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    Component Protection Structures for Electronic Devices
    11.
    发明申请
    Component Protection Structures for Electronic Devices 有权
    电子元器件保护结构

    公开(公告)号：US20160066438A1

    公开(公告)日：2016-03-03

    申请号：US14801686

    申请日：2015-07-16

    Applicant: Apple Inc.

    Inventor： Shayan Malek ,  David A. Pakula ,  Gregory N. Stephens ,  Sawyer I. Cohen ,  Scott A. Myers ,  Tyler B. Cater ,  Eric W. Bates

    IPC: H05K5/00 ,  H05K1/18 ,  H05K1/11

    CPC classification number: H05K1/181 ,  G06F1/1658 ,  H05K2201/10151 ,  H05K2201/10219 ,  H05K2201/10598 ,  Y02P70/611

    Abstract: An electronic device may have a printed circuit to which electrical components are mounted. The electrical components may include a thermal sensor and a pressure sensor. A through hole in the printed circuit may receive the shaft of a standoff The standoff may be soldered to plated metal on the sides of the through hole. A screw or other fastener may secure the printed circuit to a housing for the electronic device. A ring-shaped metal member may be soldered to the printed circuit. The ring-shaped metal member may form a bumper that surrounds the screw or other fastener and the thermal sensor. The pressure sensor may have a port through which ambient pressure measurements are made. A dust protection cover such as a fabric or other porous layer may cover the port.

    Abstract translation: 电子设备可以具有安装电气部件的印刷电路。 电气部件可以包括热传感器和压力传感器。 印刷电路中的通孔可以接收支架的轴。支座可以焊接到通孔侧面的电镀金属。 螺钉或其他紧固件可将印刷电路固定到电子设备的外壳。 可以将环形金属构件焊接到印刷电路。 环形金属构件可以形成围绕螺钉或其他紧固件和热传感器的保险杠。 压力传感器可以具有通过其进行环境压力测量的端口。 诸如织物或其它多孔层的防尘罩可以覆盖端口。

    Apparatus and method for a back plate for heat sink mounting
    13.
    发明授权
    Apparatus and method for a back plate for heat sink mounting 有权
    用于散热片安装的背板的装置和方法

    公开(公告)号：US09196564B2

    公开(公告)日：2015-11-24

    申请号：US13864951

    申请日：2013-04-17

    Applicant: FutureWei Technologies, Inc.

    Inventor： Vadim Gektin ,  Youlin Jin

    IPC: H05K1/16 ,  H05K1/00 ,  H05K7/20 ,  H01L23/40 ,  H05K1/02 ,  H05K1/18

    CPC classification number: H01L23/4006 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/18 ,  H05K7/209 ,  H05K2201/10598 ,  Y10T29/49117 ,  H01L2924/00

    Abstract: Apparatus and method embodiments are provided for a heat sink mounted on a printed circuit board using a back plate with preload. An apparatus comprises a circuit component, a heat sink on a first side of the circuit component a, a back plate having an initial curvature and positioned at a second side of the circuit component opposite to the heat sink, and one or more screws through the back plate and the circuit component and partially through the heat sink. A method further includes placing and flattening a curved back plate on a second side of a circuit board opposite to the first side, and fastening the back plate, the circuit board, and the heat sink together by inserting a plurality of screws through the back plate, the circuit board, and a partial depth on a single side of the heat sink.

    Abstract translation: 提供了使用具有预载的背板安装在印刷电路板上的散热器的装置和方法实施例。 一种装置包括电路部件，在电路部件a的第一侧上的散热器，具有初始曲率并位于电路部件的与散热器相对的第二侧的背板，以及一个或多个穿过 背板和电路元件，部分通过散热器。 一种方法还包括将弯曲的背板放置在与第一侧相对的电路板的第二侧上，并且通过将多个螺钉插入背板中来将背板，电路板和散热器紧固在一起 ，电路板，以及散热器单侧的局部深度。

    Package structure and stacked package module with the same
    14.
    发明授权
    Package structure and stacked package module with the same 有权
    封装结构和堆叠封装模块相同

    公开(公告)号：US09107290B1

    公开(公告)日：2015-08-11

    申请号：US14230941

    申请日：2014-03-31

    Applicant: Delta Electronics Int'l (Singapore) Pte Ltd

    Inventor： Da-Jung Chen

    IPC: H01L23/495 ,  H05K3/00 ,  H05K1/02

    CPC classification number: H05K3/0061 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/3677 ,  H01L23/3735 ,  H01L23/4334 ,  H01L23/49811 ,  H01L23/5389 ,  H01L24/20 ,  H01L25/074 ,  H01L25/16 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/2518 ,  H01L2224/32245 ,  H01L2224/73267 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/19105 ,  H05K1/0204 ,  H05K2201/10598 ,  H01L2924/00

    Abstract: A package structure includes two insulation layers, three conductive layers, and two electronic components. The first and second conductive layers are disposed on a top surface and a bottom surface of the first insulation layer, respectively. The second insulation layer is disposed over the first conductive layer. The third conductive layer is disposed on a top surface of the second insulation layer. The first and second electronic components are embedded within the first and second insulation layers, respectively. The first conducting terminals of the first electronic component are electrically connected with the first conductive layer and the second conductive layer through at least one first conductive via and at least one second conductive via. The second conducting terminals of the second electronic component are electrically connected with the first conductive layer and/or electrically connected with the third conductive layer through at least one third conductive via.

