公开(公告)号：US10080292B2

公开(公告)日：2018-09-18

申请号：US15635590

申请日：2017-06-28

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Junji Sato ,  Hitoshi Kondo ,  Katsuya Fukase

IPC: H01L23/31 ,  H05K1/18 ,  H01L21/48 ,  H05K3/46 ,  H01L21/683 ,  H01L23/538 ,  H01L25/065 ,  H05K1/11 ,  H05K3/40 ,  H05K3/42 ,  H01L23/00

CPC classification number: H05K1/186 ,  H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/3121 ,  H01L23/3157 ,  H01L23/49816 ,  H01L23/5383 ,  H01L23/5384 ,  H01L23/5386 ,  H01L23/5389 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L25/03 ,  H01L25/0657 ,  H01L2221/68345 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06586 ,  H01L2924/1434 ,  H01L2924/15311 ,  H01L2924/19041 ,  H01L2924/19102 ,  H01L2924/386 ,  H05K1/111 ,  H05K1/115 ,  H05K3/4007 ,  H05K3/424 ,  H05K3/4682 ,  H05K2201/10015 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10734 ,  H05K2201/10977 ,  H01L2924/00014 ,  H01L2924/01029 ,  H01L2924/01047 ,  H01L2924/00012

Abstract: A wiring board includes an electronic component; an insulating layer containing the electronic component therein, and including a via hole that is open at one surface of the insulating layer to expose an electrode of the electronic component; a first wiring layer embedded in the insulating layer, one surface of the first wiring layer being exposed at the one surface of the insulating layer; a second wiring layer including a wiring pattern formed on the one surface of the first wiring layer, and a via wiring extended from the wiring pattern to be extended in the via hole and directly connected to an electrode of the electronic component.

公开(公告)号：US20180211785A1

公开(公告)日：2018-07-26

申请号：US15876247

申请日：2018-01-22

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yoshinao NISHIOKA ,  Yasuo FUJII

IPC: H01G4/252 ,  H01G4/30 ,  H01G4/248 ,  H01G4/12

CPC classification number: H01G4/252 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/1227 ,  H01G4/1236 ,  H01G4/1245 ,  H01G4/224 ,  H01G4/232 ,  H01G4/248 ,  H01G4/30 ,  H05K3/3442 ,  H05K2201/10015 ,  H05K2201/10636

Abstract: An electronic component includes a multilayer body including dielectric layers and inner electrodes alternately laminated together, first to third outer electrodes arranged in this order in one direction on a first main surface of the multilayer body, and fourth to sixth outer electrodes provided on a second main surface opposite to the first main surface such that at least a portion of the fourth outer electrode, at least a portion of the fifth outer electrode, and at least a portion of the sixth outer electrode respectively face the first outer electrode, the second outer electrode, and the third outer electrode. The first, third, and fifth outer electrodes are electrically connected to one another. The second, fourth, and sixth outer electrodes are electrically connected to one another and each have a polarity different from that of the first outer electrode.

公开(公告)号：US20180211776A1

公开(公告)日：2018-07-26

申请号：US15937008

申请日：2018-03-27

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Byoung Hwa LEE ,  Doo Young KIM ,  Hai Joon LEE ,  Jin Man JUNG

IPC: H01G2/06 ,  H05K1/18 ,  H01G4/012 ,  H01G4/232 ,  H05K3/00 ,  H01G4/30

CPC classification number: H01G2/06 ,  H01G4/012 ,  H01G4/232 ,  H01G4/30 ,  H05K1/185 ,  H05K3/0035 ,  H05K2201/10015 ,  H05K2201/10636 ,  Y02P70/611

Abstract: There is provided a multilayer ceramic electronic component to be embedded in a board, including a ceramic body including dielectric layers and having first and second main surfaces facing each other, first and second side surfaces facing each other, and first and second end surfaces facing each other, an active layer including a plurality of first and second internal electrodes alternately exposed through both end surfaces of the ceramic body with the dielectric layers interposed therebetween, to form capacitance therein, upper and lower cover layers formed on upper and lower portions of the active layer, and first and second external electrodes formed on both end surfaces of the ceramic body, wherein when a thickness of the upper or lower cover layer is defined as tc, 4 μm≤tc≤20 μm may be satisfied.

