公开(公告)号：US11148157B2

公开(公告)日：2021-10-19

申请号：US16610141

申请日：2018-05-02

Applicant: I.M.A. INDUSTRIA MACCHINE AUTOMATICHE S.P.A.

Inventor： Nicola Gandolfi ,  Gjergj Darragjati

IPC: B05B13/02 ,  B01J2/12 ,  A23P20/18 ,  A23P20/15 ,  A61J3/00 ,  A23K20/20 ,  B05C5/00 ,  B05C9/08 ,  B05C11/08 ,  B05C13/00 ,  B01F13/10 ,  A23G3/34 ,  A23G3/26 ,  B05C3/08

Abstract: A coating apparatus and method are disclosed for coating tablets with a film, in which the tables transit through a drilled first container where they are coated, then exit the first container and are removed from a rotating element provided on the periphery of a plurality of removal members that are spaced angularly apart from one another, in which each removal member removes a quantity of tablets, raises the removed tables as far as a certain height and then discharges the tablets into a chute that conveys the tablets into a second rotating drilled container, with delicate transfer of the coated tablets from one container to the next.

公开(公告)号：US11065639B2

公开(公告)日：2021-07-20

申请号：US16468356

申请日：2017-11-24

Applicant: Tokyo Electron Limited

Inventor： Shogo Inaba ,  Kosuke Yoshihara ,  Shinichi Hatakeyama

IPC: B05C11/08 ,  B05C5/02 ,  B05D1/36 ,  B05D3/12 ,  B05D1/00 ,  H01L21/027

Abstract: A method for coating a top of a substrate with a coating solution includes supplying, before a solution film of the coating solution formed on the substrate dries, a solvent for the coating solution to a peripheral portion on the solution film of the coating solution on the substrate while rotating the substrate at a predetermined rotation speed to form a mixed layer of the coating solution and the solvent at the peripheral portion. The method includes, then, controlling a film thickness of the coating solution after drying by rotating the substrate at a rotation speed higher than the predetermined rotation speed to push the mixed layer to an outer peripheral side.

公开(公告)号：US20210187540A1

公开(公告)日：2021-06-24

申请号：US17197597

申请日：2021-03-10

Applicant: Nabors Drilling Technologies USA, Inc.

Inventor： Ronald SCHANLAUB ,  Keith HAGER ,  Chris MAGNUSON ,  Eric DEUTSCH

IPC: B05C3/20 ,  E21B19/00 ,  F16N7/00 ,  B05C11/08 ,  B05C9/12 ,  B05C11/06

Abstract: A pipe doping apparatus comprises a bucket assembly including a base and a bucket supported on the base and having an inside volume, a lubricating unit having at least one lubricant applicator inside the bucket; and a source of torque configured to rotate the bucket and/or the lubricating unit relative to a tubular. The apparatus may include a cleaning unit and/or a drying unit and the source of torque may be a fluid jet in either. At least one lubricant applicator may be retractable and may be actuated between a retracted position and an extended position by centripetal force. The apparatus may further include a positioning assembly supporting the base and the rotary bucket assembly and a controller connected to and controlling each of:—the positioning assembly, the cleaning unit, the drying unit, and the lubricating unit.

公开(公告)号：US10919071B2

公开(公告)日：2021-02-16

申请号：US15562006

申请日：2016-03-23

Applicant: OBDUCAT AB

Inventor： Pirmin Muffler

IPC: B05D3/12 ,  B05C13/00 ,  H01L21/683 ,  H01L21/687 ,  B05C11/08 ,  B05D1/00 ,  H01L21/67

Abstract: A rotary plate for holding a substrate for a coating device, which rotary plate comprises a plurality of suction points, is intended to be characterized by an annular elevation, wherein a diameter of the annular elevation substantially corresponds to a diameter of the substrate.

公开(公告)号：US20200234979A1

公开(公告)日：2020-07-23

申请号：US16735902

申请日：2020-01-07

Applicant: Tokyo Electron Limited

Inventor： Shogo INABA

IPC: H01L21/67 ,  B05C11/08 ,  B05D1/00 ,  G03F7/16 ,  H01L21/02

Abstract: A coating film forming method includes: rotating a substrate at a first rotation speed in a coating cup with an upper surface open, and supplying and diffusing a coating solution for forming a coating film on the substrate; and after the supplying and diffusing the coating solution, drying the substrate by exhausting air through a gap between an annular member arranged above the substrate with centers thereof being located on a same axis and the front surface of the substrate, while rotating the substrate at a second rotation speed lower than the first rotation speed, wherein at the drying the substrate, a flow velocity of the air exhausted through the gap is higher than a flow velocity of air supplied from above the substrate in the coating cup to the substrate.

公开(公告)号：US10571611B2

公开(公告)日：2020-02-25

申请号：US15026620

申请日：2014-10-03

Applicant: Transitions Optical, Inc.

