公开(公告)号：US09748697B2

公开(公告)日：2017-08-29

申请号：US14798536

申请日：2015-07-14

Applicant: Tyco Electronics Corporation ,  TYCO ELECTRONICS JAPAN G.K.

Inventor： Sandeep Patel ,  Linda Ellen Shields ,  Bruce Allen Champion ,  Chad William Morgan ,  Masayuki Aizawa

IPC: H01R13/66 ,  H01R13/6471 ,  H05K1/02 ,  H05K1/11

CPC classification number: H01R13/6471 ,  H01R13/6616 ,  H05K1/0228 ,  H05K1/023 ,  H05K1/117 ,  H05K2201/09409

Abstract: Pluggable connector includes a plug housing configured to couple to a communication cable. The plug housing has a plug cavity. The pluggable connector also includes a module board that is disposed within the plug cavity and configured to be communicatively coupled to the communication cable. The module board has a mating edge configured to interface with a mating connector. The module board includes a plurality of signal pathways and a plurality of ground pathways in which the signal pathways are interleaved between corresponding ground pathways. The signal and ground pathways include respective contact pads that are disposed proximate to the mating edge for engaging corresponding contacts of the mating connector. Each of the ground pathways has separate first and second trace segments and a damping component that electrically joins the first and second trace segments.

公开(公告)号：US09673545B2

公开(公告)日：2017-06-06

申请号：US14916663

申请日：2014-09-04

Applicant: FUJIKURA LTD. ,  DDK Ltd.

Inventor： Yuki Ishida ,  Masayuki Suzuki ,  Yuki Nakano ,  Harunori Urai ,  Norifumi Nagae

IPC: H01R13/62 ,  H01R12/73 ,  H01R12/88 ,  H01R12/77 ,  H05K1/02 ,  H05K1/11

CPC classification number: H01R12/732 ,  H01R12/772 ,  H01R12/88 ,  H05K1/0218 ,  H05K1/0298 ,  H05K1/111 ,  H05K1/113 ,  H05K1/117 ,  H05K2201/09409 ,  H05K2201/09709 ,  H05K2201/09781

Abstract: A printed wiring board (1) includes: a base substrate (3); a plurality of pads (15a, 17a) for electrical connection that are disposed at one surface side of the base substrate (3) and at a connection end portion (13) to be connected with another electronic component (50); wirings (9, 11) that are connected with the pads (15a, 17a); and engageable parts (28, 29) that are formed at side edge parts of the connection end portion (13) and are to be engaged with engagement parts (58) of the other electronic component (50) in the direction of disconnection. The flexible printed wiring board (1) further includes reinforcement layers (31, 32) that are disposed at the other surface side of the base substrate (3) and at a frontward side with respect to the engageable parts (28, 29) when viewed in the direction of connection with the other electronic component, and that are formed separately from the wirings (9, 11).

公开(公告)号：US09605983B2

公开(公告)日：2017-03-28

申请号：US14299563

申请日：2014-06-09

Applicant: Infineon Technologies AG

Inventor： Udo Ausserlechner

IPC: G01R33/02 ,  G01D11/30 ,  G01D5/14 ,  G01D5/244 ,  H05K1/18

CPC classification number: G01R33/09 ,  G01D5/142 ,  G01D5/24442 ,  G01D11/305 ,  G01R33/0023 ,  G01R33/0047 ,  H01L43/02 ,  H01L43/08 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/48245 ,  H01L2924/00014 ,  H05K1/181 ,  H05K2201/09063 ,  H05K2201/09227 ,  H05K2201/09409 ,  H05K2201/09418 ,  H05K2201/10151 ,  H05K2201/10522 ,  Y02P70/611 ,  H01L2224/45099 ,  H01L2924/014

Abstract: A sensor arrangement according to an embodiment includes a board with a plurality of conductive lines of a first type, and a plurality of conductive lines of a second type different from the conductive lines of the first type, and a recess. The sensor arrangement further includes a plurality of sensor devices mechanically accommodated on a main surface of the board and arranged around the recess, each sensor device being electrically coupled to the conductive lines of the first type and at least to one of the conductive lines of the second type, wherein each conductive line of the second type electrically couples a sensor device with at least one other item different from the sensor devices of the plurality of sensor devices. A projection of the conductive lines of the first and second types perpendicular to the main surface is crossing-free. Each conductive line of the first type electrically couples at least all of the plurality of sensor devices.