公开(公告)号：US09997294B2

公开(公告)日：2018-06-12

申请号：US15248512

申请日：2016-08-26

Applicant: Samsung Electro-Mechanics Co., Ltd.

Inventor： Hae Suk Chung ,  Kyung Pyo Hong ,  Mi Suk Lee ,  Min Hyang Kim ,  Kyeong Jun Kim ,  Tae Ho Song ,  Seung Hyun Ra

IPC: H01G4/30 ,  H01G4/005 ,  H01G4/232 ,  H01G4/12 ,  H01G4/248 ,  H05K3/32

CPC classification number: H01G4/005 ,  H01G4/12 ,  H01G4/2325 ,  H01G4/248 ,  H01G4/30 ,  H05K3/321 ,  H05K2201/10015 ,  H05K2201/10636 ,  Y02P70/611

Abstract: An electronic component includes a body including a dielectric material and an internal electrode embedded in the dielectric material, an external electrode disposed on the body and connected to the internal electrode, and a conductive adhesive connected to the external electrode. The external electrode and the conductive adhesive include a conductive resin. A circuit board includes the electronic component.

公开(公告)号：US09978725B2

公开(公告)日：2018-05-22

申请号：US14903834

申请日：2014-07-08

Applicant: PSI CO., LTD.

Inventor： Young Rag Do

IPC: H01L25/075 ,  H01L33/62 ,  H05K1/02 ,  H05K3/28 ,  H01L33/50 ,  H05K1/11 ,  H05K3/34

CPC classification number: H01L25/0753 ,  H01L33/504 ,  H01L33/507 ,  H01L33/62 ,  H01L2924/0002 ,  H05K1/0295 ,  H05K1/0296 ,  H05K1/111 ,  H05K3/28 ,  H05K3/3442 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2201/09381 ,  H05K2201/0939 ,  H05K2201/09427 ,  H05K2201/09954 ,  H05K2201/10106 ,  H05K2201/10583 ,  H05K2201/10636 ,  H05K2201/10651 ,  H05K2203/048 ,  Y02P70/611 ,  H01L2924/00

Abstract: Provided is an LED lamp using a nano-scale LED electrode assembly. The LED lamp using the nano-scale LED electrode assembly may solve limitations in which, when a nano-scale LED device according to the related art stands up and is three-dimensionally coupled to an electrode, it is difficult to allow the nano-scale LED device to stand up, and when the nano-scale LED devices are coupled to one-to-one correspond to electrodes different from each other, product quality is deteriorated. Thus, the nano-scale LED device having a nano unit may be connected to the two electrodes different from each other without causing defects, and light extraction efficiency may be improved due to the directivity of the nano-scale LED devices connected to the electrodes. Furthermore, deterioration in function of the LED lamp due to the defects of a portion of the nano-scale LEDs provided in the LED lamp may be minimized, and the LED lamp may have a flexible structure and shape by using the nano-scale LED electrode assembly of which a portion is deformable according to the used purpose or position of the LED lamp.

公开(公告)号：US20180122536A1

公开(公告)日：2018-05-03

申请号：US15802032

申请日：2017-11-02

Applicant: ROHM CO., LTD.

Inventor： Masaki YONEDA

IPC: H01C1/012 ,  H01C1/14 ,  H05K1/18

CPC classification number: H01C1/012 ,  H01C1/014 ,  H01C1/028 ,  H01C1/14 ,  H01C1/142 ,  H01C3/12 ,  H05K1/181 ,  H05K3/3442 ,  H05K2201/10022 ,  H05K2201/10636 ,  Y02P70/611

Abstract: A chip resistor with a reduced thickness is provided. The chip resistor includes an insulating substrate, a resistor embedded in the substrate, a first electrode electrically connected to the resistor, and a second electrode electrically connected to the resistor. The first electrode and the second electrode are spaced apart from each other in a lateral direction that is perpendicular to the thickness direction of the substrate.

公开(公告)号：US20180098430A1

公开(公告)日：2018-04-05

申请号：US15718280

申请日：2017-09-28

Applicant: SHINKO ELECTRIC INDUSTRIES CO., LTD.