Inventor： Jerry L. Koenig, II ,  Willard Beamer ,  Lex Eric Pace

IPC: B05C11/08 ,  B05C11/10 ,  G02B5/22 ,  B29D11/00 ,  G03C1/73 ,  C08G18/62 ,  C08G18/78 ,  C08G18/80 ,  C08G18/81 ,  C08G18/22 ,  C08G18/28 ,  C09D175/06 ,  C08G18/40 ,  C08G18/44 ,  G02B1/14 ,  C08J7/04 ,  C08J7/12 ,  C09D5/32 ,  G02B5/23 ,  G02C7/10 ,  B05D3/14 ,  B05D7/00 ,  C09K9/02 ,  B05C5/02 ,  B05C13/00 ,  B05D1/00 ,  B05D3/00 ,  B05D3/02

Abstract: A spin coater that can be used to apply multiple coating compositions over an optical substrate, is described. The spin coater includes, a coater bowl configured to collect excess coating material expelled from an optical substrate being coated, a rotatable chuck configured to receive and rotate the optical substrate in the bowl during coating, a plurality of coating reservoirs, each containing a coating material, and an indexable coating reservoir platform containing the plurality of reservoirs and configured to index a selected reservoir into a dispensing position above the coater bowl. The spin coater can include or have associated therewith at least one curing station, in which each curing station is independently configured to cure at least partially at least one applied coating material. Each curing station can include at least one of a thermal curing station, a UV curing station, and/or an IR curing station.

公开(公告)号：US20190157116A1

公开(公告)日：2019-05-23

申请号：US16128990

申请日：2018-09-12

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： HYUN-JOO JEON ,  SUNG-HYUP KIM

IPC: H01L21/67 ,  H01L21/687 ,  B05C11/08

CPC classification number: H01L21/6715 ,  B05C11/08 ,  H01L21/68735

Abstract: A spin coater includes a rotatable chuck structure configured to hold a substrate, a bowl enclosing the substrate and guiding a flow of a fluid around the substrate to a bottom of the bowl, and a flow controller detachably coupled to the bowl such that the flow controller is arranged between the bowl and an edge of the substrate and separates the flow into a linear flow and a non-linear flow.

公开(公告)号：US20180345334A1

公开(公告)日：2018-12-06

申请号：US15610082

申请日：2017-05-31

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Wei Chang Cheng ,  Cheng-Kuang Chen ,  Chi-Hung Liao

IPC: B08B9/027 ,  B08B3/08 ,  B05C11/08 ,  B05C9/08 ,  H01L21/027

Abstract: Embodiments of the present disclosure relate to apparatus and methods for cleaning an exhaust path of a semiconductor process tool. One embodiment provides an exhaust pipe section and a pipe cleaning assembly connected between a semiconductor process tool and a factory exhaust. The pipe cleaning assembly includes a residue remover disposed in the exhaust pipe section. The residue remover is operable to move in the exhaust pipe section to dislodge accumulated materials from an inner surface of the exhaust pipe section.

公开(公告)号：US10128136B2

公开(公告)日：2018-11-13

申请号：US15671325

申请日：2017-08-08

Applicant: Tokyo Electron Limited

Inventor： Masahiro Fukuda ,  Hiroshi Ichinomiya ,  Koichi Obata ,  Taro Yamamoto ,  Kouichirou Tanaka

IPC: H01L21/76 ,  H01L21/67 ,  B05C5/02 ,  B05C11/08 ,  B05C11/10 ,  B08B3/08 ,  B08B3/10 ,  G03F7/16 ,  H01L21/027 ,  G03F7/30

Abstract: There is provided a guide member 3 in which an inclined surface 32 thereof is inclined downwardly outwards from an edge portion of a rear surface of a horizontally held wafer W; and a cylindrical surrounding member 2 which surrounds the wafer W and in which an upper peripheral portion thereof is inwardly extended obliquely upwards. Further, the surrounding member 2 has, at an inner surface side thereof, two groove portions 23 extended along an entire circumference and located above a height position of the horizontally held wafer W. If an air flow flows along the surrounding member 2, a vortex flow is formed within the groove portions 23 and stays therein. Thus, mist can be captured, so that the flow of the mist to the outside of a cup body 1 can be suppressed. Accordingly, the adhesion of the mist to the wafer W can be suppressed.

公开(公告)号：US10120285B2

公开(公告)日：2018-11-06

申请号：US15374081

申请日：2016-12-09

Applicant: Tokyo Electron Limited

Inventor： Kousuke Yoshihara ,  Hideharu Kyouda ,  Koshi Muta ,  Taro Yamamoto ,  Yasushi Takiguchi ,  Masahiro Fukuda

IPC: B05C11/08 ,  G03F7/30 ,  B05D1/00 ,  B05D1/26 ,  B05C5/02 ,  H01L21/67

Abstract: A developing apparatus including a horizontal substrate holder, a rotating mechanism to rotate the substrate holder, a developer nozzle to supply a developer onto a part of the substrate to form a liquid puddle, a moving mechanism to move the developer nozzle in a radial direction of the rotating substrate, a contact part that moves with the developer nozzle and has a surface opposed to the substrate, which is smaller than the surface of the substrate, and a control unit to output a control signal such that a supply position of the developer on the substrate is moved in the radial direction of the substrate so that the liquid puddle is spread out on a whole surface of the substrate while the contact part is in contact with the liquid puddle.