公开(公告)号：US20170053726A1

公开(公告)日：2017-02-23

申请号：US15211967

申请日：2016-07-15

Applicant: TDK Corporation

Inventor： Nobuo Takagi

IPC: H01F27/24 ,  H01F41/076 ,  H05K1/18 ,  H05K1/11 ,  H01F27/29 ,  H01F27/28

CPC classification number: H05K1/165 ,  H01F17/045 ,  H01F27/24 ,  H01F27/2823 ,  H01F27/292 ,  H01F41/076 ,  H01F2017/0093 ,  H05K1/111 ,  H05K1/16 ,  H05K1/181 ,  H05K3/30 ,  H05K2201/09409 ,  H05K2201/09427 ,  H05K2201/1003 ,  Y02P70/611

Abstract: Disclosed herein is a coil component that includes a drum-shaped core having a flange portion and a winding core around which a wire is wound. The flange portion includes first and second side surface opposite to each other, and a mounting surface. The mounting surface of the flange portion includes first and second convex portions and a concave portion positioned therebetween. The first convex portion has a third side surface parallel to the first side surface of the flange portion. The second convex portion has a fourth side surface parallel to the second side surface of the flange portion. A level difference between the first side surface and the third side surface is larger than a level difference between the second side surface and the fourth side surface.

Abstract translation: 本文公开了一种线圈部件，其包括具有凸缘部分的卷筒形芯和卷绕在其上的绕线芯。 凸缘部包括彼此相对的第一和第二侧表面以及安装表面。 凸缘部的安装面包括第一和第二凸部以及位于其间的凹部。 第一凸部具有与凸缘部的第一侧面平行的第三侧面。 第二凸部具有与凸缘部的第二侧面平行的第四侧面。 第一侧表面和第三侧表面之间的水平差大于第二侧表面和第四侧表面之间的水平差。

公开(公告)号：US09578760B2

公开(公告)日：2017-02-21

申请号：US14721973

申请日：2015-05-26

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hyojae Bang ,  Dogeun Kim ,  Hongkyun Kim ,  Youngbok Jeon

IPC: H05K1/14 ,  H05K5/00 ,  G06K7/00 ,  H01R12/57 ,  H01R12/50 ,  H05K1/11 ,  H01R13/00 ,  H05K3/10 ,  H05K3/30 ,  H05K7/02 ,  H05K13/00 ,  G06F1/18 ,  H05K1/18 ,  H01R27/00 ,  H05K1/02 ,  H05K3/34

CPC classification number: H05K5/0026 ,  G06F1/18 ,  G06F1/185 ,  G06K7/0047 ,  H01R12/57 ,  H01R12/721 ,  H01R13/00 ,  H01R23/70 ,  H01R27/00 ,  H05K1/0295 ,  H05K1/11 ,  H05K1/117 ,  H05K1/181 ,  H05K3/10 ,  H05K3/303 ,  H05K3/3405 ,  H05K7/02 ,  H05K13/00 ,  H05K2201/09409 ,  H05K2201/09709 ,  H05K2201/09954 ,  H05K2201/10159 ,  H05K2201/10189 ,  H05K2201/10446 ,  Y10S439/946 ,  Y10S439/951 ,  Y10T29/49124 ,  Y10T29/49147

Abstract: Example embodiments are directed to circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same, which are common to at least two different form factors. In an example embodiment, the SSD includes a circuit board that is smaller than a case, and the circuit board is secured to the bottom surface of the case by the securing element. The securing element is spaced apart from edges of the case to allow using a circuit board that is smaller than the case.

Abstract translation: 示例性实施例涉及电路板，连接器，外壳，电路板组件，壳体组件，其制造方法及其制造方法，这对于至少两种不同的形状因子是共同的。 在示例性实施例中，SSD包括小于壳体的电路板，并且电路板通过固定元件固定到壳体的底表面。 固定元件与壳体的边缘间隔开，以允许使用小于壳体的电路板。

公开(公告)号：US09478879B2

公开(公告)日：2016-10-25

申请号：US13935292

申请日：2013-07-03

Applicant: PANASONIC CORPORATION

Inventor： Hiroshi Iwano ,  Mitsuru Iida ,  Daisuke Sato ,  Hidetoshi Takeyama

IPC: H01R12/79 ,  H05K1/11 ,  H01R12/61 ,  H05K3/00 ,  H05K3/36 ,  H05K3/40

CPC classification number: H01R12/613 ,  H01R12/79 ,  H05K1/11 ,  H05K1/114 ,  H05K1/117 ,  H05K3/0038 ,  H05K3/365 ,  H05K3/4007 ,  H05K2201/0367 ,  H05K2201/0394 ,  H05K2201/09409 ,  H05K2201/09427 ,  H05K2201/09445 ,  H05K2201/0949 ,  H05K2201/09509 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/10189 ,  H05K2201/2009 ,  H05K2201/2072 ,  H05K2203/167