Inventor： Junji Sato ,  Katsuya Fukase

IPC: H05K1/18 ,  H01L23/498 ,  H01L23/31 ,  H01L23/00 ,  H01L21/48 ,  H05K1/11 ,  H05K3/00 ,  H05K3/30

CPC classification number: H05K1/183 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/3185 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/16 ,  H01L2224/16235 ,  H01L2224/16267 ,  H01L2924/1205 ,  H01L2924/1432 ,  H05K1/115 ,  H05K1/185 ,  H05K3/0011 ,  H05K3/301 ,  H05K3/4602 ,  H05K2201/10015 ,  H05K2201/10636 ,  H05K2203/0191 ,  H05K2203/1469 ,  Y02P70/611

Abstract: An electronic component-embedded substrate includes a core substrate, a cavity penetrating the core substrate, a wiring layer formed on one surface of the core substrate, a support pattern extending over the cavity and configured to divide the cavity into a plurality of component embedding areas, an insulation wall portion arranged on a part of the support pattern in the cavity and formed of the same material as the core substrate, a plurality of electronic components each of which is mounted in each of the plurality of component embedding areas, and an insulating material filling an inside of the cavity.

公开(公告)号：US20180084639A1

公开(公告)日：2018-03-22

申请号：US15554274

申请日：2016-02-09

Applicant: OMRON CORPORATION

Inventor： Wakahiro KAWAI

IPC: H05K1/02 ,  H05K1/18

CPC classification number: H05K1/0284 ,  H01L2224/20 ,  H01L2224/24195 ,  H05K1/185 ,  H05K2201/0209 ,  H05K2201/0215 ,  H05K2201/09118 ,  H05K2201/09218 ,  H05K2201/10636 ,  H05K2203/1469

Abstract: An electronic component (11) is embedded in an end portion of a surface (P1) and an end portion of a surface (P2) adjacent to each other in a three-dimensional base (2). The portion of an electrode (21) exposed from the surface (P1) and an electrode (101) of a packaged IC (41) are connected to each other via a wiring line (201). The portion of the electrode (21) exposed from the surface (P2) and an electrode (25) of an electronic component (15) are connected to each other via a wiring line (202). Accordingly, it is possible to realize a three-dimensional circuit structure requiring no wiring line spanning over or along an end portion thereof.

公开(公告)号：US20180082923A1

公开(公告)日：2018-03-22

申请号：US15811038

申请日：2017-11-13

Applicant: Nuvotronics, Inc

Inventor： Jean-Marc Rollin ,  David W. Sherrer

IPC: H01L23/373 ,  H01L23/66 ,  H01L23/00 ,  H01L23/552 ,  H01L23/528 ,  H01L23/58

CPC classification number: H01L23/373 ,  H01L23/5286 ,  H01L23/552 ,  H01L23/562 ,  H01L23/58 ,  H01L23/66 ,  H01L2223/6627 ,  H01L2224/48091 ,  H01L2224/85444 ,  H01L2924/01012 ,  H01L2924/01019 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/07811 ,  H01L2924/1423 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3025 ,  H01P3/06 ,  H01P11/005 ,  H05K1/0221 ,  H05K1/0224 ,  H05K1/0272 ,  H05K3/4092 ,  H05K3/4661 ,  H05K2201/09809 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/0733 ,  H05K2203/308 ,  Y02P70/611 ,  Y10T29/49002 ,  Y10T29/49018 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Provided are integrated electronic components which include a waveguide microstructure formed by a sequential build process and an electronic device, and methods of forming such integrated electronic components. The microstructures have particular applicability to devices for transmitting electromagnetic energy and other electronic signals.

公开(公告)号：US20180042112A1

公开(公告)日：2018-02-08

申请号：US15295010

申请日：2016-10-17

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Lu-Yi Chen ,  Cheng-Hsiang Liu ,  Chang-Lun Lu ,  Jun-Cheng Liao ,  Cheng-Yi Chen

IPC: H05K1/18 ,  H05K3/34 ,  H05K1/11

CPC classification number: H05K1/181 ,  H05K1/111 ,  H05K3/341 ,  H05K3/3442 ,  H05K2201/09663 ,  H05K2201/10636 ,  Y02P70/611 ,  Y02P70/613

Abstract: An electronic device includes a circuit board having a plurality of conductive contacts, and an electronic component disposed on the circuit board and having a plurality of electrode terminals. The conductive contacts include a plurality of solder pads spaced apart from each other, and are coupled to the electrode terminals, respectively. The stress generated by any one of the electrode terminals is distributed to all of the solder pads so as to prevent the electronic component from being offset during an assembly process.