    Abstract translation: 封装结构包括两个绝缘层，三个导电层和两个电子部件。 第一和第二导电层分别设置在第一绝缘层的顶表面和底表面上。 第二绝缘层设置在第一导电层上。 第三导电层设置在第二绝缘层的顶表面上。 第一和第二电子部件分别嵌入在第一和第二绝缘层内。 第一电子部件的第一导电端子通过至少一个第一导电通孔和至少一个第二导电通孔与第一导电层和第二导电层电连接。 第二电子部件的第二导电端子与第一导电层电连接和/或通过至少一个第三导电通孔与第三导电层电连接。

    Flexible wiring board and display device
    15.
    发明授权
    Flexible wiring board and display device 有权
    柔性布线板及显示装置

    公开(公告)号：US09066436B2

    公开(公告)日：2015-06-23

    申请号：US13503319

    申请日：2010-10-04

    Applicant: Masahiro Takahashi ,  Isao Kajima

    Inventor： Masahiro Takahashi ,  Isao Kajima

    IPC: G09G3/36 ,  G06F3/038 ,  H05K1/02 ,  H05K1/11 ,  H05K3/28

    CPC classification number: H05K1/118 ,  H05K1/0275 ,  H05K3/281 ,  H05K2201/048 ,  H05K2201/055 ,  H05K2201/10598

    Abstract: A flexible wiring board includes a base member having flexibility, a write terminal section which is formed on the base member and which is a section to be protected, a protecting section which is integrally formed with the base member and which is folded back so as to cover the write terminal section, and a slit which is formed in the base member in a position that overlaps with the protecting section in a folded state and into which the protecting section can be inserted.

    Abstract translation: 柔性布线板包括具有柔性的基底构件，形成在基底构件上并且是待保护部分的写入端子部分，与底部构件整体形成并被折回的保护部分 覆盖写入端子部分，以及在折叠状态下形成在与保护部分重叠的位置的基部部件中的可以插入保护部分的狭缝。

    Ultrasonic probe
    17.
    发明授权
    Ultrasonic probe 有权
    超声波探头

    公开(公告)号：US08974393B2

    公开(公告)日：2015-03-10

    申请号：US13873342

    申请日：2013-04-30

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Kyung Il Cho ,  Seung Heun Lee ,  Bae Hyung Kim ,  Young Il Kim ,  Jong Keun Song

    IPC: A61B8/00 ,  G01N29/24 ,  H05K1/02 ,  G01N29/32 ,  H05K7/20 ,  B06B1/02

    CPC classification number: H05K7/20336 ,  B06B1/0292 ,  G01N29/2406 ,  G01N29/326 ,  H05K1/0204 ,  H05K2201/064 ,  H05K2201/09072 ,  H05K2201/10598

    Abstract: An ultrasonic probe, from which heat generated in an integrated circuit which is bonded to a cMUT is released, is provided. The ultrasonic probe includes a transducer which is configured to generate ultrasound radiation, an integrated circuit which is installed on the rear surface of the transducer, a printed circuit board which is installed on the rear surface of the integrated circuit and has an opening via which the rear surface of the integrated circuit is at least partially exposed, a heat spreader which has a protrusion inserted into the opening of the printed circuit board and is configured to absorb heat generated in the integrated circuit, and a heat dissipation module which is configured to release heat absorbed by the heat spreader to the outside.

    Abstract translation: 提供了一种超声波探头，其中释放了结合到cMUT的集成电路中产生的热量。 超声波探头包括被配置为产生超声波的换能器，安装在换能器的后表面上的集成电路，安装在集成电路的后表面上的印刷电路板，并且具有开口， 集成电路的后表面至少部分地露出，散热器具有插入印刷电路板的开口中的突起，并且被构造成吸收集成电路中产生的热量，散热模块被配置为释放 散热器吸收的热量到外面。

    Multi-piece board and method for manufacturing the same
    18.
    发明授权
    Multi-piece board and method for manufacturing the same 有权
    多块板及其制造方法

    公开(公告)号：US08926785B2

    公开(公告)日：2015-01-06

    申请号：US13523935

    申请日：2012-06-15

    Applicant: Takahiro Yada

    Inventor： Takahiro Yada

    IPC: B29C65/00 ,  B32B37/00 ,  H05K3/00 ,  H05K1/02

    CPC classification number: H05K3/0097 ,  H05K1/0269 ,  H05K3/0052 ,  H05K2201/09036 ,  H05K2201/09063 ,  H05K2201/09145 ,  H05K2201/09154 ,  H05K2201/09781 ,  H05K2201/09918 ,  H05K2201/10598 ,  H05K2203/0169 ,  H05K2203/166 ,  H05K2203/167 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T156/1002 ,  Y10T156/1066 ,  Y10T428/19 ,  Y10T428/192 ,  Y10T428/24612

    Abstract: A method for manufacturing a multi-piece board having a frame section and a multiple piece sections connected to the frame section includes forming a frame section from a manufacturing panel for the frame section, sorting out multiple acceptable piece sections by inspecting quality of piece sections, forming notch portions in the frame section and the acceptable piece sections such that the notch portions allow the acceptable piece sections to be arranged with respect to the frame section, provisionally fixing the piece sections and the frame section in respective positions, injecting an adhesive agent into cavities formed by the notch portions when the frame section and the piece sections are provisionally fixed to each other, and joining the acceptable piece sections with the frame section by curing the adhesive agent injected into the cavities.

    Abstract translation: 一种用于制造具有框架部分和连接到框架部分的多个部分的多片板的方法包括：从用于框架部分的制造面板形成框架部分，通过检查片段的质量来分选多个可接受片段， 在框架部分和可接受的片部分中形成切口部分，使得切口部分允许相对于框架部分布置可接受的片部分，将片部分和框架部分临时固定在相应的位置，将粘合剂注入 当框架部分和片段彼此临时固定时，由切口部分形成的空腔，以及通过固化注入到空腔中的粘合剂将可接受片段与框架部分接合。

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