Abstract: A socket (female connector) used for a connector assembly includes a film substrate constituted by a flexible thin board made of insulation material. The film substrate is provided with connection through holes adapted to be inserted therein connection posts of a header (male connector). Connection pads are formed on a first surface of the film substrate around respective connection through holes. The connection pads include a first pad and a second pad. The film substrate is provided on the first surface with a first patterned conductor connected to the first pad and a third patterned conductor connected to the second pad. The third patterned conductor is connected to a second patterned conductor formed on a second surface of the film substrate by means of a blind via that is formed by boring the film substrate from the second surface so as to reach the third patterned conductor.

Abstract translation: 用于连接器组件的插座（母连接器）包括由绝缘材料制成的柔性薄板构成的薄膜基片。 薄膜基片设置有适于插入插头（公连接器）的连接柱中的连接通孔。 连接衬垫围绕各个连接通孔形成在薄膜基片的第一表面上。 连接焊盘包括第一焊盘和第二焊盘。 薄膜基板在第一表面上设置有连接到第一焊盘的第一图案化导体和连接到第二焊盘的第三图案化导体。 第三图案化导体通过盲孔通过第二图案导体连接到形成在膜基板的第二表面上的第二图案化导体，所述盲孔通过从第二表面镗孔而形成，以到达第三图案化导体。

公开(公告)号：US20160270219A1

公开(公告)日：2016-09-15

申请号：US15033836

申请日：2014-10-24

Applicant: INGENICO GROUP

Inventor： Stephane Pavageau ,  Xavier Lambert

IPC: H05K1/02 ,  H05K3/34 ,  H05K3/10 ,  B23K1/00

CPC classification number: H05K1/0284 ,  B23K1/0016 ,  B23K2101/42 ,  G06F21/86 ,  G06K7/0091 ,  H05K1/0275 ,  H05K3/10 ,  H05K3/1241 ,  H05K3/1275 ,  H05K3/143 ,  H05K3/245 ,  H05K3/34 ,  H05K2201/09409 ,  H05K2201/09781 ,  H05K2201/098 ,  H05K2201/10204 ,  H05K2203/0551

Abstract: A support is provided for fabrication of an electronic device. The support includes at least one component to be protected and at least one three-dimensional element of a height at least equal to a height of the electronic component. The three-dimensional element is disposed laterally opposite the at least one component to be protected. The three-dimensional element is chiefly constituted of a permanent assembling material.

Abstract translation: 提供了用于制造电子设备的支撑件。 支撑件包括至少一个待保护的部件和至少一个至少等于电子部件高度的高度的三维元件。 三维元件与要保护的至少一个部件横向相对设置。 三维元素主要由永久组装材料构成。

公开(公告)号：US09391012B2

公开(公告)日：2016-07-12

申请号：US14638408

申请日：2015-03-04

Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.

Inventor： Kai-Chiang Wu ,  Hsien-Wei Chen ,  Yu-Feng Chen ,  Chun-Hung Lin ,  Ming-Kai Liu ,  Chun-Lin Lu

IPC: H01L29/40 ,  H01L23/40 ,  H01L23/498 ,  H01L21/56 ,  H01L25/10 ,  H01L25/065 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K1/18 ,  H01L23/31 ,  H01L23/00

CPC classification number: H01L23/49838 ,  H01L21/4853 ,  H01L21/52 ,  H01L21/563 ,  H01L21/565 ,  H01L23/3128 ,  H01L23/3157 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/5386 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05572 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1144 ,  H01L2224/1145 ,  H01L2224/11462 ,  H01L2224/11849 ,  H01L2224/13111 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/1712 ,  H01L2224/26175 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06575 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/00014 ,  H01L2924/01322 ,  H01L2924/1431 ,  H01L2924/1436 ,  H01L2924/1437 ,  H01L2924/1443 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/157 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H05K1/0284 ,  H05K1/0313 ,  H05K1/111 ,  H05K1/181 ,  H05K3/40 ,  H05K2201/09409 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Methods and apparatus for an interposer with dams used in packaging dies are disclosed. An interposer may comprise a metal layer above a substrate. A plurality of dams may be formed above the metal layer around each corner of the metal layer. Dams may be formed on both sides of the interposer substrate. A dam surrounds an area where connectors such as solder balls may be located to connect to other packages. A non-conductive dam may be formed above the dam. An underfill may be formed under the package connected to the connector, above the metal layer, and contained within the area surrounded by the dams at the corner, so that the connectors are well protected by the underfill. Such dams may be further formed on a printed circuit board as well.

