公开(公告)号：US3541225A

公开(公告)日：1970-11-17

申请号：US3541225D

申请日：1968-12-20

Applicant: GEN ELECTRIC

Inventor： RACITI JOSEPH A

IPC: H01R12/51 ,  H05K3/34 ,  H01C1/14 ,  H02G15/02 ,  H05K3/30

CPC classification number: H05K3/3447 ,  H01R12/58 ,  H05K3/3468 ,  H05K2201/0373 ,  H05K2201/1081 ,  Y10T29/49169

公开(公告)号：US20190191565A1

公开(公告)日：2019-06-20

申请号：US16283858

申请日：2019-02-25

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takahiro Oka ,  Yuki Takemori ,  Kazuo Kishida ,  Hiromichi Kawakami ,  Yukio Yamamoto ,  Kensuke Otake

IPC: H05K1/18 ,  H01L23/13 ,  H01L23/15 ,  H01L23/498 ,  H05K1/11 ,  H05K1/03 ,  H05K3/34

CPC classification number: H05K1/181 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/4864 ,  H01L21/4867 ,  H01L23/13 ,  H01L23/15 ,  H01L23/49822 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L2224/13017 ,  H01L2224/13147 ,  H01L2224/1357 ,  H01L2224/1403 ,  H01L2224/16227 ,  H01L2224/16237 ,  H01L2924/014 ,  H05K1/0306 ,  H05K1/111 ,  H05K1/18 ,  H05K3/1216 ,  H05K3/26 ,  H05K3/34 ,  H05K3/3436 ,  H05K3/4007 ,  H05K3/4061 ,  H05K3/4644 ,  H05K2201/09472 ,  H05K2201/10795 ,  H05K2201/1081

Abstract: An electronic device that includes an electronic component mounted on a multilayer ceramic substrate. The electronic component includes a connection terminal on the mounting surface side thereof, the connection terminal having an end with a rounded convex shape when viewed in cross section. The multilayer ceramic substrate includes a recessed portion at a position corresponding to the connection terminal, the recessed portion having a rounded concave shape when viewed in cross section, and a surface electrode disposed on at least part of the recessed portion and electrically connected to the connection terminal.

公开(公告)号：US20120211266A1

公开(公告)日：2012-08-23

申请号：US13397867

申请日：2012-02-16

Applicant: Akira Harao ,  Mototatsu Matsunaga ,  Yusuke Takagi ,  Akinori Saneto

Inventor： Akira Harao ,  Mototatsu Matsunaga ,  Yusuke Takagi ,  Akinori Saneto

IPC: H05K1/03 ,  B29C43/02

CPC classification number: H05K3/445 ,  H05K1/0366 ,  H05K1/056 ,  H05K3/325 ,  H05K2201/1059 ,  H05K2201/1081

Abstract: The present invention is to provide a wiring board which can prevent whitening. The wiring board is made of a fiber reinforced resin plate, and has a through hole and a whitening prevention portion. The whitening prevention portion is made only with matrix resin forming the fiber reinforced resin plate, and is integrally formed in the fiber reinforced resin plate. Furthermore, the whitening prevention portion is arranged around the through hole.

Abstract translation: 本发明提供一种可防止白化的布线板。 布线板由纤维增强树脂板制成，具有通孔和防止白化部分。 美白防止部仅由形成纤维增强树脂板的基质树脂制成，并且一体地形成在纤维增强树脂板中。 此外，防止白化部分围绕通孔布置。

公开(公告)号：US20100290203A1

公开(公告)日：2010-11-18

申请号：US12762123

申请日：2010-04-16

Applicant: Osamu Nagasaki

Inventor： Osamu Nagasaki

IPC: H05K7/02

CPC classification number: H05K3/3468 ,  G03G15/80 ,  H01L2924/0002 ,  H05K1/0259 ,  H05K1/111 ,  H05K1/116 ,  H05K3/3447 ,  H05K3/3452 ,  H05K2201/09463 ,  H05K2201/09781 ,  H05K2201/09854 ,  H05K2201/099 ,  H05K2201/10083 ,  H05K2201/10689 ,  H05K2201/1081 ,  H05K2203/044 ,  H05K2203/046 ,  H01L2924/00

Abstract: An electronic apparatus includes, for example, a circuit board with an electronic component and a piezoelectric element, a reference potential pattern that gives a reference potential to at least one of the electronic component and the piezoelectric element, and a solder land connected to the reference potential pattern. On the circuit board, the electronic component is located on a downstream side in a transport direction of the circuit board during mounting of the piezoelectric element and the electronic component on the solder land, and the piezoelectric element is located on an upstream side in the transport direction.

