adapted to solder to the electrical connecting area and has at least one metal sheet hole. The bus has a connecting portion. The connecting portion is corresponding to the metal sheet. The bus has at least one fixed screwing hole. The fixed screwing hole is corresponding to the metal sheet hole. The circuit board and the bus is locked by the fixed member.

公开(公告)号：US09913361B2

公开(公告)日：2018-03-06

申请号：US14989271

申请日：2016-01-06

Applicant: International Business Machines Corporation

Inventor： David Barron ,  Jason R. Eagle ,  Roger D. Hamilton ,  Mark K. Hoffmeyer ,  Christopher W. Mann ,  Matthew T. Richardson

IPC: H05K7/20 ,  H05K1/02 ,  H05K1/18 ,  H05K3/30 ,  H05K5/00 ,  H01L23/40 ,  H01L23/473

CPC classification number: H05K1/0204 ,  H01L23/40 ,  H01L23/4006 ,  H05K1/0203 ,  H05K1/181 ,  H05K3/30 ,  H05K5/0008 ,  H05K7/20409 ,  H05K2201/066 ,  H05K2201/10409

Abstract: A method for assembling an integrated circuit device includes positioning a thermal interface material (TIM) on top of an electronic component, positioning a load frame onto a printed circuit board, the load frame having an open region for the electronic component to extend through, and positioning a heat sink onto the TIM. The method further comprises fastening a first screw fastener, resulting in a TIM bond line between the heat sink and the electronic component, and actuating a second screw fastener disposed within a bore of the heat sink and threaded into the load frame. The second screw fastener, upon being tightened expands radially to lock the heat sink into the load frame. The first screw fastener, upon the tightening of the second screw fastener, connects the heat sink and the load frame to the printed circuit board.

公开(公告)号：US09888562B2

公开(公告)日：2018-02-06

申请号：US13726509

申请日：2012-12-24

Applicant: Apple Inc.

Inventor： Shayan Malek ,  Michael B. Wittenberg ,  Sawyer I. Cohen ,  Ashutosh Y. Shukla

IPC: H05K1/00 ,  H05K1/02 ,  H05K7/14 ,  H05K9/00 ,  H01R12/79 ,  H01R13/6595 ,  H05K3/36

CPC classification number: H05K1/0219 ,  H01R12/79 ,  H01R13/6595 ,  H05K3/363 ,  H05K3/368 ,  H05K7/142 ,  H05K9/0022 ,  H05K2201/0311 ,  H05K2201/0314 ,  H05K2201/09063 ,  H05K2201/10189 ,  H05K2201/10409 ,  Y10T29/49126

Abstract: Electrical components in an electronic device are mounted on substrates such as printed circuits. Printed circuits contain signal paths formed from metal traces. The signal lines in the signal paths of the printed circuits are coupled together using electrical connection structures such as printed circuit board-to-board connectors, contacts joined by anisotropic conductive film, or contacts joined using solder. Electrical connection structures may be surrounded by conductive resilient ring-shaped structures such as conductive foam structures or spring structures. The conductive foam structures may be provided with a metal layer with which the conductive foam structures are soldered to a ring of metal on a printed circuit. Strain relief structures may be formed from an elastomeric ring that surrounds the electrical connection structures or an overmolded plastic structure. Coating layers and conductive plastic may be used in providing strain relief structures with electromagnetic interference shielding capabilities.

公开(公告)号：US20180027646A1

公开(公告)日：2018-01-25

申请号：US15542783

申请日：2015-12-28

Applicant: AutoNetworks Technologies, Ltd. ,  Sumitomo Wiring Systems, Ltd. ,  SUMITOMO ELECTRIC INDUSTRIES, LTD.

Inventor： Tatsuya Sumida

IPC: H05K1/02 ,  H05K3/10 ,  H05K7/20

CPC classification number: H05K1/0204 ,  H05K1/0209 ,  H05K3/0064 ,  H05K3/10 ,  H05K3/202 ,  H05K3/4007 ,  H05K7/1432 ,  H05K7/20854 ,  H05K7/209 ,  H05K2201/0382 ,  H05K2201/062 ,  H05K2201/066 ,  H05K2201/10272 ,  H05K2201/10409

Abstract: A circuit assembly includes a circuit board having an insulating board in which a conductive path is formed on an insulating plate and a plurality of busbars that are bonded to one side of the insulating board, an insulating layer that is printed to the plurality of busbars so as to couple adjacent ones of the plurality of busbars to each other, a heat dissipation member on which the insulating layer is placed and which is configured to dissipate heat conducted from the insulating layer, a fixing member that is configured to fix the circuit board and the heat dissipation member to each other in a state in which the insulating layer is sandwiched between the heat dissipation member and the plurality of busbars.