公开(公告)号：US20160198572A1

公开(公告)日：2016-07-07

申请号：US14916605

申请日：2014-09-04

Applicant: FUJIKURA LTD. ,  DDK LTD.

Inventor： Yuki ISHIDA ,  Masayuki SUZUKI ,  Yuki NAKANO ,  Harunori URAI ,  Norifumi NAGAE

IPC: H05K1/11 ,  H01R12/72

CPC classification number: H05K1/113 ,  H01R12/727 ,  H01R12/772 ,  H01R12/88 ,  H05K1/0218 ,  H05K1/117 ,  H05K2201/09409 ,  H05K2201/09709 ,  H05K2201/09781

Abstract: A printed wiring board (1) includes: a base substrate (3); a plurality of pads (15a, 17a) for electrical connection that are disposed at one surface side of the base substrate (3) and at a connection end portion (13) to be connected with another electronic component (50); wirings (9, 11) that are connected with the pads (15a, 17a); and engageable parts (28, 29) that are formed at side edge parts of the connection end portion (13) and are to be engaged with engagement parts (58) of the other electronic component (50) in the direction of disconnection. The flexible printed wiring board (1) further includes reinforcement layers (31, 32) that are disposed at the other surface side of the base substrate (3) and at a frontward side with respect to the engageable parts (28, 29) when viewed in the direction of connection with the other electronic component, and that are formed integrally with the wirings (9).

Abstract translation: 印刷电路板（1）包括：基底（3）; 多个用于电连接的焊盘（15a，17a），其设置在所述基底基板（3）的一个表面侧和连接端部（13）处以与另一个电子部件（50）连接; 与焊盘（15a，17a）连接的布线（9,11）; 以及形成在连接端部（13）的侧边缘部分处并且沿着断开方向与另一个电子部件（50）的接合部分（58）接合的可接合部分（28,29）。 柔性印刷布线板（1）还包括加强层（31,32），其被设置在基底基板（3）的另一个表面侧，并且当观察时相对于可接合部分（28,29）在前侧 在与其他电子部件连接的方向上，与导线（9）一体形成。

公开(公告)号：US20150334850A1

公开(公告)日：2015-11-19

申请号：US14707295

申请日：2015-05-08

Applicant: NGK SPARK PLUG CO., LTD.

Inventor： Takahiro HAYASHI

IPC: H05K3/46 ,  H05K1/02

CPC classification number: H05K3/28 ,  H05K1/0284 ,  H05K3/188 ,  H05K3/243 ,  H05K3/244 ,  H05K3/282 ,  H05K3/381 ,  H05K3/383 ,  H05K3/4007 ,  H05K3/46 ,  H05K3/4602 ,  H05K3/4661 ,  H05K2201/09409 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/10204 ,  H05K2203/0307 ,  H05K2203/0574 ,  H05K2203/058 ,  H05K2203/0597 ,  H05K2203/0766 ,  Y10T29/49156

Abstract: A method of manufacturing a wiring substrate according to the present invention includes a step of forming a wiring layer including connection terminals on a first insulating layer; a step of forming a second insulating layer on the wiring layer and on the first insulating layer; a step of forming electrically insulative dummy portions separated from the wiring layer on the first insulating layer through patterning of the second insulating layer; a step of forming a third insulating layer on the wiring layer, on the dummy portions, and on the first insulating layer; and a step of forming openings in the third insulating layer for exposing the connection terminals in such a manner that upper end portions of the connection terminals protrude from the third insulating layer, and lower end portions of the connection terminals are embedded in the third insulating layer.

Abstract translation: 根据本发明的制造布线基板的方法包括在第一绝缘层上形成包括连接端子的布线层的步骤; 在所述布线层和所述第一绝缘层上形成第二绝缘层的步骤; 通过图案化所述第二绝缘层而形成与所述第一绝缘层上的所述布线层分离的电绝缘的虚设部分的步骤; 在所述布线层上，所述虚拟部分上和所述第一绝缘层上形成第三绝缘层的步骤; 以及在所述第三绝缘层中形成用于暴露所述连接端子的开口的步骤，使得所述连接端子的上端部从所述第三绝缘层突出，并且所述连接端子的下端部嵌入所述第三绝缘层 。