Abstract translation: 电子设备例如包括具有电子部件和压电元件的电路板，向电子部件和压电元件中的至少一个赋予参考电位的基准电位图形以及连接到基准电极的焊接焊盘 潜在的模式。 在电路板上，电子部件在将压电元件和电子部件安装在焊锡焊盘上时位于电路基板的输送方向的下游侧，压电元件位于输送路径的上游侧 方向。

公开(公告)号：US06402531B1

公开(公告)日：2002-06-11

申请号：US09166632

申请日：1998-10-05

Applicant: Janos Legrady

Inventor： Janos Legrady

IPC: H01R1200

CPC classification number: H01R4/028 ,  H05K3/3421 ,  H05K3/3447 ,  H05K3/368 ,  H05K2201/10303 ,  H05K2201/10318 ,  H05K2201/10424 ,  H05K2201/1053 ,  H05K2201/10636 ,  H05K2201/1081 ,  Y02P70/611

Abstract: A capillary action enhanced surface mount pin header includes a first flat substrate provided with a predetermined array of plated-through holes having substantially parallel and each having an internal surface defining a first substantially uniform cross section. Pins are provided each of which defines a longitudinal axis and having one end extending through an associated plated-through hole and another end extending to one side of said first substrate. Each pin has an external surface on at least a portion thereof which is received within an associated plated-through hole which defines a second substantially uniform cross section. In the disclosed embodiment, the pins have square or hexagonal cross sections while the plated-through holes have circular cross sections. The first and second cross sections are dissimilar and configured to provide spaced lines of contact and elongate channels substantially parallel to the axes between the internal and external surfaces and adjacent lines of contact, dimensioned to promote capillary action for molten solder at a channel opening on one side of the first substrate to cause the solder to be drawn through the channels towards the opposite side of the first substrate. A second substantially flat substrate is provided for positioning the solder at points substantially aligned with points on the predetermined array and proximate to at least one channel in at least one plated-through hole prior to melting of the solder.

Abstract translation: 毛细管作用增强的表面安装针头头部包括第一平坦基底，该第一平坦基底设置有基本上平行的预定阵列的电镀通孔，每个具有限定第一基本上均匀横截面的内表面。 提供引脚，每个引脚限定纵向轴线，并且其一端延伸穿过相关联的电镀通孔，而另一端延伸到所述第一基板的一侧。 每个销的至少一部分上具有外表面，该外表面被接纳在限定第二基本均匀横截面的相关电镀通孔内。 在所公开的实施例中，销具有方形或六边形横截面，而电镀通孔具有圆形横截面。 第一和第二横截面是不相似的并且构造成提供基本上平行于内表面和外表面和相邻接触线之间的轴线的间隔开的接触线和细长通道，其尺寸被设计成在一个通道开口上促进熔融焊料的毛细作用 使得焊料通过通道朝向第一基板的相对侧被拉出。 提供第二基本上平坦的基底，用于将焊料定位在基本上与预定阵列上的点对准的点处，并且在焊料熔化之前在至少一个电镀通孔中的至少一个通道附近。

公开(公告)号：US06380491B1

公开(公告)日：2002-04-30

申请号：US09383701

申请日：1999-08-26

Applicant: Richard G. Witty

Inventor： Richard G. Witty

IPC: H05K100

CPC classification number: H05K9/0032 ,  H05K3/306 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/09854 ,  H05K2201/10371 ,  H05K2201/1059 ,  H05K2201/1081

Abstract: A novel method is disclosed to create elongated apertures from circular holes provide a snap fit of square or rectangular tabs or tangs without requiring special tooling or milling. According to the method of the invention, at the intersection of the circular holes, points of engagement are formed that hold the square or rectangular tab in place. The size and spacing of the intersecting circular holes determine the depth of the points of engagement and the size of the square or rectangular tab that can be held.

Abstract translation: 公开了一种新颖的方法来从圆形孔形成细长的孔，提供方形或矩形突片或柄脚的卡扣配合，而不需要特殊的加工或铣削。 根据本发明的方法，在圆形孔的交叉处，形成将正方形或矩形突出部保持在适当位置的接合点。 相交的圆形孔的尺寸和间距决定了接合点的深度和可以保持的正方形或矩形片的尺寸。

公开(公告)号：US20010030882A1

公开(公告)日：2001-10-18

申请号：US09740707

申请日：2000-12-19

Applicant: SynQor, Inc.

Inventor： Lennart Pitzele

IPC: H02M001/00

CPC classification number: H05K7/142 ,  H01R12/58 ,  H05K1/141 ,  H05K3/308 ,  H05K3/3447 ,  H05K3/3484 ,  H05K3/368 ,  H05K2201/042 ,  H05K2201/1081 ,  H05K2201/10871 ,  H05K2201/2036 ,  H05K2203/0545 ,  Y10T29/49165

Abstract: A dc/dc converter is mounted to a printed circuit board with rigid terminal pins which extend into a converter substrate to provide electrical connection to circuitry on the substrate. A terminal pin includes a flange which abuts the printed circuit board and spaces the converter substrate from the printed circuit board. Connection to the printed circuit board is made by solder provided between the flange and the circuit board.

Abstract translation: DC / DC转换器安装到具有刚性端子引脚的印刷电路板上，该引脚延伸到转换器基板中以提供与基板上的电路的电连接。 端子销包括与印刷电路板抵接并将转换器基板与印刷电路板隔开的凸缘。 与印刷电路板的连接是由法兰和电路板之间的焊料制成的。

公开(公告)号：US6160239A

公开(公告)日：2000-12-12

申请号：US267284

申请日：1999-03-12

Applicant: Jose Antonio Cubero Pitel

Inventor： Jose Antonio Cubero Pitel

IPC: B23K26/00 ,  B23K1/005 ,  B23K26/12 ,  B23K26/20 ,  B23K101/42 ,  H05K3/00 ,  H05K3/32 ,  H05K3/34 ,  H05K3/40

CPC classification number: H05K3/3447 ,  B23K1/0056 ,  B23K2101/42 ,  H05K3/3494 ,  H05K3/4046 ,  H05K2201/10303 ,  H05K2201/1081 ,  H05K2203/107

Abstract: The proposed procedure, that of laser soldering or welding, is an auto-energetic process in which the density of the laser beam is obtained because of the concentration of light beams. Said process involves two metals (alike or disimilar) and, previously to the metallurgical union, same must be positioned in front of the laser head with enough accuracy. The metallurgical union is carried out by direct fusion of the metals to be joined and not being therefore necessary to use any filler metal.

Abstract translation: 所提出的激光焊接或焊接的过程是一种自动能量过程，其中由于光束的集中而获得激光束的密度。 所述方法涉及两种金属（类似或不相似的），并且事先对冶金联合体必须以足够的精度将其定位在激光头前面。 冶金联合是通过直接融合待接合的金属进行的，因此不需要使用任何填充金属。

公开(公告)号：US5092035A

公开(公告)日：1992-03-03

申请号：US580408

申请日：1990-09-10

Applicant: T. Blane McMichen ,  Kerry J. McMullen ,  John A. Sudanowicz, III

Inventor： T. Blane McMichen ,  Kerry J. McMullen ,  John A. Sudanowicz, III

IPC: H05K3/32 ,  H05K3/00 ,  H05K3/30 ,  H05K3/34

CPC classification number: H05K3/308 ,  H05K3/0094 ,  H05K3/3452 ,  H05K2201/10303 ,  H05K2201/1059 ,  H05K2201/1081 ,  H05K2203/1189 ,  H05K2203/1394 ,  H05K3/3447 ,  H05K3/3468 ,  Y10T29/49149 ,  Y10T29/49153

Abstract: A first set of plated-through holes in the printed circuit board (PCB) are covered by a protective solder mask on the solder side of the PCB while a second set of plated-through holes are exposed. Electrical components are disposed on the component side with leads inserted in the second set of holes. Solder is prevented from flowing into the first set of holes during wave soldering by the mask covering. Conductive pins designed for press fitting into the first set of holes are inserted therethrough to define connecting pins on each side of the PCB following wave soldering. This permits both a wave soldering and press fit operation to be accommodated.

Abstract translation: 印刷电路板（PCB）中的第一组电镀通孔被PCB的焊料侧上的保护性焊接掩模覆盖，而第二组电镀通孔露出。 电气部件设置在部件侧，引线插入第二组孔中。 通过掩模罩在波峰焊期间防止焊料流入第一组孔。 设计用于压配合到第一组孔中的导电插针插入其中以在波峰焊后在PCB的每一侧限定连接引脚。 这允许容纳波峰焊和压配合操作。

公开(公告)号：US3827004A

公开(公告)日：1974-07-30

申请号：US32475573

申请日：1973-01-18

Applicant: DU PONT

Inventor： HEUVEL M ,  THELISSEN W

IPC: H01R12/58 ,  H05K3/30 ,  H05K3/32 ,  H05K3/34 ,  H05K1/04

CPC classification number: H01R12/58 ,  H01R12/585 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/10303 ,  H05K2201/10787 ,  H05K2201/1081 ,  H05K2201/10878

Abstract: A pin for mounting in a hole in a circuit board without injuring plating in the hole or connections between such plating and multi-layer circuitry in the board. The pin includes pairs of collapsible fins which are bent toward each other when inserted into the hole.

Abstract translation: 用于安装在电路板的孔中的引脚，而不会损伤孔中的电镀或板中的这种电镀和多层电路之间的连接。 销包括成对的可折叠翅片，当插入孔中时它们彼此弯曲。